电沉积Fe-Cr合金研究

三价铬盐的二甲基酰胺（ＤＭＦ）水溶液体系电沉积Ｆe-Cr合金,可获得含Ｃr12%-65%(质量分数）的光亮合金镀层,研究了阴极电流密度,镀液pH值,三价铬盐浓度对镀层分的影响及合金层耐腐蚀性能。     

阴极等离子电解沉积技术简介及其研究进展

阴极等离子电解沉积是一种将传统电解和等离子体相结合的表面处理与材料制备技术,与传统的表面处理技术相比,该技术在能量消耗、制备速率、沉积层表面致密度、与基体结合力等方面均有大幅度改善,因此备受关注。概述了阴极等离子电解沉积的基本机理,包括电压-电流的演变过程、气体鞘层的形成过程、等离子体的演变规律和金属离子的沉积现象等,在此基础上讲解了阴极等离子电解沉积的技术优势。针对阴极等离子电解沉积过程中复杂的影响因素,分析并探讨了电压、占空比、时间等电参数以及酸含量、添加剂、电解液浓度等溶液参数对阴极等离子电解沉积的影响规律。在此基础上,重点综述了近年来阴极等离子电解沉积在多个领域的研究进展,包括先进陶瓷涂层、金属涂层以及复合涂层的制备,纳米电催化剂、纳米微球、中空微球和石墨烯等功能材料的合成以及渗碳、渗氮等领域的应用等。最后总结并展望了阴极等离子电解沉积在涂层领域的发展方向以及催化剂、石墨烯等其他新型领域的研究前景。     

复合电沉积的电化学测试方法与研究进展

采用不同的原料和工艺使金属离子与粉体复合电沉积,可以获得具有独特性能的复合镀层,是目前材料研究的热点领域之一。本文综述了几种复合电沉积研究中常用的电化学测试方法,以及近年来国内外对该工艺的研究进展,并提出了现存的一些问题和今后的研究方向。     

MEMS微器件电沉积层均匀性的研究进展

有效地改善沉积层厚度均匀性是电化学沉积技术应用的关键,简述了微电铸原理,综述了国内外微器件沉积层均匀性的最新研究进展,包括优化工艺参数、脉冲电流与换向脉冲电流、改善传质条件、辅助阴极、阴极屏蔽、阳极特性及数值模拟仿真技术改善沉积层均匀性的研究报道,详细介绍了超临界CO2电化学沉积新方法及其优点,并展望了今后的研究重点及发展方向.     

复合电沉积过程中的界面调控和界面结合研究进展

复合电沉积是一种获得功能镀层的表面防护技术。概述了界面调控与界面结合对复合镀层性能的重要影响。分析了提高界面结合能力的主要机理与方法,即:通过基体表面改性,如增加基体表面粗糙度、提高反应活性、提供外延生长条件和形成预镀层或转化膜层等,增强镀层与基体之间的机械结合、化学键合作用,进而提高镀层与基体间的界面结合力;通过颗粒改性,包括颗粒表面清洁、修饰与吸附等,以改变颗粒微观结构形态和荷电状态,利用静电机制、空间位阻机制和电胶束空间等理论来增强颗粒与颗粒间的分散能力、颗粒与金属离子间结合能力和颗粒所受电化学作用力等,从而提高颗粒与镀层之间的异质相界面结合能力。鉴于镍基复合电沉积的重要性以及颗粒改性对提高其界面结合的关键作用,综述了其颗粒改性工艺研究和影响,包括细化镍基复合镀层晶粒、改变颗粒表面接触状态、增加颗粒沉积量与其对镍基复合镀层性能的影响。最后对复合电沉积的界面调控和界面结合研究做了总结,指出现阶段还存在的问题,并展望了复合电沉积技术在界面调控和界面结合方面的研究发展方向。     

