熔石英元件抛光加工亚表面缺陷的检测

亚表面缺陷的准确检测是进行亚表面损伤研究的前提和基础,对保证光学元件加工质量至关重要.基于HF酸化学蚀刻法对熔石英元件抛光加工产生的亚表面水解层、缺陷层深度和亚表面损伤形貌进行了定量检测,并利用X射线荧光光谱法研究了熔石英抛光试件杂质元素的种类和元素含量沿深度分布规律,提出了熔石英元件抛光加工亚表面损伤深度的判定方法.研究表明:由于水解层和亚表面缺陷层的存在,熔石英抛光试件的蚀刻速率随着时间的增加呈现递减的趋势,且在蚀刻的初始阶段蚀刻速率下降尤为明显;当蚀刻深度超过某一特定值后,全部或部分覆盖在水解层以下的缺陷层将会被完全蚀刻去除,蚀刻速率基本保持不变;另外,熔石英抛光试件存在多种形式的表面及亚表面缺陷,在不同蚀刻深度,亚表面损伤形貌、划痕的宽度和深度也存在一定的差异.     

固结磨料研磨SiC单晶基片(0001)C面研究

碳化硅(SiC)单晶基片已广泛应用于微电子、光电子等领域.本文针对传统游离磨料研磨加工的缺点,提出了固结磨料研磨SiC单晶基片技术,以前期研究的SiC单晶基片研磨膏配方,试制了一系列固结磨料研磨盘,研究了固结磨料研磨SiC单晶基片(0001)C面时的材料去除率、表面粗糙度及平面度,并与游离磨料研磨进行了对比.结果表明,固结磨料研磨后样品表面有深度较浅的划痕,游离磨料研磨后表面没有划痕,但表面呈凹坑状;游离磨料研磨后工件表面粗糙度轮廓最大高度Rz远大于固结磨料研磨;固结磨料研磨的材料去除率高于游离磨料,固结磨料研磨后的表面粗糙度Ra远低于游离磨料研磨,固结磨料研磨可提高平面度;研究结果可为进一步研究固结磨料化学机械研磨盘、固结磨料研磨工艺参数及机理提供参考依据.     

碳/碳复合材料切削表面粗糙度的评定方法及评定参数研究

通过对航空航天领域应用的碳,碳（C／C）复合材料和硬铝材料切削表面进行三维表面粗糙度测量实验,研究了C／C复合材料切削表面粗糙度的二维评定与三维评定方法、幅度表征参数及分形表征。结果表明：对于C／C一类的复合材料需选用三维评定参数才能准确表达其切削表面粗糙度的真实特征;表面均方根偏差比表面算术平均偏差更适合作为C／C复合材料切削表面粗糙度的幅度评定参数,表面粗糙度的三维标准应优先选用表面均方根偏差作为评定参数;表面分形维数可作为C／C复合材料切削表面粗糙度的表征参数之一。     

基于径向基函数神经网络的CFRP切削力预测

碳纤维增强树脂基复合材料(CFRP)加工中基体相极易因切削力过大而破坏,并迅速扩展至加工表面以下而形成损伤。为了准确预测其切削力并加以控制,基于实验切削力数据建立了人工神经网络切削力模型,预测了不同纤维角度、切削深度和刀具角度下加工CFRP的切削力变化规律,并完成了不同刀具角度及切削参数下典型纤维角度CFRP单向板的直角切削实验,对预测模型进行验证,其预测精度可达85%以上。结合成屑过程在线显微观测结果可知:纤维角度是影响CFRP切削力的主要因素, 0°~135°范围内,切屑形成方式为切断型和开裂后弯断型;切削力随纤维角度增大呈先减小后增大的趋势, 135°时最大,随切削深度增加,切削力总体呈增大趋势。      

单晶表面加工损伤的评价方法

单晶表面加工损伤是衡量工艺水平以及单晶片质量的一个主要参数.综述对单晶表面加工损伤进行分析评价的各种方法,对各种分析方法的基本原理、主要特点及应用做了概要介绍.由于单晶表面损伤以及表面残余应力存在一定的梯度及各种表征方法的作用机理、作用深度不尽相同,因此不同的评价方法对同一样品的分析往往会出现差异.根据不同的分析目的,给出了选择分析手段的建议.     

