Electric characterization of HfO2 thin films prepared by chemical solution deposition

Hafnium dioxide (HfO₂) thin films were prepared on Si substrates using the chemical solution deposition (CSD) method. The Au/HfO₂/n-Si/Ag structures were characterized by X-ray diffraction (XRD), C–V curves and leakage current measurements. A relative dielectric constant of about 13.5 was obtained for the 65 nm HfO₂ film. Atomic force microscopy (AFM) measurements show uniform surfaces of the films. C–V hysteresis was found for the metal-oxide-semiconductor (MOS) structures with HfO₂ films of 52 and 65 nm thick. It is found that the width of C–V windows is related with the thickness of the HfO₂ films. Furthermore, the C–V hysteresis reveals the possibility of stress-effect, suggesting that it is possible to use HfO₂ to build an MOS structure with controllable C–V windows for memory devices. The leakage current decreases as the film thickness increases and a relatively low leakage current density has been achieved with the HfO₂ film of 65 nm.     

Low temperature UV/ozone oxidation formation of HfSiON gate dielectric

Physical and electrical properties of hafnium silicon oxynitride (HfSi_xO_yN_z) dielectric films prepared by UV ozone oxidation of hafnium silicon nitride (HfSiN) followed by annealing to 450 °C are reported. Interfacial layer growth was minimized through room temperature deposition and subsequent ultraviolet/ozone oxidation. The capacitance–voltage (C–V) and current–voltage (I–V) characteristics of the as-deposited and annealed HfSi_xO_yN_z are presented. These 4 nm thick films have a dielectric constant of 8–9 with 12 at.% Hf composition, with a leakage current density of 3×10⁻⁵ A/cm² at V_fb+1 V. The films have a breakdown field strength >10 MV/cm.     

Doping and electrical characteristics of in-situ heavily B-doped Si1−x−yGexCy films epitaxially grown using ultraclean LPCVD

Doping and electrical characteristics of in-situ heavily B-doped Si_1−x−yGe_xC_y (0.22<x<0.6, 0<y<0.02) films epitaxially grown on Si(100) were investigated. The epitaxial growth was carried out at 550°C in a SiH₄–GeH₄–CH₃SiH₃–B₂H₆–H₂ gas mixture using an ultraclean hot-wall low-pressure chemical vapor deposition (LPCVD) system. It was found that the deposition rate increased with increasing GeH₄ partial pressure, and only at high GeH₄ partial pressure did it decrease with increasing B₂H₆ as well as CH₃SiH₃ partial pressures. With the B₂H₆ addition, the Ge and C fractions scarcely changed and the B concentration (C_B) increased proportionally. The C fraction increased proportionally with increasing CH₃SiH₃ partial pressures. These results can be explained by the modified Langmuir-type adsorption and reaction scheme. In B-doped Si_1−x−yGe_xC_y with y=0.0054 or below, the carrier concentration was nearly equal to C_B up to approximately 2×10²⁰ cm⁻³ and was saturated at approximately 5×10²⁰ cm⁻³, regardless of the Ge fraction. The B-doped Si_1−x−yGe_xC_y with high Ge and C fractions contained some electrically inactive B even at the lower C_B region. Resistivity measurements show that the existence of C in the film enhances alloy scattering. The discrepancy between the observed lattice constant and the calculated value at the higher Ge and C fraction suggests that the B and C atoms exist at the interstitial site more preferentially.     

Electrical properties of sol-gel processed barium titanate films

The sol-gel technique has been used to prepare ferroelectric barium titanate (BaTiO₃) films. The electrical properties of the films have been investigated systematically. The room temperature dielectric constant (ε) and loss tangent (tanδ) at 1 kHz were respectively found to be 370 and 0.012. Both ε and tanδ showed anomaly peaks at 125°C. The room temperature remanant polarization (P_r) and coercive field (E_c) were found to be 3.2 μC/cm² and 30 kV/cm, respectively. The capacitance–voltage (C–V) and conductance–voltage (G–V) characteristics also showed hysteresis effect. The temperature variation of C–V and G–V characteristics also confirms the ferroelectric to paraelectric phase transition at 125°C.     

Microstructure, crystallinity, and properties of low-pressure MOCVD-grown europium oxide films

A study of growth, structure, and properties of Eu₂O₃ thin films were carried out. Films were grown at 500–600 °C temperature range on Si(1 0 0) and fused quartz from the complex of Eu(acac)₃·Phen by low pressure metalorganic chemical vapor deposition technique which has been rarely used for Eu₂O₃ deposition. These films were polycrystalline. Depending on growth conditions and substrates employed, these films had also possessed a parasitic phase. This phase can be removed by post-deposition annealing in oxidizing ambient. Morphology of the films was characterized by well-packed spherical mounds. Optical measurements exhibited that the bandgap of pure Eu₂O₃ phase was 4.4 eV. High frequency 1 MHz capacitance–voltage (C–V) measurements showed that the dielectric constant of pure Eu₂O₃ film was about 12. Possible effects of cation and oxygen deficiency and parasitic phase on the optical and electrical properties of Eu₂O₃ films have been briefly discussed.     

