Scratch behavior of boron nitride nanotube/boron nitride nanoplatelet hybrid reinforced ZrB2-SiC composites

Spherical instrumented scratch behavior of ZrB₂-SiC composites with and without hybrid boron nitride nanotubes (BNNTs) and boron nitride nanoplatelets (BNNPs) was investigated in this research. Typical brittle fracture such as microcracks both in and beyond the residual groove and grain dislodgement was observed in ZrB₂-SiC composite, while hybrid BN nanofiller reinforced ZrB₂-SiC composite exhibited predominantly ductile deformation. The peculiar three-dimensional hybrid structure in which BNNPs retain their high specific surface area and de-bundled BNNTs extend as tentacles contributes to the improved tolerance to brittle damage. Additionally, easier grain sliding due to BN hybrid nanofillers located at grain boundaries and these BN hybrid nanofillers attached on the scratch surface would provide significant self-lubricating effect to reduce lateral force during scratch and to alleviate contact damage.     

Use of a nanoindentation fatigue test to characterize the ductile–brittle transition

When considering grinding of minerals, scaling effect induces competition between plastic deformation and fracture in brittle solids. The competition can be sketched by a critical size of the material, which characterizes the ductile–brittle transition. A first approach using Vickers indentation gives a good approximation of the critical size through an extrapolation from the macroscopic to the microscopic scales. Nanoindentation tests confirm this experimental value. According to the grain size compared to the indent size, it can reasonably be said that the mode of damage is deformation-induced intragranular microfracture. This technique also enables to perform cyclic indentations to examine calcite fatigue resistance. Repeated loadings with a nanoindenter on CaCO₃ polycrystalline samples produce cumulative mechanical damage. It is also shown that the transition between ductile and brittle behaviour depends on the number of indentation cycles. The ductile domain can be reduced when the material is exposed to a fatigue process.     

Atomistic origin of brittle-to-ductile transition behavior of polycrystalline 3C–SiC in diamond cutting

The machinability of hard brittle polycrystalline ceramic has a strong correlation with internal microstructures and their accommodated deformation behavior. In the present work, we investigate the mechanisms governing the brittle-to-ductile transition behavior of polycrystalline 3C–SiC in diamond cutting by means of molecular dynamics simulations. Simulation results reveal the co-existence of dislocation slip and amorphization-dominated ductile deformation and cracking along grain boundaries-mediated brittle fracture, as well as the correlation of individual deformation modes with machining force variation and machined surface morphology. In addition, inter-granular fracture, grain boundary sliding and grain pull-up are also operating brittle deformation modes of polycrystalline 3C–SiC. The strong competition between above heterogeneous deformation modes determines the brittle-to-ductile transition behavior in grooving of polycrystalline 3C–SiC. Simulation results also demonstrate that grain size has a strong impact on the brittle-to-ductile transition and material deformation behavior of polycrystalline 3C–SiC under diamond cutting.     

Smoothed particle hydrodynamics simulation and experimental analysis of SiC ceramic grinding mechanism

Crack induced surface/subsurface damage in SiC ceramic grinding limits the industrial application. A single-grain scratching simulation based on the smoothed particle hydrodynamics (SPH) has been used to analyze the SiC grinding mechanism, including the material removal process, scratching speed effect on crack propagation, ground surface roughness, and scratching force. The simulation results showed that the material removal process went through the pure ductile mode, brittle assisted ductile mode, and brittle mode with the increase of the depth of cut. The critical depth of cut for ductile-brittle transition was about 0.35?µm based on the change of ground surface crack condition, surface roughness, and maximum scratching force. Increasing the scratching speed promoted the transformation of deep and narrow longitudinal crack in the subsurface into the shallow and wide transverse crack on the surface, which improved the surface quality. The SPH simulation results were indirectly validated by the cylindrical grinding experiments in terms of the critical single grain depth of cut for ductile-brittle transition, and the trend of ground surface roughness and grinding forces.     

