Normal metal, ohmic contacts to high-temperature superconducting YBa2Cu3O7-δ thin films suitable for multichip modules

Normal metal, ohmic contacts to high-temperature superconductor (HTSC) materials will be used to form via structures between HTSC interconnect levels, and also, substrate bonding pads in a superconducting multichip module (SMCM). Specific contact resistivities below 10⁻⁸ Ω cm² will be required for such contacts to control signal attenuation and local contact heating of the LN₂cooled SMCM. Previous work on normal metal/superconducting contacts has not focused on metallization schemes which will be stable during subsequent high-temperature processing. Metal contacts of gold, silver, and palladium were formed on superconducting thin films of YBa₂Cu₃O_7-δ via evaporation and sputtering through a shadow mask followed by annealing in various ambients and at several temperatures. Palladium contacts oxidized readily during anneal, and sputtered gold contacts required additional processing and exhibited higher specific contact resistivities. The best contacts were obtained by a controlled-cooling oxygen anneal of evaporated gold or silver, as indicated by normal-state specific contact resistivities of 3 × 10⁻⁵ Ω cm² and 4 × 10⁻⁵ Ω cm², respectively. This work differs from previously published results by describing contacts which required no extensive preparation of the HTSC surface and were stable to 700 °C, indicating these contacts would be compatible with subsequent high-temperature processing of the additional HTSC layers required in a multi-level SMCM.     

Improved Al/Si ohmic contacts to p-type 4H-SiC

An AlSi-based ohmic contact with a new composition is reported in this paper. AlSi(2%)Ti(0.15%) contacts are formed by evaporation on p-type 4H-SiC grown by liquid phase epitaxy (LPE) and annealed in the temperature range from 700 to 950°C. The ohmic behaviour has been checked by I–V characteristics and the contact resistivity has been measured by the linear transmission-line-model (TLM) method. The dependence of the contact resistivity on the annealing conditions has been studied. An ohmic behaviour has been established at 700°C while the lowest contact resistivity value of 9.6×10⁻⁵ Ω cm² has been obtained after annealing at 950°C. The thermal stability of both Al/Si/SiC and AlSiTi/SiC contacts at a temperature of 600°C has been studied. It has been found that the AlSiTi/SiC contacts are stable for 100 h at this ageing temperature while the Al/Si/SiC contacts deteriorate after 24 h.     

Investigation of the dependence of the contact resistance on the external gold layer in AuNiGeAu/n-GaAs

The contact resistance of an Au/Ni/Ge/Au metallization system on n-GaAs exhibits a drop in contact resistance from 13.3 × 10⁻⁶ ω cm² to 8.6 × 10⁻⁶ ω cm² when the external gold layer is varied from 800 Å to 6000 Å in thickness. Secondary ion mass spectroscopy indicates that the improvement in contact resistance is due to the gold's “regulating” the amount of NiAs formed, leading to an increase in the area fraction covered by the Ni₂GeAs. The result shows that the external gold layer deposited to improve bonding should be optimized in thickness. This role played by the external gold layer of the metal system in affecting the contact resistance has not been previously studied.     

Deep levels in GaInAs grown by molecular beam epitaxy and their concentration reduction with annealing treatment

X-ray diffraction (XRD), current–voltage (IV), capacitance–voltage (CV), deep-level transient Fourier spectroscopy (DLTFS) and isothermal transient spectroscopy (ITS) techniques are used to investigate the thermal annealing behaviour of three deep levels in Ga_0.986In_0.014As heavily doped with Si (6.8 × 10¹⁷ cm⁻³) grown by molecular beam epitaxy (MBE). The thermal annealing was performed at 625 °C, 650 °C, 675 °C, 700 °C and 750 °C for 5 min. XRD study shows good structural quality of the samples and yields an In composition of 1.4%. Two main electron traps are detected by DLTFS and ITS around 280 K, with activation energies of 0.58 eV and 0.57 eV, capture cross sections of 9 × 10⁻¹⁵ cm² and 8.6 × 10⁻¹⁴ cm² and densities of 2.8 × 10¹⁶ cm⁻³ and 9.6 × 10¹⁵ cm⁻³, respectively. They appear overlapped and as a single peak, which divides into two smaller peaks after annealing at 625 °C for 5 min.

