Investigation of the effect of composition on microhardness and determination of thermo-physical properties in the Zn–Cu alloys

Zinc–copper of (99.99%) high purity alloys were directionally solidified upward with different compositions, C_o, Zn–(0.7,1.5, 2.4 and 7.37) wt.% Cu under two different solidification conditions (G = 3.85 K/mm, V = 0.0083 mm/s and G = 8.70 K/mm, V = 0.436 mm/s) using a Bridgman type directional solidification apparatus. The measurements of microhardness of directionally solidified samples were made by using a microhardness test device. The dependence of microhardness (HV) on composition was analyzed. According to these results, it has been found that the values of HV increase with the increasing Cu content (C_o). Variation of electrical resistivity (ρ) and electrical conductivity (σ) with the temperature were also measured by using a standard d.c. four-point probe technique. The enthalpy of fusion (ΔH) and specific heat (Cp) of the Zn–Cu alloys were determined from heating curve during the transformation from solid to liquid phase by using differential scanning calorimeter (DSC).     

Dependency of eutectic spacings and microhardness on the temperature gradient for directionally solidified Sn–Ag–Cu lead-free solder

Sn–3.5 wt.%Ag–0.9 wt.%Cu alloy was directionally solidified upward at a constant growth rate (V = 7.20 μm s⁻¹) with different temperature gradients (G = 2.48–6.34 K mm⁻¹) by using a Bridgman type directional solidification furnace. The eutectic microstructures of directionally solidified Sn–3.5 wt.%Ag–0.9 wt.%Cu alloy were observed to be plate and rod structures from quenched samples. The values of eutectic spacings (λ) and microhardness (H_V) were measured from both transverse and longitudinal sections of the samples. The dependence of eutectic spacings (λ) and microhardness (H_V) on the temperature gradient (G) were determined by using linear regression analysis. According to these results, it has been found that, the value of λ decreases with the increasing the value of G and whereas, the value of H_V increases for a constant growth rate. The results obtained in the present work were also compared with the previous similar experimental results obtained for binary and ternary alloys.     

Effects of nano-structured particles on microstructure and microhardness of Sn–Ag solder alloy

In this research, the typical nano-structured Polyhedral Oligomeric Silsesquioxane (POSS) particles were incorporated into the Sn–3.5Ag eutectic solder paste by mechanically mixing to form lead-free composite solder. The effects of nano-structured POSS additions on the microstructure and mechanical properties of as-fabricated composite solder alloys were systematically investigated. Experimental results indicated that the average size and spacing distance of Ag₃Sn intermetallic compounds (IMCs) in composite solder matrix decreased as compared to the Sn–3.5Ag eutectic solder. The 3 wt% addition of nano-structured POSS particles could enhance the microhardness of composite solder by 18.4% compared with the Sn–3.5Ag eutectic solder matrix. The average grain size and spacing distance of Ag₃Sn IMCs in Sn–Ag + 3 wt% POSS composite solder matrix reduced from 0.35 to 0.23 μm and from 0.54 to 0.32 μm, respectively. The refined Ag₃Sn IMCs, acting as a strengthening phase in the solder matrix, could enhance the microhardness of the composite solders.     

The effect of ball milling on the melting behavior of Sn–Cu–Ag eutectic alloy

Sn–Ag–Cu (SAC) solder alloys are the best Pb free alternative for electronic industry. Since their introduction, efforts are made to improve their efficacies by tuning the processing and composition to achieve lower melting point and better wettability. Nanostructured alloys with large boundary content are known to depress the melting points of metals and alloys. In this article we explore this possibility by processing prealloyed SAC alloys close to SAC305 composition (Sn-3wt%Ag-0.5wt%Cu) by mechanical milling which results in the formation of nanostructured alloys. Pulverisette ball mill (P7) and Vibratory ball mills are used to carry out the milling of the powders at room temperature and at lower temperatures (−104 °C), respectively. We report a relatively smaller depression of melting point ranging up to 5 °C with respect to original alloys. The minimum grain sizes achieved and the depression of melting point are similar for both room temperature and low-temperature processed samples. An attempt has been made to rationalize the observations in terms of the basic processes occurring during the milling.     

