Metallization technology for very-large-scale integration circuits

This review summarizes the results of a program whose goals were to develop (a) high conductivity refractory silicide gates, (b) electromigration-resistant fine-line aluminum interconnects, (c) small geometry electromigration-resistant contacts to shallow junctions and (d) two-level interconnect systems. There is a critical need for these innovations, since the chip area in very-large-scale integration circuits tends to be interconnect dominated. Also discussed are the effects of shrinking design rules on the RC time constants of various interconnect structures.     

Electrode coatings for high temperature hydrogen electrolysis

A discussion of fabrication techniques and performance testing of solid oxide components for use in hydrogen steam electrolysis is presented. Novel plasma spray techniques are utilized to deposit the thin ceramic oxide electrode, electrolyte, and interconnect layers on a planar intermetallic bipolar plate. Optimal porosity is achieved within the electrode microstructure through mixed feed techniques that are a combination of dry powder feed and liquid solution injection. The perovskite anode coatings formed from liquid precursor feedstock require post-deposition annealing in an oxygen-rich atmosphere to form the desired perovskite structures. Electrical conductivity measurements were measured for all electrodes and interconnect materials as a function of temperature to 1000 °C. Supported by the U.S. Department of Energy, Office of Nuclear Energy Science and Technology, under the DOE Idaho Operations Contract No. DE-AC07-05ID14517     

Oxide-ion conducting ceramics for solid oxide fuel cells

Realization of a solid oxide fuel cell (SOFC) operating at 700°C on a hydrocarbon fuel or gaseous H₂ is an outstanding technical target. For the past 25 years, efforts to achieve this goal have been based on yttria-stabilized zirconia as the electrolyte, a NiO + electrolyte composite as the anode, a porous La_0.85Sr_0.15MnO₃ (LSM) metallic perovskite as the cathode, and a La_1–x Sr _x CrO₃ ceramic as the interconnect material. This paper reviews progress in our laboratory on an alternate approach that would use a Sr- and Mg- doped LaGaO₃ perovskite as the electrolyte, a Sm-doped ceria (SDC) as the anode or as a buffer layer with a NiO + SDC composite as the anode, a mixed oxide-ion/electronic conductor (MIEC) as the cathode, and a stainless steel as the metallic interconnect.     

钠离子电池HOPG负极固体电解质界面膜的AFM研究

固体电解质界面膜(Solid Electrolyte Interphase, SEI)在钠离子电池(Sodium Ion Battery, NIB)中扮演着重要作用。迄今为止, 对于钠离子电池SEI膜的探索仍然十分有限。本研究利用电化学原子力显微镜(Electrochemical AFM, EC-AFM), 通过循环伏安法研究了钠离子电池负极材料高定向热解石墨(Highly Oriented Pyrolytic Graphite, HOPG), 在碳酸乙烯酯(Ethylene Carbonate, EC)和氟代碳酸乙烯酯(Fluoroethylene Carbonate, FEC)电解液中首次充放电过程SEI膜的结构变化。通过纳米刻蚀的方法, 进一步获得首次充放电结束后SEI的厚度。结合X射线光电子能谱(X-ray Photoelectron Spectroscopy, XPS)分析了HOPG在EC和FEC电解液中所形成的SEI膜的化学组成区别。研究结果表明, 在EC电解液中, 所生成的SEI膜在HOPG表面非台阶处较薄, 但在HOPG的台阶处较厚; 在FEC电解液中, 所生成的SEI膜很厚, 具有明显的双层结构。其中上层是由体积较大的颗粒组成, 下层则由致密的小颗粒组成。     

Design methods for space-variant optical interconnections to achieve optimum power throughput

Optoelectronic systems based on space-variant optics give great freedom to the system designer in terms of interconnect topologies. One feature of space-variant systems is that they can achieve a high interconnect density. However, this density is achieved by having large arrays of diffractive elements with very small apertures relative to the propagation distances involved. Thus diffraction losses from the finite apertures can significantly affect power throughput for these types of systems, regardless of the diffractive efficiencies of the optical elements involved. Therefore it is desirable that this loss be minimized. We present several space-variant optical interconnect design methods (for both one-to-one and fan-out interconnects) and compare them in terms of power throughput for diffraction-limited interconnect distances. Both numerical simulations and experimental results are presented.     

氧化锆固体电解质高温电子电导的研究

针对高温固体电解质的离子阻塞电极制备难点,提出了一种新的离子阻塞电极制备方法.基于Wagner直流极化法测得了不同掺杂的氧化锆固体电解质的电子电导率.结果表明,依靠制备的可用于高温实验条件下的离子阻塞电极,可准确获得氧化钇稳定的氧化锆(YSZ)电解质的电子电导.     