甘氨酸体系三价铬电沉积工艺研究

为了研究1种以甘氨酸为络合剂的三价铬镀铬工艺,采用正交试验法确定三价铬电沉积的最佳工艺,即0.6mol/L CrCl3*6H2O,0.6mol/L Gly,50g/L NH4Cl,0.6mol/L AlCl3·H2O,0.5mol/L NaCl,60g/L H3BO3,20g/L NaF,0.1mol/L KBr,适量的润湿剂和去极化剂,pH=1.8,Jk=15A/dm2,θ=20℃,时间15min.并具体讨论了络合比、阴极电流密度、时间、温度等因素对镀层厚度和外观的影响;试验结果证明:在该种工艺下可获得光亮、呈准镜面外观、厚度达8μm 左右的铬镀层;且经镀层性能检测表明:该镀层表面光亮、平整,与基体材料结合良好,具有一定的耐腐蚀性能.     

电沉积制备镍基复合镀层的研究进展

金属-陶瓷复合镀层可以显著改善的硬度、致密性、耐蚀性、耐磨性以及抗高温氧化性能等可显著得到改善,应用范围广泛。综述了影响复合镀层性能的几大因素,重点介绍了增强相粒子粒径、表面活性剂类型、制备镀层的沉积方式以及第二相颗粒种类对电沉积复合镀层性能的影响。陶瓷颗粒尺寸影响复合镀层的性能,细小颗粒对镍基复合镀层具有细晶强化作用,微米级陶瓷颗粒能够大大改善Ni基复合镀层的力学性能。超细纳米陶瓷颗粒作为增强相,可以显著提高复合镀层的耐蚀性,添加纳米颗粒的复合镀层的显微硬度优于添加微米颗粒复合镀层。非离子表面活性剂能提高第二相颗粒在镀层中的复合量及在镀液中的分散性,有利于获得高硬度的复合镀层,进而提高整个镀层的耐磨性和耐蚀性。超声波-脉冲电沉积法得到的复合镀层形貌更平整,晶粒更细小,结构更致密,且得到的复合镀层硬度更高,耐磨性、耐蚀性更好。与SiC复合镀层相比,SiO_2复合镀层具有更好的耐蚀性和抗氧化性。最后,分析展望了颗粒增强镍基复合材料的应用前景及未来研究的重点。     

磁场作用下电沉积镀层技术的研究进展

介绍了外加磁场辅助作用下电沉积镀层技术的研究概况,电沉积过程中外加磁场对镀液性质、传质过程、电荷转移、晶粒生长及结晶取向等均会产生影响;阐明了外加磁场在材料制备过程中的工作原理,并就外加磁场对电沉积过程的具体影响作用进行了分类及归纳;阐述了现阶段外加磁场在电沉积领域应用中存在的问题及其在该领域的发展前景。     

Electrodeposition of alloys XIX: Electrodeposition of lead-tin alloys

Pb-Sn alloys containing from 1.2 to 94.3 wt.% Sn were electrodeposited from aqueous solutions prepared from diethylenetriaminepentaacetates of the two metals. The effects of current density and the solution composition on the composition of deposits and cathodic current efficiencies were investigated. Pb-Sn alloy deposition was of irregular type. At current densities equal to or less than 2.0 A dm^-2, lead deposited preferentially. At current densities of more than 2.0 A dm^-2 and in solutions containing more than 50.0 met.% Sn (the percentage weight of the total metal content), preferential deposition of tin occured. An increased in the tin content of the bath increased the percentage of tin in the deposit. The presence of chloride ions in the bath did not seem to affect the composition of the deposit.     

含稀土镀液电沉积镍镀层耐蚀性的研究

借用扫描电镜、电化学分析和腐蚀失重实验方法研究了镀液中添加RE经直流和单向脉冲电沉积方法制备的镍镀层的耐蚀性。结果表明：单向脉冲法制备的镍镀层抗腐蚀能力优于直流法制备的镍镀层抗腐蚀能力，其原因主要归于单向脉冲镀层结晶比较细小致密，直流镀层结晶较粗大且致密性差。     

Electrodeposition of alloys XVIII: Electrodeposition of Bi-Sn alloys and their structure

A new Bi-Sn plating bath has been developed from which alloy deposits over a wide range of compositions can be obtained by varying the solution composition and plating conditions. The alloy deposition was of the anomalous type and bismuth behaved as the less noble metal. Bright alloy deposits were obtained under certain conditions. Increase in current density, pH and temperature increased the bismuth content of the alloy plate. The phenomena of inversion pH and temperature were observed in this system. The X-ray structure of the deposits is reported.     