Investigation on Sn grain number and crystal orientation in the Sn–Ag–Cu/Cu solder joints of different sizes

Polarized light microscopy and electron backscatter diffraction have been used to quantify the number of β-Sn grains and to examine the Sn crystallographic orientation in Sn–Ag–Cu/Cu solder joints, respectively. The effect of solder joint size on the Sn grain features was investigated due to the miniaturization of solder joints. The Sn–Ag–Cu solder joints of different sizes were found to contain only several β-Sn crystal grains and most solder joints were comprised of no more than three Sn grains. The solder joints showed a preferred crystal orientation. The c crystal axis of β-Sn grains tended to be at a small angle with solder pads. Specific orientation relationships were observed to be prevalent between neighboring β-Sn grains. The grain number, crystal orientation and misorientation were independent of solder joint size.     

Influence of solidification variables on the microporosity formation on Al–Cu (4.5 wt%) alloy with axial heat processing

The effects of solidification rate, hydrogen concentration, and level of convection on porosity formation in Al–Cu (4.5 wt%) alloys were investigated using Axial Heat Processing (AHP). This processing technique is similar to the conventional directional solidification (DS) technique, except that it utilizes a graphite baffle immersed near the solidification interface to control the shape of the interface and impart an axial temperature gradient. It was found that the samples produced by AHP contained 20–40% less microporosity than similar samples produced by conventional DS. The reduction was also more pronounced with decreasing a cooling rate and increasing an initial hydrogen concentration in the melt. These differences are attributed to the solute accumulation that is due to the confinement of the liquid below the baffle and the concomitant reduction in the convection level near the interface.     

Investigation on the mechanical properties and frictional performance of Ni–Cu–Si alloy

The microstructure evolution, mechanical properties and dry sliding behaviour of Ni–30Cu–xSi alloy have been investigated systematically. As the volume fraction of microscale second-phase particles and nanoscale precipitates increases, the hardness, yield strength and ultimate tensile strength of alloy are improved significantly but elongation is reduced. Through confocal laser scanning microscope and atomic force microscope, it is suggested that the wear mode changes from the mixture of abrasive and adhesive wear to single abrasive wear. Owing to the existence of netlike microscale second-phase particles which are more likely to split the matrix, the Ni–30Cu–5.5Si alloy exhibits an abnormal higher wear rate even with the highest hardness. The netlike structure which deteriorates the friction performance should be avoided in wear-resistant materials.     

Effect of Al on the microstructure and properties of Sn–0.7Cu solder alloy

Effect of Al on the microstructure and mechanical properties were investigated. The results showed that Al could depress the formation of eutectic phase in Sn–Cu–Al solder alloy. The intermetallic compounds of Sn–0.7Cu–0.03Al were refined compared with that of Sn–0.7Cu–0.015Al. Segregated CuAl intermetallic compound was observed in Sn–0.7Cu–0.15Al and Sn–0.7Cu–0.5Al solder alloy. Sn-whisker was observed on the polished surface of Sn–0.7Cu–0.15Al and Sn–0.7Cu–0.5Al. The ultimate tensile strength of Sn–0.7Cu–0.03Al and Sn–0.7Cu–0.5Al was found to be higher than that of Sn–0.7Cu–xAl (x = 0, 0.015 and 0.15). The elongation of Sn–0.7Cu–0.015Al was the highest. The creep performance of Sn–0.7Cu–0.03Al and Sn–0.7Cu–0.5Al was similar and higher than that of Sn–0.7Cu and Sn–0.7Cu–0.15Al.     

Dependency of microstructure parameters and microhardness on the temperature gradient for directionally solidified Ti–49Al alloy

Intermetallics Ti–49Al (at.%) alloy was directionally solidified with different temperature gradients (G) ranged from 2.8 K mm⁻¹ to 12.5 K mm⁻¹ at a constant growth rate (V = 10 μm s⁻¹) by using a Bridgman-type directional solidification furnace. The microstructure of the directionally solidified specimen is constituted of α₂(Ti₃Al) and γ(TiAl) lamellar structures. The values of the primary dendritic spacing (λ), interlamellar spacing (λ_L) and microhardness (HV) were measured. Dependencies of λ, λ_L and HV on G were determined by using the linear regressing analysis. According to these results, the values of λ and λ_L decrease with the increase of G, and the values of HV increase with the increase of G and with the decrease of λ and λ_L. In addition, these results were compared with the previous similar experimental results of TiAl-based alloys.     