Effect of a Magnetic Field on the Preparation of Silver Nanowires Using Solid Electrolyte Thin Films

The effect of an external magnetic field on the preparation of silver nanowires was studied. The silver nanowires were synthesized using solid electrolyte RbAg4I5 thin films by applying both a direct current （DC） electric field and a magnetic field. The RbAg4I5 thin films, which were prepared by deposition at room temperature and atmospheric pressure on a NaCI substrate, were used for the transfer of Ag^＋ ions between two Ag electrodes during the preparation process. When only the DC electric field is applied, the silver ions migrate toward the cathode. On the edge of the silver film at the cathode the Ag^＋ ions congregate to form aligned nanowires. If the magnetic field is also applied perpendicular to the DC electric field, the morphology of the nanowires can be controlled by rotating the sample in the magnetic field. Experimental results show that the growth of the silver nanowires is determined by the Ag^＋ ionic flux.     

Spectroelectrochemical reflection studies of gold nano-rod array membrane

Gold nano-rod array membranes (Au-NRM) were prepared by modification of the template method. A simple two-electrode device was assembled by holding an electrolyte solution between the Au-NRM and a transparent electrode. Small reflectance changes (less than 2%) in the visible band were induced on the Au-NRM surface by applying a DC voltage to the device. These changes could be visually observed. It was found based on a further evaluation that the reflectance changes responded very fast (less than 100 ms) to the DC voltage application, and were stable during the switching repetition (over 5000 times). When the cyclic scanning of the applied voltage to the device was carried out between -1.5 V and +1.5 V, the reflectance changes were increased over +1.0 V (-1.0 V). It was suggested from these experimental results that the reflectance changes were attributed to the surface oxidation and the deformation or mechanical motion of the Au nano-rod.     

光学设计用于全固态电致变色器件的高溅射效率三明治结构电解质

全固态电致变色器件以其光学对比度高、响应速度快以及良好的循环稳定性等特点而广泛应用于节能窗、屏幕显示、多功能储能设备等诸多领域.然而,传统的基于单层电解质体系的全固态电致变色器件常受限于光学透过率和溅射效率的不足.本工作利用反应直流磁控溅射技术成功制备了基于LiAlOx/Ta2C5/LiAlOx(ATA)三明治结构电解...     

A nickel silicide nanowire microscopy tip obtains nanoscale information

An electric conductive Ni silicide nanowire (NiSi NW) embedding electric force microscopy (EFM) tip was fabricated by the dielectrophoretic method and was used to obtain electric information. Due to the geometric and electric excellence, the NiSi NW provides advantages in imaging and fabrication of the microscopy tip. A lead zirconate titanate (PZT) ferroelectric thin film was positively and negatively polarized, and the polarities were obtained by probing of the NiSi NW EFM tip to give distinctive charging information of the PZT film. Moreover, the NiSi NW EFM probing was adopted to achieve the electrical signal from the NW interconnect. The NiSi NW EFM probe confirmed the uniform electric-potential distribution through the NiSi NW interconnect with a small standard deviation. This demonstrates the feasibility of functional utilizations of the NiSi NW.     

大型薄壁钢筋混凝土连体筒仓群爆破拆除

12个钢筋混凝土筒仓相互连接、结构稳定,因高宽比较小,难以整体向同一方向倾倒。通过预处理将其分割成3组独立的结构群体,通过每组顺序延时起爆,实现连体筒仓向两个方向定向倒塌。在对其进行较为充分预处理的基础上,通过选择合理的爆破切口高度、布孔参数、药量、延期时间和安全防护措施,确保了本次爆破的成功。     

A study of multiple singularities in multi-material wedges and their use in analysis of microelectronic interconnect structures

The nature of the singular stress field at bi-material and multi-material wedges with de-bonded or bonded interfaces is investigated in this paper with the aim of relating singular stress field to failures in microelectronic interconnect structures. The dependence of the strength and the number of the singularities on the relative material behavior as well as the wedge angle is extensively analyzed using planar isotropic elasticity. The procedure is used to analyze modern copper interconnect structures; the orders of singularities and angular functions are asymptotically determined, based on which the stress intensity factors are calculated.     

Morphology and growth of electrodeposited cuprous oxide under different values of direct current density

The growth of Cu₂O thin films electrodeposited by a two-electrode system with acid and alkaline electrolytes under different values of direct current (DC) densities was investigated. The microstructure of Cu₂O thin films produced in the acid electrolyte changes from a ring shape to a cubic shape with increasing DC density, and the microstructure of Cu₂O thin films produced in the alkaline electrolyte has a typical pyramid shape. The X-ray diffraction results show that Cu₂O thin films can be electrodeposited over a larger current domain than those deposited by a three-electrode system. The growth of Cu₂O thin films is examined under this domain, and the electrocrystallization process of such films is discussed taking into consideration the effect of current density on nucleation, cluster growth, and crystal growth.     

