2～4GHz MMIC低噪声放大器

采用中国电子科技集团公司第十三研究所的GaAs PHEMT低噪声工艺,设计了一款2~4 GHz微波单片集成电路低噪声放大器(MMIC LNA)。该低噪声放大器采用两级级联的电路结构,第一级折中考虑了低噪声放大器的最佳噪声和最大增益,采用源极串联负反馈和输入匹配电路,实现噪声匹配和输入匹配。第二级采用串联、并联负反馈,提高电路的增益平坦度和稳定性。每一级采用自偏电路设计,实现单电源供电。MMIC芯片测试结果为:工作频率为2~4 GHz,噪声系数小于1.0 dB,增益大于27.5 dB,1 dB压缩点输出功率大于18 dBm,输入、输出回波损耗小于-10 dB,芯片面积为2.2 mm×1.2 mm。     

2.8～4.2GHz MMIC低噪声放大器

报道了基于0.25μm GaAs PHEMT工艺的2.8～4.2GHz MMIC低噪声放大器,详细介绍和分析了低噪声放大器的器件基础和设计原理,设计采用源极串联电感负反馈方法使输入阻抗共轭匹配和最小噪声匹配趋于一致,偏置网络采用自偏置栅压、单电源供电,并用ADS软件仿真。电路评估板选用Rogers RO4350B,在2.8～4.2GHz频段内测得增益大于20dB、增益平坦度小于2.5dB、噪声系数小于2.3dB、输入输出驻波比小于2.0。     

应用于2.4GHz无线传感网的带ESD保护CMOS低噪声放大器的设计与优化

本文给出一种新的带ESD保护源极电感负反馈低噪声放大器优化方法,可以实现在功耗受限条件下的噪声和输入同时匹配,并给出了输入阻抗和噪声参数的分析。采用该方法设计并优化了一个基于0.18-μm RF CMOS工艺、应用于无线传感网的2.4GHz低噪声放大器。测试结果表明,低噪声放大器的噪声系数为1.69dB,功率增益为15.2dB,输入1dB压缩点为-8dBm,输入三阶截点为1dBm,1.8V电源电压下的工作电流为4mA。     

0.6～18.0 GHz超宽带低噪声放大器MMIC

基于0.15μm GaAs E-pHEMT工艺设计并制备了一款0.6～18.0 GHz的低噪声放大器单片微波集成电路。该放大器使用一级共源共栅结构,通过负反馈实现宽带的匹配设计。同时在共栅晶体管栅极增加到地电容,共源管和共栅管漏极增加峰化电感,以提高高频增益,扩展带宽,改善噪声。常温在片测试结果表明,在3.3 V单电源供电下,0.6～18.0 GHz频带内该款低噪声放大器噪声系数典型值1.5 dB,小信号增益约15 dB,增益平坦度小于±0.9 dB,输入、输出电压驻波比典型值分别为1.7和1.8,1 dB压缩点输出功率典型值14 dBm,功耗72.6 mW,芯片面积1.5 mm×1.2 mm。     

12~18 GHz GaAs MMIC低噪声放大器设计

采用GaAs工艺设计了一个12~18 GHz毫米波单片集成电路(MMIC)低噪声放大器(LNA)。采用三级单电源供电放大结构,运用最小噪声匹配设计、共轭匹配技术和负反馈结构,同时满足了噪声系数、增益平坦度和输出功率等要求。仿真表明：在12~18 GHz的工作频带内,噪声系数为1.15~1.41 dB,增益为27.9~29.1 dB,输出1 dB压缩点达到15 dBm,输入、输出电压驻波比(VSWR)系数小于1.72。     

Ka波段单片自偏压低噪声放大器

本文介绍了一款基于0.15μm PHEMT工艺的Ka波段自偏压单片低噪声放大器(LNA)。该款低噪声放大器采用四级级联的电路结构,前两级采用源极电感负反馈同时获得较好的输入驻波和噪声;采用电阻自偏压技术,单电源供电,使用方便。该款低噪声放大器在26~40GHz频段内增益为22±1dB,噪声优于3dB;在36GHz处噪声优于2.5dB。芯片尺寸为2.0mm×1.0mm×0.1mm。     

0.15μmInGaAs PHEMT50MHz-1GHz高线性CATV放大器设计

本文对应用于CATV（有线电视）的50MHz - 1GHz频段的低噪声和高线性度单片微波集成电路（MMIC）放大器进行了设计。设计采用并联电压交流负反馈和源极电流负反馈相结合以扩大带宽和高线性度。本文引入一种新的共源共栅管基极偏置以稳定工作点来进一步提高线性度。该电路由台湾稳懋半导体公司的0.15μm InGaAs PHEMT工艺制作。测试在有线电视频段50MHz-1GHz范围内和75欧姆测试匹配系统中进行。.测试结果表明芯片小信号增益为16.5dB,带内波动小于 1dB。噪声指数在带内为1.7-2.9dB。IIP3高达16dBm。CSO和CTB分别为68dBc和77dBc。芯片面积为0.56 mm2,而功耗在5V供电下为110mA。测试结果表明芯片展现了出色的噪声性能和高线性度,非常适合于有线电视系统。     