基于分子动力学的单晶硅纳米振动切削过程

为了研究脆性材料单晶硅原子级的纳米振动切削加工去除机制,应用分子动力学,通过改变刀具椭圆振动切削的模式,进行单晶硅纳米振动切削仿真．仿真结果表明,主切削力和法向力的变化趋势总体上呈现正弦曲线变化,并且已加工表面不同深度的亚表层存在残余应力;同时在不同切削模式下,由于刀具法向的振幅增加,使得法向力和残余应力增大;当刀具通过已加工表面时,残余应力随着亚表层深度降低而减弱;刀具法向振幅高于主切削力方向振幅时,法向力峰值高于主切削力峰值,已加工表面亚表层没有明显驰豫现象．     

机械滚压对A473M钢疲劳性能的影响

采用机械滚压对A473M马氏体不锈钢轴套材料进行表面处理,研究滚压工艺对其力学性能的影响。采用SEM、白光干涉仪、X射线衍射仪、显微硬度计、EBSD、拉伸试验机和疲劳试验机分别对试样表面形貌、表面粗糙度、残余应力、显微硬度、拉伸性能和疲劳性能进行系统表征。结果表明:滚压加工试样表面的粗糙度明显降低,仅为车削加工的1/5;滚压加工在材料近表面引入残余压应力,其值最高可达946 MPa,沿深度方向逐渐减小,残余压应力层深度约为200μm,表面硬度提高30%左右,硬度影响层深度可达200μm;抗拉强度、屈服强度和伸长率分别提升了40%,22%和8%,疲劳寿命由基体材料的5.4×10^4周次提高到1×10^7周次。采用滚压加工后材料的力学性能明显提升,疲劳寿命显著增加。     

LBO晶体的超精密加工工艺研究

采用Logitech PM5精密研抛机,通过机械抛光和化学机械抛光方法超精密加工LBO晶体;详细研究了LBO晶体的超精密加工工艺,并观察研磨和抛光等加工过程后的晶体表面形貌;研究抛光液和抛光垫在抛光中对LBO晶体表面微观形貌的影响.使用Wkyo激光干涉仪测量平面度,光学显微镜观察表面宏观损伤,原子力显微镜测量表面粗糙度和观察微观形貌.通过实验,实现高效率、高精度、高质量的LBO晶体的超精密加工,得到了LBO晶体的超精密加工工艺;超精密加工后晶体的表面粗糙度＜0.2nm RMS,表面平面度＜氇/10(氇=633nm),微观损伤少.     

振动磁力研磨机理及多型面加工

针对目前振动辅助磁力研磨中装置复杂、设备专用、缺少小孔加工装置的问题,提出电磁永磁振动辅助磁力研磨的方案。该方案将励磁装置与振动发生装置集成起来,结构简单。同时,设计针对平面、圆柱面、球面以及3mm内孔面的快换加工部件,可实现对上述多种型面的加工。建立起单个磨粒的材料去除模型以及磁粒刷的剪切扭矩模型。根据模型可知,在传统磁力研磨基础上引入振动,可增大磁性磨粒的研磨压力和剪切扭矩,研磨效率得以提高。通过三维光学表面轮廓仪和粗糙度仪对研磨前后表面质量进行测量,平面、圆柱面、球面以及内孔面表面质量都得到明显改善。同时,对电磁永磁振动辅助磁力研磨加工特性进行分析。     

Ti-6Al-4V合金表面超声振动滚压强化研究

采用超声振动滚压加工技术对Ti-6Al-4V合金表面进行处理,探究该项技术对Ti-6Al-4V合金表面质量的影响。通过对该工艺加工前后的Ti-6Al-4V合金进行表面粗糙度参数、XRD图谱、截面微观形貌、表层残余应力及显微硬度的对比分析,结果表明:经该工艺处理后的合金表面各项粗糙度参数皆有明显降低;加工后的合金表面XRD图谱的衍射峰减弱且宽化,衍射角向高角度方向偏移;加工后的合金表层β相组织相较加工前明显细化,且随着深度增加β相组织逐渐增大;在距离表面约50μm位置的残余应力值最大可达到-967 MPa;加工后的合金表面显微硬度可达到421HV,且在0~140μm的深度范围内,显微硬度随着深度的增加逐渐减小至与基体硬度一致。经超声振动滚压加工后的Ti-6Al-4V合金表面质量显著提高,有利于提高其零部件的使用性能。     

Subsurface damage distribution in the lapping process

To systematically investigate the influence of lapping parameters on subsurface damage (SSD) depth and characterize the damage feature comprehensively, maximum depth and distribution of SSD generated in the optical lapping process were measured with the magnetorheological finishing wedge technique. Then, an interaction of adjacent indentations was applied to interpret the generation of maximum depth of SSD. Eventually, the lapping procedure based on the influence of lapping parameters on the material removal rate and SSD depth was proposed to improve the lapping efficiency.     