Study on mechanism of chip formation of grinding plasma-sprayed alumina ceramic coating

The mechanisms of ductile–brittle transition and surface/subsurface crack damage during the grinding of plasma–sprayed alumina ceramic coatings were investigated in an experiment and simulation on single diamond abrasive grain cutting. We observed that the brittle damage modes of alumina ceramic include boundary cracks, median cracks and lateral fractures. The normal force of the abrasive grain results in the initiation of median cracks, whereas the tangential force of the abrasive grain results in the propagation of median cracks in the direction of the abrasive grain cutting. Some cracks propagate downward to form machined surface cracks, whereas others propagate to the unmachined surface of the workpiece to produce brittle removal. Owing to the alternating tensile and compressive stresses, the material in contact with the top of the abrasive grain fractures continuously, forming the main morphology of the machined surface. The geometry and cutting depth of the abrasive grain have a significant influence on the ductile–brittle transition, whereas the cutting speed of the abrasive grain have no significant influence. On one hand, the stress concentration at the pore defects result in crack propagation to the deep layer; on the other hand, it reduces the local strength of the surface material, produces brittle fracturing, and interrupts crack propagation. The pores exposed on the machined surface and the broken morphology around them are important factors for reducing the surface roughness. Experimental observations show that the machined surface morphology of the alumina ceramic coating is composed of brittle fracturing, ductile cutting and plowing, cracks, original pores, and unmelted particles.     

Effect of grit shape and crystal structure on damage in diamond wire scribing of silicon

Fundamental understanding of the fixed abrasive slicing of photovoltaic silicon wafers is crucial for producing low‐cost wafers with superior surface quality and mechanical strength. With the goal of understanding the diamond wire sawing process, this paper investigates the scribing of mono‐ and multi‐crystalline silicon by the abrasive grits on an actual diamond wire. Specifically, the effects of grit shape and silicon crystal structure on the resulting surface morphology, subsurface damage, and the critical depth of cut at which ductile‐to‐brittle transition occurs are investigated. Results show that surface cracking depends on the grit shape. Scribing across the grain and twin boundaries in multi‐crystalline silicon impacts the resulting surface morphology, with grit shape producing a greater effect than crystallographic orientation in the grain interior relative to the grain boundary. Subsurface damage depends on the grit shape and crystal structure. Differences in the critical depth of cut for ductile‐to‐brittle transition in scribing of mono‐crystalline silicon are explained via analysis of the stress state produced by idealized grit shapes.     

Damage formation mechanisms of sintered silicon carbide during single-diamond grinding

In this research, a single-diamond grinding test was performed on sintered silicon carbide (SSiC) to explore the damage formation mechanism. A scanning electron microscope and a transmission electron microscope (TEM) were used to examine the surface and subsurface morphologies of the grinding groove, respectively. The characteristics of the ground surface morphologies reveal that the single-diamond grinding process of SSiC can be classified into purely ductile, primarily ductile, primarily brittle, and purely brittle stages. Based on the high-resolution TEM (HRTEM) images and the corresponding Fast Fourier transform images of the near-surface region, results reveal that the high density of dislocations and amorphization of SiC grains are responsible for the plastic deformation of SSiC. Most of the cracks congregate on the top grains of the ground surface due to the distinct obstruction of the grain boundary on the cracks propagation, and the cracks generated at the grain boundaries emit into the top grain interiors and go up toward the exposed surface for the distortedly deformed region with higher strain energy; Furthermore, stress concentration caused by the dislocation pileups at grain boundaries represents the crack initiation mechanisms for SSiC. Finally, based on the dislocations pile-up theory, a critical undeformed chip thickness model for boundary crack system nucleation is established, which considers the cutting-edge radius, grinding wheel speed, material properties, and grain size of ceramics.     

Understanding of scratch-induced damage mechanisms in polymers

Following the ASTM and ISO test standards, a series of scratch tests were carried out on four categories of polymers: I) ductile and strong, II) ductile and weak, III) brittle and weak, and IV) brittle and strong. The scratch damage features were characterized by using a desktop scanner for scratch visibility assessment, and optical and electron microscopes for detailed damage mechanisms investigation. Various scratch damage mechanisms were identified for the different categories of polymers. The effect of testing rate on possible alteration of scratch damage mechanisms was also studied. The stress fields experienced by the polymer during scratch were determined using three-dimensional finite element methods modeling. It is found that both the material characteristics and the complex stress state exerted on the scratched surface are responsible for the various scratch damage mechanisms observed. A generalized scratch damage mechanism map for polymers is presented. The usefulness of the above understanding for designing scratch-resistant polymers is also discussed.     

