共查询到19条相似文献,搜索用时 171 毫秒
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针对Sn42Bi57Ag1无铅焊料开发出一种低温无铅焊锡膏,着重研究助焊剂中活性剂对焊锡膏润湿性能的影响。以铺展性能作为主要评价指标,通过回流焊接实验,对用于助焊剂的7种有机酸进行了筛选。最终选取了性能较好的甲基丁二酸、己二酸、水杨酸与丁二酸四种有机酸进行正交试验,通过量化分析选取正交试验水平,根据方差分析确定助焊剂中活性剂的最佳组合。结果表明:有机酸的复配能显著改善焊点铺展情况,当甲基丁二酸、己二酸、水杨酸与丁二酸质量比为2∶3∶5∶2时,Sn42Bi57Ag1无铅焊膏的润湿性能优异,焊点铺展率达86.52%。 相似文献
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Kwang-Lung Lin Ya-Te Liu 《Advanced Packaging, IEEE Transactions on》1999,22(4):580-585
This study investigated the feasibility of the multilayer Cu/Ta/Cu under bump metallurgy (UBM), deposited on AlN/Si where AlN is a thin film. An interdiffusion study found that Ta is an appropriate diffusion barrier layer for the investigated solder bump structure. The temperature profiles and the flux compositions for solder reflow were also investigated. The flux activators investigated include succinic acid, adipic acid, stearic acid, dimethylamine hydrochloride, and diethylamine hydrochloride. Among these, succinic acid was the most appropriate in terms of wetting and cleaning 相似文献
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M. J. Rizvi Y. C. Chan C. Bailey H. Lu M. N. Islam B. Y. Wu 《Journal of Electronic Materials》2005,34(8):1115-1122
The wettability of newly developed Sn-2.8Ag-0.5Cu-1.0Bi lead-free solder on Cu and Ni substrates was assessed through the
wetting balance tests. The wettability assessment parameters such as contact angle (ϑc) and maximum wetting force (Fw) were documented for three solder bath temperatures with three commercial fluxes, namely, no-clean (NC), nonactivated (R),
and water-soluble organic acid flux (WS). It was found that the lead-free Sn-2.8Ag-0.5Cu-1.0Bi solder exhibited less wetting
force, i.e., poorer wettability, than the conventional Sn-37Pb solder for all flux types and solder bath temperatures. The
wettability of Sn-2.8Ag-0.5Cu-1.0Bi lead-free solder on Cu substrate was much higher than that on Ni substrate. Nonwetting
for Sn-2.8Ag-0.5Cu-1.0Bi and Sn-Pb solders on Ni substrate occurred when R-type flux was used. A model was built and simulations
were performed for the wetting balance test. The simulation results were found very close to the experimental results. It
was also observed that larger values of immersion depth resulted in a decrease of the wetting force and corresponding meniscus
height, whereas the increase in substrate perimeter enhanced the wettability. The wetting reactions between the solder and
Cu/Ni substrates were also investigated, and it was found that Cu atoms diffused into the solder through the intermetallic
compounds (IMCs) much faster than did the Ni atoms. Rapid formation of IMCs inhibited the wettability of Sn-2.8Ag-0.5Cu-1.0Bi
solder compared to the Sn-Pb solder. 相似文献
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SnAgCu无铅焊膏用活性物质研究 总被引:3,自引:3,他引:0
以SnAgCu无铅焊膏铺展性能为主要指标,通过回流焊接实验,对用于助焊剂的17种有机酸活性物质进行了筛选。选取两种性能较好的有机酸配成复合活性物质,并对该活性物质的组成进行优化。用湿热试验测试焊后残留物的腐蚀性。结果表明:以羧基官能团比例为3:7的丁二酸和一元酸A混合物作为活性物质,并添加质量约0.66%的乙醇胺调整酸度,得到了pH值约为3的助焊剂;此助焊剂性能优良,可使焊点铺展率达到84%。使用含有此助焊剂的焊膏,采用回流焊接工艺在PCB板上贴装片式元件,所得焊点光亮饱满,且焊后残留物无腐蚀性,可以实现免清洗。 相似文献
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The solderability of 95.5Sn-3.9Ag-0.6Cu solder on oxygen-free high-conductivity (OFHC) copper and Au-Ni-plated Kovar was examined
as a function of flux and process temperature. The three solder fluxes included a rosin-based (R) material, a rosin mildly
