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1.
Zn diffusion into InP was carried out ex-situ using a new Zn diffusion technique with zinc phosphorus particles placed around InP materials as zinc source in a semi-closed chamber formed by a modified diffusion furnace.The optical characteristics of the Zn-diffused InP layer for the planar-type InGaAs/InP PIN photodetectors grown by molecular beam epitaxy (MBE) has been investigated by photoluminescence (PL) measurements.The temperature-dependent PL spectrum of Zn-diffused InP samples at different diffusion temperatures showed that band-to-acceptor transition dominates the PL emission,which indicates that Zn was commendably diffused into InP layer as the acceptor.High quality Zn-diffused InP layer with typically smooth surface was obtained at 580 ℃ for 10 min.Furthermore,more interstitial Zn atoms were activated to act as acceptors after a rapid annealing process.Based on the above Zn-diffusion technique,a 50μm planar-type InGaAs/InP PIN photodector device was fabricated and exhibited a low dark current of 7.73 pA under a reverse bias potential of-5 V and a high breakdown voltage of larger than 41 V (I < 10 μA).In addition,a high responsivity of 0.81 A/W at 1.31 μm and 0.97 A/W at 1.55 μm was obtained in the developed PIN photodetector.  相似文献   

2.
肖雪芳  谢生  陈朝 《半导体技术》2010,35(3):245-247,251
以GaAs和InP材料为例,对化合物半导体材料中的快速热退火扩Zn可行性进行比较分析,研究表明,化合物半导体材料中快速热退火扩Zn可行性与化合物半导体材料的分解温度有着密切关系。化合物半导体材料分解温度越低,对扩散源、帽层和阻挡层要求越高。针对InP材料高于360℃就分解、低温Zn扩散困难的特点,提出了直接溅射Zn层在410℃低温扩散的方法。对InP快速热退火扩散结果进行分析,初步分析表明其掺杂机理是形成合金结。  相似文献   

3.
采用闭管扩散方式实现了Zn元素在晶格匹配InP/In_(0.53)Ga_(0.47)As及晶格失配InP/In_(0.82)Ga_(0.18)AS两种异质结构材料中的P型掺杂,利用二次离子质谱(SIMS)以及扫描电容显微技术(SCM)对Zn在两种材料中的扩散机制进行了研究.SIMS测试表明:Zn元素在晶格失配材料中的扩散速度远大于在晶格匹配材料中的扩散速度,而SCM测试表明:两种材料中的实际PN结深度与SIMS测得的Zn扩散深度之间存在一定的差值,这是由于扩散进入材料中的Zn元素并没有被完全激活,而晶格失配材料中Zn的激活效率相对更低,使得晶格失配材料中Zn元素扩散深度与PN结深度的差值更大.SCM法是一种新颖快捷的半导体结深测试法,对于半导体器件工艺研究具有重要的指导意义.  相似文献   

4.
利用闭管扩散方法以Zn3P2为扩散源,在不同扩散温度和扩散时间下对非故意掺杂InP (100)晶片进行扩散. 用电化学C-V法(ECV)和二次离子质谱法(SIMS)分别测出了空穴浓度和Zn的浓度随深度的分布曲线. 结果表明扩散后InP表面空穴和Zn的浓度在扩散结附近突然下降,InP表面空穴浓度主要取决于扩散温度,扩散深度随着扩散时间的增长而变大,InP表面Zn浓度一般比空穴浓度高一个数量级. 另外对扩散后的样品进行光致发光(PL) 测试,表明在保证表面载流子浓度的同时,适当降低扩散温度和增加扩散时间能减小对InP表面性质的影响.  相似文献   

5.
本文用Zn3P2源在闭管条件下研究了Zn在InP中的低温(520700℃)扩散。比较了用等温扩散和双温区扩散技术扩散后,样品的电学参数。结果表明:双温区扩散法可得到表面光亮,无损伤的高浓度表面层。该法已用于InGaAsP/InP双异质结发光管的制备工艺中,并制得了光功率1mW,串联电阻23的发光管。还讨论了Zn在InP中扩散时的行为,解释了低温(550℃)扩散过程中,等温扩散时出现的异常现象。  相似文献   