Effect of addition of Al and Cu on the properties of Sn–20Bi solder alloy

This study investigates the effect of the composite addition of Al and Cu on the microstructure, physical properties, wettability, and corrosion properties of Sn–20Bi solder alloy. Scanning electron microscopy and X-ray diffraction were used to identify the microstructure morphology and composition. The spreading area and contact angle of the Sn–20Bi–x (x?=?0, 0.1 wt% Al, 0.5 wt% Cu, and 0.1 wt% Al–0.5 wt% Cu) alloys on Cu substrates were used to measure the wettability of solder alloys. The results indicate that the alloy with 0.1 wt% Al produces the largest dendrite and the composite addition of 0.1 wt% Al and 0.5 wt% Cu formed Cu₆Sn₅ and CuAl₂ intermetallic compounds in the alloy structure. And the electrical conductivity of Sn–20Bi–0.1Al is the best, which reaches 5.32 MS/m. The spread area of the solder alloy is reduced by the addition of 0.1 wt% Al and 0.5 wt% Cu, which is 80.7 mm². The corrosion products of Sn–20Bi–x solder alloys are mainly lamellar Sn₃O(OH)₂Cl₂ and the corrosion resistance of 0.1 wt% Al solder alloy alone is the best. The overall corrosion resistance of Sn–20Bi–0.1Al–0.5Cu is weakened and the corrosion of solder alloy is not uniform.

     

Effects of Dy substitution for Sn on the solderability and mechanical property of the standard near eutectic Sn–Ag–Cu alloy

In this study, the solderability of Sn–3.5Ag–0.5Cu–xDy solders were investigated and the shear strength properties of joints with Cu substrate were investigated. The results indicated that a small amount Dy addition can improve the solderability, and the optimal amount of Dy was 0.025 wt%. The maximum shear strength can be found with 0.025 wt% Dy addition, improved by 74%. With the observation of the fracture morphology, it was found that a small amount Dy can improve the ductility of the solder joints; but excessive amount of Dy would deteriorate the shear strength and form large dimples on the fracture surface.     

On effect of FSP on microstructural and mechanical characteristics of A390 hypereutectic Al–Si alloy

Abstract

In the present article, the effect of friction stir processing (FSP) on the microstructural and mechanical characteristics of A390 hypereutectic Al–Si alloy was studied. The effect of tool rotational speed ω, traverse speed υ and the number of passes on such characteristics was investigated. The results showed that FSP significantly improved the microstructural characteristics of A390 Al alloy by reducing the structural defects found in the as cast alloy such as porosity and the size of α-Al primary grains as well as the size of the primary Si particles. The size of Si particulates was found to be reduced by reducing the tool rotational speed, increasing tool traverse speed and increasing the number of FSP passes.     

In situ study on growth behavior of Cu6Sn5 during solidification with an applied DC in RE-doped Sn–Cu solder alloys

The growth behavior of Cu₆Sn₅ intermetallic compounds in rare earth (RE)-doped Sn–Cu solder alloys with an applied direct current (DC) has been in situ investigated using synchrotron radiation imaging technology. The morphological evolutions of Cu₆Sn₅ with various shapes of I-like, Y-like and bird-like are directly observed. After doping RE, the number of I-like and bird-like Cu₆Sn₅ is decreased, but the number of Y-like Cu₆Sn₅ is increased. The morphologies of Cu₆Sn₅ are more uniform and the mean lengths of Cu₆Sn₅ of different shapes are reduced in RE-doped alloys compared with that in RE-free alloys, which is attributed to the adsorption effect of RE. The growth orientation of Y-like Cu₆Sn₅ is changed after La is doped. Additionally, with an applied DC, the nucleation rate of Cu₆Sn₅ is increased and the growth rate is markedly enhanced resulting in the refinement of Cu₆Sn₅. Furthermore, the mechanisms of refinement caused by RE and DC are specifically discussed.     

