铝钎焊接头中Cu元素的扩散行为研究

为了研究Al-Cu共晶合金钎料中Cu元素在钎焊接头中的扩散行为,采用快速凝固技术制备了Al-Cu共晶合金钎料,以纯铝棒料为基体采用对接接头在不同温度下进行了真空钎焊,并利用SEM和EDS对接头进行了研究.研究表明:钎料中Cu原子的扩散以晶界扩散为主,当晶界上Cu原子的浓度达到一定值后开始向晶内扩散,当晶内的Cu原子饱和后又反向扩散到晶界上;钎焊温度过低、保温时间过短时,Cu元素在基体内部不能充分扩散,在基体晶界上产生严重偏析,生成Al-Cu相中最脆的θ相(Al2Cu);提高钎焊温度和保温时间有利于提高Cu元素在Al基体中的扩散,但过高的钎焊温度又导致θ相的重新出现,选取合适的钎焊工艺参数才能获得良好的钎缝.     

耐高温瞬时液相连接无铅钎焊接头的时效稳定性

通过瞬时液相(TLP)连接的互连工艺,采用Sn4.7Ag1.7Cu+Ag复合钎料,制备Sn4.7Ag1.7Cu+Ag复合钎料/Cu接头.采用SEM观察恒温时效过程中接头的组织,结合EDS对比不同工艺下试样接头组织,并对接头性能进行对比分析.结果表明:随着Ag颗粒含量的增加,Sn4.7Ag1.7Cu+Ag/Cu接头耐高温(300℃)服役性能随之提高;Ag含量为25％(质量分数)时接头在高于基体钎料熔点(217℃)83℃下服役15天未断裂,且抗拉强度为25.74 MPa,达到了低温焊接、高温服役的目的;与Sn4.7Ag1.7Cu/Cu接头相比,随着时效的进行,Sn4.7Ag1.7Cu+Ag复合钎料/Cu接头焊缝组织中残余的Ag颗粒不断溶解,并在接头界面附近产生大量Ag3 Sn化合物,而大量的块状Ag3 Sn化合物可以有效抑制焊缝中Sn元素向Cu基板扩散,达到抑制Cu3 Sn层生长的目的;在200℃服役温度条件下,随着时效的进行,Sn4.7Ag1.7Cu+Ag复合钎料/Cu接头力学性能先下降后上升,然后再下降并趋于稳定,且力学性能稳定性比Sn4.7Ag1.7Cu/Cu接头要好.     

微量Ag元素对Sn-O.7Cu-O.2Ni钎料性能的影响

在Sn-0.7Cu-0.2Ni钎料中添加微量的Ag元素,测试了钎料的熔化温度、热膨胀性能、抗腐蚀性能及其润湿性.结果表明,添加微量的Ag元素降低了Sn-0.7Cu-0.2Ni的熔点,但增加了钎料的熔程.当Ag含量为0.3％(质量分数)时,钎料熔点为224.07℃,熔程为6.1℃.钎料的热膨胀系数随Ag含量的增加而升高.当Ag含量为0.3％(质量分数)时,钎料的热膨胀系数(20～100℃)为1.84×10-5/℃.另外添加Ag元素提高了钎料在HC1溶液中的抗腐蚀性能,同时也提高了钎料在Cu基板上的铺展面积.     

轧制工艺对银钎料流铺性的影响

采用扫描电镜、XRD等分析手段对有油和无油轧制后的银基钎料进行研究.结果表明,有油轧制的钎料会在其表面残留一层含碳层,含碳层的厚度约为3~7μm;所选银钎料的主要的相组成为Cu Zn、Ag Cd、(Ag,Cu)5Zn8、Ag Cd19等,碳在钎料表面主要以游离的碳分子和Zn C8、C2Cd O4形式存在;钎料表面的含碳层在钎料熔化后将以三种不同的形式存在,部分碳分子来不及上浮到表面而被包裹在钎料内部;部分碳分子随着钎料的熔化铺展,被液态钎料推到了铺展的最前沿,在液态钎料周围形成一个包围圈;还有一部分形成含碳的复杂化合物,其存在都将明显降低钎料对钢基体的润湿性,影响后续的焊接强度等.     

