Effect of surface state of carbon fiber electrode on copper electroplating from sulfate solutions

The effect of the fiber surface state of a carbon fiber fabric on the parameters of copper electro-plating from a sulfate solution (the copper current efficiency, the electroplating rate, and the deposit distribution in the depth of electrode) is studied. The surface state of fibers was changed by preliminarily polarizing the carbon fiber fabric in electrolyte solutions. The change in the specific conductivity and weight of the carbon fiber fabric, as well as the surface state of oxides and the morphology of the copper deposit, depending on the conditions of electrode polarization was studied.     

Effect of additive concentration during copper deposition using EnFACE electrolyte

Copper deposition from solutions using high concentration of acid, metal ions and polyethylene glycol (PEG), and bis-(3-sulphopropyl) disulphide (SPS) and chloride ions (Cl^–) is well known. A recent maskless micropatterning technology, which has the potential to replace the traditional photolithographic process, called EnFACE, proposed using an acid-free, low metal ion solution which is in direct contrast to those used in standard plating technology. In this work copper has been deposited using both standard electroplating solutions and those used in the EnFACE process. In the standard electrolyte 0.63 M CuSO₄ and 2.04 M H₂SO₄ has been used, along with Gleam additives supplied by Dow Chemicals. For the Enface electrolyte, copper deposition has been carried out without any acid, and with different concentrations of additives between 17% - 200% of those recommended by suppliers. 25?µm of metal has been plated on stainless steel coupons as suggested by ASTM, peeled off and subjected to ductility and resistance measurements. Scanning electron microscopy and electron back scatter diffraction have been carried out to determine the deposit morphology. It was found that copper deposits obtained from acid-free solutions containing low concentration of metal ion and additives produced copper deposits with properties which are comparable to those obtained from standard electrolytes. The optimum additive concentration for the EnFACE electrolyte was 50% of the supplier recommended value.     

化学镀镍作为钢酸性镀铜前处理工艺的应用研究

为了防止钢表面酸性电镀铜出现置换铜,采取在电镀铜前增加化学镀镍工序,研究了化学镀镍工艺对酸性电镀铜的影响。结果表明,化学镀镍时间超过6 min时(镍层厚度>2.5～3μm),工件在酸性镀铜液中浸泡10 min,无置换铜出现。化学镀镍层对后续的酸性镀铜层的表面形貌和附着力均无明显影响,表明化学镀镍可作为钢酸性镀铜的底层。     

碳纤维表面沉积铜工艺及其参数影响机理研究

碳纤维增强铝基复合材料因具备碳纤维与铝的优良性能,高比强度、比模量,良好的热稳定性及性能与功能的可设计性等特点,在光机结构、航空航天结构件等方面具有广阔的应用前景。为了改善碳纤维与铝基体的界面润湿性能和抑制基体与纤维的界面反应,需要在碳纤维表面沉积铜界面层。本文通过对传统电镀装置的改进,采用了超声振荡分散的电镀装置在碳纤维表面沉积了铜界面层,通过对电镀前碳纤维的预处理、电镀液成分的优选调配,解决了碳纤维铜界面层沉积过程中因纤维束丝难以分散而出现的“夹心”问题(束丝内部纤维难以沉积或不能均匀沉积);在此基础上,详细研究了电镀液添加剂、电镀液PH值、电镀时间等工艺参数对铜界面层的微观结构、铜界面层质量及影响机制,为制备碳纤维增强铝基复合材料提供了一定的技术支持。     

The effect of hydrodynamic conditions on the rate of copper cathodic reduction from aqueous ethanol environments

The effect of hydrodynamic conditions on copper electroplating from aqueous ethanol CuSO₄ solutions is studied. Adding ethanol is found to result in a decrease in the ionic mass transfer rate in the solution. Experimental data are analyzed on the basis of the convective diffusion equation for a rotating disc electrode. Diffusivities of copper cations and kinetic current densities are estimated.     