基于70 nm InP HEMT工艺的230～250 GHz低噪声放大器设计

基于70 nm InP HEMT工艺,设计了一款五级共源放大级联结构230～250 GHz低噪声太赫兹单片集成电路（TMIC）。该放大器采用扇形线和微带线构成栅极和源极直流偏置网络,用以隔离射频信号和直流偏置信号;基于噪声匹配技术设计了放大器的第一级和第二级,基于功率匹配技术设计了中间两级,最后一级重点完成输出匹配。在片测试结果表明,230～250 GHz频率范围内,低噪声放大器的小信号增益大于20 dB。采用Y因子法对封装后的低噪声放大器模块完成了噪声测试,频率为243～248 GHz时该MMIC放大器噪声系数优于7.5 dB,与HBT和CMOS工艺相比,基于HEMT工艺的低噪声放大器具有3 dB以上的噪声系数优势。     

基于ADS宽带微波低噪声放大器设计与仿真

文章主要研究低噪声放大器在宽频带范围内增益平坦度低、阻抗匹配差的问题。选用Avago公司生产的具有高动态范围和低噪声特性的PHEMT器件ATF-38143晶体管,采用自给偏置共源,负反馈结构,基于ADS仿真设计完成一款两级级联的宽带低噪声放大器。该放大器利用源极串联反馈电感和输入端接双支节微带线的匹配方法。仿真结果显示放大器在1.0～3.0 GHz的频带范围内,输入输出回波损耗均小于-10 dB;系统稳定性因子K> 1;噪声系数为(1.6±0.4)dB;最大增益为26.5 dB,增益平坦度缩小到±0.5 dB。     

一种GaAs基HEMT低噪声放大器的设计实现

采用GaAs标准高电子迁移率晶体管(HEMT)工艺设计了一种低噪声放大器.放大器由4级4指双栅槽结构HEMT器件级联构成.0.25μm栅线条的选用保证器件有低的噪声系数和较高的增益.通过在HEMT的源极串联电感和选择MIM电容微带线实现了放大器输入级、中间级、输出级之间的最佳匹配网络.芯片测试结果表明,所设计低噪声反放大器在34 GHz频率下的小信号增益大于22 dB,噪声系数小于1.8 dB,具有10 dBm的饱和输出功率且线性度较好.该设计方法实现了低噪声、高增益、低功耗放大器的性能要求.     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

A rigorous proof of MIMO channel capacity’s increase with antenna number

It is well known that adding more antennas at the transmitter or at the receiver may offer larger channel capacity in the multiple-input multiple-output（MIMO） communication systems. In this letter, a simple proof is presented for the fact that the channel capacity increases with an increase in the number of receiving antennas. The proof is based on the famous capacity formula of Foschini and Gans with matrix theory.     

Teleportation of an arbitrary unknown N-qubit entangled state under the controlling of M controllers

A new quantum protocol to teleport an arbitrary unknown N-qubit entangled state from a sender to a fixed receiver under M controllers(M < N) is proposed. The quantum resources required are M non-maximally entangled Greenberger-Home-Zeilinger (GHZ) state and N-M non-maximally entangled Einstein-Podolsky-Rosen (EPR) pairs. The sender performs N generalized Bell-state measurements on the 2N particles. Controllers take M single-particle measurement along x-axis, and the receiver needs to introduce one auxiliary two-level particle to extract quantum information probabilistically with the fidelity unit if controllers cooperate with it.     

Diode-end-pumped Nd:YVO4/LBO lasers with 4.2W continuous-wave output at 457 nm

A continuous-wave (CW) 457 nm blue laser operating at the power of 4.2 W is demonstrated by using a fiber coupled laser diode module pumped Nd: YVO4 and using LBO as the intra-cavity SHG crystal With the optimization of laser cavity and crystal parameters, the laser operates at a very high efficiency. When the pumping power is about 31 W, the output at 457nm reaches 4.2 W, and the optical to optical conversion efficiency is about 13.5% accordingly. The stability of the out putpower is better than 1.2% for 8 h continuously working.     

Call for Papers

正Wireless Body-area Networks The last decade has witnessed the convergence of three giant worlds:electronics,computer science and telecommunications.The next decade should follow this convergence in most of our activities with the generalization of sensor networks.In particular with the progress in medicine,people live longer and the aging of population will push the development of wireless personal networks