Avalanche effect in Si heavily irradiated detectors: Physical model and perspectives for application

The model explaining an enhanced collected charge in detectors irradiated to 10¹⁵-10¹⁶ n_eq/cm² is developed. This effect was first revealed in heavily irradiated n-on-p detectors operated at high bias voltage ranging from 900 to 1700 V. The model is based on the fundamental effect of carrier avalanche multiplication in the space charge region and in our case is extended with a consideration of p-n junctions with a high concentration of the deep levels. It is shown that the efficient trapping of free carriers from the bulk generation current to the deep levels of radiation induced defects leads to the stabilization of the irradiated detector operation in avalanche multiplication mode due to the reduction of the electric field at the junction. The charge collection efficiency and the detector reverse current dependences on the applied bias have been numerically simulated in this study and they well correlate to the recent experimental results of CERN RD50 collaboration. The developed model of enhanced collected charge predicts a controllable operation of heavily irradiated detectors that is promising for the detector application in the upcoming experiments in a high luminosity collider.     

The charge collection in single side silicon microstrip detectors

The transient current technique has been used to investigate signal formation in unirradiated silicon microstrip detectors, which are similar in geometry to those developed for the ATLAS experiment at LHC. Nanosecond pulsed infrared and red lasers were used to induce the signals under study. Two peculiarities in the detector performance were observed: an unexpectedly slow rise to the signal induced in a given strip when signals are injected opposite to the strip, and a long duration of the induced signal in comparison with the calculated drift time of charge carriers through the detector thickness—with a significant fraction of the charge being induced after charge carrier arrival. These major effects and details of the detector response for different positions of charge injection are discussed in the context of Ramo's theorem and compared with predictions arising from the more commonly studied phenomenon of signal formation in planar pad detectors.     

Comparative measurements of highly irradiated n-in-p and p-in-n 3D silicon strip detectors

Silicon detectors in 3D technology are a candidate for applications in environments requiring an extreme radiation hardness, as in the innermost layers of the detectors at the proposed High-Luminosity LHC. In 3D detectors, the electrodes are made of columns etched into the silicon perpendicular to the surface. This leads to higher electric fields, a smaller depletion voltage and a reduced trapping probability of the charge carriers compared to standard planar detectors. In this article, the signal and the noise of irradiated n-in-p and p-in-n 3D silicon strip detectors are compared. The devices under test have been irradiated up to a fluence of 2×10¹⁶ 1 MeV neutron equivalent particles per square centimetre (n_eq/cm²), which corresponds to the fluence expected for the inner pixel detector layers at the High-Luminosity LHC. A relative charge collection efficiency of approximately 70% was obtained even after the highest irradiation fluence with both detector types. The influence of different temperatures on the signal and the noise is investigated and results of annealing measurements are reported.     

Performance of a radiation hard 128 channel analogue front-end chip for the readout of a silicon-based hybrid photon detector

The performance is described of a front-end chip, the SCT128A-LC chip, originally developed for the readout of a silicon based Hybrid Photon Detector (HPD), which is part of an RICH detector to be run in an LHC experimental environment. The relatively low signal charge from single photoelectrons, impinging on the silicon pad sensor, put very stringent requirements on the noise performance of the front-end chip. An absolute noise calibration using X-ray sources and a ²⁴¹Am γ source was performed. It is demonstrated that sufficiently good signal over noise ratio can be obtained to use this chip for the read-out of an HPD in LHC experiments.     

A simple model of radiation swelling of silicon

The radiation swelling of silicon is explained as a diffusion-like process where the flux of interstitials out of the plane is defined by the gradient of the concentration of interstitials and the gradient of mechanical stresses in the ion-implanted region of the solid. This model was applied to describe the dynamics and the main regularities (dependence of strain on the ion flux density, ion energy, substrate temperature) of ion implanted silicon (Ni⁺, E = 40–160 keV, j = 5–180 μA cm⁻²). It is demonstrated that suppression of radiation swelling at high temperatures of the substrate or high ion beam current density can be explained by the annihilation of radiation defects.     

Effect of bias voltage on the space charge in irradiated silicon detectors

Full depletion voltage of irradiated silicon pad detectors was observed to increase with time after applied bias voltage. The increase of V_fd, obtained from C–V measurements, is proportional to the fluence and is independent of the irradiation particle type, space charge sign, silicon material, and thickness. Upon switching off the bias voltage, the V_fd returns to those expected values for an unbiased sample. However, the leakage current is not affected. The same behavior is observed in the measurements of the charge collection efficiency for the minimum ionizing particles. As the time constants of the increase and decrease of V_fd are of the order of 10 h at , the effect can play an important role in the future high-energy physics experiments.     