阴极旋转电沉积生物陶瓷涂层的工艺研究

采用一种电化学沉积磷酸钙生物陶瓷涂层的新方法--阴极旋转电沉积工艺.通过测定涂层的XRD、界面结合强度、SEM观察表面与断面,研究了工艺的沉积特性及机理.在该工艺中,作为金属基体的阴极始终处于旋转状态,制备出比普通电沉积工艺更致密、均匀、尺寸更小的磷酸钙生物活性涂层,通过控制旋转速度制备出内部致密、外部多孔的梯度涂层,经后处理转化为羟基磷灰石涂层.通过控制旋转速度获得的梯度涂层,界面结合强度优于普通电沉积生物涂层.模拟体液浸泡后,在涂层表面先析出纳米粒子,之后成长为针状、网状,最后连接成一层.阴级旋转电沉积生物陶瓷梯度涂层具有较高的抗溶解性和生物活性.     

电铸技术的发展及应用

通过阐述电铸的基本原理，分析了电源、电解液和阳极材料等电铸要素对电铸技术发展的影响，并结合电铸的自身优点介绍了电铸技术的应用情况，在正确面对并处理好电铸技术存在的不足的情况下，电铸作为一门交叉学科的技术仍具有广阔的发展空间和应用前景。     

高速电喷镀纳米聚四氟乙烯(PTFE)复合镀层的研究动态与展望

综述了高速电喷镀制备纳米PTFE复合镀层的研究情况,着重阐述了该技术的基本原理和特点,重点探讨了喷射速度、电流密度等工艺参数对沉积速度的影响,并介绍了纳米PTFE的合成工艺以及表面改性的可行性,展望了高速电喷镀纳米PTFE复合镀层的应用前景。     

Electrodeposition of Rubber

Transmission electron microscopy has been used to investigate the structure of nickel electrodeposits plated from solutions containing copper and zinc as contaminants. Ductility of deposits was determined and subsequently deformed deposits were examined by transmission electron microscopy. An addition of copper or zinc (within concentration range 0–0.134 g/1 metal ion) to the dull Watts nickel solution did not result in significant changes in microstructure or ductility at 40 A/ft², 135°F and pH 4. Additions of copper or zinc to a semi-bright nickel solution (Watts +0·1 g/1 coumarin) resulted in a small grain size and a moderate reduction in ductility. The dislocation density in deformed deposits was increased and strain fields formed at twin boundaries.     

Electrodeposition of Ruthenium

A new electrolyte has been developed for the electrodeposition of ruthenium. Deposits are bright at cathode current efficiencies up to 100%, the bath is stable in operation and has a useful working life, expressed as total deposit weight, of over 50 g ruthenium per litre of electrolyte. The process is based on a novel,? readily prepared anionic complex of ruthenium having the formula (NH₄)₂ [Ru₂NCl₈(H₂O)₂].     

The Electrodeposition Exhibition

This paper is intended for guidance to the practical plater for preventing and curing the most commonly encountered troubles in plating solutions. It is not intended to be exhaustive, nor is it written from an academic point of view. The remedies given are those which a practical man with the usual facilities of a plating shop at his disposal can reasonably be expected to employ. Laboratory methods are seldom applicable on a large scale. The following types of solutions are dealt with:

Brass; Cadmium (Cyanide); Chromium; Copper (Acid and Cyanide); Lead (Fluoborate and Sulphamate); Nickel (Watts type and Bright Nickel); Silver; Tin (Sodium Stannate); and Zinc (Cyanide).

In all cases symptoms of troubles and remedies are given on the assumption that the particular type of solution trouble has actually been confirmed and all other possible causes been eliminated. The value of routine analysis of plating solutions as a preventive to serious troubles and resulting loss of production cannot be overrated. Haphazard methods and “rule of thumb” should by now be extinct in the workshop.