Annealing at higher temperatures further reduces the trap concentrations. A secondary electron trap is found at 150 K with an activation energy of 0.274 eV, a capture cross section of 8.64 × 10⁻¹⁵ cm² and a density of 1.38 × 10¹⁵ cm⁻³. The concentration of this trap level is also decreased by thermal annealing.     

Excited-state absorption at 1.57 μm in U:CaF2 and Co:ZnSe saturable absorbers

Appreciable excited-state absorption (ESA) in U²⁺:CaF₂ and Co²⁺:ZnSe saturable absorbers was measured at λ=1.573 μm by optical transmission versus light fluence curves of 30–40 ns long pulses. The ground- and excited-state absorption cross-sections obtained were (9.15±0.3)×10⁻²⁰ and (3.6±0.2)×10⁻²⁰ cm², respectively, for U²⁺:CaF₂, and (57±4)×10⁻²⁰ and (12.5±1)×10⁻²⁰ cm² for Co²⁺:ZnSe. Thus, ESA is not negligible in U²⁺:CaF₂ and Co²⁺:ZnSe, as previously estimated.     

Effects of reduction treatment on the photorefractive properties of Pb0.5Ba0.5Nb2O6

Lead barium niobate is a new photorefractive material of high interest for a variety of applications including holographic storage. Pb_0.5Ba_0.5Nb₂O₆ crystals have been grown by the Bridgman method, and the effects of heat treatments on their photorefractive properties were investigated using Ar ion laser at λ=514.5 nm. The color and absorption spectrum of the crystals varied depending on the oxygen partial pressure during heat treatment. The oxygen diffusivity was estimated to be in the order of 10⁻⁶ and 10⁻⁵ cm²/h at 425 and 550 °C, respectively. Reduction treatment at an oxygen pressure of 215 mTorr increased the effective density of photorefractive charges about three times from 8.0×10¹⁵ to 2.2×10¹⁶ cm⁻³ and made the charge transport more electron-dominant. As a result, the maximum gain coefficient improved from 5.5 to 13.8 cm⁻¹. A diffraction efficiency as high as 70% was achieved in a reduced crystal.     

Al2O3 formation on Si by catalytic chemical vapor deposition

Catalytic chemical vapor deposition (Cat-CVD) has been developed to deposit alumina (Al₂O₃) thin films on silicon (Si) crystals using N₂ bubbled tri-methyl aluminum [Al(CH₃)₃, TMA] and molecular oxygen (O₂) as source species and tungsten wires as a catalyzer. The catalyzer dissociated TMA at approximately 600 °C. The maximum deposition rate was 18 nm min⁻¹ at a catalyzer temperature of 1000 °C and substrate temperature of 800 °C. Metal oxide semiconductor (MOS) diodes were fabricated using gates composed of 32.5-nm-thick alumina film deposited at a substrate temperature of 400 °C. The capacitance measurements resulted in a relative dielectric constant of 7.4, fixed charge density of 1.74×10¹² cm⁻², small hysteresis voltage of 0.12 V, and very few interface trapping charges. The leakage current was 5.01×10⁻⁷ A cm⁻² at a gate bias of 1 V.     

Room temperature indium tin oxide by XeCl excimer laser annealing for flexible display

A XeCl excimer laser (λ=308 nm) has been used to anneal Indium Tin Oxide (ITO) films deposited at 25 °C using DC magnetron sputtering. With increasing laser fluence, the film crystallinity was improved while retaining the as-deposited 111 texture. As a result of laser irradiation, the sheet resistance of 100 nm ITO films decreased from 191 Ω/□ (1.91×10⁻³ Ω cm) to 25 Ω/□ (2.5×10⁻⁴ Ω cm), while the optical transmittance in the visible range increased from 70% to more than 85%. Surface roughness and etching properties were also significantly improved following laser annealing.     