亚共晶钎缝组织分析与冷却速率对其形态的影响

对熔化后的BCuP-5钎料进行XRD分析,并用BCuP-5钎料真空钎焊紫铜,用扫描电镜对钎缝组织进行分析研究,利用EDX能谱分析钎缝中各相元素含量,探讨钎缝的形成机理.结果表明:钎缝主要是形成了亚共晶组织,领先相为含Ag和P的a(Cu)固溶体,共晶体的组分为!α(Cu)+α(Ag)+Cu3P.BCuP-5钎焊紫铜后形成...     

SnAgCuBi无铅钎料对不同体积比SiCP/6063Al复合材料真空软钎焊接头组织和性能的影响

在不同保温时间下,分别采用 Sn-3.0Ag-0.5Cu 和 Sn-3.0Ag-0.5Cu-3.0Bi 无铅软钎料,对表面镀镍的两种不同体积分数的 SiCP/6063Al 复合材料进行真空软钎焊。通过剪切强度测试、显微组织分析、能谱分析等手段研究了钎焊接头的组织和性能。结果表明：Bi 元素的加入改善了 Sn-3.0Ag-0.5Cu 钎料的铺展润湿性,降低了熔点,提高了焊缝的抗剪强度;在270℃保温35 min 时,Sn-3.0Ag-0.5Cu-3.0Bi 钎料钎焊接头抗剪强度达到最高值38.23 MPa;钎焊过程中只是两侧镀镍层间的焊接,钎料并未透过镍层与母材发生扩散反应。     

采用银基活性钎料钎焊碳/碳复合材料

采用银基活性钎料（Ag-Cu-Ti）对二维层间增强型和三维正交增强型C/C复合材料进行了真空钎焊工艺试验，采用扫描电镜（SEM）观察了钎焊接头和连接界面的微观组织形貌，测定了各元素的面分布，对钎焊接头进行了室温压缩剪切性能试验和三点弯曲强度试验。结果表明：钎料中的元素Ti向钎料和C/C界面区扩散并富集，生成了含元素C的Ti2Cu化合物相，形成了钎料对C/C基体的良好润湿，可获得组织致密的接头，接头室温三点弯曲强度为：39MPa，抗剪强度为22MPa。     

微量Ag元素对Sn-0.7Cu-0.2Ni钎料性能的影响

在Sn-0.7Cu-0.2Ni钎料中添加微量的Ag元素,测试了钎料的熔化温度、热膨胀性能、抗腐蚀性能及其润湿性。结果表明,添加微量的Ag元素降低了Sn-0.7Cu-0.2Ni的熔点,但增加了钎料的熔程。当Ag含量为0.3%(质量分数)时,钎料熔点为224.07℃,熔程为6.1℃。钎料的热膨胀系数随Ag含量的增加而升高。当Ag含量为0.3%(质量分数)时,钎料的热膨胀系数(20～100℃)为1.84×10-5/℃。另外添加Ag元素提高了钎料在HCl溶液中的抗腐蚀性能,同时也提高了钎料在Cu基板上的铺展面积。     

SiC纤维增强钛基复合材料钎焊接头界面组织及连接机理

针对SiCf/β21s钛基复合材料,采用Ti-Zr-Cu-Ni-Co系新钎料,进行了钎焊实验和接头组织研究.实验结果表明:Cu,Ni,Co三种元素在整个钎缝中扩散充分,这使得与Ti基体反应形成的化合物相在单位体积内减少;同时,Al和Mo两种β相形成元素在钎缝中大量分布,导致钎缝基体与母材基体组织相近,均由β相组成.这两方面因素共同存在将提高接头性能.     

第十四讲:真空工程用焊接技术

7．2．2扩散钎焊用钎料 扩散钎焊时，钎料起着决定性的作用。与一般钎焊方法相比，扩散钎焊用钎料应满足两个特殊要求：一是应含有一定量能够降低钎料熔点的降熔元素，这些元素在扩散钎焊过程中又非常容易地扩散到基材中或被基材溶解；二是降熔元素扩散或被溶解后，钎料的强度和性能应能满足设计和使用要求。     

The effects of welding parameters on the weldability of different materials using brazing alloy fillers