Influence of equal channel angular extrusion processing parameters on the microstructure and mechanical properties of Mg–Al–Y–Zn alloy

An as-cast Mg–Al–Y–Zn alloy was successfully processed by equal channel angular extrusion (ECAE) in the temperature range of 225–400 °C, and the influences of processing temperature on the microstructure and mechanical properties were investigated. The use of back pressure during one-pass ECAE of Mg–Al–Y–Zn alloy was favorable for eliminating the undeformed area in the billet. At the processing temperature below 250 °C, the microstructures were characterized by unrecrystallised structure and the precipitated phase Mg₁₇Al₁₂ was elongated along the extrusion direction. With increasing processing temperature to 350 °C, a large number of recrystallised grains were obtained. Increasing processing temperature promoted workability but led to decrease in the strength of Mg–Al–Y–Zn alloy. Then billets of as-cast Mg–Al–Y–Zn alloy were extruded at different numbers of ECAE passes. It was found that the microstructure was effectively refined by ECAE and mechanical properties were improved with numbers of ECAE passes increasing from one-pass to four passes. However, strengths decreased slightly after five passes though the grain size decreased considerably.     

Investigation on preparation and mechanical properties of W–Cu–Zn alloy with low W–W contiguity and high ductility

In order to improve the mechanical properties of the W–Cu alloy, the W–Cu–Zn alloys with low W–W contiguity were fabricated by three different preparation methods. For the first method, the mixed powder of copper-coated tungsten powder and Zn powder was sintered by SPS (Spark Plasma Sintering) process. For the second method, the mixed powder was processed by CIP (Cold Isostatic Pressing) before SPS. For the third method, a skeleton of the copper-coated tungsten powder was prepared by CIP, and then the skeleton was infiltrated with H70 brass. The microstructure, mechanical properties and failure mechanism of the prepared W–Cu–Zn alloys were investigated. The results show that the W–Cu–Zn alloy fabricated by the third method achieves a high relative density of 98.4% and a low W–W contiguity of 10%. The alloy exhibits a high dynamic compressive strength of 1000 MPa, with a high critical failure strain of 0.7. The Cu-Zn matrix of the alloy fabricated by the third method is composed of α-phase Cu–Zn alloy and Cu₃Zn particles. The homogeneous distribution of Zn in the matrix manifests good solution strengthening effect and the uniformly distributed Cu₃Zn particles has a strong precipitation strengthening effect, which are both responsible for the evidently enhanced mechanical properties.     

Evolution behavior of δ phase in Cu12Sn2Ni alloy and the corresponding effects on alloy property

With the increase of tin content in tin bronze, the rise of δ phase made the strength, hardness of tin bronze increase and the ductility decrease sharply, that difficult to process. In this paper, the Cu12Sn2Ni alloy was prepared by centrifugal casting, the microstructure and phase formation before and after heat treatment were observed by x-ray diffraction, scanning electron microscope, and transmission electron microscope. The results showed that the as-cast sample microstructure was composed of equiaxed grains rather than coarse dendrites. centrifugal casting inhibits tin diffusion to form metastable phase β′-Cu_13.7Sn. The as-cast sample had good deformability and its tensile strength and elongation were 381.9 MPa and 12.4 %, respectively, which are higher than the mechanical properties of gravity casting. The tensile strength and elongation of the sample after furnace cooling at 620 °C/8 min are 439.5 MPa and 24.4 %, respectively, the increase was 16.6 % and 85.07 %, compared with the as-cast samples, due to the solid solution strengthening, the second phase strengthening and the homogenization of the microstructure.     

Review on microstructure evolution in Sn–Ag–Cu solders and its effect on mechanical integrity of solder joints

The use of Pb-bearing solders in electronic assemblies is avoided in many countries due to the inherent toxicity and environmental risks associated with lead. Although a number of “Pb-free” alloys have been invented, none of them meet all the standards generally satisfied by a conventional Pb–Sn alloy. A large number of reliability problems still exist with lead free solder joints. Solder joint reliability depends on mechanical strength, fatigue resistance, hardness, coefficient of thermal expansion which are influenced by the microstructure, type and morphology of inter metallic compounds (IMC). In recent years, Sn rich solders have been considered as suitable replacement for Pb bearing solders. The objective of this review is to study the evolution of microstructural phases in commonly used lead free xSn–yAg–zCu solders and the various factors such as substrate, minor alloying, mechanical and thermo-mechanical strains which affect the microstructure. A complete understanding of the mechanisms that determine the formation and growth of interfacial IMCs is essential for developing solder joints with high reliability. The data available in the open literature have been reviewed and discussed.     

