基于马赫-曾德尔干涉的球形结构光纤温度传感器

提出一种基于马赫-曾德尔干涉的球形结构光纤 温度传感器。该传感器通过在单模光纤上熔接两个球 形结构形成球形-单模-球形结构的马赫-曾德尔干涉仪。外界温度的变化会引起光纤包层 模的有效折射率变化, 从而导致干涉光谱的变化,通过检测干涉谷的特征波长漂移量,实现对温度的测量。实验结 果表明,在温度 变化范围为18～78℃时,当中间单模光纤长度为1.8cm时,传感器 的灵敏度为0.129nm/℃ ,当中间单模 光纤长度为2.4cm时,传感器灵敏度为0.121 nm/℃,当中间单模光纤长度为4.0cm时,传感器灵敏度为 0.070nm/℃。根据0.01nm的波长分辨率,该传感器可以实现温度 的分辨率为0.077℃。该球形结构的 光纤温度传感器灵敏度高、结构紧凑、制作简单、成本低廉,在温度检测方面具有良好的应 用前景。     

增敏型级联双参量测量的光纤传感器北大核心CSCD

旨在有效解决液体折射率检测中温度和折射率交叉敏感的问题,研制了一种增敏型光纤光栅(FBG)级联马赫-曾德尔(M-Z)结构的温度、折射率双参量测量的光纤传感器。通过多次熔接实验,调节相应参数将单模光纤(SMF)和薄芯光纤(TCF)进行拉锥熔接;然后在TCF的另一端熔接无心光纤(NCF),制备出M-Z光纤干涉仪;再在NCF末端级联上铝制毛细管增敏封装后的光纤光栅(FBG),最终完成双参量测量的光纤传感器的制备。根据M-Z干涉原理及FBG模式理论,计算了增敏FBG理论的温度灵敏度,给出了传感器的灵敏度系数矩阵与温度、折射率与透射谱的波长漂移量的理论公式。搭建了温度、折射率传感测试系统,实验结果表明:在15~85℃温度范围内,随着温度增加,该传感器的透射谱逐渐红移,封装后的FBG和M-Z结构的温度与波长偏移量线性相关系数分别为0.96323和0.91577,温度灵敏度分别为33.71 pm/℃和11.58 pm/℃;在室温下(25℃),液体折射率在1.333RIU~1.34235RIU范围内,随着折射率增加,FBG透射谱不发生偏移,M-Z透射谱逐渐蓝移,折射率与波长偏移量线性相关系数分别为0和0.98761,折射率灵敏度分别为0 nm/RIU和-493.51322 nm/RIU。该传感器可以有效提高温度、折射率的检测精度和灵敏度,可应用于环境、生物、石油化工和食品生产等领域。     

基于SMS-FBG结构的温度应变双参数传感特性研究

提出了一种基于单模-多模-单模(SMS)光纤干涉结构级联光纤布拉格光栅(FBG)的光纤微结构温度应变双参数测量传感器,并对其应变特性、温度特性进行了实验研究。通过采用光纤熔接手段将长度为35.5 mm的多模光纤熔接在两段单模光纤之间,构成SMS光纤干涉结构,并通过级联FBG制成温度应变双参数测量传感器。结果证明,在200～2 000με应变范围内,单模-多模-单模干涉结构和FBG的应变灵敏度分别为-2.31和1.22 pm/με,线性度分别达到0.999 2和0.999 4;在580～700℃温度范围内,其温度灵敏度分别为58.79和13.64 pm/℃,线性度分别达到0.996 7和0.998 2,可实现温度、应变双参数的同时测量。     

基于波长与强度双解调的光纤温度传感器

为了更好的了解光纤传感原理,并提高温度光纤传感器的各方面性能,提出一种新型的具有波长与强度双解调的光纤温度传感器。将30mm的保偏光纤(PMF)的两端分别与单模光纤(SMF)进行腰椎放大熔接,形成两个腰椎,构成全光纤马赫泽德尔(M-Z)温度传感器。温度的变化将会引起光纤的纤芯模与包层模相位差的变化,从而导致干涉光谱的变化。以25-70℃作为测试温度,通过光谱仪(OSA)监测宽带光源经传感器后的干涉光谱。实验结果表明,温度升高,特征峰波长在向长波长方向移动,并且其强度在逐渐增大。因此,采用波长与强度双解调的方法对温度进行测量,其灵敏度分别为0.127nm/℃和0.32dB/℃,对应的分辨率分别为0.16℃和0.03℃。这个双解调的全光纤温度传感器制造简单、成本低、体积小和结构稳固,而且具有很高的分辨率,因此适用于实际测量。     