The objectives of the study were to investigate the microwelding conditions related to diffusion mechanism and elemental migration metallurgical and microscopy investigation, and to establish the fundamental corrosion mechanism on the properties of small welding and brazing areas that consist different materials. This study focuses on the weldability of Ti /Ni using microspot brazing technology by selection of brazing condition current, 2, 2.5, 3, 3.5 and 4 kA, voltage 2 V, load 60 N and welding time 25–50 ms, this welding condition effective on brazing temperature optimization this condition. Ti and Ni were selected as base metals. Four types of metal fillers were used as filler foils, sandwiched between Ti/Ni. First type of metal fillers was, 65Ni–35Cu foil, melting point 846 °C; the second was, 71Ag–28Cu–1Mg foil, melting point 775 °C; the third was, 80Ag–18Cu–2Ti foil, melting point 782 °C; and fourthly was, 73Ni–18Cr–9Si foil, melting point 917 °C. The electrode tip face chosen was circuitous in form. All brazed joint were made by microspot brazing method. Brazing was done under normal atmospheric condition.     

Vacuum brazing of NiTi alloy by AgCu eutectic filler

Abstract

Joining of NiTi alloy to itself has been realised by vacuum brazing process using AgCu28 eutectic as filler metal. Microstructures, mechanical and shape memory behaviour have been investigated. The shearing strength of the brazed joint exceeds 100 MPa, and rupture occurs at the diffusion layer of parent metal beside brazing metal. The brazed joint will be stronger than parent metal on condition of the specimen with a joint of lap length 10 times of plate thickness. The brazed specimen shows a good shape memory behaviour. From the point of view of practice, the brazing joint design principle and brazing quality improvement have been discussed.     

A process model for active brazing of ceramics: Part II Optimization of brazing conditions and joint properties

In the present investigation, the process model developed in Part I has been applied to evaluate the microstructure and strength evolution during active brazing of ceramics. As a starting point, reaction-layer growth is assumed to occur isothermally with no restrictions in the supply of reactive element. Different kinds of diagrams are then constructed to show how specific process variables (e.g. the heating and cooling period, the limiting layer thickness, and the diffusion mechanism) affect the growth kinetics. It is concluded that the key to improved joint properties lies in control of the reaction-layer thickness through optimization of the brazing conditions, and an illustration of this is given. This revised version was published online in November 2006 with corrections to the Cover Date.     

CuTiNiZrV Amorphous Alloy Foils for Vacuum Brazing of TiAl Alloy to 40Cr Steel

Vacuum brazing of TiAl alloy to 40Cr steel sheets was conducted with newly developed CuTiNiZrV amorphous foils. It was found that a diffusion layer,filler metal and reaction layer existed in the brazed seam. The diffusion layer in the joint brazed with Cu43.75Ti37.5Ni6.25Zr6.25V6.25(at.%) foil was flat and thin,containing Ti19Al6 and Ti2Cu intermetallic compounds; however,the diffusion layer brazed with Cu37.5Ti25Ni12.5Zr12.5V12.5 foil was uneven with bulges,consisting of essentially Ti-based solute solution. The foil with 12.5 at.% V showed inferior spreadability compared to that with 6.25 at.% V at brazing temperature. However,fracture happened along the diffusion layer with 6.25 at.% V foil due to the formation of brittle intermetallic phases,but the joints brazed with 12.5 at.% V foil failed through the TiAl substrate. These results show that designing amorphous alloy with less Ti and more V for brazing TiAl alloy to steel is appropriate.     

Diffusionslöten von Aluminium mittels PVD applizierter Lotzusatzwerkstoffe

Diffusion brazing of aluminium by PVD applied filler metals Diffusion brazing of aluminium and aluminium alloys precoated with filler metal components enables fluxless wetting and obtains braze joints of high strength at moderate brazing temperatures. Previously deposited components of filler metals on the base materials as thin film, using Arc‐PVD‐process lead during a subsequently diffusion brazing process to the formation of a local liquid phase (transient liquid phase). The liquid phase is formed from the deposited thin film material and the base material and is solidified isotherm due to diffusion procedures. In doing so braze joints of higher melting point than brazing temperature can be realised. In this work, vacuum brazing of the two systems, Al‐Cu and Al‐Cu‐Si have been investigated. Cu and Al‐Cu‐Si were deposited on the base material using Arc‐PVD‐process. The base materials were pure aluminum and EN‐AW6060. Metallographic and scanning electron microscope analyses proved that the braze seam area after the completed diffusion brazing process shows similar structure and composition as the base material.     