Highly conducting indium tin oxide (ITO) thin films deposited by pulsed laser ablation

Highly conducting and transparent indium tin oxide (ITO) thin films were prepared on SiO₂ glass and silicon substrates by pulsed laser ablation (PLA) from a 90 wt.% In₂O₃-10 wt.% SnO₂ sintered ceramic target. The growths of ITO films under different oxygen pressures (P_O2) ranging from 1×10⁻⁴–5×10⁻² Torr at low substrate temperatures (T_s) between room temperature (RT) and 200°C were investigated. The opto-electrical properties of the films were found to be strongly dependent on the P_O2 during the film deposition. Under a P_O2 of 1×10⁻² Torr, ITO films with low resistivity of 5.35×10⁻⁴ and 1.75×10⁻⁴ Ω cm were obtained at RT (25°C) and 200°C, respectively. The films exhibited high carrier density and reasonably high Hall mobility at the optimal P_O2 region of 1×10⁻² to 1.5×10⁻² Torr. Optical transmittance in excess of 87% in the visible region of the solar spectrum was displayed by the films deposited at Po₂≥1×10⁻² Torr and it was significantly reduced as the P_O2 decreases.     

Dielectric properties of AlN films prepared by laser-induced chemical vapour deposition

The dielectric properties and electrical conductivity of AlN films deposited by laser-induced chemical vapour deposition (LCVD) are studied for a range of growth conditions. The static dielectric constant is 8.0 ± 0.2 over the frequency range 10²−10⁷ Hz and breakdown electric fields better than 10⁶ V cm⁻¹ are found for all films grown at temperatures above 130°C. The resistivity of the films grown under optimum conditions (substrate temperature above 170°C, NH₃/TMA flow rate ratio greater than 300 and a deposition pressure of 1–2 Torr) is about 10¹⁴ Ω cm and two conduction mechanisms can be identified. At low fields, F < 5 × 10⁵ V cm⁻¹ and conductivity is ohmic with a temperature dependence showing a thermal activation energy of 50–100 meV, compatible with the presumed shallow donor-like states. At high fields, F > 1 × 10⁶ V cm⁻¹, a Poole-Frenkel (field-induced emission) process dominates, with electrons activated from traps at about 0.7–1.2 eV below the conduction band edge. A trap in this depth region is well-known in AlN. At fields between 4 and 7 × 10⁵ V cm⁻¹ both conduction paths contribute significantly. The degradation of properties under non-ideal growth conditions of low temperature or low precursor V/III ratio is described.     

Structure-composition-property dependence in reactive magnetron sputtered ZnO thin films

Thin films of zinc oxide (ZnO) were prepared by dc reactive magnetron sputtering on glass substrates at various oxygen partial pressures in the range 1×10⁻⁴–6×10⁻³ mbar and substrate temperatures in the range 548–723 K. The variation of cathode potential of zinc target on the oxygen partial pressure was explained in terms of target poisoning effects. The stoichiometry of the films has improved with the increase in the oxygen partial pressure. The films were polycrystalline with wurtzite structure. The films formed at higher substrate temperatures were (0 0 2) oriented. The temperature dependence of Hall mobility of the films formed at various substrate temperatures indicated that the grain boundary scattering of charge carriers was predominant electrical conduction mechanism in these films. The optical band gap of the films increased with the increase of substrate temperature. The ZnO films formed under optimized oxygen partial pressure of 1×10⁻³ mbar and substrate temperature of 663 K exhibited low electrical resistivity of 6.9×10⁻² Ω cm, high visible optical transmittance of 83%, optical band gap of 3.28 eV and a figure of merit of 78 Ω⁻¹ cm⁻¹.     

Thin film TiO2 on nickel(110): an STM study

Titanium oxide films grown on the surface of a Ni(110) single crystal have been investigated using STM, LEED and AES for Ti coverages ranging from 1 to 10 ml [1 ml of Ti is defined here as equivalent to the number of top layer Ni atoms of Ni(110)]. The oxide overlayers were prepared by vapour phase deposition of Ti followed by oxidation in 1×10⁻⁷ mbar O₂ at 800 K. Oxidation of Ti coverages between 1 and 10 ML results in STM images indicating the presence of two terminations coexisting on the surface. One termination consists of islands of epitaxial rutile TiO₂(110), the second having cell parameters of 2.98±0.1×3.15±0.2 Å. The latter unit cell is consistent with TiO(001) (2.99×2.99 Ų). On oxidation of higher Ti coverages (10 ml), only epitaxial rutile TiO₂(110) islands are observed.     

Up-conversion dynamics in GdAlO3:Er single crystal fibre

Green fluorescence has been obtained under continuous laser excitation in the 780–860 nm range in GdAlO₃:Er³⁺. With the help of the Judd-Ofelt treatment we built a model based on population rate equations to describe its time evolution. We found the intensity parameters to be Ω₂ = 2.045 × 10⁻²⁰ cm², Ω₄ = 1.356 × 10⁻²⁰ cm² Ω₆ = 1. 125 × 10⁻²⁰ cm². Even if a two-photon absorption and a looping mechanism are necessary to well describe the dynamics, the main process responsible for up-conversion is energy transfer between erbium ions.     

