15～17GHz高精度单片数控移相器的研制

采用南京电子器件研究所4英吋0.25μmGa AsPHEMT工艺技术,设计、制作Ku波段Ga AsMMIC六位数控移相器芯片,芯片尺寸为3mm×1.1mm×0.1mm。在15～17GHz设计频带内,该移相器具有优良的电性能,插入损耗小于9dB,移相精度(RMS)小于1°,输入输出电压驻波比小于1.4。     

K-band HBT and HEMT monolithic active phase shifters using vector sum method

Two monolithic 3-bit active phase shifters using the vector sum method to K-band frequencies are reported in this paper. They are separately implemented using commercial 6-in GaAs HBT and high electron-mobility transistor (HEMT) monolithic-microwave integrated-circuit (MMIC) foundry processes. The MMIC HBT active phase shifter demonstrates an average gain of 8.87 dB and a maximum phase error of 11/spl deg/ at 18 GHz, while the HEMT phase shifter has 3.85-dB average measured gain with 11/spl deg/ maximum phase error at 20 GHz. The 20-GHz operation frequency of this HEMT MMIC is the highest among all the reported active phase shifters. The analysis for gain deviation and phase error of the active phase shifter using the vector sum method due to the individual variable gain amplifiers is also presented. The theoretical analysis can predict the measured minimum root-mean-square phase error 4.7/spl deg/ within 1/spl deg/ accuracy.     

Distributed 2- and 3-bit W-band MEMS phase shifters on glass substrates

This paper presents state-of-the-art RF microelectromechanical (MEMS) phase shifters at 75-110 GHz based on the distributed microelectromechanical transmission-line (DMTL) concept. A 3-bit DMTL phase shifter, fabricated on a glass substrate using MEMS switches and coplanar-waveguide lines, results in an average loss of 2.7 dB at 78 GHz (0.9 dB/bit). The measured figure-of-merit performance is 93/spl deg//dB-100/spl deg//dB (equivalent to 0.9 dB/bit) of loss at 75-110 GHz. The associated phase error is /spl plusmn/3/spl deg/ (rms phase error is 1.56/spl deg/) and the reflection loss is below -10 dB over all eight states. A 2-bit phase shifter is also demonstrated with comparable performance to the 3-bit design. It is seen that the phase shifter can be accurately modeled using a combination of full-wave electromagnetic and microwave circuit analysis, thereby making the design quite easy up to 110 GHz. These results represent the best phase-shifter performance to date using any technology at W-band frequencies. Careful analysis indicates that the 75-110-GHz figure-of-merit performance becomes 150/spl deg//dB-200/spl deg//dB, and the 3-bit average insertion loss improves to 1.8-2.1 dB if the phase shifter is fabricated on quartz substrates.     

A Millimeter-Wave (40–45 GHz) 16-Element Phased-Array Transmitter in 0.18-$mu$ m SiGe BiCMOS Technology

This paper demonstrates a 16-element phased-array transmitter in a standard 0.18-mum SiGe BiCMOS technology for Q-band satellite applications. The transmitter array is based on the all-RF architecture with 4-bit RF phase shifters and a corporate-feed network. A 1:2 active divider and two 1:8 passive tee-junction dividers constitute the corporate-feed network, and three-dimensional shielded transmission-lines are used for the passive divider to minimize area. All signals are processed differentially inside the chip except for the input and output interfaces. The phased-array transmitter results in a 12.5 dB of average power gain per channel at 42.5 GHz with a 3-dB gain bandwidth of 39.9-45.6 GHz. The RMS gain variation is < 1.3 dB and the RMS phase variation is < for all 4-bit phase states at 35-50 GHz. The measured input and output return losses are < -10 dB at 36.6-50 GHz, and <-10 dB at 37.6-50 GHz, respectively. The measured peak-to-peak group delay variation is plusmn 20 ps at 40-45 GHz. The output P_-1dB is -5plusmn1.5 dBm and the maximum saturated output power is - 2.5plusmn1.5 dBm per channel at 42.5 GHz. The transmitter shows <1.8 dB of RMS gain mismatch and < 7deg of RMS phase mismatch between the 16 different channels over all phase states. A - 30 dB worst-case port-to-port coupling is measured between adjacent channels at 30-50 GHz, and the measured RMS gain and phase disturbances due to the inter-channel coupling are < 0.15 dB and < 1deg, respectively, at 35-50 GHz. All measurements are obtained without any on-chip calibration. The chip consumes 720 mA from a 5 V supply voltage and the chip size is 2.6times3.2 mm².     

