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Si衬底GaN基LED理想因子的研究 总被引:3,自引:0,他引:3
首次报道Si衬底GaN LED的理想因子.通过GaN LEDI-V曲线与其外延膜结晶性能相比较,发现理想因子的大小与X射线双晶衍射摇摆曲线(102)面半峰宽有着对应关系:室温时Si衬底GaN LED的理想因子为6.6,对应着半峰宽707arcsec;理想因子为4.5时,对应半峰宽530arcsec.蓝宝石衬底GaN LED理想因子为3.0,其对应半峰宽401arcsec.硅衬底GaN LED理想因子大的原因可以归结为高缺陷密度所致,高缺陷密度使电流隧穿更容易进行. 相似文献
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采用金属有机物化学气相沉积法(MOCVD)在硅(Si)衬底制备铝/氮化铝/氮化镓(Al/AlN/GaN)多层薄膜,使用光学显微镜(OM)、原子力显微镜(AFM)、X射线衍射(XRD)等手段表征AlN和GaN薄膜的微观结构和晶体质量,研究了TMAl流量对AlN薄膜和GaN薄膜的形核和生长机制的影响。结果表明,预沉积Al层能促进AlN的形核和生长,进而提高GaN外延层的薄膜质量。TMAl流量太低则预沉积Al层不充分,AlN缓冲层的质量取决于由形核长大的高结晶度AlN薄膜与在气氛中团聚长大并沉积的低结晶度AlN薄膜之间的竞争,AlN薄膜的质量随着TMAl流量的升高而提高,GaN薄膜的质量也随之提高。TMAl流量太高则预沉积Al层过厚,AlN缓冲层的质量取决于由形核长大的高结晶度AlN薄膜与Al-Si回融蚀刻之间的竞争,AlN薄膜的质量随着TMAl流量的升高而降低,GaN薄膜的质量也随之降低。 相似文献
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衬底材料作为半导体照明产业技术发展的基石,是半导体照明产业的核心,具有举足轻重的地位,直接决定了LED芯片的制造路线.高亮度LED的半导体材料体系对衬底材料提出的要求比传统的LED更为严格.村底材料表面的粗糙度、热膨胀系数、热传导系数、极性的影响、表面的加工要求以及与外延材料间晶格间不匹配数,这些因素与高亮度LED的发光效率与稳定性密切相关.重点介绍几种典型材料与外延材料的晶格匹配及其加工要求,从材料制备难易程度和衬底与外延薄膜的化学稳定性对各种衬底材料进行比较分析,并对衬底材料的应用前景进行了预测. 相似文献
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Si Complies with GaN to Overcome Thermal Mismatches for the Heteroepitaxy of Thick GaN on Si 下载免费PDF全文
Atsunori Tanaka Woojin Choi Renjie Chen Shadi A. Dayeh 《Advanced materials (Deerfield Beach, Fla.)》2017,29(38)
Heteroepitaxial growth of lattice mismatched materials has advanced through the epitaxy of thin coherently strained layers, the strain sharing in virtual and nanoscale substrates, and the growth of thick films with intermediate strain‐relaxed buffer layers. However, the thermal mismatch is not completely resolved in highly mismatched systems such as in GaN‐on‐Si. Here, geometrical effects and surface faceting to dilate thermal stresses at the surface of selectively grown epitaxial GaN layers on Si are exploited. The growth of thick (19 µm), crack‐free, and pure GaN layers on Si with the lowest threading dislocation density of 1.1 × 107 cm?2 achieved to date in GaN‐on‐Si is demonstrated. With these advances, the first vertical GaN metal–insulator–semiconductor field‐effect transistors on Si substrates with low leakage currents and high on/off ratios paving the way for a cost‐effective high power device paradigm on an Si CMOS platform are demonstrated 相似文献
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LED绝缘铝基板的制备与散热性能研究 总被引:1,自引:0,他引:1
采用硬质阳极氧化工艺制备LED封装用铝基板绝缘层,通过实验分析了制备铝基板过程中氧化时间、草酸浓度、硫酸浓度和电流密度等因素对其氧化膜厚度、击穿电压的影响,得到了制备低热阻铝基板的最佳工艺参数:电流密度3A/dm2,草酸浓度为10g/L,H2SO4浓度150g/L,氧化时间45min。利用原子力显微镜(AFM)观察热冲击后裂纹萌生的情况,结果表明铝基板有微小裂纹,但仍满足绝缘要求,通过对氧化铝膜热阻的测试发现,铝基板与氧化膜的复合热阻在1~3℃/W之间。结果表明用阳极氧化法制备的铝氧化膜满足LED基板对散热及绝缘性的要求。 相似文献
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We prepared ZnO/n-Si heterojunctions by depositing ZnO films on n-Si substrates with different resistivities by radio-frequency magnetron sputtering. The microstructure of ZnO film was analyzed by X-ray diffraction and scanning electron microscopy. The current-voltage characteristics and ethanol gas sensing properties of the junctions were investigated at room temperature. It is found that optimization of n-Si substrate resistivity is critical to enhance the ethanol gas sensitivity of ZnO/n-Si heterojunction. The ZnO/n-Si heterojunction with n-Si substrate of 2-3 Ω cm exhibits the best ethanol gas sensing property. The junction shows the sensitivity of 29.41% to 0.24 g/L ethanol gas under + 0.52 V forward bias voltage. 相似文献