Loose abrasive slurries for optical glass lapping

Loose abrasive lapping is widely used to prepare optical glass before its final polishing. We carried out a comparison of 20 different slurries from four different vendors. Slurry particle sizes and morphologies were measured. Fused silica samples were lapped with these different slurries on a single side polishing machine and characterized in terms of surface roughness and depth of subsurface damage (SSD). Effects of load, rotation speed, and slurry concentration during lapping on roughness, material removal rate, and SSD were investigated.     

Twyman effect mechanics in grinding and microgrinding

In the Twyman effect (1905), when one side of a thin plate with both sides polished is ground, the plate bends: The ground side becomes convex and is in a state of compressive residual stress, described in terms of force per unit length (Newtons per meter) induced by grinding, the stress (Newtons per square meter) induced by grinding, and the depth of the compressive layer (micrometers). We describe and correlate experiments on optical glasses from the literature in conditions of loose abrasive grinding (lapping at fixed nominal pressure, with abrasives 4-400 μm in size) and deterministic microgrinding experiments (at a fixed infeed rate) conducted at the Center for Optics Manufacturing with bound diamond abrasive tools (with a diamond size of 3-40 μm, embedded in metallic bond) and loose abrasive microgrinding (abrasives of less than 3 μm in size). In brittle grinding conditions, the grinding force and the depth of the compressive layer correlate well with glass mechanical properties describing the fracture process, such as indentation crack size. The maximum surface residual compressive stress decreases, and the depth of the compressive layer increases with increasing abrasive size. In lapping conditions the depth of the abrasive grain penetration into the glass surface scales with the surface roughness, and both are determined primarily by glass hardness and secondarily by Young's modulus for various abrasive sizes and coolants. In the limit of small abrasive size (ductile-mode grinding), the maximum surface compressive stress achieved is near the yield stress of the glass, in agreement with finite-element simulations of indentation in elastic-plastic solids.     

Grinding process for beveling and lapping operations in lens manufacturing

A grinding process that uses loose abrasives for the beveling of lenses is presented. Determination of the parameters of grinding tools with loose abrasives for beveling applications with various optical elements is discussed. The process of grinding with loose abrasives for a lapping operation is analyzed by examination of the influence of optical glass material parameters on material removal and surface roughness for lens manufacturing conditions. The model established for this analysis uses the concept of lateral fracture, which is based on removal of optical glass material by rolling abrasive particles. The particles remove material by lateral cracking. The abrasive mineral Barton Garnet was used in the lapping experiments. Under specific large-diameter lens manufacturing conditions, lapping time values at the conventional removal depth have been obtained for various optical glasses.     

Subsurface damage in some single crystalline optical materials

We present a nondestructive method for estimating the depth of subsurface damage (SSD) in some single crystalline optical materials (silicon, lithium niobate, calcium fluoride, magnesium fluoride, and sapphire); the method is established by correlating surface microroughness measurements, specifically, the peak-to-valley (p-v) microroughness, to the depth of SSD found by a novel destructive method. Previous methods for directly determining the depth of SSD may be insufficient when applied to single crystals that are very soft or very hard. Our novel destructive technique uses magnetorheological finishing to polish spots onto a ground surface. We find that p-v surface microroughness, appropriately scaled, gives an upper bound to SSD. Our data suggest that SSD in the single crystalline optical materials included in our study (deterministically microground, lapped, and sawed) is always less than 1.4 times the p-v surface microroughness found by white-light interferometry. We also discuss another way of estimating SSD based on the abrasive size used.     