An X- and Ku-Band 8-Element Phased-Array Receiver in 0.18-$mu{hbox{m}}$ SiGe BiCMOS Technology

This paper demonstrates an 8-element phased array receiver in a standard 0.18-mum SiGe BiCMOS (1P6M, SiGe HBT f_t ap 150 GHz) technology for X- and Ku-band applications. The array receiver adopts the All-RF architecture, where the phase shifting and power combining are done at the RF level. With the integrations of all the digital control circuitry and ESD protection for all I/O pads, the receiver consumes a current of 100 ~ 200 m A from a 3.3 V supply voltage. The receiver shows 1.5 ~ 24.5 dB of power gain per channel from a 50 Omega load at 12 GHz with bias current control, and an associated NF of 4.2 dB (@ max. gain) to 13.2 dB (@ min. gain). The RMS gain error is < 0.9 dB and the RMS phase error is < 6deg at 6-18 GHz for all 4-bit phase states. The measured group delay is 162.5 plusmn 12.5 ps for all phase states at 6-18 GHz. The RMS phase mismatch and RMS gain mismatch among the eight channels are < 2.7deg and 0.4 dB, respectively, for all 16 phase states, over 6-18 GHz. The 8-element array can operate instantaneously at any center frequency and with a wide bandwidth (3 to 6 GHz, depending on the center frequency) given primarily by the 3 dB gain variation in the 6-18 GHz range. To our knowledge, this is the first demonstration of an All-RF phased array on a silicon chip with very low RMS phase and gain errors at 6-18 GHz. The chip size is 2.2 times 2.45 mm² including all pads.     

A Ku‐Band 5‐Bit Phase Shifter Using Compensation Resistors for Reducing the Insertion Loss Variation

This paper describes the performance of a Ku‐band 5‐bit monolithic phase shifter with metal semiconductor field effect transistor (MESFET) switches and the implementation of a ceramic packaged phase shifter for phase array antennas. Using compensation resistors reduced the insertion loss variation of the phase shifter. Measurement of the 5‐bit phase shifter with a monolithic microwave integrated circuit demonstrated a phase error of less than 7.5° root‐mean‐square (RMS) and an insertion loss variation of less than 0.9 dB RMS for 13 to 15 GHz. For all 32 states of the developed 5‐bit phase shifter, the insertion losses were 8.2 ± 1.4 dB, the input return losses were higher than 7.7 dB, and the output return losses were higher than 6.8 dB for 13 to 15 GHz. The chip size of the 5‐bit monolithic phase shifter with a digital circuit for controlling all five bits was 2.35 mm × 1.65 mm. The packaged phase shifter demonstrated a phase error of less than 11.3° RMS, measured insertion losses of 12.2 ± 2.2 dB, and an insertion loss variation of 1.0 dB RMS for 13 to 15 GHz. For all 32 states, the input return losses were higher than 5.0 dB and the output return losses were higher than 6.2 dB for 13 to 15 GHz. The size of the packaged phase shifter was 7.20 mm × 6.20 mm.     

A Low-Loss Ku-Band Monolithic Analog Phase Shifter

A GaAs monolithic Ku-band analog phase shifter integrating 90° branch line coupler with planar varactor diodes has been fabricated for the first time. A phase shift of 109° +- 3° with an insertion loss of 1.8+-0.3 dB was measured from 16 to 18 GHz. A 360° phase shifter with 4.2+-0.9 dB insertion loss was realized in the same frequency range by connecting three phase-shifter chips in series. To our knowledge, this is the lowest insertion loss obtained by a 360° Ku-band phase shifter using monolithic circuits. In addition, hyperabrupt varactors using nonuniform doping profiles increased the phase shift by more than 30° and produced a more linear dependence of phase shift on control voltage.     

一种X波段五位数字移相器的研究与设计

介绍了数字移相器的基本原理及设计方法。在ADS仿真环境下,基于GaAs HJ—FET开关器件,设计仿真了一种X波段五位数字移相器,大大降低了移相器的后期制作成本。利用矢量网络分析仪对制作的实物进行了测试,结果表明：在12—12．5GHz频段内,移相器的最大插损小于9．5dB,均方根相位误差在3°以内。     

2.4 GHz continuously variable ferroelectric phase shifters using all-pass networks

Continuously variable ferroelectric (BST on sapphire) phase shifters based on all-pass networks are presented. An all-pass network phase shifter consists of only lumped LC elements, and thus the total size of the phase shifter is kept to less than 2.2 mm /spl times/ 2.6 mm at 2.4 GHz. The tunability (C/sub max//C/sub min/) of a BST interdigital capacitor is over 2.9 with a bias voltage of 140 V. The phase shifter provides more than 121/spl deg/ phase shift with the maximum insertion loss of 1.8 dB and the worst case return loss of 12.5 dB from 2.4 GHz to 2.5 GHz. By cascading two identical phase shifters, more than 255/spl deg/ phase shift is obtained with the maximum insertion loss of 3.75 dB. The loss figure-of-merit of both the single- and double-section phase shifters is over 65/spl deg//dB from 2.4 GHz to 2.5 GHz.     