氟化物熔盐体系中锆的电沉积

<正> 锆极易生成表面氧化膜,对酸、碱具有极好的耐蚀性能,尤其对碱性溶液的耐蚀性优于钽、钛和不锈钢。然而锆材价格较昂贵,因此,采用电镀的方法来制备锆镀层具有重要的现实意义。锆的析出电位较析氢电位负得多,其电还原过程只能在熔盐体系中进行。Senderoff及其同事曾研究了锆及其它难熔金属的熔盐电镀,他们的研究表明锆能从氟化物熔盐     

Electrocrystallization and physicochemical properties of nanosized copper-containing powders

The electroctystallization mechanism of copper-containing powders from water-isopropanol solutions of copper dichloride is studied. The effect of the nature and concentration of solution components on the electroplating of cathodic deposits is considered. Morphological characteristics of particles of the synthesized powder are determined on a transmission electron microscope. The qualitative composition of synthesized powders is determined.     

The Plating of Castings

Sound, adherent deposits of copper-nickel alloys may be produced from solutions containing copper and nickel sulphates and trisodium citrate. The composition of the deposit is dependent on both the composition of the solution and the cathode current density, but is not markedly affected by variations in temperature or by agitation of the solution. In solutions containing a small proportion of chloride the anode efficiency is substantially 100%, but the cathode efficiency varies from 50% to 80%, depending on electrolyte composition, temperature, and current density. The hardness and contractile stress of an alloy deposit containing 55 copper/45 nickel is somewhat greater than that of nickel deposited from a Watts solution. Preliminary throwing-power measurements have indicated that the solution is capable of very uniform metal distribution.     

安徽贵池铜山铜矿成矿地质条件及矿床成因

从地层、构造、岩浆岩与成矿的关系入手,对本区成矿地质条件进行分析,指出石炭系中上统黄龙组和船山组为矿区最主要的赋矿层位,其灰岩岩性是形成接触交代矿床的最有利的岩性,且与泥盆系上统五通组和二叠系上统砂页岩构成了构造薄弱面——钙硅界面,有利于矿液的运移和矿质的沉淀;五通组石英砂岩为矿体定位起隔挡屏蔽作用;断裂构造F1为矿液运移、矿体定位的关键因素;燕山期的岩浆活动为成矿提供了物质来源、成矿流体和热能,是成矿的第一要素。在此基础上,结合本区成矿物质来源、形成条件、控矿因素、矿化形式以及成矿作用等方面的特征,对铜山铜矿的矿床成因进行了探讨,认为铜山铜矿包括多种矿化成因类型,整体上属以矽卡岩型成矿作用为主的燕山期岩浆热液铜铁金硫成矿系列。     

The Growth Habit of Electrodeposited Copper

By plating under base reproduction conditions in an acidified copper sulphate solution, the growth processes occurring at polycrystalline cathodes have been studied and compared with those at single crystal cathodes. It has been found that the surface topography of the deposit formed on any one grain of the polycrystalline aggregate is identical to that of a deposit, grown under similar conditions, on a single crystal of the same orientation. The growth habit is in each case related to the atomic configuration of the initial cathode surface. The thickness of the deposit formed on electropolished polycrystalline strip has been found to vary from grain to grain. This may be explained in terms of electrochemical anisotropy. It has been found that the growth habit of thick deposits (10 microns) formed on deeply etched surfaces is similar to that on electropolished surfaces. Mechanical polishing of the basis metal causes the development of a polycrystalline, textured deposit, although some base influence can be detected even through very thick deposits (40 microns). Under certain conditions, deposits of the base-reproduction type can be obtained from cyanide copper solutions. Such deposits develop well-defined surface structures, with large, regular features and highly reflecting facets.     