基于马赫-曾德尔干涉的温度和应变同时测量的光纤传感器研究

提出了一种基于马赫-曾德尔干涉的温度和应变 双参数同时测量的光纤传感器,其结构是在单模光纤(SMF)上分别熔接两 个球形结构并在SMF光纤中间熔接一段细芯光纤(TCSMF)。利用光纤的纤芯 模、包层模对温度、应变的灵 敏度差异,通过检测不同级次的干涉谷的特征波长位移变化,结合敏感矩阵实现了对温度、 应变双参数的 同时测量。实验选取位于波长1545.1nm554.8nm处的干涉谷进行温度和应变的同时测量,测 得两个波谷 的温度灵敏度分别为53.86 pm/℃和47.51pm/ ℃,两个波谷的应变灵敏度分 别为0.75 pm/με和1.39pm/με,并且不 同级次干涉波谷的波长位移量与外界温度和应变具有良好的线性度。     

锥-单模光纤-细芯光纤-球结构的复合干涉型传感器温度特性研究

随着传感技术的发展,传感器的应用领域变得更加 广阔。许多场合需要高精度的温度传感器,干涉型光纤传感器具有灵敏度高、抗电磁干扰等 优点,受到广泛关注。因此,基于复合干涉原理,设计了一种基于锥-单模光 纤-细芯光纤-球结构的传感器。该传感 器是在由单模光纤制作的锥型结构和球型结构之间,插入相同长度的单模光纤和细芯光纤制 成的,在单模光纤与细芯光纤的熔接处,以及细芯光纤和球型结构的熔接处皆发生干涉。当 温度变化时,光纤纤芯模式和包层模式的相位差发生改变,从而使透射谱中的干涉谷发生漂 移。通过测量干涉谷的漂移量,便可得到温度变化量,实现温度传感。对 传感器温度特性进行研究,当温度从30 ℃变化到75 ℃时,透射谱中的两个干涉谷分别向长波长漂移了 1.5 nm和3.75 nm,灵敏度分别为0.033 nm/℃和0.083 nm/℃。本文提出的传感结构体积小 、制作简便、成本低且两个谷的温度灵敏度较高,可望应用在双参量或多参量测量的场合。     

可调谐多波长自激布里渊掺铒光纤激光器

利用光纤扩径腰椎熔接技术,分别对长为4.5cm单模光纤的两端进行扩径,形成了球形-单模-球形结构的新型马赫-曾德尔干涉仪(MZI)。基于MZI构造了一种可调谐多波长自激布里渊掺铒光纤激光器。将其置于丙三醇溶液中,在波长为980nm、抽运功率为200mW的情况下,改变丙三醇质量分数会引起光纤包层外界环境的有效折射率的变化,从而导致干涉光谱的改变,实现在1558.6~1562.8nm范围内输出激光波长可调谐,其调谐范围为4.2nm,得到了波长间隔为0.088nm、平均光信噪比大于15dB的6个布里渊激光输出。该激光器结构简单、波长间隔稳定,在密集波分复用、光纤传感等领域的应用前景十分广阔。     

一种全光纤拼接结构的MZI液位温度传感器

本文设计并制作了一种基于光纤马赫-曾德尔干涉仪(Mach-Zehnder interferometer, MZI)的光纤液位温度传感器。该结构是由熔接在单模光纤(single-mode fibers, SMFs)之间的一段无芯光纤(no-core fiber, NCF)和一段多模光纤(multi-mode fiber, MMF)拼接而成。由于周围环境液位和温度的变化会导致干涉仪传输光模式改变,进而引起干涉光谱条纹移动。通过检测干涉光谱的两个谷值波长的漂移情况,便可获得液位和温度响应的灵敏度,利用灵敏度系数矩阵可实现对液位和温度的同时测量。研究表明,当液位升高时,干涉光谱发生红移;在0—36 mm液位变化范围内,其最大液位响应灵敏度为208.38pm/mm。当温度升高时,干涉光谱依然保持红移现象;在30—70℃温度变化范围内,其最大温度响应灵敏度为29.67 pm/℃。该传感器结构具有灵敏度高、测量范围大、制造简单、成本低以及液位温度同时测量等优点,在传感领域具有应用潜力。     