An X-band 22.5°/45° digital phase shifter based on switched filter networks

The design approach and performance of a 22.5°/45°digital phase shifter based on a switched filter network for X-band phased arrays are described. Both the MMIC phase shifters are fabricated employing a 0.25μm gate GaAs pHEMT process and share in the same chip size of 0.82×1.06 mm². The measurement results of the proposed phase shifters over the whole operating frequency range show that the phase shift error is less than 22.5°±2.5°, 45°±3.5°, which shows an excellent agreement with the simulated performance, the insertion loss is within the range of 0.9-1.2 dB for the 22.5°phase shifter and 0.9-1.4 dB for the 45°phase shifter, and the input/output return loss is better than -12.5 and -11 dB respectively. They also achieve the similar P_1dB continuous wave power handing capability of 24.8 dBm at 10 GHz. The phase shifters show a good phase shift error, insertion loss and return loss in the X-band (40%), which can be employed into the wide bandwidth multi-bit digital phase shifter.     

A CMOS K-Band Quadrature Generator

This letter presents a K-band quadrature signal generator in a standard 0.13 mu m CMOS process. The quadrature generator operates from 18 to 21 GHz. A maximum output power of -3.7 dBm (per I or Q channel) is achieved, and the down converted signal suppression is >25 dB at the operating bandwidth. A measured sideband rejection ratio >30 dB is achieved from 19 to 21 GHz, with a peak of >40 dB at 19.5-20.5 GHz. The current consumption of the quadrature generator is 49-54 mA from a 2-2.5 V supply with an effective chip area of 0.51times 0.44 mm² . To the author's knowledge, this is the first demonstration of a K-band quadrature signal generator with high spectral purity and quadrature accuracy.     

基于GaN HEMT工艺的高功率宽带6 bit数字移相器

基于GaN HEMT工艺研制了一款8～12.5 GHz宽带6 bit数字移相器.通过采用优化的宽带拓扑和集总元件,以及在片上集成GaN并行驱动器,提高了移相精度,缩小了芯片的尺寸,减少了控制端数量.测试结果表明,在8～12.5 GHz频带内,全部64个移相状态下,插入损耗小于11 dB,输入回波损耗小于-14 dB,输出回波损耗小于-16 dB,移相均方根误差小于1.8°,幅度变化均方根误差小于0.5 dB.在8 GHz频率下,1 dB压缩点输入功率高达33 dBm.芯片尺寸为5.05 mm×2.00 mm×0.08 mm.     

New miniature 15-20-GHz continuous-phase/amplitude control MMICs using 0.18-/spl mu/m CMOS technology

The design and performance of two new miniature 360/spl deg/ continuous-phase-control monolithic microwave integrated circuits (MMICs) using the vector sum method are presented. Both are implemented using commercial 0.18-/spl mu/m CMOS process. The first phase shifter demonstrates all continuous phase and an insertion loss of 8 dB with a 37-dB dynamic range from 15 to 20 GHz. The chip size is 0.95 mm /spl times/ 0.76 mm. The second phase shifter can achieve all continuous phase and an insertion loss of 16.2 dB with a 38.8-dB dynamic range at the same frequency range. The chip size is 0.71 mm /spl times/ 0.82 mm. To the best of the authors' knowledge, these circuits are the first demonstration of microwave CMOS phase shifters using the vector sum method with the smallest chip size for all MMIC phase shifters with 360/spl deg/ phase-control range above 5 GHz reported to date.     

一种6~18 GHz宽带高精度有源移相器

设计了一种6 bit 6~18 GHz工作频段的宽带高精度有源移相器。片上集成了输入无源巴伦、逻辑编码器、RC多相滤波器、矢量合成单元、数控单元等。该移相器的设计采用55 nm CMOS工艺实现,芯片尺寸为1.29 mm×0.9 mm,移相器核心尺寸为1.02 mm×0.58 mm。后仿结果表明,在6~18 GHz频率范围内,增益误差RMS值小于1 dB,相位误差RMS值小于0.75°,输入回波损耗、输出回波损耗分别小于-8.5 dB、-8.9 dB,芯片总功耗为20.7 mW。该6 bit移相器的相对带宽为100%,覆盖C、X和Ku波段,适用于雷达探测等领域。     

A Monolithic Phased Array Using 3-bit Distributed RF MEMS Phase Shifters

This paper presents a novel electronically scanning phased-array antenna with 128 switches monolithically implemented using RF microelectromechanical systems (MEMS) technology. The structure, which is designed at 15 GHz, consists of four linearly placed microstrip patch antennas, 3-bit distributed RF MEMS low-loss phase shifters, and a corporate feed network. MEMS switches and high-Q metal-air-metal capacitors are employed as loading elements in the phase shifter. The system is fabricated monolithically using an in-house surface micromachining process on a glass substrate and occupies an area of 6 cm times 5 cm. The measurement results show that the phase shifter can provide nearly 20deg/50deg/95deg phase shifts and their combinations at the expense of 1.5-dB average insertion loss at 15 GHz for eight combinations. It is also shown by measurements that the main beam can be steered to required directions by suitable settings of the RF MEMS phase shifters.     