Thermally stable Pd/Sn and Pd/Sn/Au ohmic contacts to n-type GaAs

Thermal stability of novel Pd/Sn and Pd/Sn/Au Ohmic contacts to n-GaAs has been investigated and compared to the non-alloyed Pd/Ge and alloyed Au–Ge/Ni metallizations. Metallization samples are furnace annealed at various temperatures and systematically characterized utilizing Scanning Electron Microscopy (SEM) and current–voltage (I–V) measurements. Contact resistivities, ρ_c, of the proposed metallization are measured using a conventional Transmission Line Model (cTLM) method. The Pd/Sn Ohmic contacts display superior thermal stability at 410°C when compared to the Pd/Ge contacts. After annealing at 410°C for 4 h, ρ_c of the Pd(50 nm)/Sn(125 nm) metallization remains in the low 10⁻⁵ Ω cm² range, whereas ρ_c values increase to 10⁻⁴ Ω cm² for the Pd(50 nm)/Ge(126 nm) contacts. At 410°C, the Pd/Sn/Au metallizations also display better thermal stability than that of non-alloyed Pd/Ge and alloyed Au–Ge/Ni metallizations. The long-term stability at 300°C of the Pd/Sn and Pd/Sn/Au Ohmic contacts is also reported.     

Atomic-layer doping in Si by alternately supplied PH3 and SiH4

Atomic-layer doping of P in Si epitaxial growth by alternately supplied PH₃ and SiH₄ was investigated using ultraclean low-pressure chemical vapor deposition. Three atomic layers of P adsorbed on Si(100) are formed by PH₃ exposure at a partial pressure of 0.26 Pa at 450°C. By subsequent SiH₄ exposure at 220 Pa at 450°C, Si is epitaxially grown on the P-adsorbed surface. Furthermore, by 12-cycles of exposure to PH₃ at 300–450°C and SiH₄ at 450°C followed by 20-nm thick capping Si deposition, the multi-layer P-doped epitaxial Si films of average P concentrations of 10²¹ cm⁻³ are formed. The resistivity of the film is as low as 2.4×10⁻⁴ Ω cm. By annealing the sample at 550°C and above, it is found that the resistivity increases and the surface may become rough, which may be due to formation of SiP precipitates at 550°C and above. These results suggest that the epitaxial growth of very low-resistive Si is achieved only at a very low-temperature such as 450°C.     

Development of Bi-oxide superconducting tapes and coils

We have developed Bi-2212 and 2223 tapes. For Bi-2212, two double stacked pancake type coils were fabricated using Bi-2212/Ag tapes prepared by a combination of the continuous dip-coating process and melt-solidification. A small coil (13 mm inner bore, 46.5 mm outer diameter) was inserted in a conventional superconducting magnet system. In a bias field of 20.9 T, the generated field of the coil was 0.9 T, at an I_c of 310 A (criterion 10⁻¹³ Ωm) at 1.8 K. Thus, the superconducting magnet system achieved the generation of a field of 21.8 T in the full superconducting state. A large coil (20 mm inner bore, 94 mm outer diameter) generated a field of 2.6 T (I_c = 385 A (10⁻¹³ Ωm)) at 4.2 K and 1.53 T (I_c = 225 A (10⁻¹³Ωm)) at 20 K in self-field. For Bi-2223, tapes were prepared by the powder-in-tube technique using Ag-10% Cu-x%M (x = 0–1.0, M = Ti, Zr, Hf or Au) alloy sheaths. The high J_c values of 5–7 × 10⁴ A cm⁻² at 4.2 K and 14 T were obtained for the tapes doped with x = 0.03–0.1 at.% Ti, 0.1 at.% Zr, 0.1 at.% Hf or 0.3% Au. These tapes have a modified Bi-2223 grain structure at the sheath/core interface and also a dense and more aligned microstructure, resulting in higher J_c values.     

