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利用扫描电镜和X射线能谱仪对真姬菇子实体菌盖、菌褶和菌柄中的常见的微量元素Na、Mg、S、P、K、Ca、Mn、Fe、Cu和Zn进行测定,并计算了它们的相对重量百分比。结果表明真姬菇子实体的菌盖、菌褶和菌柄的微量元素含量各不相同。 相似文献
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表面镀铑对X射线荧光能谱测定白色K金首饰成分含量影响的研究 总被引:1,自引:0,他引:1
本文研究表面镀铑对X射线荧光能谱测定白色K金首饰成分含量影响,用一次靶(Rh)测首饰成分含量,用二次靶(Sn)测镀层厚度,系统研究含量与镀Rh层厚度之间函数关系。结果表明随着铑层厚度增加,所测的Au,Ag元素含量将会增加。Cu,Ni元素含量将会减少,因此必须进行修正。 相似文献
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X射线光电子能谱(XPS) 总被引:5,自引:0,他引:5
在对许多材料的研究和应用中,了解其表面特性是很重要的。而要获得材料的表面特性,就需要一些特殊的仪器,对各种材料从成分和结构上进行表面表征。其中,X射线光电子能谱(XPS)由于其对材料表面化学特性的高度识别能力,成为材料表面分析的一种重要技术手段。 X射线光电子能谱的基本原理(图1)是当一束特定能量的X射线辐照样品,在样品表面发生光电效应,就会产生与被测元素内层电子能级有关的具有特征能量的光电子,对这些光电子的能量分布进行分析,便得到光电子能谱图。XPS起始于发现光电效应之后不久,1914年Rutherford即成功地表述了XPS的基本方程: 相似文献
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18.2nm正人射显微成像系统用多层膜可极大地提高18.2nm的反射率,但它对紫外、可见和红外光也产生很高的反射。显微成像系统用的激光等离子体光源会在红外到敦X射线产生大量的辐射,18.2nm正入射显微系统用的胶片对所有光谱都十分敏感。因此,182nm正人射显微成像系统需要用滤光片滤除不需要的光辐射并对18.2nm的软X射线有较大的透射比,这样才能获得18.2nm的软X射线像。本文讨论了18.2nm正入射显微成像系统用滤光片的设计、制作及其特性。为了去除滤光片膜中的应力,用交替蒸镀Al和C多层膜的方法来制备法光片,铝和碳膜是用磁控溅射法制备的。针孔透过率和成像实验表明,所制备的滤光片满足了18.2nm正入射显微成像系统对滤光片的要求,并且为进一步制备其他薄膜滤光片打下了基础。 相似文献
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通过对加单一助剂包覆的铝粉和复合助剂包覆的铝粉的X射线光电子能谱(XPS)研究表明,制备浮型铝粉时采用了油酸在铝粉表面的包覆率很大,有效地减少了表面氧化,使之具有较高的亮度,由于羧基的存在,具有使铝粉分散和提高光亮度的能力。比较上述复合助剂和单一助剂制备的铝粉,它们最大的区别在于,加入了聚醚-16后,铝粉光亮度提高许多,同时盖水面积也上升,说明铝粉表面的亲油基相对增多.同时也证明了助剂聚醚-16的活性基团有助于提高铝粉亮度。 相似文献
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X射线相位衬度成像利用X射线穿过样品后的相位变化, 通过衍射信息来获得样品的结构特征。X射线相位衬度成像在生物影像、显微成像以及材料科学研究中有重要的应用。如果X射线成像样品物质密度比较低, 它对X射线的吸收很小, 所以常规的吸收衬度成像质量较差, 不易分辨样品的结构细节。理论分析和实验研究都表明当X射线束点尺寸减小到一定尺度后, X射线源的空间相干性增强, 采用相位衬度成像可以提高低密度样品的成像质量。X射线相位衬度成像质量与X射线束点尺寸, 样品到影像记录平面之间距离直接相关。本文研究了X射线束点尺寸与低密度样品影像边沿轮廓宽度和对比度之间的影响关系。研究结果表明, 根据低密度样品的介电常数、X射线源到样品距离, 以及样品到影像记录平面距离, 存在最优化的X射线束点尺寸。在该最优化配置条件下, 低密度样品的X射线成像可以获得最好的图像质量。 相似文献
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采用磁控溅射方法制备了NiFe/Cu和NiFe/Mo两个系列的多层膜,进行了结构,磁性和磁电阻测量,并对部分NiFe/Cu多层膜样品作了电镜分析,对于NiFe/Cu多层膜,在室温下的测量到巨磁电阻随Cu层厚度振荡的第一,二三峰。在NiFe/Mo多层膜样品中未发现巨磁电阻效应,讨论了非磁性 多层膜的磁性,界面结构和巨磁电阻效应。 相似文献
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Mo and Cu were bonded successfully by means of diffusion bonding using a Ni interlayer. The tensile strength of the joint increases firstly and then decreases with the bonding temperature or holding time increases. Compared with 79 MPa which was the maximum value of Mo/Cu joint, the maximum tensile strength of joint with Ni interlayer was 97 MPa. The interfacial structure of the joints was studied by SEM, EPMA, EDS and XRD, the results showed that the different atoms diffused to each other in the bonding process and no intermetallic compound appeared. MoNi and NiCu solid solutions formed in the joint. The fracture of the joint had taken place in the Mo/Ni interface rather than in the Ni/Cu interface and the fracture way of the joints was brittle fracture. 相似文献