Performance of silicon pad detectors after mixed irradiations with neutrons and fast charged hadrons

A large set of silicon pad detectors produced on MCz and FZ wafer of p- and n-type was irradiated in two steps, first by fast charged hadrons followed by reactor neutrons. In this way the irradiations resemble the real irradiation fields at LHC. After irradiations controlled annealing started in steps during which the evolution of full depletion voltage, leakage current and charge collection efficiency was monitored. The damage introduced by different irradiation particles was found to be additive. The most striking consequence of that is a decrease of the full depletion voltage for n-type MCz detectors after additional neutron irradiation. This confirms that effective donors introduced by charged hadron irradiation are compensated by acceptors from neutron irradiation.     

Characterization of charge collection in CdTe and CZT using the transient current technique

The charge collection properties of Cadmium–Telluride (CdTe) and Cadmium–Zinc–Telluride (CZT) in comparison with Silicon (Si) are presented using the transient-current technique (TCT) where the current pulses are generated by -particles emitted from an ²⁴¹Am source. From the recorded current pulse shapes, the charge collection efficiency, the charge carrier mobility and the electric field distribution inside the detectors are extracted. In particular, the signals of the compound semiconductors CdTe and CZT are interpreted with respect to the build-up of space–charges in the sensor volume and the subsequent deformation of the electric field. As high-quality CdTe and CZT samples are now commercially available, the knowledge of these material characteristics is of outmost importance for the application of CdTe and CZT in X-ray imaging.

In addition, the paper describes the influence of Ohmic and Schottky contacts on the current pulses in CdTe as well as the effects of polarization, i.e. the time-dependent degradation of the detector signals due to the accumulation of fixed charges within the sensor.     

Schottky and pn junction cryogenic radiation detectors made of p-InSb compound semiconductor

Schottky and pn junction detectors were fabricated with p-InSb. Fabrication methods, energy spectra of ²⁴¹Am alpha particles and rise times are shown. We could observe pulses at operating temperatures up to 77 and 115 K for the Schottky and the pn junction detectors, respectively.     

Energy and spatial response of silicon strip detectors to X-rays

This paper describes an experimental investigation of the energy and spatial response of silicon strip detectors used for X-ray measurements. The measurements of single strip amplitude distributions have been performed for a p⁺–n silicon strip detector irradiated with X-rays for different detector bias voltages and for two measurements geometries (with the detector irradiated from either the strip side or from the ohmic contact side). The measured amplitude distributions have been compared with those obtained from simulations using the developed simulation package. The spatial response of the detector has been measured by scanning an edge across the strips and measuring the corresponding strip count rate. The measured spatial response has been compared with that obtained from simulations.     

Bias-dependent radiation damage in high-resistivity silicon diodes irradiated with heavy charged particles

High-resistivity p⁺–n–n⁺ planar diodes were irradiated with neutrons to fluences up to 2×10¹⁴ cm⁻² 1 MeV neutron NIEL equivalent and with pions to 0.47×10¹⁴ cm⁻². Special care was taken to irradiate samples under strictly controlled conditions (temperature, bias). The influence of detector biasing on the effective dopant concentration as measured with the C–V method was studied. Permanently biased diodes exhibit about two times higher |N_eff| after beneficial annealing has been completed. After switching off the bias the difference between biased and unbiased samples diminishes with a temperature-dependent annealing time. Part of the difference is attributed to a bistable defect since it recovers if the bias is re-applied for a few days at room temperature. The bias-induced damage was estimated to result in a 40–70 V addition to required bias for detectors in the ATLAS SCT after 10 years of LHC operation.     

Edge sensitivity of “edgeless” silicon pad detectors measured in a high-energy beam

We report measurements in a high-energy beam of the sensitivity of the edge region in “edgeless” planar silicon pad diode detectors. The edgeless side of these rectangular diodes is formed by a cut and break through the contact implants. A large surface current on such an edge prevents the normal reverse biasing of this device above the full depletion voltage, but we have shown that the current can be sufficiently reduced by the use of a suitable cutting method, followed by edge treatment, and by operating the detector at a low temperature. A pair of these edgeless silicon diode pad sensors was exposed to the X5 high-energy pion beam at CERN, to determine the edge sensitivity. The signal of the detector pair triggered a reference telescope made of silicon microstrip detector modules. The gap width between the edgeless sensors, determined using the tracks measured by the reference telescope, was then compared with the results of precision metrology. It was concluded that the depth of the dead layer at the diced edge is compatible with zero within the statistical precision of ±8 μm and systematic error of ±6 μm.     