Scratch behavior of SiAlON ceramics

The mechanical response of four different types of hot pressed yttrium stabilized α/β composite SiAlON ceramics was investigated by scratch testing in order to interpret their severe wear behavior. A progressive loading scratch tester with both rough and smooth spherical diamond styluses was used to analyze the variation in mechanical response with roughness of stylus. The extent of subsurface damage produced by the different styluses on a 50% β-content composite was also investigated using a visualization technique with plasma etching, which has been previously developed by one of the authors. When scratched by the rough stylus, quasi-plastic deformation recognized in the form of grain release after plasma etching was present predominantly in the surface, and the use of this stylus was regarded to be more appropriate for comparing the results of scratch tests with those of severe wear due to similarity of crack formation between grain dislodgement in severe wear and subsurface damage in the scratch tests. The work required to produce damage and groove formation (W_dg) when scratched by the rough stylus was evaluated for all test materials and it was found that the worn volume under severe wear follows the reverse order of W_dg.     

Precrack hysteresis energy in determining polycarbonate ductile–brittle transition. IV. Effect of strain rate

Effect of deformation rate on the ductile–brittle transition behavior for polycarbonate (PC) with different molar mass, notch radius, and rubber content has been investigated. PC with higher molar mass, notch radius, or rubber-modification possesses a higher critical strain rate when the ductile–brittle transition occurs. Whether a notched specimen will fail in a ductile mode or a brittle mode is already decided before the onset of the crack initiation. If size of the precrack plastic zone exceeds a critical level prior to onset of crack initiation, the crack extension developed later will propagate within the plastic zone and result in a ductile mode fracture. The precrack elastic storage energy, the input energy subtracting the hysteresis energy, is the main driving force to strain the crack tip for crack initiation. The precrack hysteresis energy (directly related to the precrack plasticity) increases with the decrease of the applied strain rate. Therefore, the strain rate is also closely related to the size of the precrack plastic zone. If the strain rate is lower than the critical strain rate, the specimen is able to grow a precrack plastic zone exceeding the critical plastic zone and results in a ductile mode fracture. © 1997 John Wiley & Sons, Inc. J Appl Polym Sci 65: 655–665, 1997     

A New Analytical Model for Estimation of Scratch-Induced Damage in Brittle Solids

Scratch tests are of fundamental interest both for understanding machining-induced damage and for evaluating the scratch resistance of brittle materials. An improved blister field model for the scratch process is proposed where the blister field strength is explicitly determined in terms of the material properties, loading conditions, and geometry of the scratch tool. Additionally, one new expanding cylindrical cavity model is implemented to estimate the plastic zone size surrounding the scratch groove. A quantitative evaluation of the damage zone size is conducted by combining the above two models. The predicted damage zone sizes are in good agreement with the results available elsewhere in literature.     

Study on the subsurface damage mechanism of optical quartz glass during single grain scratching

The single grain scratching SPH simulation model was established to study the subsurface damage of optical quartz glass. Based on the analysis of the stress, strain and scratching force during scratching, the generation and propagation of subsurface cracks were studied by combining with the scratch elastic stress field model. The simulation results show that the cracks generate firstly at the elastic-plastic deformation boundary in front of the grain (φ = 28°) due to the influence of the maximum principal tensile stress. During the scratching process, the median crack closes to form the subsurface damage by extending downward, the lateral crack promotes the brittle removal of the material by extending upward to the free surface, and microcracks remain in the elastic-plastic boundary at the bottom of the scratch after scratching. The depth of subsurface crack and plastic deformation increases with rising scratching depth. The increase of scratching speed leads to the greater dynamic fracture toughness, accompanied by a significant decrease of the maximum depth of subsurface crack and the number of subsurface cracks. The subsurface residual stress is concentrated at the bottom of the scratch, and the residual stress on both sides of the scratch surface would generate and propogate the Hertz crack. When the scratching depth is less than 1.5 μm or the scratching speed is greater than 75 m/s, the residual stress value and the depth of residual stress are relatively small. Finally, the scratching experiment was carried out. The simulation analysis is verified to be correct, as the generation and propagation of the cracks in the scratching experiment are consistent with the simulation analysis and the experimental scratching force indicates the same variation tendency with the simulation scratching force. The research results in this paper could help to restrain the subsurface damage in grinding process.     

