金刚石化学镀铜工艺研究

介绍了金刚石化学镀铜工艺流程、工艺配方。研究了不同络合剂体系对镀液稳定性以及不同预处理方法对化学镀铜层表面形貌的影响。探讨了硫酸铜质量浓度、络合剂物质的量之比和不同pH下甲醛质量浓度对金刚石表面沉积铜速率的影响。结果表明:使用胶体钯敏化活化能显著提高金刚石表面镀铜质量,多元络合剂的加入可以增加镀液的稳定性。获得了化学镀铜最佳工艺条件:CuSO4·5H2O15g/L,甲醛(w(HCHO)=36%)15g/L,酒石酸钾钠14g/L,EDTA14.6g/L,NaOH适量,二联吡啶0.02g/L,亚铁氰化钾0.01g/L,温度(43±0.5)°C,pH=12.5。采用此工艺在金刚石颗粒表面获得了良好的镀铜层。     

PET及PVC基材表面化学镀铜研究

采用AgNO_3取代传统的活化剂PdCl_2,改进PET及PVC基材表面化学镀铜预处理过程,开展了PET和PVC基材表面化学镀铜的比较研究。重点考察了化学镀铜温度和pH等操作工艺条件以及化学镀铜液中主盐和还原剂含量对镀铜效果的影响。结果表明:PET和PVC的镀铜增重率均随温度升高先增大而后减小,PET和PVC的最佳镀铜温度分别为70℃和75℃,二者镀铜的最佳pH值分别为12和11;PET和PVC镀铜时化学镀铜液中硫酸铜的最佳质量浓度均为15 g/L;PET镀液中甲醛的最佳用量为15 ml/L,PVC镀液中甲醛的最佳用量为20 ml/L。采用SEM测试对比考察了PET和PVC镀铜层表面和切面的形态形貌,结果表明,在相同化学镀条件下,PET基材表面的化学镀铜效果明显优于PVC。     

陶瓷化学镀铜沉积速度及镀层外观的研究

探讨了硫酸铜质量浓度、络合剂质量浓度比例、甲醛质量浓度、稀土质量浓度及温度变化对陶瓷表面化学镀铜的沉积速率和镀铜层微观形貌的影响。结果表明:随着硫酸铜质量浓度的增加、温度的升高和络合比的降低,化学镀铜的沉积速率提高,但镀液稳定性有所降低;增加甲醛或稀土含量,镀速先升高后下降,有一个最佳值。加入稀土Ce细化了铜颗粒,铜在基体表面的沉积变得均匀,当ρ(硫酸铈)为0.8g/L时,镀铜层平整细密、孔洞较少。     

金刚石颗粒化学镀铜工艺优化

以KBH4为还原剂、CuSO4为氧化剂,对金刚石颗粒进行化学镀铜。研究了pH、亚铁氰化钾含量、甲醇以及镀覆时间对镀液稳定性和化学镀铜沉积速率的影响。利用X射线衍射仪、场发射扫描电镜、能谱仪表征了镀铜金刚石颗粒的成分、表面形貌和晶粒大小。结果表明,采用硼氢化钾体系能够在金刚石颗粒表面镀覆晶粒细小(约35 nm)且较薄(约210 nm)的铜层。pH对镀液稳定性的影响较大:随着pH的升高,镀液稳定性显著增强;但pH过高会降低沉积速率,且不利于镀层增厚。亚铁氰化钾具有整平铜层和细化晶粒的作用,而甲醇能抑制副反应,提高沉积速率,两者联用能够保证镀液稳定性和镀层表面质量。     

ABS塑料化学镀铜工艺

介绍了ABS塑料表面化学镀铜的工艺流程,讨论了粗化温度和时间、敏化和活化时间、硫酸铜质量浓度、甲醛体积浓度、酒石酸钾钠质量浓度、镀液温度和镀液pH对镀层质量以及化学镀铜沉积速率的影响。确定了最佳工艺条件为15~20g/L硫酸铜、15mL/L甲醛、14g/L酒石酸钾钠,镀液温度为323K,镀液的pH为11~12。扫描电镜表明,所得镀层均匀、光亮,结合力好。     

亚氨基二乙酸为络合剂的新型化学镀铜研究

本文以亚氨基二乙酸为络合剂,次磷酸钠为还原剂,在酸性条件下研究了镀液组成对化学镀铜沉积速率和镀液稳定性的影响。结果表明:化学镀铜的沉积速率随着温度、硫酸铜浓度和次磷酸钠浓度的增加而升高,随着亚氨基二乙酸浓度和镀液pH的增加而降低。极化曲线试验结果表明:随着镀液pH的降低,阴极还原峰电位正移,峰电流密度增大,加速了铜络离子的还原,提高了化学镀铜的沉积速率。采用扫描电镜和原子力显微镜观察了镀层形貌。     

