A superelastic nanocrystalline Cu-Sn alloy thin film processed by electroplating

A nanocrystalline Cu-Sn alloy film was processed by electroplating, and the indentation tests and microstructural observation were conducted on the electroplated Cu-Sn alloy film. The indentation tests at room temperature showed that a large amount of strain was recovered on unloading for the electroplated Cu-Sn alloy film, in contract, such a large reversible strain was not found in an electroplated pure Cu film. Thus, the electroplated Cu-Sn alloy film exhibited superelastic behavior. The grain size of the Cu-Sn alloy film was 99 nm. In spite of the very small grain size, the austenite start and finish temperatures of the Cu-Sn alloy film were relatively high. This is suggested to be related to the presence of the α-Cu phase.     

Cu/Sn比率对Cu2SnSe3薄膜若干物理性质的影响

利用射频(RF)磁控溅射在玻璃基片上共溅射沉积Cu-Sn预制膜。采用固态硒化法,制备Cu/Sn化学计量比在1.87～2.22之间的Cu2SnSe3薄膜。研究了Cu/Sn比率对Cu2SnSe3薄膜的晶体结构、微结构、光学性能以及电学性能的影响。X射线衍射(XRD)结果表明,所制备的Cu2SnSe3薄膜为立方晶体结构,具有(111)择优取向;贫铜的Cu2SnSe3薄膜光学带隙Eg随着Cu/Sn比率增大而增大;富铜的Cu2SnSe3薄膜光学带隙Eg随着Cu/Sn比率增大而不变。薄膜电阻率为1.67～4.62mΩ.cm。     

Crystal orientation in CuSn-alloy coatings obtained by magnetron sputtering

Crystal orientation in copper-tin alloy coatings of different chemical composition as a function of substrate temperature has been studied using the X-ray texture goniometer technique. The coatings were obtained by magnetron sputtering an alloy target in argon at a gas pressure of 6 × 10⁻¹ Pa using two kinds of substrate—one of ferritic stainless steel and the other of a glass ceramic material. It has been established that Cu-Sn 7.8% alloy films, which represent an α-solution of Sn in Cu are textured. At low substrate temperature (710–770 K) the α-phase crystals have a mixed 〈100〉 and 〈110〉 orientation and at temperatures in the range from 870 to 1000 K—〈110〉 orientation. No orientation was detected when the condensation proceeded by the mechanism vapour→liquid→solid. The η-Cu₆Sn₅ and Sn phase crystals in CuSn 74% alloy films were not oriented.     

钒基普鲁士蓝类似物VHCF用于水系铜电池正极

针对开发高性能水系铜电池电极材料的迫切需求,通过简易的共沉淀法制备钒基普鲁士蓝类似物铁氰化钒(VHCF)用作水系铜电池正极,考察反应温度及转速对VHCF样品表面形貌及微观结构的影响,探究不同VHCF样品在电化学性能上的差异,并分析VHCF样品的铜离子储存机理。研究结果表明：通过适当提升反应温度及搅拌器的转速,可以制备出[Fe(CN)₆]^4-含量多,粒径小且结构稳定的立方相VHCF;丰富的[Fe(CN)₆]^4-可以为Cu²⁺离子提供更多的化学活位点,较小的粒径有利于提高Cu²⁺离子的扩散速率,与普鲁士蓝骨架结合更稳定的结晶水则能改善电池循环稳定性;电化学反应过程中,Cu²⁺离子会取代VHCF骨架中的V⁵⁺离子形成不可逆新相。VHCF正极在0.1 A/g电流密度下的首次放电比容量高达146.5 m A·h/g,循环500次后,保留了56.1 m A·h/g的可逆容量;在1.0 A/g的大电流密度下的放电比容量仍有60...     

Interfacial reaction and growth behavior of IMCs layer between Sn–58Bi solders and a Cu substrate

This paper reports on the interfacial reaction and growth behavior of intermetallic compounds (IMCs) layer (η-Cu₆Sn₅ + ε-Cu₃Sn) between molten Sn–58Bi solder and Cu substrate for various liquid–solid soldering temperatures and times. In addition, the Bi segregation at the Cu₃Sn/Cu interface was also discussed, too. It was found that the Cu₆Sn₅ IMC could be observed as long as the molten solder contacted with the Cu substrate, while the Cu₃Sn IMC was formed at the interface between Cu₆Sn₅ and Cu substrate as the higher soldering temperature and/or longer soldering time were applied. Both thickness of total IMCs layer and Cu₆Sn₅ grains size increased with increased soldering temperature or time. The growth of the Cu-Sn IMCs layer during soldering exhibited a linear function of the soldering temperature and 0.27 power of soldering time. With soldering temperature increasing (above 280 °C in this present study), Bi was accumulated at the Cu₃Sn/Cu interface and resulted in some isolated Bi particles were formed.     