A 2-bit RF MEMS phase shifter in a thick-film BGA ceramic package

The development of a thick-film hermetic BGA package for a radio-frequency (RF) microelectromechanical systems (MEMS) 2-bit phase shifter is presented. The measured packaged MEMS phase shifter average in-band insertion loss was 1.14 dB with an average return loss of 15.9 dB. The package transition insertion loss was less than 0.1 dB per transition with excellent agreement between simulated and measured results. It was also demonstrated that the RF MEMS phase shift performance could be improved to obtain a phase error of less than 3.3 degrees. The first reported measurements of the average rise and fall times associated with a MEMS circuit (in this case a 2-bit phase shifter) were 26 and 70 /spl mu/s, respectively. The advent of packaged RF MEMS phase shifters will reduce the cost (both design and building) of future phase arrays.     

A compact V-band 2-bit reflection-type MEMS phase shifter

Air-gap overlay CPW couplers and low-loss series metal-to-metal contact microelectromechanical system (MEMS) switches have been employed to reduce the loss of reflection-type MEMS phase shifters at V-band. Phase shift is obtained by changing the lengths of the open-ended stubs using series MEMS switches. A 2-bit [135] reflection-type MEMS phase shifter showed an average insertion loss of 4 dB with return loss better than 11.7 dB from 50 to 70 GHz. The chip is very compact with a chip size as small as 1.5 mm /spl times/ 2.1 mm.     

Design of a Reflection-Type Phase Shifter With Wide Relative Phase Shift and Constant Insertion Loss

reflection-type phase shifter with constant insertion loss over a wide relative phase-shift range is presented. This important feature is attributed to the salient integration of an impedance-transforming quadrature coupler with equalized series-resonated varactors. The impedance-transforming quadrature coupler is used to increase the maximal relative phase shift for a given varactor with a limited capacitance range. When the phase is tuned, the typical large insertion-loss variation of the phase shifter due to the varactor parasitic effect is minimized by shunting the series-resonated varactor with a resistor R_p. A set of closed-form equations for predicting the relative phase shift, insertion loss, and insertion-loss variation with respect to the quadrature coupler and varactor parameters is derived. Three phase shifters were implemented with a silicon varactor of a restricted capacitance range of C_v,_min = 1.4 pF and C_v,_max = 8 pF, wherein the parasitic resistance is close to 2 Omega. The measured insertion-loss variation is 0.1 dB over the relative phase-shift tuning range of 237deg at 2 GHz and the return losses are better than 20 dB, excellently agreeing with the theoretical and simulated results.     

Highly Linear Ku-Band SiGe PIN Diode Phase Shifter in Standard SiGe BiCMOS Process

This letter presents a fully integrated highly linear 4-bit SiGe PIN diode phase shifter MMIC for Ku-band phase-array application in the standard SiGe BiCMOS process. High-performance customized SiGe PIN diode switches are employed for high linearity and low insertion loss. The use of differential inductors in the hybrid switched filters makes this phase shifter compact in size. Measurements show 20 dB ${pm}5$ dB input/output return loss, less than ${pm} 1.8^{circ}$ phase variation, and maximum 37 dBm input-referred IP3 over the 14.5–15.5 GHz frequency range, while this phase shifter draws an average current of 3.5 mA from a 3.3 V power supply. To the authors' best knowledge, this 4-bit phase shifter MMIC achieves the highest linearity at Ku-band in the standard SiGe BiCMOS process without utilizing any post-fabrication process for low loss transmission lines.      

X波段GaN基小相位移相器设计

基于0.25 μm GaN HEMT工艺,设计并制作了X波段11.25°和22.5°的小相位移相器单片微波集成电路(MMIC),两个移相器单元均采用低通开关滤波型拓扑结构.最终芯片面积分别为0.9 mm× 1.05 mm和0.95 mm× 1.05 mm.芯片测试结果表明,两个小相位移相器性能良好,且测试结果与仿真结果吻合.在8 ～ 12 GHz频带内,11.25°和22.5°移相器电路的相移精度小于2.8°,输入回波损耗分别优于-15和-12 dB,插入损耗值分别小于1和1.5 dB,幅度波动分别小于0.8和1.3 dB.两个移相器电路的1 dB压缩点输入功率均大于36 dBm,其功率容限优于GaAs HEMT设计的移相器.结果表明,所设计的移相器具有优异的相移精度以及良好的功率性能,可广泛应用于高精度和大功率的雷达系统中.