6.
Diffusion of Zn in InP during growth of InP epitaxial layers has been investigated in layer structures consisting of Zn-InP epilayers grown on S-InP and Fe-InP substrates, and on undoped InP epilayers. The layers were grown by metalorganic chemical vapour deposition (MOCVD) atT = 625° C andP = 75 Torr. Dopant diffusion profiles were measured by secondary ion mass spectrometry (SIMS). At sufficiently high Zn doping levels ([Zn] ≥8 × 1017 cm−3) diffusion into S-InP substrates took place, with accumulation of Zn in the substrate at a concentration similar to [S]. Diffusion into undoped InP epilayers produced a diffusion tail at low [Zn] levels, probably associated with interstitial Zn diffusion. For diffusion into Fe-InP, this low level diffusion produced a region of constant Zn concentration at [Zn] ≈ 3 × 1016 cm−3, due to kick-out of the original Fe species from substitutional sites. We also investigated diffusion out of (Zn, Si) codoped InP epilayers grown on Fe-InP substates. The SIMS profiles were characterised by a sharp decrease in [Zn] at the epilayer-substrate interface; the magnitude of this decrease corresponded to that of the Si donor level in the epilayer. For [Si] ≫ [Zn] in the epilayer no Zn diffusion was observed; Hall measurements indicated that the donor and acceptor species in those samples were electrically active. All these results are consistent with the presence of donor-acceptor interactions in InP, resulting in the formation of ionised donor-acceptor pairs which are immobile, and do not contribute to the diffusion process.  相似文献   

7.
锌(Zn)扩散是制作InP基光电探测器(PD)的重要工艺过程.分析了锌扩散的机制,利用金属有机化学气相沉积(MOCVD)设备对InP基PD及雪崩光电探测器(APD)材料进行了锌扩散,由于MOCVD设备具有精确的温度控制系统,所以该扩散工艺具有简单、均匀性好、重复性好的优点.对于扩散后的样品,采用电化学C-V方法和扫描电子显微镜(SEM)等测试分析手段,研究了退火、扩散温度、扩散源体积流量和反应室压力等主要工艺参数对InP材料扩散速率和载流子浓度的影响,并将该锌扩散工艺应用于InP基光电探测器和雪崩光电探测器的器件制作中,得到了优异的器件性能结果.  相似文献   

8.
The diffusion of Zn in InP at low temperature is investigated. The experiment is accomplished in an evacuated and sealed quartz ampoule using ZneP2 as the source of Zn. The electrical characteristics of the diffusion samples obtained by the isotemperature process and the two-temperature process have been compared. It is found that with the two-temperature process one can obtain a smooth, damageless and high-concentration surface layer. This process has been applied to fabricate InGaAsP/InP light emitting diodes, and the diodes obtained have an output power of ≥1mW with a series resistance of 2–5Ω. The behaviors of Zn diffusion in InP are discussed.  相似文献   

9.
Open-tube diffusion techniques used between 450 and 600° C are described which involve the supply of diffusant from a vapour source (via a solution) and a solid evaporated metal source. Investigations of Zn into InP and InGaAs(P) have been undertaken using both sources. SIMS profile analyses show that in the case of the vapour source the profiles indicate a concentration-dependent diffusion coefficient while the solid source diffusions can be well described by a Gaussian-type profile. The usefulness of the vapour source method has been demonstrated in the fabrication of bipolar transistors which exhibit good d.c. characteristics. The solid source method is limited by the slow diffusion velocity and more gradual profile. The InGaAs(P)/InP materials system has important applications in optical communications and future high speed microwave and switching devices. Useful technologies allied to the introduction of impurities into Si by diffusion, have gradually been emerging for use in the III-V semiconductor family. Closed tube systems1 have been used in order to contain the volatile group V species and prevent surface erosion. In addition, simpler open tube systems2,3 have been developed that maintain a sufficient overpressure of the group V element. Zn and Cd p-dopants have been studied extensively because of the volatility and relatively large diffusion rates in III-V semiconductors. Opentube diffusion into both InP and InGaAs2-6 has been studied but little detail has appeared concerning InGaAs and InGaAsP. In this paper we describe a comprehensive study of the diffusion of Zn into InP and InGaAs(P) using both open-tube vapour source and a Au/Zn/Au evaporated solid source with SiNx acting both as a mask and also an encapsulant to prevent loss of Zn and decomposition of the substrate material. The techniques have been successfully applied to the fabrication of InP/lnGaAs heterojunction bipolar transistors which show good dc characteristics. Reference to InGaAs in the text implies the InP lattice-matched composition In0.53Ga0.47As.  相似文献   

