A 64-kbit block addressed charge-coupled memory

This paper describes the design and performance of a 64-kbit (65 536 bits) block addressed charge-coupled serial memory. By using the offset-mask charge-coupled device (CCD) electrode structure to obtain a small cell size, and an adaptive system approach to utilize nonzero defect memory chips, the system cost per bit of charge-coupled serial memory can be reduced to provide a solid-state replacement of moving magnetic memories and to bridge the gap between high cost random access memories (RAM's) and slow access magnetic memories. The memory chip is organized as 64K words by 1 bit in 16 blocks of 4 kbits. Each 4-kbit block is organized as a serial-parallel-serial (SPS) array. The chip is fully decoded with write/recirculate control and two-dimensional decoding to permit memory matrix organization with X-Y chip select control. All inputs and the ouput are TTL compatible. Operated at a data rate of 1 MHz, the mean access time is about 2 ms and the average power dissipation is 1 µW/bit. The maximum output data rate is 10 MHz, giving a mean access time of about 200 µs, and an average power dissipation of 10 µW/bit. The memory chip is fabricated using an n-channel polysilicon gate process. Using tolerant design rules (8-µm minimum feature size and ±2-µm alignment tolerance) the CCD cell size is 0.4 mil²and the total chip size is 218 × 235 mil². The chip is mounted in a 22-pin 400-mil wide ceramic dual in-line package.     

A 64-kbit block addressed charge-coupled memory

Describes the design and performance of a 64-kbit (65536 bits) block addressed charge-coupled serial memory. By using the offset-mask charge-coupled device (CCD) electrode structure to obtain a small cell size, and an adaptive system approach to utilize nonzero defect memory chips, the system cost per bit of charge-coupled serial memory can be reduced to provide a solid-state replacement of moving magnetic memories and to bridge the gap between high cost random access memories (RAM's) and slow access magnetic memories.     

A 64-kbit dynamic MOS RAM

A 64-kbit dynamic MOS RAM is developed by using 2 /spl mu/m rule VLSI fabrication technology and low power circuit technology. The 2 /spl mu/m rule VLSI fabrication technology is achieved by improving various aspects of the ultraviolet photolithographic, thin-gate oxidation, arsenic ion implantation, and multilevel interconnection processes. Microminiaturization of the device structure has made the voltage requirements for its MOST threshold voltage and DC supply voltages low. A highly sensitive and low power dissipating sense circuit has been developed for the VLSI RAM. A new level-detecting circuit with a logic threshold which is independent of MOST threshold voltage is proposed. A dynamic address-buffer circuit is also shown. The fabricated 64K RAM has 200 ns of access time, 370 ns of minimum cycle time, and 150 mW of power dissipation under typical supply voltage conditions of V/SUB DD/=7 V and V/SUB BB/=-2 V.     

A High-Speed 64-kbit CMOS RAM

The first memory of a high-performance CMOS 64K family, an 8K X 8 asynchronous static RAM, has been developed using a full CMOS six-transistor memory cell approach to reduce power consumption and enhance endurance in disturbed environments. New design techniques have been adopted to optimize both speed and power dissipation. Built on a self-aligned CMOS technology with 1.5-/spl mu/m design rules, the circuit reaches the size of 45 mm/sup 2/ and achieves access times of 35 ns under typical conditions. To improve fabrication yield of the memory, redundancy assistance has been utilized allowing correction of physical defects by column replacement.     

A 2-kbit superconducting memory chip

A 2-kb nondestructive readout memory chip has been built using an Nb/AlO_x/Nb Josephson-junction process with a 2.5-μm design rule. A bitmap of 56% functional cells among 1.5 K tested cells, a read access time of 200 ps, an average cycle time of 500 ps without the decoder, and a power dissipation of 1.6 mW including peripheral circuits have been obtained. The decoding time is estimated to be 540 ps. The circuits in this 5-mm by 5-mm, 24-pin chip includes 2 K memory cells, 6-b decoder and drivers, serial-to-parallel and parallel-to-serial converters, and circuits for design of testability or timing measurements. More than 14000 junctions are used on the chip     

适用于射频识别标签的64-kbit嵌入式阻变存储器

设计并实现了一颗适用于射频识别(RFID)标签的低功耗嵌入式64-kbit阻变存储器芯片.提出了新型的带尖峰电流控制功能的高压稳压电路,在提供稳定编程电压的同时降低了芯片电源上的瞬态大电流,改善了存储器电路的可靠性;设计了适用于2T2R(2 Transistors and 2 Resistive cells)单元的敏感...     