activated (RMA) flux, and a low-solids (LS) flux. The solderability metric was the contact angle, θC, measured by a meniscometer and wetting-balance techniques. The wetting rate and time to maximum force parameters were also
documented. In most cases, the contact angles for the 95.5Sn-3.9Ag-0.6Cu solder alloy, regardless of the type of flux or temperature,
were higher then those for the 63Sn-37Pb eutectic-solder alloy, indicating a less “solderable” surface. 相似文献
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Sn-9Zn合金无铅钎料用助焊剂研究 总被引:10,自引:1,他引:9
通过测量润湿面积和润湿角,研究不同助焊剂对Sn-9Zn焊料润湿性的影响。结果表明:助焊剂对Sn-9Zn焊料润湿性影响很大,由乳酸、聚乙二醇和SnCl2所构成的助焊剂与Sn-9Zn焊料有很好适应性;同时扫描电镜和能谱分析也表明焊料与Cu基体界面的IMC为Cu5Zn8相,比Sn-37Pb焊料具有更高的剪切强度。 相似文献
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Jae Yong Park Jae Pil Jung Choon Sik Kang 《Components and Packaging Technologies, IEEE Transactions on》1999,22(3):372-377
In order to evaluate the withdrawal force curve that is shown in a typical wetting balance curve, a number of wetting balance tests were conducted in this study using Sn-37%Pb solder and copper plate samples whose shapes and immersion depths were varied for the purpose of this study. In the shape-effect experiment using vertical copper plate samples whose bottom corners were cut out in rectangles, a new step-like section appeared in the downfall segment of the wetting balance curve. According to the depth-effect experiment, the amount of time needed for the curve to reach the pinnacle of the withdrawal force curve increased in proportion to the immersion depths of the plates while the span of time taken for the drop of the curve was not affected by the depth. The decrease of the maximum measured force under the condition of a deeper immersion depth is attributable to the buoyancy force that also increases as the immersion depth gets deeper. It can be concluded from the results that: 1) the ascending profile of the withdrawal force curve in the typical force-time curve represents the sliding of solder on plates; 2) the highest point on the withdrawal force curve stands for the state in which the sliding solder meets the bottom corners of a normal vertical plate 相似文献
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Hongqin Wang Hui Zhao Dusan P. Sekulic Yiyu Qian 《Journal of Electronic Materials》2008,37(10):1640-1647
Reactive wetting of solders on Cu and Cu6Sn5/Cu3Sn/Cu substrates was investigated using both (1) the wetting balance, and (2) the hot-stage real time, in situ visualization of the triple-line movement. To understand the phenomenology of the spreading behavior better, comprehensive
real-time in situ observations were performed. It was found that the wetting time during the wetting balance tests for both the lead solder
(63SnPb) and lead-free solder systems (Sn0.7Cu and Sn3.5Ag) is shorter on Cu substrates than it is on Cu6Sn5/Cu3Sn/Cu substrates. The wetting force was not remarkably different on these two substrates for the same solder system. The hot-stage
tests indicate a more pronounced spreading of 63Sn-Pb on Cu6Sn5/Cu3Sn/Cu substrates, along with a much larger spreading area. Spreading of lead-free solders in terms of the triple-line kinetics
studied by using the hot-stage visualization shows no significant difference in the spreading evolution either over Cu or
over Cu6Sn5/Cu3Sn/Cu substrates. 相似文献