Controlled material removal mode and depth of micro cracks in precision grinding of fused silica – A theoretical model and experimental verification

A critical function for crack propagation for the single grit scratching of fused silica is developed based on the fracture mechanics. The effects of original crack density on the surface, strain rate and grinding coolant are considered in the function. A theoretical model for controlled material removal mode and depth of micro cracks precision grinding is presented based on the critical function for crack propagation. It can be predicted by the model that the material removal mode in the grinding of fused silica with original cracks damage will change from a ductile mode to a semi-brittle mode, a full-brittle mode and a semi-brittle mode in sequence with the increasing single grit scratching depth. It was found that the micro crack damage depth of fused silica does not increase with the single grit scratching depth after a full brittle mode grinding and it is always smaller than that after a semi brittle mode grinding even with a smaller single grit scratching depth. These interesting results are explained by the fracture mechanics. The ductile mode grinding is a recognized desirable process of fabricating fused silica while the full-brittle grinding is also a feasible process for its shallow subsurface damage, high efficiency, low grinding force and energy consumption. Therefore, the depth of micro cracks after grinding can be controlled by choosing suitable grinding parameters. Grinding experiments are conducted on fused silica. The undeformed chip thickness of randomly distributed effective grits is simulated based on 3D reconstruction of wheel topography to reveal the relationship between the grinding parameters and the single grit scratching depth. Ground surface roughness, sub-surface damage (SSD) depth and grinding force are measured and discussed. It is shown that the model predictions correlate well with the experimental trend of grinding modes.     

Material removal mode and friction behaviour of RB-SiC ceramics during scratching at elevated temperatures

Thermal assistance is considered a potentially effective approach to improve the machinability of hard and brittle materials. Understanding the material removal and friction behaviour influenced by deliberately introduced heat is crucial to obtain a high-quality machined surface. This paper aims to reveal the material removal and friction behaviours of RB-SiC ceramics scratched by a Vickers indenter at elevated temperatures. The material-removal mode, scratching hardness, critical depth of the ductile–brittle transition, scratching force, and friction are discussed under different penetration depths. The size effect of scratching hardness is used to assess the plastic deformation at elevated temperatures. A modified model is established to predict the critical depth at elevated temperatures by considering the changes in mechanical properties. The results reveal that the material deformation and adhesive behaviour enhanced the ductile-regime material removal and the coefficient of friction at elevated temperatures.     

The brittle‐ductile transition temperature of polycarbonate as a function of test speed

The fracture behavior of polycarbonate was studied as a function of temperature (?80°C to +80°C) and test speed (10^?5 to 10 m/s) using an instrumented, singleedged, notched tensile test (SENT). SENT tests give information on the fracture stress, fracture displacements, and fracture energies of polycarbonate, and from these data the average crack speeds were calculated and the brittle‐ductile transitions were determined. The fracture stress and the fracture energies of ductile fracturing samples increased with increasing test speed. The fracture surfaces were studied by scanning electron analysis, and sometimes a mixed mode fracture, part ductile and part brittle, could be seen. At high test speeds, a sharp brittle‐ductile transition was observed, while at low test speeds the transition was more gradual, via a mixed mode region. This mixed mode region decreased in size with increasing test speed and was absent at the higher test speeds. The average crack speeds in the ductile region were directly related to the test speeds. The brittle‐ductile transition temperature increased with the logarithmic of the test speed.     

Mechanical fracture behavior of polyacetal and thermoplastic polyurethane elastomer toughened polyacetal

Polyacetal (POM) toughening with thermoplastic polyurethane (TPU) elastomer was investigated in terms of Theological, mechanical, and morphological properties. Polyacetal can be effectively toughened by the blending with TPU elastomer and the improvement on toughness is found most significant with TPU content from 20 to 30 percent. POM does fracture in ductile mode under extremely low deformation rate and the ductile-brittle transition rate is at 0.5 mm/min. The transition rate is increased with the increase of elastomer content. The precrack hysteresis energy is important in dictating the failure mode. The experimental results show the hysteresis energy (under constant load) increases with the increase of elastomer content and the decrease of deformation rate. Greater hysteresis energy results in larger precrack plastic zone size and thus tends to shift the fracture mode from brittle to ductile as the critical size of the plastic zone is reached. The adoption of the slow rate fracture method has the advantages of ranking toughness of very brittle polymeric materials vs. the conventional Izod or Charpy impact method by varying temperatures. FTIR shows significant interaction between POM and TPU which is probably responsible for the TPU elastomer being such an efficient toughening agent for POM. Delamination in the buffer zone between the plane-strain and the plane-stress is discovered and the possible mechanism is discussed.     

Scratch with double-tip tool: Crack behavior during simultaneous double scratch on BK7 glass

Over the past decade, successive double-scratch tests have been extensively performed to study the grinding mechanism of brittle materials. However, the grits sometimes interact with the surface simultaneously. In this study, double tips with a tip separation of 0.6–1.8 μm are fabricated by focused ion beam. Subsequently, double-scratch tests on BK7 optical glass are conducted using the double-tip scratch tool with a scratch depth of 200–600 nm. The typical crack system and its evolution mechanism for double-tip scratch are discovered, before being explained using an analytical stress model. The ductile–brittle transition and the material-removal mechanism are discussed. An influential radius for the interference between cracks and the stress field in the double scratch is obtained, which can serve as a reference for the design of textured grinding wheels. Subsequently, the advantages and disadvantages of double-tip scratches are discussed considering different applications, such as microstructure fabrication and grinding.     

