<Emphasis Type="Italic">C-V</Emphasis> and <Emphasis Type="Italic">I-V</Emphasis> characteristics of ultrathin-oxide MOS structures: Identification and analysis

For an NMOS structure with 3.7-nm-thick oxide, dynamic I-V characteristics are digitally measured by applying an upward and a downward gate-voltage ramp. An averaging procedure is employed to deduce the tunneling (active) current component and the quasi-static C-V characteristic (CVC). Analyzing the depletion segment of the CVC provides reliable values of the semiconductor doping level, the oxide capacitance and thickness, and the sign and density of oxide-fixed charge, as well as estimates of the dopant concentration in the poly-Si region. These data are used to identify the Ψ_s(V _g), V _i(V _g), and I _t(V _i) characteristics, where Ψ_s is the n-Si surface potential, V _i is the voltage drop across the oxide, V _g is the gate voltage, and I _t is the tunneling current; the gate-voltage range explored extends to prebreakdown fields (～13 MV cm^?1). The results are obtained without recourse to fitting parameters and without making any assumptions as to the energy spectrum of electrons tunneling from the n-Si deep-accumulation region through the oxide. It is believed that experimental I _t-V _i and Ψ_s-V _g characteristics will provide a basis for developing a theory of tunneling covering not only the degeneracy and size quantization of the electron gas in the semiconductor but also the nonclassical profile of the potential barrier to electron tunneling associated with the oxide-fixed charge.     

Work Function Tuning and Doping Optimization of 22-nm HKMG Raised SiGe/SiC Source–Drain FinFETs

The basic requirements on process design of extremely scaled devices involve appropriate work function and tight doping control due to their significant effect on the threshold voltage as well as other critical electrical parameters such as drive current and leakage. This paper presents a simulation study of 22-nm fin field-effect transistor (FinFET) performance based on various process design considerations including metal gate work function (WF), halo doping (N _halo), source/drain doping (N _sd), and substrate doping (N _sub). The simulations suggest that the n-type FinFET (nFinFET) operates effectively with lower metal gate WF while the p-type FinFET (pFinFET) operates effectively with high metal gate WF in 22-nm strained technology. Further investigation shows that the leakage reduces with increasing N _halo, decreasing N _sd, and increasing N _sub. Taguchi and Pareto analysis-of-variance approaches are applied using an L₂₇ orthogonal array combined with signal-to-noise ratio analysis to determine the best doping concentration combination for 22-nm FinFETs in terms of threshold voltage (V _t), saturation current (I _on), and off-state current (I _off). Since there is a tradeoff between I _on and I _off, the design with the nominal-is-best V _t characteristic is proposed, achieving nominal V _t of 0.259 V for the nFinFET and ?0.528 V for the pFinFET. Pareto analysis revealed N _halo and N _sub to be the dominant factor for nFinFET and pFinFET performance, respectively.     

Special features of radiation-defect annealing in silicon <Emphasis Type="Italic">p-n</Emphasis> structures: The role of Fe impurity atoms

Deep-level transient spectroscopy is used to study the formation of complexes that consist of a radiation defect and a residual impurity atom in silicon. It is established that heat treatment of the diffused Si p⁺-n junctions irradiated with fast electrons lead to the activation of a residual Fe impurity and the formation of the FeVO (E_0.36 trap) and FeV₂ (H_0.18 trap) complexes. The formation of these traps is accompanied by the early (100–175°C) stage of annealing of the main vacancy-related radiation defects: the A centers (VO) and divacancies (V₂). The observed complexes are electrically active and introduce new electron (E_0.36: E _t ^e =E _c -0.365 eV, σ _n =6.8×10^?15 cm²) and hole (H_0.18: E _t ^h =E _v +0.184 eV, σ _p =3.0×10^?15 cm²) levels into the silicon band gap and have a high thermal stability. It is believed that the complex FeVO corresponds to the previously observed and unidentified defects that have an ionization energy of E _t ^e =E _c ?(0.34–0.37) eV and appear as a result of heat treatment of irradiated diffused Si p⁺-n junctions.     

