Deposition and characterization of pulsed direct current magnetron sputtered Al95.5Cr2.5Si2 (N1 − xOx) thin films

Aluminum rich oxynitride thin films were prepared using pulsed direct current (DC) magnetron sputtering from an Al_95.5Cr_2.5Si₂ (at.%) target. Two series of films were deposited at 400 °C and 650 °C by changing the O₂/(O₂ + N₂) ratio in the reactive gas from 0% (pure nitrides) to 100% (pure oxides). The films were investigated by X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS), scanning electron microscopy (SEM) and nanoindentation. The results showed the existence of three different regions of microstructure and properties with respect to the oxygen concentration. For the samples deposited at 650 °C in the nitrogen rich region (O₂/(O₂ + N₂) ≤ 0.08), the formation of the h-AlN (002) and Al-N bond were confirmed by XRD and XPS measurements. The hardness of the films was around 30 GPa. In the intermediate region (0.08 ≤ O₂/(O₂ + N₂) ≤ 0.24), the presence of an amorphous structure and the shifting of the binding energies to lower values corresponding to non-stoichiometric compounds were observed and the hardness decreased to 12 GPa. The lowering of mechanical properties was attributed to the transition of the clean target to the reacted target under non-steady state deposition conditions. In the oxygen rich region (0.24 ≤ (O₂/(O₂ + N₂) ≤ 1), the existence of α-Al₂O₃-(113), α-Al₂O₃-(116) and Al-O bonds confirmed the domination of this phase in this region of deposition and the hardness increased again to 30-35 GPa. Films deposited at 400 °C showed the same behavior except in the oxygen rich region, where hardness remains low at about 12-14 GPa.     

Synthesis of functional diamond-like carbon nanocomposite films containing titanium dioxide nanoparticles

Synthesis of diamond-like carbon (DLC) films with UV-induced-hydrophilicity function was studied by inductively-coupled plasma (ICP) chemical vapor deposition. Titanium tetraisopropoxide (TTIP) and oxygen gases were employed as the precursors to deposit diamond-like nanocomposite films containing titanium dioxide (TiO₂) nanoparticles. X-ray diffraction and high-resolution transmission electron microscopy revealed that TiO₂ nanocrystallites were formed in the DLC films when oxygen concentration was higher than TTIP concentration during deposition. The DLC nanocomposite film was hydrophobic without ultraviolet (UV) irradiation, and became highly hydrophilic under UV irradiation, exhibiting the self-cleaning effect. A very broad peak centered at 1580 cm^− 1 was observed in the Raman spectra confirming the formation of DLC films. The hardness of the film was about 8 GPa with a stress of 3 GPa. ICP was essential in forming the photocatalytic TiO₂ nanoparticles in the DLC matrix.     

Evolution of structure and properties of multi-component (AlCrTaTiZr)Ox films

(AlCrTaTiZr)O_x films were deposited at 350 °C by DC magnetron sputtering from high-entropy alloy target. Oxygen concentration increases with oxygen flow ratio, and saturates near 67 at.%. As-deposited films have an amorphous structure. Their hardness fall in the range of 8-13 GPa. All amorphous oxide films maintain their amorphous structure up to 800 °C for at least 1 h. After 900 °C 5 h annealing, crystalline phases with the structures of ZrO₂, TiO₂, or Ti₂ZrO₆ form. Annealing enhances mechanical properties of the films. Their hardness and modulus attain to the values about 20 and 260 GPa, respectively. The resistivity of the metallic films is around 10² μΩ cm but drastically rises to 10¹² μΩ cm when oxygen concentration increases.     

Structural, optical and electrical properties of undoped polycrystalline hematite thin films produced using filtered arc deposition

Thin films of α-Fe₂O₃ (hematite) were deposited using filtered arc deposition. The structural, optical and electrical properties of the films have been characterized. High-purity hematite films were produced, free from other iron oxide phases and impurities. The films exhibit preferred orientation, with the c-axis of the hexagonal structure aligned perpendicular to the substrate. The films have an upper uncertainty bound of the porosity of 15%, with a microindentation hardness of 17.5 ± 1 GPa and elastic modulus of 1235 ± 5 GPa. The indirect and direct band gap energies were found to be approximately 1.9 eV and 2.7 eV, respectively. The refractive index, and the extinction and absorption coefficients were determined from total reflectance and direct transmittance measurements. The thin films exhibit a high resistivity (≥ 10⁵ Ω cm) which indicates pure α-Fe₂O₃. An activation energy of 0.7 eV was calculated from an Arrhenius plot of the conductivity.     