Development of a fabrication technology for double-sided AC-coupled silicon microstrip detectors

We report on the development of a fabrication technology for double-sided, AC-coupled silicon microstrip detectors for tracking applications. Two batches of detectors with good electrical figures and a low defect rate were successfully manufactured at IRST Laboratory. The processing techniques and the experimental results obtained from these detector prototypes are presented and discussed.     

SENTIRAD—An innovative personal radiation detector based on a scintillation detector and a silicon photomultiplier

The alarming personal radiation detector (PRD) is a device intended for Homeland Security (HLS) applications. This portable device is designed to be worn or carried by security personnel to detect photon-emitting radioactive materials for the purpose of crime prevention. PRD is required to meet the scope of specifications defined by various HLS standards for radiation detection. It is mandatory that the device be sensitive and simultaneously small, pocket-sized, of robust mechanical design and carriable on the user's body. To serve these specialized purposes and requirements, we developed the SENTIRAD, a new radiation detector designed to meet the performance criteria established for counterterrorist applications. SENTIRAD is the first commercially available PRD based on a CsI(Tl) scintillation crystal that is optically coupled with a silicon photomultiplier (SiPM) serving as a light sensor. The rapidly developing technology of SiPM, a multipixel semiconductor photodiode that operates in Geiger mode, has been thoroughly investigated in previous studies. This paper presents the design considerations, constraints and radiological performance relating to the SENTIRAD radiation sensor.     

A prototype of very high resolution small animal PET scanner using silicon pad detectors

A very high-resolution small animal positron emission tomograph (PET), which can achieve sub-millimeter spatial resolution, is being developed using silicon pad detectors. The prototype PET for a single slice instrument consists of two 1 mm thick silicon pad detectors, each containing a 32×16 array of 1.4×1.4 mm pads readout with four VATAGP3 chips which have 128 channels low-noise self-triggering ASIC in each chip, coincidence units, a source turntable and tungsten slice collimator. The silicon detectors were located edgewise on opposite sides of a 4 cm field-of-view to maximize efficiency. Energy resolution is dominated by electronic noise, which is 0.98% (1.38 keV) FWHM at 140.5 keV. Coincidence timing resolution is 82.1 ns FWHM and coincidence efficiency was measured to be 1.04×10⁻³% from two silicon detectors with annihilation photons of ¹⁸F source. Image data were acquired and reconstructed using conventional 2-D filtered-back projection (FBP) and a maximum likelihood expectation maximization (ML-EM) method. Image resolution of approximately 1.45 mm FWHM is obtained from 1-D profile of 1.1 mm diameter ¹⁸F line source image. Even better resolution can be obtained with smaller detector element sizes. While many challenges remain in scaling up the instrument to useful efficiency including densely packed detectors and significantly improved timing resolution, performance of the test setup in terms of easily achieving sub-millimeter resolution is compelling.     

Characterization of thick epitaxial silicon detectors from different producers after proton irradiation

Epitaxial (EPI) silicon has recently been investigated for the development of radiation tolerant detectors for future high-luminosity HEP experiments. A study of thick EPI silicon diodes irradiated with protons up to a fluence of has been performed by means of Charge Collection Efficiency (CCE) measurements, investigations with the Transient Current Technique (TCT) and standard CV/IV characterizations. The aim of the work was to investigate the impact of radiation damage as well as the influence of the wafer processing on the material performance by comparing diodes from different manufacturers. The changes of CCE, full depletion voltage and leakage current as a function of fluence are reported. While the generation of leakage current due to irradiation is similar in all investigated series of detectors, a difference in the effective doping concentration can be observed after irradiation. In the CCE measurements an anomalous drop in performance was found even for diodes exposed to very low fluences in all measured series. This result was confirmed for one series of diodes in TCT measurements with an infrared laser. TCT measurements with a red laser showed no type inversion up to fluences of for n-type devices whereas p-type diodes undergo type inversion from p- to n-type for fluences higher than .     

PIN结构GaInAsSb红外探测器的PSPICE模型

研究了PIN结构GaInAsSb红外探测器的暗电流特性，建立了器件的PSPICE模型。模拟结果与实际测试结果基本符合。计算结果表明，器件表面和内部的缺陷及表面复合电流对器件的反向特性起主要作用，当反向偏压大于0.35V，缺陷引起的隧穿电流对器件暗电流起主要作用。