Electron transport in unipolar heterostructure transistors with quantum dots in strong electric fields

A model for the explaining specific features of the electron transport in strong electric fields in the quantum-dot unipolar heterostructure transistor (AlGaAs/GaAs/InAs/GaAs/InAs) is presented. It is shown that the two-step shape of the output current-voltage characteristic I _D (V _D ) and the anomalous dependence of the drain current I _D on the gate voltage V _G are caused by the ionization of quantum dots in the strong electric field at the drain gate edge. The ionization of quantum dots sets in at the drain voltage V _D that exceeds the V_D1 value, at which the I _D (V _D ) dependence is saturated (the first step of the I-V characteristic). With the subsequent increase in V _D , i.e., for V _D >V_D1, the I _D (V _D ) dependence has a second abrupt rise due to the ionization of quantum dots, and then, for V _D =V_D2>V_D1, the current I _D is saturated for the second time (the second step in the current-voltage characteristic). It is suggested to use this phenomenon for the determining the population of quantum dots with electrons. The model presented also describes the twice-repeated variation in the sign of transconductance g _m =dI _D /dV _G as a function of V _G .     

Electron mobility in the inversion layers of fully depleted SOI films

The dependences of the electron mobility μ_eff in the inversion layers of fully depleted double–gate silicon-on-insulator (SOI) metal–oxide–semiconductor (MOS) transistors on the density N _e of induced charge carriers and temperature T are investigated at different states of the SOI film (inversion–accumulation) from the side of one of the gates. It is shown that at a high density of induced charge carriers of N _e > 6 × 10¹² cm^–2 the μeff(T) dependences allow the components of mobility μ_eff that are related to scattering at surface phonons and from the film/insulator surface roughness to be distinguished. The μ_eff(N _e ) dependences can be approximated by the power functions μ_eff(N _e) ∝ N _e ^?n . The exponents n in the dependences and the dominant mechanisms of scattering of electrons induced near the interface between the SOI film and buried oxide are determined for different N _e ranges and film states from the surface side.     

Increase in the electron mobility in the inversion channel of a Si-MOS transistor in the case of ion polarization of the gate oxide

The effective mobility of electrons μ* in the inversion n-type channel of a field-effect transistor increases appreciably (as a result of space-charge ion polarization of the gate oxide) from the typical values of ?820 cm² V^?1 s^?1 to the values of ?2645 cm² V^?1 s^?1, which exceed the electron mobility in bulk silicon. After polarization, the sheet concentration of Na⁺ ions at the SiO₂/Si interface exceeds 6 × 10¹³ cm^?2. The ions are almost completely neutralized by electrons in the inversion channel. As temperature T is decreased in the range from 293 to 203 K, μ* increases according to the law μ* ∝ T ^?0.82. Apparently, the observed dependence μ*(T) is caused by the combined scattering of electrons by roughness of the Si/SiO₂ interface surface, phonons, and the interface states. Depolarization of the oxide reverts μ* to the initial value. Anomalously large values of μ* are assumed to be either a consequence of the origination of pronounced structural stresses in the surface Si layer due to the oxide polarization or a result of a phase reconstruction of the inversion-channel region due to hybridization of the wave functions of electrons localized at the Na⁺ ions with the wave functions of electrons in the inversion channel.     

Temperature dependences of the electrical parameters of anisotype NiO/CdTe heterojunctions

The I–V characteristics of NiO/CdTe heterostructures fabricated by reactive magnetron sputtering are measured at different temperatures. It is established that current transport through the NiO/CdTe heterojunction is mainly controlled via generation–recombination and tunneling under forward bias and via tunneling under reverse bias. The investigated heterostructures generate an open-circuit voltage of V _oc = 0.26 V and a short-circuit current density of I _sc = 58.7 μA/cm² at an illumination intensity of 80 mW/cm².     

Analog/RF Study of Self-aligned In<Subscript>0.53</Subscript>Ga<Subscript>0.47</Subscript>As MOSFET with Scaled Gate Length

This study presents the impact of gate length scaling on analog and radio frequency (RF) performance of a self- aligned multi-gate n-type In_0.53Ga_0.47As metal oxide semiconductor field effect transistor. The device is fabricated using a self-aligned method, air-bridge technology, and 8 nm thickness of the Al₂O₃ oxide layer with different gate lengths. The transconductance-to-normalized drain current ratio (g _m/I _D) method is implemented to investigate analog parameters. Moreover, g _m and drain conductance (g _D) as key parameters in analog performance of the device are evaluated with g _m/I _D and gate length variation, where g _m and g _D are both showing enhancement due to scaling of the gate length. Early voltage (V _EA) and intrinsic voltage gain (A _V) value presents a decreasing trend by shrinking the gate length. In addition, the results of RF measurement for cut-off and maximum oscillation frequency for devices with different gate lengths are compared.     