Directing Highly Ordered and Dense Li Deposition to Achieve Stable Li Metal Batteries

Li metal anode is promising to achieve high-energy-density battery. However, it has rapid capacity fading due to the generation of inactive Li (dead Li), especially at high current density. This study reveals that the random distribution of Li nuclei leads to large uncertainty for the further growth behavior on Cu foil. Here, periodical regulation of Li nucleation sites on Cu foil by ordered lithiophilic micro-grooves is proposed to precisely manipulate the Li deposition morphology. The management of Li deposits in the lithiophilic grooves can induce high pressure on the Li particles, leading to the formation of dense Li structure and smooth surface without dendrite growth. Li deposits comprising tightly packed large Li particles largely reduce the side reaction and the generation of isolated metallic Li at high current density. Less dead Li accumulating on the substrate significantly prolongs the cycling life of full cells with limited Li inventory. The precise manipulation of the Li deposition on Cu is promising for high-energy and stable Li metal batteries.     

机械合金化制备Ag-Cu-Sn钎料的组织和热稳定性

研究了机械合金化制备Ag-Cu-Sn三元体系形成过饱和固溶体的可能性,并对所得到的非平衡球磨产物的组织结构、热稳定性及其铺展重熔后的金相组织进行了表征。结果表明,通过控制球磨工艺和第三组元含量,可得到以过饱和固溶体为主要组成相的钎料合金粉,减少或细化脆性金属间化合物相。真空退火时,富银固溶体相较稳定,富铜固溶体相易于分解生成Cu_3Sn,银锡化合物可分解形成Ag基固溶体和富锡相,铜锡化合物的分解产物则为多种中间相,随退火温度的升高,转变顺序逐渐向铜锡原子比例增大的方向进行。以过饱和固溶体为主要组成相的钎料合金粉在重熔后虽然仍存在金属间化合物相,但金相组织明显细化。     

The Mechanism of Li Deposition on the Cu Substrates in the Anode-Free Li Metal Batteries

Due to the rapid growth in the demand for high-energy-density Lithium (Li) batteries and insufficient global Li reserves, the anode-free Li metal batteries are receiving increasing attention. Various strategies, such as surface modification and structural design of copper (Cu) current collectors, have been proposed to stabilize the anode-free Li metal batteries. Unfortunately, the mechanism of Li deposition on the Cu surfaces with the different Miller indices is poorly understood, especially on the atomic scale. Here, the large-scale molecular dynamics simulations of Li deposition on the Cu substrates are performed in the anode-free Li metal batteries. The results show that the surface properties of the Li panel can be altered through the different Cu substrate surfaces. Through surface similarity analysis, potential energy distributions,and inhomogeneous deposition simulations, it is found that the Li atoms exhibit different potential energy variances and kinetic characteristics on the different Cu surfaces. Furthermore, a proposal to reduce the fraction of the (110) facet in commercial Cu foils is made to improve the reversibility and stability of Li plating/stripping in the anode-free Li metal batteries.     

Einfluß von unverformbaren Teilchen auf die Strangpresstexturen von Verbundwerkstoffen

Influence of undeformable particles on the extrusion texture of composite materials The influence of α-Al₂O₃ particles on the extrusion texture of Ni-, Cu or CuZn30-composites has been investigated, variing particle size and interparticles spacing. The rods show a 〈100〉-recrystallization texture, which decreases with greater values of the interparticle spacing. In the case of the addition-free Cu and CuZn30 a random orientation distribution of the crystals was found. These results are discussed in comparison with the results found on Al? Al₂O₃-composites.     

Instantaneous preparation of CuInSe2 films from elemental In, Cu, Se particles precursor films in a non-vacuum process

CuInSe₂ (CIS) films are successfully prepared by means of non-vacuum, instantaneous, direct synthesis from elemental In, Cu, Se particles precursor films without prior synthesis of CIS nanoparticle precursors and without selenization with H₂Se or Se vapor. Our precursor films were prepared on metal substrates by spraying the solvent with added elemental In, Cu, and Se particles. Precursor films were instantaneously sintered using a spot welding machine. When the electric power was fixed to 0.6 kVA, elemental In, Cu, or Se peaks were not observed and only peaks of CIS are observed by X-ray diffraction (XRD) on the film sintered for 7/8 s. We can observe XRD peaks indicative of the chalcopyrite-type structure, such as (101), (103) and (211) diffraction peaks. We conclude that the synthesized CIS crystals have chalcopyrite-type structure with high crystallinity.     