基于磁流体的干涉型光纤温度与磁场双测量传感器

将一种基于磁流体包覆的单模-大芯径多模光纤-单模-单模错位熔接(SMSS)构成的马赫-曾德干涉仪(MZI)和光纤光栅(FBG)相结合,利用磁流体的磁致折变效应和光纤光栅的温度灵敏特性,实现了低成本的温度与磁场双测量.利用光束传播法模拟分析了传感结构的内部光场,确定多模光纤的选型,熔接并制作了传感结构,建立敏感矩阵,实现温度与磁场的同时测量.实验测试结果表明,该传感结构的磁场与温度灵敏度分别为15.9 pm/Oe和-161.7 pm/℃.     

金属基底增敏的干涉型高温光纤传感器

为了实现对井下潜油电泵机组温度的实时监测,设计了一种由粗锥型单模--多模--单模(Coarse Cone Singlemode-Multimode-Singlemode, CCSMS)构成的马赫--曾德尔干涉(Mach-Zehnder Interferometer, MZI)型高温光纤传感器。该结构采用直接熔接的方法将单模光纤与多模光纤相熔接;接着通过调整熔接机的熔接参数,在单模光纤上制作出粗锥结构;最后将制备的结构嵌入铜基板的U型槽中,实现传感器的增敏封装。对封装后的传感器的温度响应特性进行了测试。实验结果表明,在40～250℃的温度范围内,该传感器实现了灵敏度为124.9 pm/℃的温度传感。对其稳定性和重复性进行了测试。结果表明,传感器的稳定性最大误差约为0.44%,重复性最大误差约为2.29 pm/℃。该传感器具有灵敏度高、重复性和稳定性好的特点,有望用于油气井下潜油电泵机组的温度监测。     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Teleportation of an arbitrary unknown N-qubit entangled state under the controlling of M controllers

A new quantum protocol to teleport an arbitrary unknown N-qubit entangled state from a sender to a fixed receiver under M controllers(M < N) is proposed. The quantum resources required are M non-maximally entangled Greenberger-Home-Zeilinger (GHZ) state and N-M non-maximally entangled Einstein-Podolsky-Rosen (EPR) pairs. The sender performs N generalized Bell-state measurements on the 2N particles. Controllers take M single-particle measurement along x-axis, and the receiver needs to introduce one auxiliary two-level particle to extract quantum information probabilistically with the fidelity unit if controllers cooperate with it.     

Diode-end-pumped Nd:YVO4/LBO lasers with 4.2W continuous-wave output at 457 nm

A continuous-wave (CW) 457 nm blue laser operating at the power of 4.2 W is demonstrated by using a fiber coupled laser diode module pumped Nd: YVO4 and using LBO as the intra-cavity SHG crystal With the optimization of laser cavity and crystal parameters, the laser operates at a very high efficiency. When the pumping power is about 31 W, the output at 457nm reaches 4.2 W, and the optical to optical conversion efficiency is about 13.5% accordingly. The stability of the out putpower is better than 1.2% for 8 h continuously working.     

A rigorous proof of MIMO channel capacity’s increase with antenna number

It is well known that adding more antennas at the transmitter or at the receiver may offer larger channel capacity in the multiple-input multiple-output（MIMO） communication systems. In this letter, a simple proof is presented for the fact that the channel capacity increases with an increase in the number of receiving antennas. The proof is based on the famous capacity formula of Foschini and Gans with matrix theory.     

Call for Papers

正Wireless Body-area Networks The last decade has witnessed the convergence of three giant worlds:electronics,computer science and telecommunications.The next decade should follow this convergence in most of our activities with the generalization of sensor networks.In particular with the progress in medicine,people live longer and the aging of population will push the development of wireless personal networks