Modification of the properties of porous silicon on adsorption of iodine molecules

Infrared spectroscopy and electron spin resonance measurements are used to study the properties of porous silicon layers on adsorption of the I₂ iodine molecules. The layers are formed on the p-an n-Si single-crystal wafers. It is established that, in the atmosphere of I₂ molecules, the charge-carrier concentration in the layers produced on the p-type wafers can be noticeably increased: the concentration of holes can attain values on the order of ～10¹⁸?10¹⁹ cm^?3. In porous silicon layers formed on the n-type wafers, the adsorption-induced inversion of the type of charge carriers and the partial substitution of silicon-hydrogen bonds by silicon-iodine bonds are observed. A decrease in the concentration of surface paramagnetic defects, P _b centers, is observed in the samples with adsorbed iodine. The experimental data are interpreted in the context of the model in which it is assumed that both deep and shallow acceptor states are formed at the surface of silicon nanocrystals upon the adsorption of I₂ molecules.     

Study of RF transistor with submicron T-shaped gate fabricated by nanoimprint lithography

The results devoted to the development of a method for creating an RF transistor, in which a T-shaped gate is formed by nanoimprint lithography, are presented. The characteristics of GaAs p-HEMT transistors have been studied. The developed transistor has a gate “foot” length of the order of 250 nm and a maximum transconductance of more than 350 mS/mm. The maximum frequency of current amplification f _t is 40 GHz at the drain-source voltage V _DS = 1.4 V and the maximum frequency of the power gain f _max is 50 GHz at V _DS = 3 V.     

Features of the capacitance-voltage characteristics in a MOS structure due to the oxide charge

MOS structures based on p-and n-type silicon and subjected to the effect of voltages of both polarities with a magnitude as large as 70 V are studied. In all cases, an increase in the effective positive charge at the Si/SiO₂ boundary was observed. In the case of structures with p-Si, a steplike increase in the high-frequency capacitance in the inversion region at some value of the threshold voltage was observed. The increase in the capacitance and the threshold voltage were governed by the value of the effective charge and the area of the gate of the structure. The observed effect is accounted for by lateral diffusion of free electrons accumulated in the semiconductor in the vicinity of the gate contact. After completion of the effect of the voltage on the structures, the capacitance-voltage characteristics were recovered to the state close to the initial state in the relaxation time characteristic of reverse drift of ions and emission of charge carriers by tunneling from “slow” traps in the vicinity of the Si/SiO₂ interface.     

Conductivity of Ga<Subscript>2</Subscript>O<Subscript>3</Subscript>–GaAs Heterojunctions

The effect of annealing in argon at temperatures of T_an = 700–900°C on the I–V characteristics of metal–Ga₂O₃–GaAs structures is investigated. Samples are prepared by the thermal deposition of Ga₂O₃ powder onto GaAs wafers with a donor concentration of N _d = 2 × 10¹⁶ cm^–3. To measure theI–V characteristics, V/Ni metal electrodes are deposited: the upper electrode (gate) is formed on the Ga₂O₃ film through masks with an area of S _k = 1.04 × 10^–2 cm² and the lower electrode in the form of a continuous metallic film is deposited onto GaAs. After annealing in argon at T_an ≥ 700°C, the Ga₂O₃-n-GaAs structures acquire the properties of isotype n-heterojunctions. It is demonstrated that the conductivity of the structures at positive gate potentials is determined by the thermionic emission from GaAs to Ga₂O₃. Under negative biases, current growth with an increase in the voltage and temperature is caused by field-assisted thermal emission in gallium arsenide. In the range of high electric fields, electron phonon-assisted tunneling through the top of the potential barrier is dominant. High-temperature annealing does not change the electron density in the oxide film, but affects the energy density of surface states at the GaAs–Ga₂O₃ interface.     

Influence of parameters of the semiconductor–dielectric interface on the current of the guard ring of silicon photodiodes

Relationships, which determine requirements for the resistance of the inversion layer for decreasing the influence of the guard ring on the dark current and photodiode noisess and allow obtaining the specified intercoupling coefficient between photosensitive elements in multielement photodiodes, are given. It is shown that dependences of the current of the guard ring on the bias voltage and the charge on the Si–SiO₂ interface in the presence of the inversion layer satisfy the current generation model in the space-charge region of the current. The resistance of the inversion layer increase with an increase in the bias voltage in accordance with the relationship R_u ～ V^1.5.     