Effect of thermal annealing on the structural and mechanical properties of amorphous silicon carbide films prepared by polymer-source chemical vapor deposition

We report on the effect of thermal annealing on the structural and mechanical properties of amorphous SiC thin films prepared by means of a polymer-source chemical vapor deposition process. The chemical bondings of the a-SiC:H films were systematically examined by means of Fourier transform infrared spectroscopy (FTIR). The film composition was measured by X-ray photoelectron spectroscopy, while X-ray reflectivity measurements were used to account for the film density variations caused by the post-annealing treatments over the 750-1200 °C range. In addition, their mechanical properties (hardness and Young's modulus) were investigated by using the nano-indentation technique. FTIR measurements revealed that not only the intensity of a-SiC absorption band linearly increases but also its position is found to shift to a higher wave number as a result of annealing. In addition, the bond density of Si―C is found to increase from (101.6-224.5) × 10²¹ bond·cm^− 3 accompanied by a decrease of Si―H bond density from (2.58-0.46)× 10²¹ bond·cm^− 3 as a result of increasing the annealing temperature (T_a) from 750 to 1200 °C. Annealing-induced film densification is confirmed, as the a-SiC film density is found to increase from 2.36 to ∼ 2.75 g/cm^− 3 when T_a is raised from 750 to 1200 °C. In addition, as T_a is increased from 750 to 1200 °C, both hardness and Young's modulus are found to increase from 15.5 to 17.6 GPa and 155 to 178 GPa, respectively. Our results confirm the previously established linear correlation between the mechanical properties of the a-SiC films and their bond densities.     

Mechanical properties determined by nanoindentation tests of [Pb(Zr,Ti)O3] and [Pb(Mg1/3Nb2/3)1−xTixO3] sputtered thin films

As the introduction of piezoelectric materials into micro electromechanical systems increases, there is a correlating requirement for understanding the mechanical properties of these films. We have investigated the mechanical properties of unpoled PZT [Pb(Zr,Ti)O₃] and PMNT [Pb(Mg_1/3Nb_2/3)_1−xTi_xO₃] thin films deposited by sputtering. In this study, nano-indentation, a technique which allows determination of the transverse mechanical properties, is used. It is the easiest method for assessing the biaxial elastic modulus and the hardness of thin films. It was confirmed that neither cracks, nor pile-ups, were observed for indentation depths below 20% of the film's thickness.The continuous stiffness method was used and allowed us to demonstrate that the indentation modulus decreases continuously with increasing grain diameter. This can be explained by the orientation changes of the crystallites with increasing grain diameter. The indentation modulus measured under load, or at almost null load (that is when the ferroelectric domains are or are not oriented by the stress) are coherent with those determined by the same method with a hard bulk ceramic. These results tend to show that the compliance C_ij of the hard bulk ceramic can possibly be used with sputtered thin films. The hardness is almost independent of the grain diameter (H_b ≅ 7.5 ± 0.9 GPa) and higher than that for the bulk PZT ceramics considered in this study. PMNT and PZT films have appreciably the same mechanical characteristics. No influence of the film thickness was found on the values of both of these parameters.     

Dielectric properties of DC reactive magnetron sputtered Al2O3 thin films

Alumina (Al₂O₃) thin films were sputter deposited over well-cleaned glass and Si < 100 > substrates by DC reactive magnetron sputtering under various oxygen gas pressures and sputtering powers. The composition of the films was analyzed by X-ray photoelectron spectroscopy and an optimal O/Al atomic ratio of 1.59 was obtained at a reactive gas pressure of 0.03 Pa and sputtering power of 70 W. X-ray diffraction results revealed that the films were amorphous until 550 °C. The surface morphology of the films was studied using scanning electron microscopy and the as-deposited films were found to be smooth. The topography of the as-deposited and annealed films was analyzed by atomic force microscopy and a progressive increase in the rms roughness of the films from 3.2 nm to 4.53 nm was also observed with increase in the annealing temperature. Al-Al₂O₃-Al thin film capacitors were then fabricated on glass substrates to study the effect of temperature and frequency on the dielectric property of the films. Temperature coefficient of capacitance, AC conductivity and activation energy were determined and the results are discussed.     