Effect of Sn addition on microstructure and dry sliding wear behaviors of hypereutectic aluminum–silicon alloy A390

In this study, the effect of Sn addition on the microstructure and dry sliding wear behaviors of as-cast and heat-treated hypereutectic A390 alloys was investigated. The microstructural features of the alloys were characterized by means of optical microscope, scanning electron microscope (SEM), and energy dispersive X-ray spectroscopy techniques and their wear characteristics were evaluated at different loads. The worn morphologies of the wear surface were examined by SEM. The results show that the β-Sn in as-cast A390 alloy precipitates mainly in the form of particles within the Al₂Cu network on the interface of the eutectic silicon and α-Al phases and the grain boundaries of α-Al phase. The addition of Sn promotes the disintegrating and spheroidizing of both the eutectic and primary silicon of the A390 alloy during solid solution-aging treatment and β-Sn phase grains coalesces and grows, and some of them form the structure of Sn wrapping Si. The wear rates and friction factors of the as-cast and heat-treated A390 alloys with Sn are lower than those without Sn. At lower load, the addition of Sn changes the wear mechanism of as-cast A390 alloy from the combination of abrasive and adhesive wear without Sn into a single mild abrasion wear with Sn; at higher load, the wear of as-cast A390 alloy without Sn includes abrasion, adhesive, and fatigue one, while the addition of Sn effectively restrains the net-like cracks on the worn surface of the alloy and avoids the fatigue wear emerged.     

The effect of aging process on the microstructure and mechanical properties of a Cu–Be–Co–Ni alloy

The paper investigated the effect of two aging processes (i.e. normal aging and interrupted aging) on the microstructure and mechanical properties of a Cu–Be–Co–Ni alloy. The results of tensile and Kahn tear tests showed that the interrupted aging (IA) process could significantly improve the uniform elongation and plane stress fracture toughness with tiny decrease in ultimate tensile strength, when compared with the results from normal aging (NA) process. Under the scanning electron microscope, the fracture surface of samples treated by NA followed the intergranular fracture, while that of the samples treated by IA followed the transgranular fracture. The transmission electron microscope study revealed the differences between the microstructure of the alloy treated by NA and IA processes. After the NA process, the slender strip of γ′ precipitates aggregated at grain boundaries with a length of approximately 10 to 45 nm; the disk-shaped γ″ precipitates in the alloy treated by IA distributed homogenously throughout whole grains with a length of about 3 to 10 nm. The discussion of strengthening mechanisms demonstrated that the mechanism of precipitate shearing by dislocations made a contribution to the strengthening of the alloy treated by IA, while the Orowan mechanism was the dominant strengthening mechanism in the alloy treated by NA.     

The segregation of copper and silicon in Al–Si–Cu alloy during electromagnetic centrifugal solidification

The present paper investigates the segregation of copper and silicon in an Al–1wt%Cu–1wt%Si alloy solidified under the co-action of centrifugal and electromagnetic forces. The reasons for the solute segregation and the effect of electromagnetic force on segregation are discussed. Tubular samples cut from the solidified alloy are analyzed, the results showing that the segregation of copper and silicon occurs along the normal direction of the samples and that the electromagnetic field has a remarkable influence on the segregation of both copper and silicon. As the exciting current increases, the segregation of copper decreases, while the segregation of silicon first increases and then decreases. The migration of solute atoms in the melt depends not only on the density difference between the solute and aluminum atoms, but also on the strength of the electromagnetic force. The magnetic force changes the rotation velocity of the melt, reduces the migration velocity of copper and causes the reduction of copper segregation. Because of the difference of the electrical conductivity between the solute and the aluminum melt, the reductions of velocity are not equal.