一种NCITS 256协议超高频无源射频识别标签

设计了一种符合NCITS 256协议的无源超高频射频识别标签.标签携带2kbit的标准商用EEPROM.在读卡器发射功率为915MHz 4W EIRP的情况下,芯片的读距离为1.5m,写距离为0.3m.芯片在SMIC 0.18μm EEPROM CMOS工艺下流片实现,面积为1mm×1mm.标签使用Dickson倍压电路从读卡器发射的电磁波中提取能量.Dickson倍压电路使用肖特基管实现,转换效率为25%.     

低压低功耗无源UHF RFID标签芯片模拟前端电路的设计

本文从设计符合EPCTM C1G2协议的超高频无源射频识别标签芯片的角度出发,对RFID标签芯片模拟前端电路进行设计.通过对各个关键电路的功耗与电源进行优化,实现了一个符合协议要求的低电压、低功耗的超高频无源RFID标签芯片的模拟前端.该UHF RFID标签模拟前端设计采用SMIC 0.18 μm EEPROM CMOS工艺库.仿真结果表明,标签芯片模拟前端的整体功耗控制在2.5 μW以下,工作电源可低至1 V,更好地满足了超高频无源射频识别标签芯片应用需求.     

应用于低频无源RFID的低成本2 kbit EEPROM

基于350 nm 2-poly 3-metal EEPROM工艺，设计了一种应用于低频无源RFID的低成本2 kbit EEPROM存储器。在保证存储容量能满足大多数使用场景的情况下，通过优化Dickson电荷泵和读出电路的结构，实现电路版图面积的最小化，从而对整体电路实现低成本设计。优化后的Dickson电荷泵能实现10μs内从3.3 V到16 V的稳定升压，且功耗为334μW;读出电路基于检测NCG器件阈值电压的方式实现存储逻辑值的判别，该方法不需要能提供高精度电流的基准电路和具有高增益的灵敏放大器，有效降低了整体电路的面积。低成本2 kbit EEPROM的工作电压为3.3 V,能实现32位并行输入和1位串行输出，芯片总面积仅为0.14 mm²,有效降低了低频无源RFID设计复杂度和制造成本。     

无源UHF RFID芯片中低功耗基带处理器的设计

对UHF RFID标签芯片的数字基带处理器结构及工作原理进行了分析。该基带处理器兼容ISO18000-6C协议。采用一系列先进的低功耗技术,如门控时钟技术、减小工作电压、降低时钟频率等,以降低无源射频识别标签的功耗。整个标签芯片采用TSMC 0.18μm 1P5M嵌入式EEPROM混合CMOS工艺实现。测试结果表明,该芯片正常工作的最低电压仅为1 V,平均电流为6.8μA,功耗为6.8μW,面积仅为150μm×690μm。     

一种低功耗高频RFID标签芯片基带控制器

设计了一款应用于高频射频识别标签芯片的基带控制器。该基带控制器符合ISO15693标准协议,满足无源射频识别标签的低成本、低功耗的需求。详细论述了解码电路、命令响应模块及状态机、数据组织模块等关键电路的设计。芯片采用中芯国际0.35μm2P3M嵌入式EEPROM的混合信号CMOS工艺实现,基带控制器的Core面积仅为0.23mm2,功耗低至66.8μW。     

一种小型UHF RFID抗金属标签天线的设计

针对射频识别标签天线小型化、抗金属环境的实际需求,提出了一种可应用于金属环境的超高频射频识别标签天线.通过在矩形贴片上开槽来实现小型化,天线总尺寸为56 mm×50 mm×1.6 mm.通过改变槽的尺寸调节标签天线的输入阻抗,结合等效电路图分析抗金属标签天线的设计过程,从而方便地实现与标签芯片的共轭匹配.实验结果表明,实测和仿真结果比较吻合,标签阻抗匹配良好,实测最大读取距离达3.1m.与其他标签天线相比,该天线具有结构简单、成本低、易于实现和读取距离远等优势.     