电沉积Ni-Mo和Ni-Mo-P合金的热力学分析

利用热力学数据计算并绘制了ＮｉＰＨ２Ｏ系电位—ｐＨ图,根据电位—ｐＨ图分析了电沉积ＮｉＭｏ和ＮｉＭｏＰ合金镀层的电化学行为;利用Ｘ射线衍射测试了ＮｉＭｏ和ＮｉＭｏＰ镀层在镀态下的物相组成。热力学分析表明：Ｍｏ和Ｐ都难以单金属的形式沉积,它们必须和其它金属以诱导共沉积的方式才能沉积出来;Ｐ,Ｎｉ能以金属间化合物Ｎｉ３Ｐ的形式在阴极上沉积;Ｍｏ以两种形式进入阴极,一种为以ＭｏＯ３固体颗粒复合电镀进入镀层,另一种为以金属间化合物的形态沉积。Ｘ射线衍射分析表明,Ｐ以Ｎｉ３Ｐ,Ｍｏ以ＭｏＯ３与ＭｏＣ的形式存在于镀层中,这一结果与热力学分析结论相一致。     

A Finite Element Simulation of the Electroplating Process

This paper describes the development, comparison and validation of both 2-D and 3-D models of the electroplating process in which the current density distribution, generated using the Finite Element Method (FEM), is used together with Faraday's law of electrolysis to determine the local plating depth. Prior to work on industrial components, a preliminary investigation was undertaken on the electroplating of a square copper cathode (work piece) with a parallel lead anode of identical shape. The results described here show good agreement, particularly in 3-D and are considered to validate the model sufficiently for it to be used for electroplating tooling design.     

Probleme der Inhibitoren in der Galvanotechnik

Problems of inhibition in electroplating Inhibition in electroplating is understood to be a hindrance or perturbation of the electrocrystallization; these phenomena may, however, have a positive effect, too, and are often a necessary condition for obtaining coatings with particular properties. The inhibitors used are mostly connected with the incorporation of foreign matter in the coating. Inhibition is of particular importance with respect to the throwing and the levelling power, the type of deposit (e.g. glossy coatings) and various chemical and physical coating properties. The various metals are characterised by various sensitivities with respect to the inhibitor effect: nickel and other transition metals are highly sensitive, copper has medium sensitivity and zinc, cadmium and lead are little sensitive. Gloss formation is controlled in the case of nickel coatings by an inhibited crystallization which, in turn, is controlled by amorphous adsorption layers; it is characteristic in this context that the texture of the base material disappears already at low coating thicknesses, while it can be observed in the case of mat coatings even at considerable coating thicknesses.     

Characterization of Zinc-Cobalt Electrodeposits

The structure and morphology of electrodeposits depend on many factors including temperature, current density, time of deposition and composition of the bath. The properties of an electrodeposit depend on its micro structure. For example corrosion and wear resistance, hardness, internal stress, strength, brightness, electrical conductivity, magnetic properties and leveling are all affected by structure.

The relationships between electroplating parameters such as current density, temperature, bath agitation and electrolyte composition have been investigated for the zinc-cobalt system. It was found that electrolyte composition and temperature affect both deposit composition and morphology. The cathodic current efficiency decreased with current density and hardness was raised with increasing cobalt content in the deposit.

Three powerful techniques were used to access the microstructure of zinc-cobalt deposits: scanning electron microscopy, transmission electron microscopy and X-ray diffraction. The results show that the alloy is constituted of a single phase of a solid solution of cobalt dissolved in zinc within an hexagonal crystal system. The deposit is porous and changes from dendritic to nodular with increasing cobalt content.     

复杂铜波导的内腔镀银工艺

铜波导作为功率传输器件,其内腔镀银质量的优劣将直接影响其传输性能的高低,但按照传统的电镀工艺很难保证复杂铜波导内腔获得均匀的银镀层。从产品的结构设计、加工工艺等方面,分析了影响复杂铜波导内腔镀银质量的主要因素,并结合表面处理过程控制、添加辅助阳极、改进电镀工艺等方面,提出了提高复杂铜波导内腔镀银质量的方案。     

21世纪的表面处理新技术(待续)