Hi-MNOS II technology for a 64-kbit byte-erasable 5-V-only EEPROM

Improved high-performance MNOS (HiMNOS II) technology has been developed for application to a byte-erasable 5-V only 64-kbit EEPROM. A minimum feature size of 2 µm and scaling theory implementation for the MNOS device have led to the realization of a small cell size of 180 µm², a low programming voltage of 16 V, and a high packing density of 64 kbits. The high-voltage structure of the MNOS device, as well as the high-voltage circuit technology, has been developed to eliminate dc programming current in the memory array and the high-voltage switching circuits for the use of on-chip generated programming voltage. This voltage is regulated with an accuracy of ± 1 V by using a Zener diode formed in a p-type well. Moreover, in order to accomplish reliable byte erasing, high-voltage switching circuits and their control logic have been carefully designed so as to eliminate the possibility of erroneous writing or erasing due to a timing skew of the high-voltage application to the memory cells. The obtained 64K EEPROM chip shows such superior characteristics as a fast access time of 150 ns, low power dissipation of 55 mA, high-speed write and erase times of less than 1 ms, and high endurance of less than 1-percent failure after 10⁴write/erase cycles.     

Hi-MNOS II Technology for a 64-kbit Byte-Erasable 5-V-Only EEPROM

Improved high-performance MNOS (HiMNOS II) technology has been developed for application to a byte-erasable 5-V only 64-kbit EEPROM. A minimum feature size of 2 /spl mu/m and scaling theory implementation for the MNOS device have led to the realization of a small cell size of 180/spl mu/m2, a low programming voltage of 16 V, and a high packing density of 64 kbits. The high-voltage structure of the MNOS device, as well as the high-voltage circuit technology, has been developed to eliminate dc programming current in the memory array and the high-voltage switching circuits for the use of on-chip generated programming voltage. This voltage is regulated with an accuracy of /spl plusmn/1 V by using a Zener diode formed in a p-type well. Moreover, in order to accomplish reliable byte erasing, high-voltage switching circuits and their control logic have been carefully designed so as to eliminate the possibility of erroneous writing or erasing due to a timing skew of the high-voltage application to the memory cells. The obtained 64K EEPROM chip shows such superior characteristics as a fast access time of 150 ns, low power dissipation of 55 mA, high-speed write and erase times of less than 1 ms, and high endurance of less than 1-percent failure after 10/sup 4/ write/erase cycles.     

A 16-kbit nonvolatile charge addressed memory

A 16-kbit nonvolatile charge addressed memory (NOVCAM) is described. A unique cell design allows a high-density memory array layout without reduced line widths or spacings. A cell size of 0.5 square mils is produced by a seven mask process with 6-/spl mu/m polysilicon gates, 10-/spl mu/m aluminum gates, and 10-/spl mu/m minimum spacing on all mask levels. Charge addressed write and read operations are implemented with a very simple interface between the memory array and a two-phase dynamic shift register. The memory is organized as 256 columns by 64 rows. Two 64-bit shift registers provide data access to the memory array via a 2:1 column decoder. With single polysilicon processing the memory array is 50/spl times/161 mils; the 16-kbit chip is 131/spl times/200 mils.     

A high-speed 16-kbit n-MOS random-access memory

This paper presents one version of a high-speed 16-kbit dynamic MOS random-access memory (RAM). This memory utilizes a one transistor cell with an area of 22/spl times/36 /spl mu/m/SUP 2/ which is fabricated using advanced n-channel silicon-gate MOS technology (5-/spl mu/m photolithography). The main feature of the design is a sense circuitry scheme, which allows a high speed (read access time of 200 ns) with low-power dissipation (600 mW at the 400-ns cycle time). The fully decoded memory is fabricated on a 5/spl times/7 mm/SUP 2/ chip and is assembled in a 22-lead ceramic dual-in-line package.     

