共查询到20条相似文献,搜索用时 140 毫秒
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采用四配位硅单体对丙烯酸酯、聚氨酯杂合水分散体进行改性,制备出具有核壳结构的共聚乳液(Si-PUA).研究了MMA添加量对Si-PUA乳液及涂膜性能的影响.并利用红外光谱(IR)、热失重(TG)、差示扫描量热(DSC)分析等手段分别进行了表征.研究表明:随着MMA含量的增加,体系聚合稳定性变差,MMA的适合添加量为Si-PUA总质量的20%~30% ; PUA涂膜的耐水性和耐溶剂性明显优于PU涂膜,而用四配位硅单体改性后的Si-PUA涂膜,改性效果更加显著.IR表明,MMA、四配位硅单体是参加了聚合反应;DSC表明通过MMA和四配位硅的改性,使得PU的软段和硬段的相容性增加.TG表明改性后的水性聚氨酯耐高温性能有所提高. 相似文献
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弱电解质电离平衡常数的测定,一般需要准确标定弱电解质溶液的浓度,其步骤较为繁琐,且易引入实验误差。通过多组实验对比,探讨电导法测定弱电解质电离平衡常数实验的改进方法,发现通过简单的调整实验方案,不仅可以简化操作步骤,而且还能获得准确的实验结果,该方法简单易行,准确可靠。 相似文献
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苯乙烯基四配位硅改性苯丙乳液的研制 总被引:2,自引:4,他引:2
将高反应活性的五配位硅钾化合物与对苄氯苯乙烯反应,制得苯乙烯基四配位硅(简称四配位硅)单体;然后,将其与苯乙烯、丙烯酸丁酯、甲基丙烯酸共聚,制成硅改性苯丙乳液。研究了乳化剂用量、乳液的理论固含量、四配位硅单位用量对苯丙乳液性能的影响。结果表明:当乳化剂质量分数为2%,乳液固含量为40%、四配位硅单体质量分数为2%~5%时,乳液的各项性能指标较好,成膜后的膜硬度和附着力均比苯丙乳胶膜好一个等级,玻璃化温度降低了8.7℃,热失重温度提高了25℃。 相似文献
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介绍了白炭黑和废砂浆的研究现状,阐述了硅制取白炭黑的两反应两循环新的氟化法工艺路线。利用传统的排水收集气体的方法,并将气体量转化为浓度,研究了氟化氢铵与线切割废砂浆中硅反应的动力学。结果表明,该反应符合二级反应规律[-r=k(C(NH4)HF2)2],确定50℃与60℃条件下的反应速率常数:k50=3.47×10-4mol3/(L.s)和k60=5.62×10-4mol3/(L.s),以及此反应的活化能Ea=43.16 kJ/mol与指前因子A=3 288.85。 相似文献
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Doo J. Choi David B. Fischbach William D. Scott 《Journal of the American Ceramic Society》1989,72(7):1118-1123
Oxidation of {111} single-crystal silicon and dense, chemically-vapor-deposited silicon nitride was done in clean silica tubes at temperatures of 1000° to woo°C. The oxidation rates of silicon nitride under various atmospheres (dry O2 , wet O2 , wet inert gas, and steam) were several orders of magnitude slower than those of silicon under the identical conditions. The activation energy for the oxidation of silicon nitride decreased from 330 to 259 kJ/mol in going from dry O2 to steam while that for Si decreased from 120 to 94 kJ/mol. The parabolic rate constant for Si increased linearly as the water vapor pressure increased. However, the parabolic rate constant for silicon nitride showed nonlinear dependency on the water vapor pressure in the presence of oxygen. The oxidation kinetics of silicon nitride is explained by the formation of nitrogen compounds (NO and NH3 ) at the reaction interface and the counterpermeation of these reaction products. 相似文献
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采用有机泡沫前躯体浸渍工艺制备了低介电、低密度的氮化硅陶瓷。以氮化硅粉体为主要原料,制备粘度和流动性合适的水基料浆,并以软质聚氨酯泡沫塑料为载体,在真空状态下浸渍,然后在氧化气氛下排塑,在氮气气氛下烧结,得到了低介电常数的多孔氮化硅陶瓷材料。所制备的材料性能可达到:容积密度为0.12g/cm3、介电常数为1.15、介电... 相似文献
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采用氧化硅为原料,木屑作为造孔剂制备了多孔的氧化硅陶瓷材料。借助于气孔率测试、抗弯强度测试、介电性能测试和SEM测试手段分析了造孔剂和烧结助剂的添加量对材料性能的影响。结果表明:加入BN作为添加剂烧成的氧化硅抗弯强度最大可达到14.80MPa。加入木屑作为造孔剂制备的陶瓷可以形成明显的气孔,气孔率最高可达到48.40%,介电常数最低可以达到3.0。 相似文献