一种13.56MHz无源射频识别模拟前端的设计

提出了一种基于ISO/IEC18000-3协议的高频13.56MHz射频识别(RFID)标签芯片的模拟前端电路结构,采用Chartered 0.35μm EEPROM工艺进行流片验证。该芯片实现了无源RFID标签芯片通信时所需的整流、稳压供电、时钟恢复、信号解调以及副载波调制的全部功能。     

基于RC522的RFID读卡器电路设计实现

设计一种基于MF RC522的射频读卡器,工作频率为13.56MHz。电路控制的核心部分采用STM32单片机实现,射频信号发送与接收采用集成射频读写芯片MF RC522完成,RS232串口实现了读卡器与上位机的通信连接,测量了周围无金属物时的最大读卡距离为60mm,高于MF RC522数据手册中给定的最大典型操作距离50mm,达到设计要求。     

一种PMOS管传输型高效电荷泵电路设计

设计了一种基于传统Dickson结构的PMOS管传输型电荷泵电路。电路通过衬底电位跟随器实现PMOS管传输,避免了传输过程中阈值电压损失;通过电阻分压反馈网络、控制振荡器输出达到稳压的目的;在电荷泵不工作时,各个子电路关断,实现低功耗设计。仿真结果表明,电路效率高,上电时间短,纹波小;采用SMIC 0.18μm工艺流片,电路达到设计要求,输出高压稳定,驱动能力强,在1M EEPROM电路芯片中得到实际应用。     

一种适用于无源超高频射频识别标签的低电压低功耗射频/模拟前端电路

提出了一种适用于无源超高频射频识别标签的低电压低功耗射频/模拟前端电路.通过引入一个使用亚阈值技术的基准源,电路实现了温度补偿,从而使得系统时钟在～40～100℃的范围内保持稳定.在模块设计中,提出了一些新的电路结构来降低系统功耗,其中包括一种零静态功耗的上电复位电路和一种新的稳压电路.该射频/模拟前端电路采用不带肖特基二极管0.18μm CMOS EEP-ROM工艺流片实现,它与数字基带、EEPROM一起实现了一个完整的标签芯片.测试结果表明,该芯片的最低电源电压要求为0.75V.在该最低电压下,射频/模拟前端电路的总电流为4.6μA.     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Development of the readout system for waveguide multilayer optical card

Waveguide multilayer optical card （WMOC） is a novel storage device of three-dimensional optical information. An advanced readout system fitting for the WMOC is introduced in this paper. The hardware mainly consists of the light source for reading, WMOC, motorized stages addressing unit, microscope imaging unit, CCD detecting unit and PC controlling ＆ processing unit. The movement of the precision motorized stage is controlled by the computer through Visual Basic （VB） language in software. A control panel is also designed to get the layer address and the page address through which the position of the motorized stages can be changed. The WMOC readout system is easy to manage and the readout result is directly displayed on computer monitor.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Collinear phase-matching study of terahertz-wave generation via difference frequency mixed in GaAs and Inp

The collinearly phase-matching condition of terahertz-wave generation via difference frequency mixed in GaAs and InP is theoretically studied. In collinear phase-matching, the optimum phase-matching wave hands of these two crystals are calculated. The optimum phase-matching wave bands in GaAs and lnP are 0.95-1.38μm and 0.7-0.96μm respectively. The influence of the wavelength choice of the pump wave on the coherent length in THz-wave tuning is also discussed. The influence of the temperature alteration on the phase-matching and the temperature tuning properties in GaAs crystal are calculated and analyzed. It can serve for the following experiments as a theoretical evidence and a reference as well.     

Effects of the alloy compositions on the phonon-polaritons in ternary mixed crystals

Composition dependence of bulk and surface phonon-polaritons in ternary mixed crystals are studied in the framework of the modified random-element-isodisplacement model and the Bom-Huang approximation. The numerical results for Several Ⅱ - Ⅵ and Ⅲ- Ⅴ compound systems are performed, and the polariton frequencies as functions of the compositions for ternary mixed crystals AlxGa1-xAs, GaPxAS1-x, ZnSxSe1-x, GaAsxSb1-x, GaxIn1-xP, and ZnxCd1-xS as examples are given and discussed. The results show that the dependence of the energies of two branches of bulk phonon-polaritons which have phonon-like characteristics, and surface phonon-polaritons on the compositions of ternary mixed crystals are nonlinear and different from those of the corresponding binary systems.     

New insert layer structure OLEDs

An insert layer structure organic electroluminescent device（OLED） based on a new luminescent material （Zn（salen）） is fabricated. The configuration of the device is ITO/CuPc/NPD/Zn（salen）/Liq/LiF/A1/CuPc/NPD/Zn（salen）/Liq/LiF/A1. Effective insert electrode layers comprising LiF（1nm）/Al（5 nm） are used as a single semitransparent mirror, and bilayer cathode LiF（1 nm）/A1（100 nm） is used as a reflecting mirror. The two mirrors form a Fabry-Perot microcavity and two emissive units. The maximum brightness and luminous efficiency reach 674 cd/m^2 and 2.652 cd/A, respectively, which are 2.1 and 3.7 times higher than the conventional device, respectively. The superior brightness and luminous efficiency over conventional single-unit devices are attributed to microcavity effect.