Fabrication of a depletion mode GaAs MOSFET using Al2O3 as a gate insulator through the selective wet oxidation of AlAs

A 1 μm thick undoped GaAs buffer layer, a 1500 Å thick n-type GaAs layer, an undoped 500 Å thick AlAs layer and a 50 Å thick GaAs cap layer were consecutively grown by molecular beam epitaxy (MBE) on a [100] oriented semi-insulating GaAs substrate. The AlAs layer was oxidized in a N₂ bubbled H₂O vapor ambient at 400°C for 3 h and fully converted to Al₂O₃ for use as a gate insulator. The I–V characteristics, having a maximum drain current of 10.6 mA, a current cut-off voltage of −4.5 V and a maximum transconductance value of 11.25 mS/mm, indicate that the selective wet thermal oxidation of AlAs/GaAs was successful in producing a depletion mode GaAs MOSFET.     

Dark and photoelectric conversion properties of p-MgPc/n-Si (Organic/Inorganic) heterojunction cells.

Heterojunction cells of p-MgPc/n-Si have been fabricated by thermal evaporation of MgPc thin films onto Si100 single crystal wafers. The devices exhibit strong photovoltaic characteristics with an open–circuit voltage of 0.35 V, a short–circuit current of 3.57 mA and a power conversion efficiency of 1.05%. These parameters have been estimated at room temperature and under a monochromatic illumination of 633 nm with an input power density of 50 mW/cm². The activation energy of the charge carriers of 0.32 eV and the cell series resistance of 2 kΩ have been evaluated from the measurements of the dark I–V characteristics. A free–carrier concentration of 2.2×10¹⁶ cm⁻³ and a barrier width of 75 nm have been estimated from C–V measurements. The temperature dependence of photocurrent, at constant illumination, has been also investigated.     

The formation of a SiOx interfacial layer on low-k SiOCH materials fabricated in ULSI application

The characterizations of SiOCH films using oxygen plasma treatment depends linearly on the O₂/CO flow rate ratio. According to the results of Fourier transform infrared spectroscopy (FTIR) and X-ray photoelectron spectroscopy (XPS) analyses, it was found that the carbon composition decreases with increasing O₂/CO flow rate ratio, because more carbon in the Si–O–C and Si–CH₃ bonds on the film surface would be converted by oxygen radicals. It was believed that the oxygen plasma could oxidize the SiOCH films and form a SiO_x interfacial capping layer without much porosity. Moreover, the result of FTIR analysis revealed that there was no water absorbed on the film. A SiO₂-like capping layer formed at the SiOCH film by the O₂/CO flow rate ratio of 0.75 had nearly the same dielectric properties from the result of capacitance–voltage (C–V) measurement in our research.     

Temperature-independent electron tunneling injection in tris (8-hydroxyquinoline) aluminum thin film from high-work-function gold electrode

We fabricated electron-only tris (8-hydroxyquinoline) aluminum (Alq₃) single-layer devices with a device structure of glass substrate/MgAg anode (100 nm)/Alq₃ layer (100 nm)/metal cathode (100 nm), and systematically varied the work functions (WF) of the metal cathodes from WF = − 1.9 (Cs) to − 2.9 (Ca), − 3.8 (Mg), − 4.4 (Al), − 4.6 (Ag), and − 5.2 eV (Au) to investigate how electron injection barriers at the cathode/Alq₃ interfaces influence their current density–voltage (J–V) characteristics. We found that current densities at a certain driving voltage decrease and the temperature dependence of J–V characteristics of the devices gradually becomes weaker as the work functions of the metal cathodes are decreased. The device with the highest-work-function Au cathode exhibited virtually temperature-independent J–V characteristics, suggesting that a current flow mechanism of this device is mainly controlled by electron tunneling injection at the Au/Alq₃ interface.     

Highly conducting doped poly-Si deposited by hot wire CVD and its applicability as gate material for CMOS devices

Highly conducting p- and n-type poly-Si:H films were deposited by hot wire chemical vapor deposition (HWCVD) using SiH₄+H₂+B₂H₆ and SiH₄+H₂+PH₃ gas mixtures, respectively. Conductivity of 1.2×10² (Ω cm)⁻¹ for the p-type films and 2.25×10² (Ω cm)⁻¹ for the n-type films was obtained. These are the highest values obtained so far by this technique. The increase in conductivity with substrate temperature (T_s) is attributed to the increase in grain size as reflected in the atomic force microscopy results. Interestingly conductivity of n-type films is higher than the p-type films deposited at the same T_s. To test the applicability of these films as gate contact Al/poly-Si/SiO₂/Si capacitor structures with oxide thickness of 4 nm were fabricated on n-type c-Si wafers. Sputter etching of the poly-Si was optimized in order to fabricate the devices. The performance of the HWCVD poly-Si as gate material was monitored using C–V measurements on a MOS test device at different frequencies. The results reveal that as deposited poly-Si without annealing shows low series resistance.     