活性钎焊法连接碳化硅陶瓷的连接强度和微观结构

采用三元Ag-Cu-Ti活性焊料连接常压烧结碳化硅陶瓷,研究了反应温度、保温时间等钎焊工艺对碳化硅陶瓷连接强度的影响,分析了连接界面的微观结构和反应产物. 实验结果表明,在实验范围内,钎焊温度和保温时间对碳化硅陶瓷的连接强度均有峰值,四点弯曲强度最高达到342MPa,随着钎焊温度的升高,界面反应层厚度增加,连接强度提高,但过高的钎焊温度引起焊料的挥发而使连接强度下降. 焊料中的活性元素Ti与碳化硅发生反应在连接界面形成均匀致密的反应层,反应层厚度约1μm,XRD和EDX能谱分析结果表明反应产物是TiC和Ti₅Si₃.     

Study on cold metal transfer welding–brazing of titanium to copper

3 mm Pure titanium TA2 was joined to 3 mm pure copper T2 by Cold Metal Transfer (CMT) welding–brazing process in the form of butt joint with a 1.2 mm diameter ERCuNiAl copper wire. The welding–brazing joint between Ti and Cu base metals is composed of Cu–Cu welding joint and Cu–Ti brazing joint. Cu–Cu welding joint can be formed between the Cu weld metal and the Cu groove surface, and the Cu–Ti brazing interface can be formed between Cu weld metal and Ti groove surface. The microstructure and the intermetallic compounds distribution were observed and analyzed in details. Interfacial reaction layers of brazing joint were composed of Ti₂Cu, TiCu and AlCu₂Ti. Furthermore, crystallization behavior of welding joint and bonding mechanism of brazing interfacial reaction were also discussed. The effects of wire feed speed and groove angle on the joint features and mechanical properties of the joints were investigated. Three different fracture modes were observed: at the Cu interface, the Ti interface, and the Cu heat affected zone (HAZ). The joints fractured at the Cu HAZ had higher tensile load than the others. The lower tensile load fractured at the Cu interface or Ti interface was attributed to the weaker bonding degree at the Cu interface or Ti interface.     

镍基含硼钎料钎焊IC-6合金接头近缝区硼化物研究

研究了采用镍基含硼钎料钎焊IC -6合金时 ,接头近缝区出现的硼化物相的形貌、成分及结构 ,结果表明主要存在两种成分的硼化物相 ,r(Ni) :r(Mo)分别近似为 1 :1和 1 :2 .硼化物取向有一定规律 .对接头近缝区与合金中硼化物的形貌、成分进行了对比 .     

Cu-P-Sn-Ni钎料真空钎焊MGH956合金的研究

为扩展Cu-P基钎料在连接MGH956合金中的应用,采用新型Cu-P-Sn-Ni钎料对MGH956合金在800~890℃进行了真空钎焊,研究了不同钎焊温度和保温时间对焊缝组织及力学性能的影响.结果表明:在所研究的钎焊温度范围内保温5 min均可获得成形效果良好的钎焊接头,其主要由钎缝中心区和界面反应层组成,其中,钎缝中心区由α(Cu)固溶体基体和化合物Cu_3P+(Fe,Ni)_3P+FeCr组成,反应层由α(Fe)固溶体、Fe_3P和Cu_3P组成;随着钎焊温度的升高,反应层厚度逐渐增加,钎缝中心区中的化合物Cu_3P+(Fe,Ni)_3P+FeCr的形态也随之发生明显改变;各钎焊温度下获得的钎焊接头经室温拉伸,断裂均发生在钎缝中心区,断口形貌呈现韧性和脆性的混合断裂特征.830℃钎焊5 min的接头抗拉强度最大,为510.3 MPa,达到了母材抗拉强度的70.9%.     

Formation of microlayers of clad residue on aluminium brazing sheet during melting and resolidification in brazing process

Abstract

The present paper is devoted to an analysis of clad residue formation during a controlled atmosphere brazing (CAB) process applied to composite aluminium brazing sheets. Evolution of the microstructure of the clad residue, and in particular the mass of resolidified clad formed, were studied. Observations confirmed that, even under optimal brazing conditions, a residue layer (formed away from the joint zone) always appears after brazing. It was established that the peak brazing temperature plays an important role in the process responsible for formation of the residue mass. However, dwell time at the peak brazing temperature does not have a significant influence on clad residue mass accumulation beyond its known influence on substrate dissolution and core metal erosion in the joint zone.