Effects of annealing process and Mn substitution on structure and ferroelectric properties of BiFeO3 films

The BiFe_1 − xMn_xO₃ (BFMO) (x = 0.03, 0.05 and 0.07) thin films were deposited on indium tin oxide/glass substrates using a metal organic decomposition method. X-ray diffraction analysis reveals that the structure of BiFeO₃ films is distorted somewhat by Mn substitution. The leakage measurements indicate that Mn doping content is a dominant factor affecting the leakage current of BFMO films. Due to the poor crystallinity, a small remanent polarization (P_r) is observed in the BFMO_x = 0.05 thin film annealed using the conventional method. The P_r values for the sequential-layer annealed BFMO films are found to be related to the intensity of (012) peak and the content of defect complexes between the oxygen vacancies and acceptors.     

Influence of RF power on the electrical and mechanical properties of nano-structured carbon nitride thin films deposited by RF magnetron sputtering

Nano structured carbon nitride thin films were deposited at different RF powers in the range of 50 W to 225 W and constant gas ratio of (argon: nitrogen) Ar:N₂ by RF magnetron sputtering. The atomic percentage of Nitrogen: Carbon (N/C) content and impedance of the films increased from 14.36% to 22.31% and 9 × 10⁻¹ Ω to 7 × 10⁵ Ω respectively with increase in RF power. The hardness of the deposited films increased from 3.12 GPa to 13.12 GPa. The increase in sp³ hybridized C-N sites and decrease of grain size with increase in RF power is responsible for such variation of observed mechanical and electrical properties.     

Properties of La-substituted Na0.5Bi4.5Ti4O15 ferroelectric thin films

Ferroelectric Na_0.5La_0.5Bi₄Ti₄O₁₅ (NaLaBTi) thin films were prepared by a chemical solution deposition method. The NaLaBTi thin films annealed at 750 °C under oxygen atmosphere were randomly oriented polycrystalline. Electrical properties of the NaLaBTi thin films were compared to Na_0.5Bi_4.5Ti₄O₁₅ thin films and better properties were observed in the NaLaBTi thin films. Remnant polarization (2P_r) and coercive electric field (2E_c) were 43 µC/cm² and 204 kV/cm at an applied electric field of 478 kV/cm, respectively. Leakage current density was 1.95 × 10^− 6 A/cm² at 100 kV/cm. Dielectric constant and dielectric loss were 805 and 0.05 at 1 kHz, respectively. Switchable polarization was suppressed by 15% after 1.44 × 10¹⁰ switching cycles.     

Nanomechanical properties of FePtPd ternary alloy thin films

Presented in this study are crystalline structure and mechanical properties of FePt_0.75Pd_0.25 ternary alloy thin films deposited under the various annealing temperatures, obtained by means of transmission electron microscopy (TEM) and nanoindentation techniques. FePtPd ternary alloy thin films are deposited on Si substrates using a multi-target DC magnetron sputtering system. Results indicate that the grain size increase from 40 to 135 nm as the annealing temperature increases from 400 to 600 °C. From nanoindentation measurements, the hardness of FePtPd ternary alloy thin films are 11.6 ± 0.4, 10.4 ± 0.1 and 8.8 ± 0.3 GPa for the annealed temperatures of 400, 500 and 600 °C, respectively. And, the corresponding Young's moduli are 175.4, 152.2 and 142.6 GPa, respectively. Hardness for FePtPd ternary alloy thin films decreased slightly in accordance with the increase of the grain size. By fitting experimental results with the Hall-Petch equation, a probable lattice friction stress of 5.15 ± 0.05 GPa and Hall-Petch constant of 44.25 ± 2.55 GPa nm^1/2 are obtained.     