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G. Prasad B. K. Roul R. N. P. Chaudhary K. V. Rao 《Journal of Materials Science》1986,21(12):4315-4317
The F-band absorption and thermoluminescence (TL) of as-cleaved or quenched KBr single crystals after X-ray irradiation and later exciting with a laser beam have been studied. The F-centre concentration at room temperature is considerably reduced with laser excitation as is the TL output. These experiments indicate that a considerable concentration of F-centres in X-ray irradiated KBr crystals can be destroyed even at room temperature by laser excitation. An attempt is made to interpret these results. 相似文献
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X rays have been widely used for nondestructive analysis of nano-scaled materials for a long time; however, the effects of x-ray radiation have been less extensively discussed. In this work, by means of the in-situ x-ray diffraction and the ex-situ high-resolution electron microscopy, we have quantitatively investigated the x-ray effect on the oxidation behavior of Cu nanoparticles prepared by the vapor condensation method. Clear evidence shows that the x-ray irradiation increases the oxidation thickness as well as the oxidation rate. The results are of critical importance not only for the oxidation studies but also for the nanomaterial researches with x-ray related equipment. 相似文献
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《真空科学与技术学报》2015,35(1)
采用直流磁控溅射方法制备了钼/铜叠层结构电极,其电阻率达到2.28μΩ·cm,显著低于铝钕合金的电阻率;金属钼作为缓冲层,提高了铜电极在玻璃上的附着力;钼作为阻挡层有效地阻挡了铜向非晶硅中的扩散,避免了铜对于薄膜晶体管有源层的影响。采用这种结构的电极作为大尺寸高分辨平板显示器的扫描线和数据线有望缓解信号延迟的问题。 相似文献
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Five Fe-16 Cr-2.5 Mo damping alloys with different Cu contents(0%,0.25%,0.5%,1.0% and 2.0%) were prepared.The microstructure was observed by scanning transmission electron microscopy(STEM) and the damping behavior was measured by using a dynamic mechanical analyzer(DMA).The results show that the grain size of experimental alloy with(0.25–1.0%) Cu was refined compared with the 0 Cu alloy.The Cu element is fully dissolved in the matrix and there are no Cu precipitates and carbides observed.Although the internal stress increases because of Cu addition,the damping capacity of the 0.5 Cu and1.0 Cu alloys has been significantly improved.The reason of damping improvement is that the magnetic domain structure is strongly modified.Meanwhile,the strength was improved gradually due to the Cu solid solution strengthening and grain refining.In the 2.0 Cu alloy,lots of Cu-riched particles appeared in the matrix.These Cu precipitates with 10–15 nm in size are spherical and homogeneously distributed,which strongly induce strength improvement through precipitation strengthening.On the contrary,the elongation and impact energy of the 2.0 Cu alloy decrease sharply.In addition,lots of Cu precipitates will significantly decrease the damping capacity by hindering the mobility of domain walls. 相似文献