10.
为了在InP/InGaAs(P)材料中进行精确的选择扩散,同时又要保证外延生长的多层异质结构不被破坏,提出了一种新的低温开管Zn扩散方法。该法直至在T=500℃,t=5min的条件下,重复性仍很好。应用该法研究了低温条件下Zn在InP,InGaAs(P)材料中的扩散行为。实验首次发现,Zn在InGaAsP材料中的扩散速率与材料中P含量的平方成正比。  相似文献   

11.
The objective of this work is to study the incorporation process of Zn in InP and related ternary and quaternary layers for long wavelength laser applications in comparison with the alternative acceptor Mg. In InP above a critical concentration of (1–2)×1018 cm?3 a sudden onset of dopant diffusion during growth is observed for Zn and for Mg as well. This diffusion during growth can be markedly reduced by counter-doping with Si (Fermi level effect). Below the critical concentration Zn dopant profiles exhibit the same steep flanks as Mg dopant profiles suggesting the same low diffusion coefficients. However, Zn appears to be more suitable forp-type doping of InP, GaInAs and GaInAsP, because an accurate control of the dopant level in the epitaxial layers is easier to achieve with Zn than with Mg.  相似文献   

12.
A procedure for achieving well-behaved planar Zn diffusion to a controllable depth in n-type InP is described. The dilute-Zn diffusion, which utilizes a Zn+Ga+P source (in an evacuated ampoule), is performed in the temperature range 650–700°C. The low diffusion temperatures employed assure that any previous junctions that might be prepared, such as LPE heterojunctions, are not affected by the diffusion process. The masking afforded by Si3N4 and partial “masking,” or attenuation, afforded by SiO2 on InP are demonstrated. The results obtained suggest that dilute-Zn diffusion in InP, with a significant P over-pressure, favors a substitutional diffusion mechanism that probably follows a complementary error function distribution.  相似文献   

13.
研究了Zn在InP、InGaAsP以及InGaAsP/InP中的扩散,扩散结深均与时间的平方根成正比.对于InGaAsP/InP单异质结,扩散结深还与InGaAsP覆盖层的厚度x_0有关.推导出其结深与扩散时间的函数关系为x_j/t~(1/2)=-x_0/(rt~(1/2))+I.  相似文献   

14.
Zn and Cd diffusion in InP were studied in the wide temperature range of 350-580°C to realize a guard ring in InP avalanche photodiodes (APD's). Hole-concentration profiles for Zn and Cd diffusions at various temperatures were found to be expressed by a unified empirical curve, which decreases exponentially with the distance from the surface, and abruptly decreases at the diffusion front. A graded junction can be formed by diffusion at temperatures lower than 500°C for the n-InP background carrier concentration of 1016cm-3, while an abrupt junction can be formed by higher temperature diffusion. Breakdown voltages for the graded-junction diodes formed by low-temperature diffusion were confirmed to be higher than those for the abrupt-junction diodes formed by the higher temperature diffusion. A guard ring formed by the low-temperature Cd diffusion enabled planar-type InP and InGaAs/InP APD's to have uniform multiplication in the photosensitive area without any edge breakdown.  相似文献   