Structural and Electrical Properties of Ag/<Emphasis Type="Italic">n</Emphasis>-TiO<Subscript>2</Subscript>/<Emphasis Type="Italic">p</Emphasis>-Si/Al Heterostructure Fabricated by Pulsed Laser Deposition Technique

We have investigated the structural and electrical characteristics of the Ag/n-TiO₂/p-Si/Al heterostructure. Thin films of pure TiO₂ were deposited on p-type silicon (100) by optimized pulsed laser ablation with a KrF-excimer laser in an oxygen-controlled environment. X-ray diffraction analysis showed the formation of crystalline TiO₂ film having a tetragonal texture with a strong (210) plane as the preferred direction. High purity aluminium and silver metals were deposited to obtain ohmic contacts on p-Si and n-TiO₂, respectively. The current–voltage (I–V) characteristics of the fabricated heterostructure were studied by using thermionic emission diffusion mechanism over the temperature range of 80–300 K. Parameters such as barrier height and ideality factor were derived from the measured I–V data of the heterostructure. The detailed analysis of I–V measurements revealed good rectifying behavior in the inhomogeneous Ag/n-TiO₂/p-Si(100)/Al heterostructure. The variations of barrier height and ideality factor with temperature and the non-linearity of the activation energy plot confirmed that barrier heights at the interface follow Gaussian distributions. The value of Richardson’s constant was found to be 6.73 × 10⁵ Am^?2 K^?2, which is of the order of the theoretical value 3.2 × 10⁵ Am^?2 K^?2. The capacitance–voltage (C–V) measurements of the heterostructure were investigated as a function of temperature. The frequency dependence (Mott–Schottky plot) of the C–V characteristics was also studied. These measurements indicate the occurrence of a built-in barrier and impurity concentration in TiO₂ film. The optical studies were also performed using a UV–Vis spectrophotometer. The optical band gap energy of TiO₂ films was found to be 3.60 eV.     

Growth,structure, and properties of GaAs-based (GaAs)1–x–y (Ge2) x (ZnSe) y epitaxial films

The possibility of growing the (GaAs)_1–x–y (Ge₂) _x (ZnSe) _y alloy on GaAs substrates by the method of liquid-phase epitaxy from a tin solution–melt is shown. X-ray diffraction shows that the grown film is single-crystal with the (100) orientation and has the sphalerite structure. The crystal-lattice parameter of the film is a _f = 0.56697 nm. The features of the spectral dependence of the photosensitivity are caused by the formation of various complexes of charged components. It is established that the I–V characteristic of such structures is described by the exponential dependence I = I ₀exp(qV/ckT) at low voltages (no higher than 0.4 V) and by the power dependence J ~ V ^α, where the exponent α varies with increasing voltage at high voltages (V > 0.5 V). The results are treated within the framework of the theory of the drift mechanism of current transfer taking into account the possibility of the exchange of free carriers within the recombination complex.     

Mechanism of formation of the response of a hydrogen gas sensor based on a silicon MOS diode

Experimental data on the dependence of the flat-band voltage and relaxation time for the capacitance of the space-charge region in an MOS diode (Pd-SiO₂-n-Si) on the hydrogen concentration in a hydrogen/air gaseous mixture are discussed. It is assumed that variation in the flat-band voltage U _fb in an MOS structure with the thickness d = 369 nm subjected to a hydrogen/air gaseous mixture can be accounted for by the formation of dipoles in the Pd-SiO₂ gap due to polarization of hydrogen atoms (H _a ). An analytical expression describing the dependence of variation in the flat-band voltage ΔU _fb on the hydrogen concentration \(n_{H_2 } \) was derived. In MOS structures with d ≤ 4 nm (or MOS diodes), the value of ΔU _fb is mainly controlled by passivation of the centers responsible for the presence of the surface acceptor-type centers at the SiO₂-n-Si interface by hydrogen atoms. Analytical expressions describing the dependences of ΔU _fb and the capacitance relaxation time in the space-charge region on \(n_{H_2 } \) are derived. The values of the density of adsorption centers and the adsorption heat for hydrogen atoms at the Pd-SiO₂ and SiO₂-n-Si interfaces are found.     