Loose abrasive lapping hardness of optical glasses and its interpretation

We present an interpretation of the lapping hardness of commercially available optical glasses in terms of a micromechanics model of material removal by subsurface lateral cracking. We analyze data on loose abrasive microgrinding, or lapping at fixed nominal pressure, for many commercially available optical glasses in terms of this model. The Schott and Hoya data on lapping hardness are correlated with the results of such a model. Lapping hardness is a function of the mechanical properties of the glass: The volume removal rate increases approximately linearly with Young's modulus, and it decreases with fracture toughness and (approximately) the square of the Knoop hardness. The microroughness induced by lapping depends on the plastic and elastic properties of the glass, depending on abrasive shape. This is in contrast to deterministic microgrinding (fixed infeed rate), where it is determined from the plastic and fracture properties of the glass. We also show that Preston's coefficient has a similar dependence as lapping hardness on glass mechanical properties, as well as a linear dependence on abrasive size for the case of brittle material removal. These observations lead to the definition of an augmented Preston coefficient during brittle material removal. The augmented Preston coefficient does not depend on glass material properties or abrasive size and thus describes the interaction of the glass surface with the coolant-immersed abrasive grain and the backing plate. Numerical simulations of indentation are used to locate the origin of subsurface cracks and the distribution of residual surface and subsurface stresses, known to cause surface (radial) and subsurface (median, lateral) cracks.     

材料特性对亲水性固结磨料研磨垫加工性能的影响

为研究材料特性对亲水性固结磨料研磨垫的加工性能影响,本文研究了K9玻璃和硅片两种材料在不同加工顺序下研磨过程中的声发射信号和摩擦系数特征,采用扫描电镜分析磨屑的尺寸与形态.结果表明:不同加工顺序下工件的材料去除速率差别很大.与直接研磨硅片相比,先研磨K9玻璃再研磨硅片,硅片的材料去除速率大幅下降;相反,先研磨硅片再研磨K9玻璃,与直接研磨K9玻璃相比,K9玻璃的材料去除速率变化不大.无论采用哪种加工顺序,后研磨的工件表面粗糙度均比直接研磨的同种工件要大.扫描电镜的分析表明,硅片的磨屑尺寸集中在600 nm~1.5μm,磨屑大部分都棱角完整;而K9玻璃的磨屑尺寸集中在300 nm~500 nm左右,无明显棱角.硅片磨屑较大的尺寸与完整的棱角促进了研磨垫的自修正过程,所以硅片这类脆性较大的材料有利于研磨垫的自修正过程.     

新型功能陶瓷高效研磨半固着磨具(英文)

为提高功能陶瓷游离磨料研磨效率,减少大颗粒杂质侵入造成的表面损伤,提出了一种高效研磨用的新型半固着磨具(SFAT).分析了SFAT的基本工作机理及其制作过程.通过对典型的功能陶瓷工件硅片的研磨实验,分析了SFAT研磨过程中工件表面质量、加工效率、材料去除形式,以及工艺参数对加工过程的影响.实验结果表明,采用#1000 SiC磨料制作的SFAT研磨后的硅片表面粗糙度在10 min内,从215 nm提高到了30 nm.定义了单位材料去除量内表面粗糙度下降值,作为评价工件精加工表面质量改善效率的指标.实验中,利用SFAT研磨硅片的单位材料去除量内表面粗糙度下降值是相似条件下游离磨料研磨的2倍,这表明利用SFAT加工能够迅速改善工件的表面质量,能够获得比游离磨料加工更高的精加工效率.     

亲水性固结磨料研磨垫自修整过程的实现探索

亲水性固结磨料研磨垫(FAP)的自修整过程影响着其加工性能的稳定性.采用亲水性树脂和铜粉制备固结磨料研磨垫,研究研磨液中添加不同含量三乙醇胺对树脂基体砂浆磨损率及研磨垫材料去除率大小、稳定性的影响,以此来判断研磨垫的自修整性能,探索亲水性固结磨料研磨垫自修整的实现机理.结果表明:在本文实验所考察范围内,随着研磨液中三乙醇胺含量的增加,树脂基体的砂浆磨损率升高,当三乙醇胺体积比从0升至5%时,砂浆磨损率从0.003 3 g上升至0.009 1 g;研磨液中三乙醇胺浓度的提高有助于其材料去除率的稳定,当三乙醇胺体积比从0升至5.0%时,材料去除率的稳定性从11%提升至42.9%.可见,研磨液中加入三乙醇胺可以改善含铜粉亲水性固结磨料研磨垫的自修整性能.