A 16-kbit block addressed charge-coupled memory device

This paper describes the design and performance of a 16- kbit charge-coupled serial memory device. The memory is organized in four blocks of 4 kbits each with on-chip decoding and is mounted in a 16-pin ceramic dual-in-line hermetic package. Each 4-kbit block is organized as a serial-parallel-serial (SPS) array. Operated at a data rate of 1 MHz the mean access time is 2 ms and the on-chip power dissipation is calculated to be 1.5 µW/bit with another 0.5 µW/bit being required in off-chip clock drivers. The maximum designed output data rate is 10 MHz. Compared to the serpentine and loop organized memory charge-coupled device (CCD), the SPS organization has the advantages of lower power dissipation, greater tolerance to process parameter variations, and higher output data rate. All inputs and outputs are TTL compatible. Write/recirculate control is provided on the chip as well as two-dimensional decoding to permit memory matrix organization with X, Y chip select control. All the on-chip peripheral circuits use dynamic MOS circuitry to minimize power consumption. The charge sensing on the chip is achieved with balanced regenerative sense amplifiers. The memory array uses the three-phase three-level polysilicon electrode structure, and the chip is fabricated using an MOS n-channel polysilicon gate process with self-aligned source, drain, and channel stop.     

基于反熔丝结构的低成本嵌入式一次可编程4-kbit 存储器宏

A 4-kbit low-cost one-time programmable （OTP） memory macro for embedded applications is designed and implemented in a 0.18-μm standard CMOS process. The area of the proposed 1.5 transistor （1.5T） OTP cell is 2.13 μm2, which is a 49.3% size reduction compared to the previously reported cells. The 1.5T cell is fabricated and measured and shows a large programming window without any disturbance. A novel high voltage switch （HVSW） circuit is also proposed to make sure the OTP macro, implemented in a standard CMOS process, works reliably with the high program voltage. The OTP macro is embedded in negative radio frequency identification （RFID） tags. The full chip size, including the analog front-end, digital controller and the 4-kbit OTP macro, is 600 × 600 μm2. The 4-kbit OTP macro only consumes 200 × 260 μm^2. The measurement shows a 100% program yield by adjusting the program time and has obvious advantages in the core area and power consumption compared to the reported 3T and 2T OTP cores.     

A GaAs 1-kbit static RAM with a shallow recessed-gate structure FET

A novel GaAs FET structure, the shallow recessed-gate structure, has been proposed and applied to a 1-kbit static RAM. In order to decrease the source resistance Rsand gate capacitance Cg, the shallow n⁺implanted layer was formed between the gate and source/drain region; then the gate region was slightly recessed. This FET has a high transconductance gm, low source resistance Rs, small gate capacitance Cg, and small deviation of threshold voltagepart V_{th}, and thus is suitable for high-speed GaAs LSI's. A 1-kbit static RAM has been designed and fabricated applying this FET structure and an access time of 3.8 ns with 38- mW power dissipation has been obtained.     

A multiplexed 4 Mbit bubble memory device

A 4-Mbit magnetic bubble memory has been designed and demonstrated which is architecturally compatible with an 1-Mbit memory. The design goals for the memory were to achieve user software compatibility and pin-for-pin interchangeability. To achieve this, one key 4-Mbit device feature was additional multiplexing. This was obtained by a novel application of thin-film detectors and replicate generators along with other function designs. The result is a 4 bit/cycle write and read operation and a page length of 512 bits. The margins for the functions are shown to be comparable to those for the 1-Mbit process while the detector signal is over three times larger. The 1-Mbit process is extended to the 4-Mbit device by adding a thin permalloy level which requires one additional critical alignment and scaling geometries to give a 0.75-/spl mu/m minimum feature size on a 5.5-/spl mu/m square memory cell.     