Thermal optical properties of TiO2 films

A fibre optic experimental arrangement was used to determine the thermo-optic coefficient (dn/dT) of electron beam deposited titanium dioxide coatings on the cleaved end faces of multimode optical fibres for a wavelength range between 600 and 1050 nm. The temperature-induced change in the index of refraction (n) and extinction coefficient (k) were successfully determined from reflection spectra. Measurements of n and k at various wavelengths for different temperatures enabled the determination of dn/dT and dk/dT. It was found that dn/dT takes different values at different temperature ranges. For example, at 800 nm, dn/dT was (−1.77±0.7)×10⁻⁴ K⁻¹, between 18°C and 120°C, and took a value of (−3.04±0.7)×10⁻⁴ K⁻¹ between 220°C and 325°C.     

Improved fatigue properties of lead zirconate titanate films made on oxygen-implanted platinum electrodes

Pb(Zr_0.3Ti_0.7)O₃ (PZT) thin film capacitors fabricated on an oxygen-implanted Pt bottom electrode were studied. Oxygen was implanted at a low acceleration voltage (40 kV) and dose (1×10¹⁵ cm⁻²). Structural examination by grazing-incident X-ray diffraction (GIXD) and chemical analysis by X-ray photoelectron spectroscopy (XPS) revealed that the implantation generated a very thin amorphous top surface layer (approx. 20 nm), which contained approximately 7% of oxygen that stayed in the film in the form of PtO bonding. The amorphous layer, however, resumed the crystalline structure accompanied by the dissociation of PtO under the rapid thermal annealing at 600 °C for 5 min. The remnant polarization of sol–gel derived Pb(Zr_0.3Ti_0.7)O₃ (PZT) films fabricated on the oxygen-implanted Pt was slightly reduced from 11.92 μC/cm² for the PZT capacitors fabricated on a Pt electrode without implanted oxygen to 9.07 μC/cm². Nevertheless, the fatigue endurance was significantly increased. The switching polarization of PtO_x/PZT/Pt (O-implanted) capacitors remained within 95% of the starting value after 4×10¹⁰ switching cycles, which is comparable to that of PZT capacitors made with other conducting oxides.     

The optical and electrical properties of copper indium di-selenide thin films

Thin films of copper indium di-selenide (CIS) with a wide range of compositions near stoichiometry have been formed on glass substrates in vacuum by the stacked elemental layer (SEL) deposition technique. The compositional and optical properties of the films have been measured by proton-induced X-ray emission (PIXE) and spectrophotometry (photon wavelength range of 300–2500 nm), respectively. Electrical conductivity (σ), charge-carrier concentration (n), and Hall mobility (μ_H) were measured at temperatures ranging from 143 to 400 K. It was found that more indium-rich films have higher energy gaps than less indium-rich ones while more Cu-rich films have lower energy gaps than less Cu-rich films. The sub-bandgap absorption of photons is minimum in the samples having Cu/In ≈ 1 and it again decreases, as Cu/In ratio becomes less than 0.60. Indium-rich films show n-type conductivities while near-stoichiometric and copper-rich films have p-type conductivities. At 300 K σ, n and μ_H of the films vary from 2.15 × 10⁻³ to 1.60 × 10⁻¹ (Ω cm)⁻¹, 2.28 × 10¹⁵ to 5.74 × 10¹⁷ cm⁻³ and 1.74 to 5.88 cm² (V s)⁻¹, respectively, and are dependent on the composition of the films. All the films were found to be non-degenerate. The ionization energies for acceptors and donors vary between 12 and 24, and 3 and 8 meV, respectively, and they are correlated well with the Cu/In ratios. The crystallites of the films were found to be partially depleted in charge carriers.     

Transparent conductive In2O3:Mo thin films prepared by reactive direct current magnetron sputtering at room temperature

An amorphous transparent conductive oxide thin film of molybdenum-doped indium oxide (IMO) was prepared by reactive direct current magnetron sputtering at room temperature. The films formed on glass microscope slides show good electrical and optical properties: the low resistivity of 5.9 × 10^− 4 Ω cm, the carrier concentration of 5.2 × 10²⁰ cm^− 3, the carrier mobility of 20.2 cm² V^− 1 s^− 1, and an average visible transmittance of about 90.1%. The investigation reveals that oxygen content influences greatly the carrier concentration and then the photoelectrical properties of the films. Atomic force microscope evaluation shows that the IMO film with uniform particle size and smooth surface in terms of root mean square of 0.8 nm was obtained.