Mechanical properties and scratch resistance of filtered-arc-deposited titanium oxide thin films on glass

The mechanical properties and the scratch resistance of titanium oxide (TiO₂) thin films on a glass substrate have been investigated. Three films, with crystalline (rutile and anatase) and amorphous structures, were deposited by the filtered cathodic vacuum arc deposition technique on glass, and characterized by means of nanoindentation and scratch tests. The different damage modes (arc-like, longitudinal and channel cracks in the crystalline films; Hertzian cracks in the amorphous film) were assessed by means of optical and focused ion beam microscopy. In all cases, the deposition of the TiO₂ film improved the contact-mechanical properties of uncoated glass. Crystalline films were found to possess a better combination of mechanical properties (i.e. elastic modulus up to 221 GPa, hardness up to 21 GPa, and fracture strength up to 3.6 GPa) than the amorphous film. However, under cyclic sliding contact above the critical fracture load, the amorphous film was found to withstand a higher number of cycles. The results are expected to provide useful insight for the design of optical coatings with improved contact-damage resistance.     

Influence of sputtering parameters and nitrogen on the microstructure of chromium nitride thin films deposited on steel substrate by direct-current reactive magnetron sputtering

Chromium nitride thin films were deposited on SA-304 stainless steel substrates by using direct-current reactive magnetron sputtering. The influence of process conditions such as nitrogen content in the fed gas, substrate temperature, and different sputtering gases on microstructural characteristics of the films was investigated. The films showed (200) preferred orientation at low nitrogen content (< 30%) in the fed gas. The formation of Cr₂N and CrN phases was observed when 30% and 40% N₂ were used, with a balance of Ar, respectively. Field emission scanning electron microscopy and atomic force microscopy were used to characterize the morphology and surface topography of the thin films, respectively. Microhardness tests showed a maximum hardness of 16.95 GPa for the 30% nitrogen content.     

A study on the plasma polymer thin film surface modification for DNA alignment by using high energy electron beam irradiation

The plasma polymer thin films were deposited on Si(100) substrate by PECVD (plasma enhanced chemical vapor deposition) method. Liquid cyclohexene was used as single organic precursor. It was heated up to 60 °C and bubbled up by hydrogen gas, which flow rate was 50 sccm (standard cubic centimeters per min). Deposition temperature was room temperature. Plasma was ignited by a radio frequency (RF; 13.56 MHz) of 10 W.As-deposited plasma polymer thin films were treated by e-beam of 300 keV with various adsorption radiation doses. The plasma polymer films, which were treated by high energy e-beam (HEEB), were investigated by FT-IR (Fourier Transform Infrared), XPS (X-ray Photoelectron Spectroscopy), AFM (Atomic Force Microscopy), and the water contact angles.From IR spectra, the intensity of OH functional group is increased by increasing electron dose rate. XPS results also show that the intensity of O_1s peak is increased by increasing electron dose rate. C_1s peak shows that oxygen bonded at carbon site. The water contact angles are decreased by increasing electron dose rate. From the AFM analysis, we observed the formation of λ-DNA (deoxyribonucleic acid) array on plasma polymer film, which was treated by HEEB with 14 kGy of adsorption radiation dose.     

Structural and discharging properties of MgO thin films prepared by pulsed laser deposition

In this work, pulsed laser-deposited thin films of MgO were studied for application in plasma display panels. The firing voltage (FV) of discharge cells with MgO films was measured and the film structure was investigated as a function of film deposition conditions. MgO thin films were deposited at oxygen pressure and substrate temperature between 0.02-5 Pa and 260-600 °C, respectively. The structure of thin films was investigated by using X-ray diffraction, X-ray reflection and atomic force microscopy methods. It was found that the FV is strongly correlated with the film deposition conditions and structural properties. In general, the FV values were smaller for the films with higher crystallinity and density. The crystallinity and the density of the films increased when the deposition temperature was raised and the O₂ pressure was reduced. The lowest FV values (~ 120 V) were obtained at the growth temperature of 550 °C and at O₂ pressures below 1 Pa.     

Ion conducting properties of hydrogen-containing Ta2O5 thin films prepared by reactive sputtering

Hydrogen-containing Ta₂O₅ (Ta₂O₅:H) thin films are considered to be a candidate for a proton-conducting solid-oxide electrolyte. In this study, Ta₂O₅:H thin films were prepared by reactively sputtering a Ta metal target in an O₂ + H₂O mixed gas. The effects of sputtering power and post-deposition heat treatment on the ion conducting properties of the Ta₂O₅:H thin films were studied. The ionic conductivity of the films was improved by decreasing the RF power and a maximum conductivity of 2 × 10⁻⁹ S/cm was obtained at an RF power of 20 W. The ionic conductivity decreased by heat-treatment in air, and no ion-conduction was observed after treatment at 300 °C due to the decrease in hydrogen content in the films.     