15.
本文利用ZnAs2、ZnAs2+Cd作扩散源,研究了Zn、Zn-Cd在InxGa1-xAs中的扩散。给出了扩散温度和扩散时间,扩散源的种类和材料的组份对xj-t1/2关系的影响,Zn在InxGa1-xAs中的扩散速度(xj2/t)较Zn-Cd在InxGa1-xAs中的快。在500600℃,Zn在InxGa1-xAs的表面浓度为1101921020cm-3。Zn在InxGa1-xAs中的表面浓度较在InP中的高。利用InxGa1-xAs作1.3m发光管的接触层可使接触电阻降低。  相似文献   

16.
Techniques are described in which selective chemical etching, localised LPE growth and localised diffusion in In0.53Ga0.47As and InP were carried out. Spun-on silica films were employed as masks in these processes and its performance was found to be comparable with pyrolytic or rf deposited films. Localised LPE growth of In0.53Ga0.47As and in-situ etching enabled well-controlled islands of In0.53Ga0.47As embedded in InP to be produced. Orientation dependent growth rates were also identified. An open-tube diffusion technique based on an LPE growth system has been successfully used for diffusion of Zn into InP and In0.53 Ga0.47As from Sn solutions. A strong variation of diffusion depth in InP with Zn concentration in Sn has been observed at low Zn concentrations but a constant depth is approached for Zn concentrations greater than ∼0.08 atomic fraction.  相似文献   

17.
To fabricate quasi-planar optoelectronic integrated circuits(OEICs),a new open tube Zndiffusion method has been developed.The characteristics of Zn diffusion in InP/InGaAs(P)heterostrueturematerials at comparatively low temperature have been studied,and it has been found for the first time that Zndiffusion rate is proportional to the square of phosphorus content of the InGaAsP materials.  相似文献   

18.
本文介绍了在450700℃的广阔温度范围内研究Cd和Zn向InP扩散的结果,并对结果作了比较。详细研究了Cd,Zn及其化合物等不同杂质源对扩散的影响。我们用结深(xj)的平方和时间(t)的比值(xj2/t)作为扩散速度的度量,并画出了xj2/t-1/T(温度)曲线。发现Cd源,特别是CdP2源的扩散速度较慢,容易控制它扩散的结深和浓度,昕以它是比较理想的扩散杂质源。利用Tien的中性复合体理论,解释了Cd和Zn在InP中扩散的复杂现象。  相似文献   

19.
采用气态源分子束外延系统生长了InAsP/InP应变多量子阱,研究了H 注入对量子阱光致发光谱的影响以及高温快速退火对离子注入后的量子阱发光谱的影响.发现采用较低H 注入能量(剂量)时,量子阱发光强度得到增强;随着H 注入能量(剂量)的增大,量子阱发光强度随之减小.H 注入过程中,部分隧穿H 会湮灭掉量子阱结构界面缺陷,同时H 也会对量子阱结构带来损伤,两者的竞争影响量子阱发光强度的变化.高温快速退火处理后,离子注入后的量子阱样品发光峰位在低温10K相对于未注入样品发生蓝移,蓝移量随着H 注入能量或剂量的增大而增加.退火过程中缺陷扩散以及缺陷扩散导致的阱层和垒层之间不同元素互混是量子阱发光峰位蓝移的原因.  相似文献   

20.
Zinc incorporation by post-growth metalorganic vapor phase diffusion (MOVPD) is used to achieve high p-doping, which is desirable for the fabrication of photodiodes. Diethylzinc (DEZ) is used as precursor and Zn is diffused into InP and InAs0.6P epitaxial layers grown by low pressure metalorganic vapor phase epitaxy (MOVPE) on different substrate orientations, enabling the investigation of the dislocation density on the Zn incorporation. Diffusion depths are measured using cleave-and-stain techniques, resistivity measurements, electrochemical profiling, and secondary ion mass spectroscopy. High hole concentrations of, respectively, 1.7 1019 and 6 1018 cm−3, are obtained for, respectively, InAs0.60P and InP. The diffusion coefficients are derived and the Zn diffusion is used for the fabrication of lattice-mismatched planar PIN InAsP/InGaAs photodiodes.  相似文献   

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