Cyclic deformation behavior of copper single crystals with dispersed SiO2 particles

Abstract

Cyclic deformation behavior of Cu single crystals with dispersed SiO₂ particles were investigated. Even for a small amount of 0.41 vol.% dispersion of SiO₂ particles, the cyclic deformation behavior was seen to be clearly different from that of pure Cu. There was longer life and slower clack propagation by the dispersion. This would be due to the homogeneous formation of the dislocation substructure in the Cu-SiO₂ sample to prohibit the stress concentration at a point that fastens the clack nucleation. © 2000 Elsevier Science Ltd. All rights reserved.     

Synthesis and characterization of Cu-Sn oxides nanoparticles via wire explosion method with surfactants,evaluation of in-vitro cytotoxic and antibacterial properties

In this study, Cu-Sn oxides nanoparticles (CSO NPs) were synthesized via explosion of Sn-coated Cu wires in aqueous solution with and without surfactants. The physicochemical properties of the synthesized nanoparticles were characterized using XRD, FTIR, SEM, TEM and HRTEM techniques. In vitro cytotoxicity of NPs against L929 cell lines was observed. Potential antibacterial activity of CSO NPs against Gram-positive and Gram-negative bacteria was explored. TEM microstructural observations depicted the core-shell structure of plate-like CSO NPs synthesized in water. TEM and FTIR analysis confirmed the presence of PEG and L-cysteine at the surface of NPs prepared in surfactants. Accurate microstructural analysis of these NPs verified the positive effects of adding surfactants on the refinement of CSO NPs as well as changing its morphology. In vitro test showed that small amount of NPs (less than 80 μg/ml) have no cytotoxicity effect. Moreover, results showed that the Cu-Sn oxides nanoparticles synthesized in the surfactant agents presented a great antibacterial properties due to lower size of NPs, higher oxide concentrations as well as existence of polymer on the surface that could induce the ROS mechanism for attacking more bacteria. Synthesizing in presence of PEG showed more efficient antibacterial activity than L-cysteine because of combined effect of CuO and attachment of PEG to the surface of NPs.     

阳极Sn含量对焦磷酸盐电镀低锡Cu-Sn合金层性能的影响

为改善焦磷酸盐电镀Cu-Sn合金层的耐蚀性能差、镀速慢、结合力差等问题,用失重试验、形貌成分分析及电化学技术等方法,研究了阳极中Sn含量对焦磷酸盐电镀Cu-Sn合金层的沉积速率、腐蚀速率、腐蚀过程和微观形貌等的影响。结果表明:当阳极中Sn含量(质量分数)为25%时,Cu-Sn合金镀层的沉积速率较大[6.32mg/(cm2·h)],镀层中Sn含量为5.80%,属于低锡青铜,镀层耐蚀性好,在5%H2SO4溶液中的失重腐蚀速率最小,为0.011 8 mg/(cm2·h),腐蚀电流密度较小(84.7μA/cm2),腐蚀电位最正(-0.405 V),腐蚀倾向最小;CuSn合金镀层的包状物颗粒大小均匀、排列紧密、无明显的表面缺陷,镀层与基体结合良好。     

The structure of stircast Al-6Cu

A series of batch-type stirring experiments have been performed to investigate the morphological changes in the growth of the primary solid phase in Al-6Cu(Al-6 wt% Cu), as a function of the cooling rate and the rotational speed of the stirrer. The experiments show, that the cell-spacings of primary particles in stircast microstructures increase as a result of stirring, when compared to secondary dendrite arm spacings in the unstirred alloy. This result can be explained regarding heat transport during solidification. It is suggested that the solid-liquid interface of floating crystals in bulk metal liquids is cellular.Al-6Cu refers to the alloy Al-6 wt% Cu, which may also be written as AlCu6.     

焦磷酸盐低锡青铜合金电镀工艺及辅助配位剂的功能

为了提高焦磷酸铜．焦磷酸亚锡电镀低锡青铜合金工艺的性能,在其镀液中加入辅助配位剂柠檬酸盐。用电化学、X射线衍射、腐蚀膏试验等方法对镀液及镀层性能进行分析。结果表明：合金镀液具有良好的分散能力,可在较宽的电流密度范围内获得色泽一致、锡含量约为10％的低锡合金镀层;电镀初始过程可实现钢铁表面的电位活化,提高了镀层与铁基体的...     

铜/碳纳米管复合粒子的制备及其对高氯酸铵热分解性能研究

以碳纳米管为载体, 用化学沉积法制备了Cu/CNTs复合粒子, 并用TEM、SEM、FT-IR、XRD、XPS和DTA对其表观形貌、结构及催化性能进行了表征. 结果表明, CNTs和Cu之间无论是简单混合还是复合, 对高氯酸铵(AP)的热分解均有催化作用. 与纯AP相比, Cu/CNTs复合粒子中的AP高温分解峰温降低126.3℃, 低温分解峰几乎消失, 表观分解热由309.92J/g提高到711.13J/g; 与简单混合物相比, 复合粒子中的AP高温分解峰温降低11.4℃, 表观分解热由494.06J/g提高到711.13J/g. 表明CNTs与Cu的复合处理可显著提高其对AP热分解反应的催化作用.     