Amorphous semiconducting film containing nanometer particles of CuTCNQ: preparation, characterization and electrical switching property

An amorphous functional organometallic semiconducting thin film containing nanometer particles of a CuTCNQ charge-transfer complex was prepared and characterized by UV-VIS-NIR spectral analysis, Fourier transform infrared (FTIR) spectral analysis, Fourier transform Raman spectral analysis and I–V characterization. All of the spectral analyses are identical to those of both chemically synthesized pure CuTCNQ powder produced by the reaction of CuI and TCNQ, and the solution-grown polycrystalline films. I–V characteristics showed a memory switching property in the amorphous film material sandwiched between two metal electrodes of Al and Cu at a electric field strength of about 7 000 V cm⁻¹.     

Properties of GaAs solar cells coated with diamondlike carbon films

Thin films of amorphous diamondlike carbon (a:DLC) were deposited on GaAs solar cells, with and without antireflecting coating. The films were deposited by decomposition of CH₄ plasma using a r.f. generator (13.56 MHz). The reflected light from these cells, in the visible light, decreased after deposition of a:DLC film thickness (from 33% for t=0 nm to 14% for t=60 nm) which indicates antireflecting properties. The I–V measurements show an increase of the short circuit current (I_sc) with films thickness up to t40–60 nm, where it reaches a maximum and then decreases for higher thickness (t>60 nm). The efficiency (η) of the cells, as a function of the a:DLC thickness, shows a maximum value of 15% for t=50 nm. It was also shown, that the a:DLC films is a useful material as a protecting material for cells for operation in an abrasive environment. In abrasive environment, the efficiency of the coated cell maintains the level of about 12% whereas the efficiency of uncoated cells drop sharply from 15.5% to 6%.     

Infrared optical properties of Bi2Ti2O7 thin films by spectroscopic ellipsometry

Bi₂Ti₂O₇ thin films have been grown directly on n-type GaAs (1 0 0) by the chemical solution decomposition technique. X-ray diffraction analysis shows that the Bi₂Ti₂O₇ thin films are polycrystalline. The optical properties of the thin films are investigated using infrared spectroscopic ellipsometry (3.0–12.5 μm). By fitting the measured ellipsometric parameter (Ψ and Δ) data with a three-phase model (air/Bi₂Ti₂O₇/GaAs), and Lorentz–Drude dispersion relation, the optical constants and thickness of the thin films have been obtained simultaneously. The refractive index and extinction coefficient increase with increasing wavelength. The fitted plasma frequency ω_p is 1.64×10¹⁴ Hz, and the electron collision frequency γ is 1.05×10¹⁴ Hz, and it states that the electron average scattering time is 0.95×10⁻¹⁴ s. The absorption coefficient variation with respect to increasing wavelength has been obtained.     

Preparation and characterization of YBa2Cu3O7−x high Tc superconducting thin films deposited by S-gun sputtering

We have prepared YBa₂Cu₃O_7−x high T_c superconducting (HTS) thin films on (100) yttria-stabilized zirconia (YSZ) and LaAlO₃ (LAO) substrates, using a 2 kW S-gun in an off-axis mode. By varying the temperature of the substrates, films with a axis and c axis orientations were readily obtained. The X-ray diffraction pattern and Laue pattern confirmed that films with a axis orientation exhibited a single-crystal texture. All films had a good mirror-like surface. For films grown on YSZ substrates, scanning electron microscopy (SEM) revealed a clear distinction between the surfaces of the films grown at various temperatures (520–780°C). Films grown on LAO substrates exhibited even smoother and flatter surfaces. The SEM changes will be discussed in correlation with J_c. The best HTS thin films were obtained on LAO substrates at a temperature of 820°C, with T_c=89 K and J_c=1×10⁶ A cm^-2 (77 K).     