Influences of post-annealing on structural and electrical properties of Bi1.5Zn1.0Nb1.5O7 thin films prepared by pulsed laser deposition

Bi_1.5Zn_1.0Nb_1.5O₇ (BZN) thin films were prepared on Pt/TiO₂/SiO₂/Si(100) substrates at 650 °C under an oxygen pressure of 10 Pa by using pulsed laser deposition process. The crystallinity, microstructure and electrical properties of BZN thin films were investigated to verify the influences of post-annealing thermal process on them. The X-ray diffractometer (XRD) results indicate that all Bi_1.5Zn_1.0Nb_1.5O₇ thin films without post-annealing process or with post-annealing in situ vacuum chamber and in oxygen ambient exhibit a cubic pyrochlore structure. The improved crystallinity of BZN thin films through post-annealing was confirmed by XRD and scanning electron microscope (SEM) analysis. Dielectric constant and loss tangent of the as-deposited BZN thin films are 160 and 0.002 at 10 kHz, respectively. After annealing, dielectric properties of thin films are significantly improved. Dielectric constant and loss tangent of the in situ annealed films are 181 and 0.0005 at 10 kHz, respectively. But the films post-annealed in O₂ oven show the largest dielectric constant of 202 and the lowest loss tangent of 0.0002, which may attribute to the increase in grain size and the elimination of oxygen vacancies. Compared with the as-deposited BZN thin films, the post-annealed films also show the larger dielectric tunability and the lower leakage current density.     

Face-centered cubic (Al1 − xCrx)2O3

We report the discovery of a face-centered cubic (Al_1−xCr_x)₂O₃ solid solution [0.60 < x < 0.70] in films grown onto Si substrates using reactive radio frequency magnetron sputtering from Al and Cr targets at 400 °C. The proposed structure is NaCl-like with 33% vacancies on the metal sites. The unit cell parameter is 4.04 Å as determined by X-ray diffraction. The films have a <100> preferred crystallographic orientation and exhibit hardness values up to 26 GPa and an elastic modulus of 220-235 GPa.     

Elastic modulus and hardness of CaTiO3, CaCu3Ti4O12 and CaTiO3/CaCu3Ti4O12 mixture

Three ceramic systems, CaTiO₃ (CTO), CaCu₃Ti₄O₁₂ (CCTO) and intermediate nonstoichiometric CaTiO₃/CaCu₃Ti₄O₁₂ mixtures (CTO.CCTO), were investigated and characterized. The ceramics were sintered at 1100 °C for 180 min. The surface morphology and structures were investigated by XRD and SEM. Elastic modulus and hardness of the surfaces were studied by instrumented indentation. It was observed that CCTO presented the higher mechanical properties (E = 256 GPa, hardness = 10.6 GPa), while CTO/CCTO mixture showed intermediate properties between CTO and CCTO.     

Transparent conducting Al and Y codoped ZnO thin film deposited by DC sputtering

Transparent conducting Al and Y codoped zinc oxide (AZOY) thin films with high transparency and low resistivity were deposited by DC magnetron sputtering. The effects of substrate temperature on the structural, electrical and optical properties of AZOY thin films deposited on glass substrates have been investigated. X-ray diffraction spectra indicate that no diffraction peak of Al₂O₃ or Y₂O₃ except that of ZnO (0 0 2) is observed. The AZOY thin film prepared at substrate temperature of 250 °C has the optimal crystal quality inferring from FWHM of ZnO (0 0 2) diffraction peak, but the AZOY thin film deposited at 300 °C has the lowest resistivity of 3.6 × 10⁻⁴ Ω-cm, the highest mobility of 30.7 cm² V⁻¹ s⁻¹ and the highest carrier concentration of 5.6 × 10²⁰ cm⁻³. The films obtained have disorderly polyhedral surface morphology indicating possible application in thin film solar cell with good quality and high haze factor without the need of post-deposition etching.