电化学还原法制备氧化铅纳米棒

本文介绍一种用电化学还原法制备氧化铅纳米棒的简单方法.实验中所用的电解液是混有氧氯化锆和三氯化钛的硝酸铅溶液,采用不锈钢片作为阴极和基底.在室温下,由直流电源供电,通过控制输出电流的大小在不锈钢片基底上沉积产物.氧化铅纳米棒的产生与电流密度有关,通过讨论,得出生成氧化铅纳米棒的最佳电流密度大小.用SEM、TEM、EDS和XRD对产物进行了表征.研究结果表明,所制备的氧化铅纳米棒是单晶结构.     

Two-sided through-wafer interconnect for optical spiral delay line

True-time-delay devices could significantly contribute to improving the performance of many optical systems in applications such as sensing, ranging, communication and signal processing. Delay devices based on spiral optical waveguides are of special interest due to their small size and relatively low power attenuation. In this paper, we propose to fabricate spirals on both sides of a wafer, where the coupling between them is through a vertical interconnect. The novel through-wafer interconnect has a level of attenuation that compares competitively with that obtained with a conventional s-shaped interconnect between two interleaved spirals and considerably simplifies the waveguide design and fabrication.     

A demountable interconnect system for a 50×50 ultrasonicimaging transducer array

A novel Pad Grid Array (PGA) system allows microminiature coaxial conductors to be electrically connected to a one-half wavelength, 50×50 element transducer array suitable for diagnostic ultrasound at 2.5 MHz. In order to achieve the desired one-half wavelength interconnection spacing present at the backing of the transducer module, an intermediary flexible printed circuit and other custom structures provide a transitional architecture between 42 AWG coax and inline interconnect pads at a 300 μm spacing. Due to critical alignment requirements, special processes are needed for fabrication and the successful connection of the fine-pitch circuit elements. A conductive anisotropic elastomeric material acts as the medium to effect the final interconnect between the PGA and transducer module. Because the anisotropic medium provides a separable interface, the interconnect system allows repeated connection. Acoustic performance indicates suitability for diagnostic imaging     

Fabrication of thin film TiO2 nanotube arrays on Co–28Cr–6Mo alloy by anodization

Titanium oxide (TiO₂) nanotube arrays were prepared by anodization of Ti/Au/Ti trilayer thin film DC sputtered onto forged and cast Co–28Cr–6Mo alloy substrate at 400 °C. Two different types of deposited film structures (Ti/Au/Ti trilayer and Ti monolayer), and two deposition temperatures (room temperature and 400 °C) were compared in this work. The concentrations of ammonium fluoride (NH₄F) and H₂O in glycerol electrolyte were varied to study their effect on the formation of TiO₂ nanotube arrays on a forged and cast Co–28Cr–6Mo alloy. The results show that Ti/Au/Ti trilayer thin film and elevated temperature sputtered films are favorable for the formation of well-ordered nanotube arrays. The optimized electrolyte concentration for the growth of TiO₂ nanotube arrays on forged and cast Co–28Cr–6Mo alloy was obtained. This work contains meaningful results for the application of a TiO₂ nanotube coating to a CoCr alloy implant for potential next-generation orthopedic implant surface coatings with improved osseointegrative capabilities.     

Materials for hydrogen generation via water electrolysis

A review is presented of materials that could be utilized as electrolytes (and their associated electrodes and interconnect materials) in solid-state electrolysis cells to convert water (or steam) into hydrogen and oxygen. Electrolytes that function as oxygen ion conductors or proton conductors are considered for various operating temperatures from approximately 80 °C to 1000 °C. The fundamental electrochemical reactions are reviewed with some discussion of special sources of steam and DC electricity (advanced nuclear) to drive the reactions at the higher temperatures.     

Modeling Electronic Properties of Multiwall Carbon Nanotubes

Reviewing experimental results and based on the physical reasoning, we present a basic circuit model for Multiwall carbon nanotubes (MWCNTs), which can simulate different experimental results. Investigation of different results confirms the severe effects of fabrication process (nanotube and contacts) on electronic properties of the MWCNTs. The circuit model has been developed to show the performance improvements of a CNT interconnect when the single-wall carbon nanotube (SWCNT) is replaced by an MWCNT. To calculate the current-voltage characteristic and the switching delay of MWCNTs, we have simulated their DC and AC properties, respectively, using the developed transmission line models. Based on the physical models, the elements of the circuit model can be changed so that the simulation and the practical measurements for an MWCNT can correspond. Switching Delays of the MWCNTs and SWCNTs are calculated and compared for different cases.     

Architectural limits on optical-highway-based parallel computing

The high bandwidth available in optoelectronic interconnects is often suggested as making them suitable for use in high-performance computer systems. However, it will be shown that for problems where message sizes are small, the latency of an optoelectronic interprocessor interconnect will place a lower limit on the number of processors required to produce performance enhancement over a traditional electronic interconnect.