Optical absorption and thermoluminescence in single NaCl:Cu crystals exposed to 60Co and UV light

Optical absorption (OA) and thermally stimulated luminescence measurements were performed on NaCl:Cu+(0.04 and 0.08%) crystals blocks grown by the Czochralski technique. The NaCl:Cu+ crystals were exposed to gamma rays from a 60Co source (0.954-30 kGy) as well as UV radiation. The radiation-induced defects were mainly F, Cu- and Cu+ centres, with absorption bands located at 464, 256.7 and 236 nm, respectively. The absorption bands were found to be independent of the Cu impurity concentration. As the gamma-dose irradiation increased, the absorption band at 256.7 nm decreased while the band at 236.3 nm increased highly along with the 256.7 nm band. The F-centres produced at high gamma-radiation dose while thermally bleached showed an increase of the Cu+ OA bands with a simultaneous decrease of Cu- absorption band. The bleaching with F-light showed the participation of the F centre generated by gamma radiation on the ion valence changes of the doping impurity as well as on the TL phenomenon. The TL measurements in NaCl:Cu crystals with both impurity concentrations demonstrated that the Cu+ concentration has a strong influence on the intensity and shape of the glow peaks.     

Solventless-mixing layering using a high shear mixer for preparing drug pellets: A feasibility study using acetaminophen

Our aim was to investigate the feasibility of mechanical-mixing layering using a high shear mixer, which can produce drug pellets by simply mixing drug crystals and inactive seed particles without the need for solvents or binders. Acetaminophen crystals and microcrystalline cellulose spheres were mechanically mixed using various impeller speeds and the resulting composite particles were characterized. Acetaminophen particles were separated from the spheres using a low impeller speed and deposited on the surface of the spheres at a higher impeller speed. The diameter of the acetaminophen crystals in the composite particles decreased as the impeller speed increased, due to increased collision impact between the spheres. The correlation between drug content and drug particle diameter in the composites indicates that acetaminophen particles were layered on the cellulose spheres due to their pulverization during the mixing treatment. We examined additional mixing treatments to enhance drug loading: after mechanically mixing acetaminophen crystals and cellulose spheres, fresh acetaminophen crystals were added and mechanically mixed with the composite particles. Additional mixing increased the loading of acetaminophen particles without lowering the layering efficiency. In conclusion, mechanical-mixing layering can be accomplished using a high shear mixer.     

阴离子掺杂对KDP晶体光散射的影响

选用硫酸钾、硝酸钾和氯化钾作为掺杂剂, 采用传统降温法和“点籽晶”快速法生长了磷酸二氢钾(KDP)晶体, 利用超显微法对KDP晶体中的散射颗粒进行了观察, 研究了SO₄^2- 、NO ₃^- 和Cl ^- 三种阴离子掺杂对晶体中光散射的影响. 结果表明, 掺杂后SO₄^2-造成晶体光散射的轻度增加; 而NO ₃ ^-和Cl ^- 离子掺杂后, 对于传统降温法所得晶体, 散射明显加重, 对于“点籽晶”快速法所得晶体的散射影响不大.     

Fabrication and application of MFe2O4 (M = Zn,Cu) nanoparticles as anodes for Li ion batteries

In this work, MFe₂O₄ (M?=?Zn, Cu) nanoparticles were successfully prepared by a hydrothermal method. The structure, morphology, microstructure, specific surface area and electrochemical properties of the resultant particles were characterised by X-ray diffraction, scanning electron microscopy, transmission electron microscopy, nitrogen physical adsorption, charge–discharge test and cyclic voltammetry (CV) method, respectively. The resulting ZnFe₂O₄ and CuFe₂O₄ products were sphere-like and cubic-shaped particles and their average size was about 30–40?nm and 60–70?nm, respectively. The initial discharge capacities of ZnFe₂O₄ and CuFe₂O₄ electrodes reached 1287.5?mAh?g^?1 and 1412.3?mAh?g^?1, respectively, at a current density of 0.2?mA?cm^?2 in a potential range of 0.0–3.0?V. This indicated that Cu is a better counter ion than Zn. The resulting MFe₂O₄ nanoparticles are expected to be a promising candidate of anode materials for Li ion batteries. The reaction mechanism of MFe₂O₄ nanoparticles in Li ion batteries was also discussed based on the CV of Li/MFe₂O₄ cell.