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在丙酮、丁二酮水溶液中采用化学氧化法合成纳米聚苯胺,并研究有机溶剂的含量对纳米聚苯胺导电性能的影响。通过傅里叶变换红外光谱仪、紫外分光光度计、扫描电镜对其分子结构及微观形貌进行表征。两探针法测试结果表明,在丙酮水溶液中合成的纳米聚苯胺电导率从0.0295 S/cm(纯水介质)提高到0.5640 S/cm;表面电阻从201.28Ω/cm(纯水介质)降至14.89Ω/cm(丙酮体积分数为25%);在丁二酮水溶液中合成的纳米聚苯胺电导率提高至0.4590 S/cm;表面电阻降低至15.57Ω/cm(丁二酮体积分数为50%)。 相似文献
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太阳能级多晶硅的制备工艺分为物理法和化学法两大类。物理法包括造渣提纯硅法、利用热交换定向凝固提纯、利用电磁感应等离子技术提纯、CP法等,其中CP法生产的太阳能级多晶硅的纯度接近于化学法。但要生产纯度大于6N的多晶硅,仍需要采用化学法。目前常用的化学法有三氯氢硅氢还原法、硅烷热分解法、四氯化硅氢还原法等。三氯氢硅氢还原法又称改良西门子法,是化学法制备太阳能级多晶硅的主流工艺,不足之处是耗能大、污染严重、运行成本较高。 相似文献
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高性能硅丙外墙涂料的研制 总被引:2,自引:0,他引:2
报道了有机硅改性丙烯酸酯乳液的合成工艺和制漆工艺 ,讨论了反应温度、反应体系的p H、有机硅单体种类等因素对乳液聚合的影响 ,合适的反应温度为 62~ 64°C,p H值为 6~ 7。得到的乳液加入各种助剂配成的外墙涂料的性能优良。 相似文献
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Intrinsic Reaction and Self-Diffusion Kinetics for Silicon Carbide Synthesis by Rapid Carbothermal Reduction 总被引:1,自引:0,他引:1
Jacob A. Johnson Christine M. Hrenya Alan W. Weimer 《Journal of the American Ceramic Society》2002,85(9):2273-2280
A one-dimensional nonisothermal model has been developed for the "rapid carbothermal reduction" synthesis of fine silicon carbide powders. Intrinsic reaction and self-diffusion kinetics are identified through simulation of the model and comparison to experimental results. The reaction rate follows a shrinking-core mechanism and is described by the relation [formula omitted] The self-diffusion coefficient for SiC in the aerosol flow reactor is described by the relation The self-diffusion coefficient for SiC in the aerosol flow reactor is described by the relation 相似文献
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Takayuki Narushima Takashi Goto Toshio Hirai 《Journal of the American Ceramic Society》1989,72(8):1386-1390
The oxidation behavior of chemically vapor deposited (CVD) SiC at high temperature was investigated using a thermogravimetric technique in the temperatures range of 1823 to 1948 K. The specimens were prepared by chemical vapor deposition using SiCl4 , C3 H8 , and H2 as source gases. The oxidation behavior of the CVD-SiC indicated "passive" oxidation and a two-step parabolic oxidation kinetics over the entire temperature range. The crystallization of the SiO2 film formed may have caused this two-step parabolic behavior. The parabolic oxidation rate constant ( K p ) varied with the square root of the oxygen partial pressure ( P 1/2 O 2 ). The activation energy for the oxidation was determined to be 345 and 387 kJ · mol−1 . These values suggest that the diffusion process of the oxygen ion which passes through the SiO2 film is rate-controlling. 相似文献