ABS塑料化学镀铜研究

采用工业级化工原料进行ABS塑料化学镀铜。研究了镀液组成、五水硫酸铜浓度、甲醛浓度、pH值等因素对镀铜的质量、外观、均匀度与结合度的影响。结果表明,镀铜的最佳工艺条件为:五水硫酸铜12 g/L、甲醛(36%～38%)16 mL/L、酒石酸钾钠60 g/L、七水硫酸镍1.2g/L,化学镀铜的pH大约在11～12,温度为303～313 K,时间为25～30 min。     

陶瓷基上化学镀铜

为提高化学镀铜液的稳定性,在化学镀铜液中加入亚铁氰化钾和a,a′-联吡啶作为添加剂,研究了温度与陶瓷基体上化学镀铜沉积速度的关系,计算出铜沉积的活化能。当镀液中含有亚铁氰化钾或a,a′-联吡啶时,铜沉积活化能提高,铜沉积速率降低,镀铜层外观及镀液稳定性均得到改善。此外,镀液中同时含有亚铁氰化钾和a,a′-联吡啶时,镀液、镀层性能得到进一步提高。     

次磷酸钠和甲醛为还原剂的化学镀铜工艺对比

比较并评价了以甲醛和以次磷酸钠为还原剂的化学镀铜工艺。结果表明,次磷酸钠镀铜液的稳定性高于甲醛镀铜液,次磷酸钠镀液的沉积速率高于甲醛镀液。以甲醛为还原剂的镀层晶粒细小,而以次磷酸钠为还原剂的镀层呈团粒状。甲醛镀铜层铜的质量分数接近100%,次磷酸钠镀铜层中铜的质量分数为93.9%,镍的质量分数为6.1%,镀层为铜-镍合金。以甲醛为还原剂的化学镀铜层的电导率、抗拉强度、延伸率等物理性能均优于次磷酸钠化学镀铜层。     

锦纶基体表面以乙醛酸为还原剂的化学镀铜工艺

锦纶表面化学镀铜是实现金属化的重要途径。本文通过检测镀铜层沉积速度、镀层体积电阻等方法,研究了锦纶表面以乙醛酸为还原剂的化学镀铜工艺。实验结果表明,乙醛酸可以代替甲醛在锦纶织物表面得到光亮、致密、结合力好的化学镀铜金属层,镀液pH值及温度适当提高,镀速增大,镀层电阻减小,光亮度提高,亚铁氰化钾3 mg/L及2,2'-联吡啶的加入降低了镀速,但可以显著降低镀层电阻,表明添加剂的加入使镀层致密性增强。锦纶织物表面以乙醛酸为还原剂得到光亮稳定镀层的化学镀铜最佳配方及工艺:CuSO_4·5H_2O 10 g/L、乙醛酸3 g/L、酒石酸钾钠20 g/L、EDTA 40 g/L、NiSO_40.9 g/L、亚铁氰化钾3 mg/L、2,2'-联吡啶5 mg/L、聚乙二醇50 mg/L、pH值为13、温度为60℃。     

镀锡铁基体的化学镀铜

为了提高铁的耐蚀性,在镀锡铁基体上进行了化学镀铜的研究。系统地研究了柠檬酸-酒石酸二元配位体化学镀铜体系中各因素对镀速的影响。结果表明,柠檬酸-酒石酸二元配位体系的镀速大于柠檬酸单配位体系的镀速。随着CuSO4.5H2O、柠檬酸、酒石酸、次磷酸钠浓度的增大,以及随着pH和温度的升高,镀速均先升高后降低。化学镀铜液的最佳组成为：CuSO4.5H2O 12 g/L,柠檬酸40 g/L,酒石酸40 g/L,次磷酸钠20 g/L,抗氧化剂1 g/L,硼酸10 g/L,表面活性剂0.1 g/L。最佳温度为55～60℃、pH为1.25～1.76。在最佳条件下,铜的镀速为5.06μm/h,获得的镀层表面光亮平滑,结晶致密,耐蚀性良好。铜锡镀层之间、锡镀层与铁基体之间的结合力优良。     

次磷酸钠化学镀铜镍合金的研究

研究了以次磷酸钠为还原剂的化学镀铜过程。分析了温度、pH、硫酸镍含量对化学镀铜沉积速率的影响及镀层的表面形貌和结构。结果表明,沉积速率随着镀液温度、pH和N i离子浓度的提高而增大。镀层组分含量和XRD实验结果表明镀层为铜镍合金,呈面心立方结构,晶面间距d与晶胞参数a与标准Cu-N i的相比略大。SEM实验表明,镀层表面形貌为团粒状,颗粒大小较不均匀。     

碳纳米管的化学镀铜

A simple chemical method was employed to coat carbon nanotubes with a layer of copper. Due to the hydrophobic nature, large surface curvature, small diameter and large aspect ratio, it is difficult to gain continuous electroless plating layer on the surface of carbon nanotubes. In this paper, a series methods (oxidization, sensitization and activation) are used to add active sites before electroless plating, and the adjustment of the traditional composition of copper electroless plating bath and operating condition can decelerate electroless plating rate. The samples before and after coating were analyzed using transmission electron microscopy and energy-dispersive X-ray spectroscopy. The results showed that the surface of carbon nanotubes was successfully coated with continuous layer of copper, which lays a good foundation for applying carbon nanotubes in composites.     