On the improvement of the ductile removal ability of brittle KDP crystal via temperature effect

Brittle KH₂PO₄ (KDP) crystal is difficult-to-machine because of its low fracture resistance whereby brittle cracks can be easily introduced in machining processes. To achieve ductile machining without any cracks, this type of materials is generally processed by some ultra-precision machining techniques at ambient temperature with nanoscale material removal, yielding low machining efficiency and high processing cost. Recently, thermal-assisted techniques have been used to successfully facilitate the machining of some difficult-to-machine materials, like superalloys, but little effort has been made to explore whether the temperature effect can contribute to the ductile machinability of brittle materials yet. Thus, the aim of this study is to figure out the specific role of temperature in the deformation behaviours of brittle KDP crystal by nano indentation/scratch methods. It is found that compared with those at ambient temperature (AT, i.e. 23 °C), the hardness and Elastic modulus of KDP crystal at elevated temperature (ET, i.e. 160 °C) decrease substantially by 21.4% and 32.5%, respectively, while the fracture toughness increases greatly by 15.5%, implying a higher ability of ductile deformation at ET. Meanwhile, the scratch length within ductile removal has been identified to be extended more than 4 times by increasing temperature from AT to ET. Both the quantity and size of brittle features (e.g., cracks and chunk removal) show a reducing trend with the increase of temperature. To uncover the underlying mechanism of this phenomenon, an updated stress field model is proposed to analyze the scratch-induced stress distribution by considering the evolution of material property at various temperature. These presented results are significant for the future design of specific thermal-assisted processing techniques for machining brittle materials efficiently.     

Mechanisms of ductile mode machining for AlON ceramics

This paper aims to reveal the mechanisms of ductile mode machining for AlON ceramics. The removal characteristics during machining were studied through ultra-precision grinding experiments. The machined surface consists of fractured and smooth areas, which were generated by brittle and ductile removal, respectively, of the individual AlON grains. The material removal mode has a determining effect on the surface/subsurface quality. The proportion of the fractured areas on the ground surface decreased gradually with a decrease in the depth of cut. The crystal indices of the grains most prone to brittle removal on the workpiece surface were determined using micro-area X-ray diffraction (μXRD) analysis performed using a beam with 50 μm diameter. The results showed that the ductile removal of the {111} planes is critical for the ductile mode machining of AlON. Nanoindentation tests based on electron back-scattered diffraction (EBSD) indicated that AlON shows strong anisotropy in its mechanical properties and machinability. The (111) plane has the highest hardness and lowest fracture toughness, at 22.91 GPa and 1.8 MPa m^1/2, respectively. The material removal mechanism during the grinding of AlON was discussed in detail. The minimum and maximum d_c(hkl) values must be known for classifying whether the removal mode of the workpiece is brittle or ductile. A damage-free surface could be obtained during ductile mode grinding by controlling h_max to be less than d_c(111). The subsurface deformation mechanism during ductile mode grinding was analysed. An amorphous layer was observed close to the ground surface. Further, dense dislocations with no particular orientation were present beneath this amorphous layer. As the crystal structure became clearer with an increase in the depth, the plastic deformation shifted to stacking faults parallel to the {111} planes.     

Effect of scratch velocity on scratch behavior of injection-molded polypropylene

Scratch tests of polypropylene injection moldings were conducted with a progressive load scratch test according to ISO 19252. Effect of scratch velocity on scratch visibility and damage initiation was investigated. The results showed that the critical normal load for onset of scratch visibility was independent of scratch velocity in the range from 1 to 10 mm/s. However, the critical normal load decreased with increase of scratch velocity higher than 10 mm/s. The other scratch damage transitions such as onset of fish-scale and cutting pattern, the critical normal load also decreased with increase of scratch velocity. A correlation between scratch behavior and subsurface deformation was observed by polarized optical microscope. The formation of yielded zone under scratch groove was clearly observed at onset of scratch visibility. It was found that the yielded zone size becomes shallower at higher scratch velocity. The results suggested that localized stress was generated near the surface at higher scratch velocity. © 2012 Wiley Periodicals, Inc. J Appl Polym Sci, 2012