CRISP: a pipelined 32-bit microprocessor with 13-kbit of cache memory

The implementation and architecture of a 172, 163-transistor single-chip general-purpose 32-b microprocessor is described. The 16-MHz chip is fabricated using a single-metal double-poly 1.75-/spl mu/m CMOS technology and is capable of a peak execution rate of over one instruction/clock. Multiple on-chip catches, pipelining, and a one-cycle I/O protocol are utilized.     

The use of submicrometer electron-beam lithography for fabricating 4-kbit CCD memory arrays

A 4-kbit CCD memory array has been fabricated using electron-beam lithography for the high-resolution patterns and projection lithography to define the low-resolution features. The basic CCD cell size is 3.2 µm × 4.2 µm consisting of a storage area 2.4 µm × 3.6 µm with a 0.8-µm barrier and a 0.6-µm channel stop. To make these small CCD's, as well as the associated short-channel MOSFET's, we modified the conventional MOS wafer processing. The new process for two-level polysilicon gates requires six electron-beam levels with a minimum resist feature of 0.3 µm. Alignment of the electron-beam patterns uses Ta benchmarks which we found to be compatible with MOS devices. Testing of the 4-kbit array and other shift resisters showed submicrometer channel-stops and barriers are feasible while maintaining low channel-to-channel crosstalk and charge-transfer efficiency greater than 0.9995. In addition, low capacitance output circuits defined by electron-beam lithography can detect the small number of charges in the high-resolution CCD's and amplify the signal sufficiently to recirculate the data.     

A fault-tolerant 64K dynamic random-access memory

A 64K dynamic MOS RAM with features and performance fully compatible with current 16K RAM's has been designed and characterized. The memory cell is a one-transistor-one-capacitor structure, standard except for a polysilicon bit line. A dual-32K architecture, along with partial selection and stepped recovery, holds power and peak current values below those of 16K parts. Spare rows and columns, which can be substituted for defective elements by the laser opening of polysilicon links, enhance yield. Worst case column enable access time of the memory is 100 ns, row enable access time is 170 ns, and only 128 cycles within 4 ms are needed to refresh the device.     

A high-speed MoSi2-gate 8-kbit read-only memory made with silicon-gate compatible processing

A high-speed n-channel MoSi2-gate 8-kbit E/D ROM was fabricated with a process similar to the Si gate process. The MoSi2gate ROM achieved higher operating speed than the poly Si gate ROM due to the lower distributed resistance of the interconnection lines. The result was in good agreement with the computor simulation result.     

A new dynamic random access memory cell using a bipolar MOS composite structure

A new dynamic random access memory (RAM) cell which incoperates an n-p-n bipolar junction transistor with an n-channel MOSFET in a composite structure, is proposed and investigated. In this novel cell called the BIMOS cell, the collector-base junction serves as a buried storage capacitor whereas the n-MOSFET as a transfer gate. The fabrication technology is simple and compatible with that of single-polysilicon CMOS IC's and a minimum cell size of 14.875F²with a minimum feature sizeFis realizable. The write, read, and standby operations of the cell are analyzed and simulated. An experimental cell is fabricated and characterized. Dynamic test is successfully performed. The investigation on the cell performance is also made. It has shown that large storage capacitance to bit-line capacitance ratio as well as fairly good packing density, soft-error immunity and leakage characteristics are expected. Furthermore, as compared to the conventional 1-transistor cell the new cell can be scaled down with less processing troubles and better performance improvements. Simple process and good scaled-down properties offer great potential for the proposed new cell to be used in the design of larger dynamic MOS RAM's.     

Characterisation of a new hump-free device structure for smart power and embedded memory technologies

A new device structure suitable for smart power and embedded memory technologies is presented that provides ideal hump-free subthreshold behaviour for shallow trench isolations by locally thickening the gate dielectric. This device structure is compared with an alternative approach to remove the hump effect, an improved process that reduces the oxide recess of the isolating trench. The new device offers a superior subthreshold slope. Emphasis has been placed not only on the hump effect but also on the reliability characterisation. The gate integrity of the new structure is comparable and only a minor degradation of the hot-carrier lifetime is observed. The new device structure provides an easy way to remove the hump without any change in the process and is applicable to every technology that offers more than one gate dielectric.