Electroless Plating of Carbon Nanotubes with Copper

A simple chemical method was employed to coat carbon nanotubes with a layer of copper. Due to the hydrophobic nature, large surface curvature, small diameter and large aspect ratio, it is difficult to gain continuous electroless plating layer on the surface of carbon nanotubes. In this paper, a series methods (oxidization, sensiti-zation and activation) are used to add active sites before electroless plating, and the adjustment of the traditional composition of copper electroless plating bath and operating condition can decelerate electroless plating rate. The samples before and after coating were analyzed using transmission electron microscopy and energy-dispersive X-ray spectroscopy. The results showed that the surface of carbon nanotubes was successfully coated with continuous layer of copper, which lays a good foundation for applying carbon nanotubes in composites.     

中低温化学镀镍工艺

采用复合络合剂,以氨基乙酸作为酸性化学镀镍体系加速剂,研究了体系的主盐、还原剂、加速剂、pH值和温度对化学镀镍层沉积速度的影响,确定了中温酸性化学镀镍工艺配方.     

碳纤维布化学镀铜工艺的研究

采用以甲醛为还原剂的化学镀铜液,用硝酸银作活化剂,在碳纤维布表面沉积出连续、均匀、有光泽的化学镀铜层。研究了不同前处理工艺对碳纤维布化学镀铜的影响。采用扫描电子显微镜表征了化学镀铜层的表面形貌,并用数字电压表测试了碳纤维布化学镀铜前后的导电性。     

超细钨粉化学镀铜工艺及性能研究

以甲醛为还原剂,采用低温、碱性化学镀制备出W-Cu复合粉体,实现了铜在W粉中的均匀分布.升温或提高镀液的pH值都会导致镀速的显著增加.X-ray分析表明,镀层中的铜以晶态存在,未发现铜的氧化物.沉积在W粉表面的高活性铜微粒加剧了W粉的团聚倾向.     

碳酸钙在化学镀表面上的结垢与脱除

The scaling process of calcium carbonate on a low-energy heat transfer surface clectroless plating surface was investigated in a simulated cooling water system. Owing to the very low surface energy, the electroless plating surface exhibited less scaling susceptibility. A longer induction period and a lower scaling rate were obtained on the low-energy surface compared to copper surface under identical conditions. The calcite particles obtained on the electroless plating surface during the induction period were larger in size than those on copper surface because fewer cryst~s formed and grew at the same time on the |ow-energy surface. With increasing surface temperature, the induction period reduced and the scaling rate increased for the low-energy surface. When initial surface temperature was fixed, an increase in fluid velocity would reduce the induction period and increase the scaling rate due to the diffusion effect. However, when the heat flux was fixed, an increase in fluid velocity would decrease the surface temperature, and lead to a longer induction period and a lower scaling rate. The removal experiments of calcium carbonate scale indicated that during post induction period, the detachment was not obvious, while during the induction period, apparent removal of crystal particles was obtained on the electroless plating surface owing to the weak adhesion force. The more frequently the transient high hydrodynamic force acted, the more the detached crystal particles were.     

乙醛酸化学镀铜工艺

研究了以乙醛酸为还原剂的化学镀铜工艺、镀层结构和形貌。其镀液组成和操作条件为:28.0 g/L CuSO4.5H2O,44.0 g/L EDTA-2Na,10.0 mg/Lα,α’-联吡啶,10.0 mg/L亚铁氰化钾,9.2 g/L乙醛酸,pH为11.5～12.5,θ为40～50℃。实验结果表明,化学镀铜溶液较稳定;镀液温度和硫酸铜质量浓度提高,铜沉积速率增大;较高的镀液温度下,化学镀铜反应的活化能较低,镀液稳定性下降;镀液pH在11.5～12.5可获得较好的铜镀层;随乙醛酸和络合剂质量浓度提高,铜沉积速率变化不大,但过量的乙醛酸导致镀液的稳定性降低;铜镀层为面心立方混晶结构,呈光亮的粉红色块状形貌,有较高的韧性。     

化学镀镍规律及机理探讨

基于化学反应所遵循的物质守恒原理,在已知主要反应物、生成物条件下,利用化学方程式配平法,探讨了不同条件下化学镀镍的基本规律,首次提出了与目前经典化学镀镍理论不同的反应方程式;在此基础上找出了次磷酸利用率规律;利用P-H键断裂理论分析探讨了化学镀镍溶液成分及工艺条件,如稳定剂、pH、装载量、加速剂及络合剂等对化学镀镍的影...