Fabrication and characterization of (1−x)SrBi2Ta2O9–xBi3TaTiO9 layered structure solid solution thin films for ferroelectric random access memory (FRAM) applications

We report on the properties of (1−x)SrBi₂Ta₂O₉–xBi₃TaTiO₉ solid solution thin films for ferroelectric non-volatile memory applications. The solid solution thin films fabricated by modified metalorganic solution deposition technique showed much improved properties compared to SrBi₂Ta₂O₉. A pyrochlore free crystalline phase was obtained at a low annealing temperature of 600°C and grain size was found to be considerably increased for the solid solution compositions. The film properties were found to be strongly dependent on the composition and annealing temperatures. The measured dielectric constant of the solid solution thin films was in the range 180–225 for films with 10–50% of Bi₃TaTiO₉ content in the solid solution. Ferroelectric properties of (1−x)SrBi₂Ta₂O₉–xBi₃TaTiO₉ thin films were significantly improved compared to SrBi₂Ta₂O₉. For example, the observed remanent polarization (2P_r) and coercive field (E_c) values for films with 0.7SrBi₂Ta₂O₉–0.3Bi₃TaTiO₉ composition, annealed at 650°C, were 12.4 μC/cm² and 80 kV/cm, respectively. The solid solution thin films showed less than 5% decay of the polarization charge after 10¹⁰ switching cycles and good memory retention characteristics after about 10⁶ s of memory retention. The improved microstructural and ferroelectric properties of (1−x)SrBi₂Ta₂O₉–xBi₃TaTiO₉ thin films compared to SrBi₂Ta₂O₉, especially at lower annealing temperatures, suggest their suitability for high density FRAM applications.     

Magnetic properties of Fe---SiO films

The results of an experimental investigation of the magnetic properties of Fe_100−x(SiO)_x cermet thin films (where x is the volume percentage of SiO in the film) in the concentration range 10 vol.% x 93 vol.% are given. The films were synthesized using the vacuum deposition method. Films with a sufficiently large SiO content (x 25–40 vol.%) are amorphous and display a number of new properties. A T−x phase diagram of the ferromagnet-superparamagnet transition was obtained. A transition to the cluster glass state was found at low temperatures and fields. The correlation radius of the exchange parameter fluctuations was determined from measurements of the spin wave resonance at a number of concentrations.     

Structural, chemical, and electrical characterisation of reactively sputtered WSx thin films

WS_x films were sputter-deposited on Si, SiO₂/Si, and glass substrates from a WS₂ target in an Ar/H₂S atmosphere. Their structure, morphology, chemical composition, and electrical properties were investigated as a function of deposition parameters such as working pressure and H₂S fraction. Films could be grown in the composition range WS_0.3−WS_3.5. Crystallisation was achieved at substrate temperatures T_s > 70 °C and compositions 0.7 ≤ x ≤ 1.95. While the first 5–50 nm near the interface exhibited a basal orientation (c), further growth resulted in the formation of edge-oriented platelets (c) giving rise to a porous, lamellar microstructure. The crystalline structure was mainly turbostratic, while some degree of ordered stacking was present in samples grown at high substrate temperature (600 °C). Resistivity measurements showed a semiconductor-type temperature dependence characterised by activation energies up to 95 meV. Sheet resistance was found to be nearly independent of film thickness, suggesting that the main carrier transport takes place in an interfacial layer of about 20 nm in thickness.     

Preparation of Pt-PtOx thin films as electrode for memory capacitors

Pt-PtO_x thin films were prepared on Si(100) substrates at temperatures from 30 to 700°C by reactive r.f. magnetron sputtering with platinum target. Deposition atmosphere was varied with O₂/Ar flow ratio. The deposited films were characterized by X-ray diffraction, X-ray photoelectron spectroscopy and scanning electron microscopy. Resistively of the deposited films was measured by d.c. four probe method. The films mainly consisted of amorphous PtO and Pt₃O₄ (or Pt₂O₃) below 400°C, and amorphous Pt was increased in the film as a deposition temperature increased to 600°C. When deposition temperature was thoroughly increased, (111) oriented pure Pt films were formed at 700°C. Compounds included in the films strongly depended on substrate temperature rather than O₂/Ar flow ratio. Electrical resistivity of Pt-PtO_x films was measured to be from the order of 10⁻¹ Ω cm to 10⁻⁵ Ω cm, which was related to the amount of Pt phase included in the deposited films.     

Stress variation in epitaxial GaAs films on silicon under thermal treatment

High quality epitaxial GaAs films of 1.8 and 6.3 μm thickness on silicon substrates were examined for lattice distortion, misalignment and curvature by X-ray diffraction (Bond method) at 20–400 °C. These films were deposited by the metal-organic chemical vapour deposition method on the (001) plane of silicon using a buffer layer produced at T_b = 370 or 460 °C. A top layer was then grown at T_t = 560 or 650 °C. The GaAs films contract more strongly on cooling than the substrate, which causes a curvature and a tetragonal distortion below a critical temperature T_c. This temperature varies on thermal treatment at 200–400 °C and approaches T_b, the growth temperature of the buffer layer. The tetragonal distortion can be stabilized, so that T_c approximates T_b, if the GaAs films are annealed for several days at 400 °C.