Optically active centers in Si/Si<Subscript>1 − <Emphasis Type="Italic">x</Emphasis></Subscript>Ge<Subscript><Emphasis Type="Italic">x</Emphasis></Subscript>:Er heterostructures containing Er<Superscript>3+</Superscript> ions

The basic types of optically active erbium centers that make the major contribution to the photo-luminescence signal from the Si/Si_{1 ? x} Ge _x :Er heterostructures with the Ge content from 10 to 30% are analyzed in detail. It is shown that the origin of the optically active centers containing Er³⁺ ions correlates with the molar composition of the Si_{1 ? x} Ge _x :Er layer and the content of oxygen impurity in the layer. The major contribution to the photoluminescence signal from the Si/Si_{1 ? x} Ge _x :Er heterostructures with the Ge content below 25% is made by the well-known centers containing Er³⁺ ions and oxygen. An increase in the Ge content in the Si_{1 ? x} Ge _x :Er layer (x ≥ 25%) yields the formation of a new type of centers, specifically, the Gecontaining optically active erbium centers unobserved in the Si-based structures previously.     

Effect of Dislocation-related Deep Levels in Heteroepitaxial InGaAs/GaAs and GaAsSb/GaAs <Emphasis Type="Italic">p</Emphasis>–<Emphasis Type="Italic">i</Emphasis>–<Emphasis Type="Italic">n</Emphasis> Structures on the Relaxation time of Nonequilibrium Carriers

The results of an experimental study of the capacitance–voltage (C–V) characteristics and deep-level transient spectroscopy (DLTS) spectra of p⁺–p⁰–i–n⁰ homostructures based on undoped dislocationfree GaAs layers and InGaAs/GaAs and GaAsSb/GaAs heterostructures with homogeneous networks of misfit dislocations, all grown by liquid-phase epitaxy (LPE), are presented. Deep-level acceptor defects identified as HL2 and HL5 are found in the epitaxial p⁰ and n⁰ layers of the GaAs-based structure. The electron and hole dislocation-related deep levels, designated as, respectively, ED1 and HD3, are detected in InGaAs/GaAs and GaAsSb/GaAs heterostructures. The following hole trap parameters: thermal activation energies (E _t ), capture cross sections (σ _p ), and concentrations (N _t ) are calculated from the Arrhenius dependences to be E _t = 845 meV, σ _p = 1.33 × 10^–12 cm², N _t = 3.80 × 10¹⁴ cm^–3 for InGaAs/GaAs and E _t = 848 meV, σ _p = 2.73 × 10^–12 cm², N _t = 2.40 × 10¹⁴ cm^–3 for GaAsSb/GaAs heterostructures. The concentration relaxation times of nonequilibrium carriers are estimated for the case in which dislocation-related deep acceptor traps are involved in this process. These are 2 × 10^–10 s and 1.5 × 10^–10 s for, respectively, the InGaAs/GaAs and GaAsSb/GaAs heterostructures and 1.6 × 10^–6 s for the GaAs homostructures.     

On the photoconductivity of TlInSe<Subscript>2</Subscript>

The current–voltage (I–V) and photocurrent–light intensity (I _pc –Φ) characteristics and the photoconductivity relaxation kinetics of TlInSe₂ single crystals are investigated. Anomalously long relaxation times (τ ≈ 10³ s) and some other specific features of the photoconductivity are observed, which are explained within the barrier theory of inhomogeneous semiconductors. The heights of the drift and recombination barriers are found to be, respectively, E _dr ≈ 0.1 eV and E _r ≈ 0.45 eV.     

Surface roughness and magnetic properties of Co/SiO<Subscript>2</Subscript>/Si(100) polycrystalline films deposited via DC magnetron sputtering

For polycrystalline films of cobalt that have the thickness t ≈ 1.3–133 nm and that are deposited via DC magnetron sputtering on SiO₂(0.1 μm)/Si(100) substrates, surface-roughness root-mean-square amplitude σ and surface correlation length ξ, which characterize the roughness of film surfaces, as well as saturation magnetization 4πM ₀, width of ferromagnetic-resonance line ΔH, coercitivity H _C, and saturation fields H _S, are studied as functions of film thickness t. It is shown that the behavior of dependences H _C(t) and H _S(t) coincides with the behavior of dependence σ(t)/t, whereas the behavior of 4πM ₀(t) depends on ratio t/σ(t). The dependence of the FMR line width on the film thickness, ΔH(t), is characterized by a minimum of ΔH ≈ 60 Oe present in the region of thicknesses of 30 to 60 nm. The behavior of dependence ΔH(t) is determined by ratio σ(t)/t at small thicknesses t ≤ 5 nm and by the behavior of σ(t) at t ≥ 5 nm.