表面处理技术不仅是产品的美容术,也是许多产品的制造技术,产品性能的改良技术和高科技的最新纳米材料的制造技术.面对21世纪环境保护新法规的出台以及高新技术发展的新需求,表面处理将如何适应这种新需求呢?评述了适应新环保新法规要求的印制板无铅表面终饰技术,如化学镀镍/置换镀金、置换镀银、置换镀锡、有机保焊剂(OSP)以及电镀镍/电镀金等工艺的优缺点.电镀、化学镀和复合镀是获得纳米膜层的最简便方法,介绍了许多纳米新镀层的性质、晶粒尺寸大小的控制以及纳米镀层在表面处理上的应用.还介绍了信息产业的表面处理新技术,如芯片铜线路的湿法工艺,印制板的二阶盲孔镀铜、细线芯片的单槽镀铜系统以及超细线挠性印制板的置换镀银和置换镀锡.最后还介绍了21世纪最新的超临界流体(SCF)表面处理新技术的特点及其在信息和印制板产业上的应用.     

含铜、镍电镀污泥硫化烧结?浮选工艺

使用硫化烧结?浮选工艺处理含铜、镍的电镀污泥,采用MLA分析和扫描电镜分析等手段,研究污泥样品硫化烧结前后的性质变化;并通过Cu-S-O与Ni-S-O三元系等温优势区位分析,以及烧结的条件试验,确定了适宜的硫化烧结条件:硫化剂用量为20%,烧结温度为1100℃,烧结时间为90 min。通过烧结产品的闭路浮选试验,获得了铜、镍品位分别为10.14%和11.89%,铜、镍作业回收率分别为75.12%和70.02%的浮选精矿。通过浮选尾矿的浸出毒性鉴定,确定尾矿中有害金属元素的浸出毒性测试结果均小于国家标准。通过硫化烧结?浮选工艺,同步实现了含铜、镍电镀污泥的资源化和无害化处理。     

The New Plating Process on Plastics

WET-PLATING PROCESS ON PLASTICS has beenindustrially used since the early1960s.It is currentlyapplied in a wide range of applications such aselectronic components(e.g.EMI shield)and auto-motive decoration parts with the aim of reducing totalcost and product weight.1,2ABS is one of the mostcommon resin substrate used.Generally,the steps ofplating on ABS resin include an initial adsorption oftin-palladium colloid on a chemically etched surface tocatalyze a subsequent deposition of …     

碳纤维表面超声振荡辅助电镀镍涂层工艺及其参数的影响规律

碳纤维增强铝基复合材料具有诸多优良性能,在航空航天以及民用领域有广阔的应用前景。在碳纤维表面电镀镍涂层,可有效改善碳纤维与铝基体的润湿性,并抑制基体对纤维的损伤。镍涂层的质量与改善效果密切相关。通过预氧化处理并结合超声振荡辅助电镀的方法在纤维表面沉积镍涂层,解决碳纤维在电镀过程中因纤维束丝难以分散而出现的"黑心"问题。在此基础上,研究电镀工艺参数对涂层质量的影响规律,并对优化工艺参数后制备的镍涂层与碳纤维的结合强度进行评价。结果表明:使用添加剂可提高镍涂层与碳纤维之间的结合力,当电镀液pH值调整到3～4、电流密度大于0.3 A/dm²、电镀液温度控制在20～40℃时,所制备的镍涂层均匀致密。     

Copper modified chitosan for protection of AA-2024

The aim of this study is to examine chitosan, which is a good film former, as a corrosion protective coating for AA-2024-T3 aluminium alloy. The aluminium samples were first anodized to increase adhesion of the subsequently dip coated film from a chitosan-acetic acid solution. To further increase the protective ability of the chitosan coating, the coated samples were immersed in a copper ion solution for 24 h. The copper salts used were sulphate and acetate. The chitosan membranes exposed to copper ion solutions revealed a reduced permeability in comparison with the unexposed samples, and an increase in stability in aqueous solutions, as revealed by a steady state and a high open circuit potential in borax solution. From UV-Vis spectroscopic measurement of the film on ITO glasses, the reduction in permeability of the chitosan film modified by copper ions appears to be associated with copper cross linking within the chitosan structure.