AZ31 镁合金板材自阻加热超塑成形及电流宏微观作用分析

目的为提高镁合金板材超塑成形加热过程的效率,将自阻加热引入到超塑成形过程中。方法通过自阻加热实验,分析了电流密度对坯料温度及升温速率的影响;设计了自阻加热胀形装置并确定了工艺参数,实现了AZ31镁合金的自阻加热超塑胀形。结果采用该加热方式可将坯料加热时间从数十分钟缩短至几十秒,极大地提高了加热速率,降低了能耗。结论分析了在电流作用下镁合金的变形机制,发现电流可以通过促进材料的再结晶形核、位错滑移来提高材料塑性,并具有钝化和阻碍空洞扩展的作用。     

An innovative method for the microstructural modification of TiAl alloy solidified via direct electric current application

Ti-48Al-2Cr-2Nb alloy solidified with the application of direct electric current has a refined and homogeneous microstructure without segregation. We observed an initial decrease followed by a subsequent increase in grain size and lamellar spacing, with the increase in current density. Similar trend can also be obtained by varying the amount of α2-phase(Ti_3Al). Using a directional solidification processing method,the columnar crystal microstructure transforms into an equiaxed crystal microstructure at a current density of 32–64 m A/mm~2. High dislocation density is also introduced with a minimum cross-sectional grain size of 460 μm at a current density of 64 mA/mm~2. The application of electric current alters the free energy of the critical nucleus and temperature via joule heating, causing a transformation from a columnar grain microstructure into an equiaxed grain microstructure. The increase in current density leads to a rise of the nucleation rate, and a resulting undercooling combined with temperature gradient contribute to growth of the primary phase, which finally results in grain coarsening at a critical current density of 96 mA/mm~2.The climb and cross-slip of dislocation and the migration of grain boundary ultimately create variable lamellae spacing of TiAl alloy.     

Influences of temperature and grain size on the material deformability in microforming process

This paper investigated the influences of temperature and grain size on the deformability of pure copper in micro compression process. Based on the dislocation theory, a constitutive model was proposed taking into account the influences of forming temperature, Hall-Petch relationship and surface layer model. Vacuum heat treatment was employed to obtain various grain sizes of cylindrical workpieces, and then laser heating method was applied to heat workpieces during microforming process. Finite element (FE) simulation was also performed, with simulated values agreed well with the experimental results in terms of metal flow stress. Both the FE simulated and experimental results indicate that forming temperature and grain size have a significant influence on the accuracy of the produced product shape and metal flow behaviour in microforming due to the inhomogeneity within the deformed material. The mechanical behaviour of the material is found to be more sensitive to forming temperature when the workpieces are constituted of fine grains.     

电解铜箔截面微观组织的EBSD分析

目的 通过树脂包埋结合离子截面抛光的制备方法,实现铜箔样品的截面EBSD分析,进而利用截面EBSD分析方法探究电流密度对铜箔组织性能的影响。方法 通过使用热固性树脂对铜箔进行包埋,使用加热平台使胶体凝固,对得到的包埋好的铜箔试样在砂纸上进行截面打磨,放入截面离子抛光仪中进行离子切割,样品制备完成后,将样品取下。使用电子背散射(EBSD)作为电镜附件,进行晶体学取向的表征。结果 结合截面微观组织的EBSD分析方法,分析了电流密度对铜箔组织性能的影响,结果表明,随着电流密度的增大,电解铜箔的晶粒尺寸呈现出先减小后增大的趋势,孪晶密度和位错密度呈现出先增大后减小的趋势,抗拉强度在45 A/dm²时达到最大547.05 MPa。结论 该方法可以利用EBSD分析软件自动分析铜箔截面的晶粒粒度分布、孪晶密度等,并将这些微观结构特征与力学性能结果进行详细对比分析,验证了电流密度对铜箔组织和性能的显著影响。     

晶粒尺寸对304奥氏体不锈钢组织演变和性能的影响

研究了初始织构相近而晶粒尺寸不同的304奥氏体不锈钢在后续10%压缩变形和热处理过程中微观组织、力学和耐蚀性的变化。结果表明,具有相似织构而晶粒尺寸不同的样品变形热处理后其织构不同,粗晶在变形中织构的变化更大;织构相近时抗拉强度对晶粒尺寸的依赖较大;织构不同时,织构对硬度和抗拉强度的影响大于晶粒尺寸和微应变的影响;变形热处理后普通大角度晶界和晶内微应变的增大降低了试样的耐腐蚀性能;初始晶粒尺寸较小的试样在变形热处理后出现四种密排面平行于外表面的织构,其耐点蚀的性能更优。     

Electron force-induced dislocations annihilation and regeneration of a superalloy through electrical in-situ transmission electron microscopy observations

What effect does electric current do on dislocation evolution of metals keeps being a confusing question to be answered and proved. To this end, the dislocation evolution of a superalloy with electric current was directly observed by electrical in-situ transmission electron microscopy in this work. Dislocations annihilation at first and then regeneration was found for the first time, which directly proves the existence of electron force during the electrically-assisted manufacturing. Dislocations regeneration would be driven by the electron force and the resistance softening by the local Joule heating effect. Resultantly,a base could be provided for future electrically-assisted research.     

成形角度对选区激光熔化4Cr5MoSiV1钢组织和性能的影响EI北大核心CSCD

选区激光熔化(SLM)成形4Cr5MoSiV1钢具有良好的强/硬度以及耐磨性是提高其使用寿命的重要保证,为优化SLM成形4Cr5MoSiV1钢的组织和性能,研究不同成形角度下4Cr5MoSiV1钢试样的显微组织、显微硬度、拉伸性能和耐磨性。结果表明:随成形角度的增加,试样熔道间的热量累积程度降低,晶粒尺寸减小,细晶强化作用增强,故试样的显微硬度升高。随成形角度的增加,拉伸试样的滑移搭接面数量增多,滑移程度增加,且熔道边界处分正应力值降低,故试样的抗拉强度和断裂伸长率均升高。磨损试样的磨损机制以黏着磨损和氧化磨损为主,且随成形角度增加,试样的耐磨性升高。同一成形角度下,试样底层表面经多次热量累积后,其细晶强化和固溶强化作用减弱,显微硬度和耐磨性均降低。SLM成形4Cr5MoSiV1钢试样的显微硬度、耐磨性和拉伸性能呈正相关,45°成形角度下试样的力学性能最高,抗拉强度最高为1576.5 MPa,断裂伸长率最高为17%,顶层表面的显微硬度最高为608.4HV,顶层表面的磨损率最低为4.95×10^(-9)kg·N^(-1)·m^(-1)。     

Effect of Prior Austenite Grain Size on the Morphology and Mechanical Properties of Martensite in Medium Carbon Steel

In industrial application,unintentional manufacturing line troubles often consequence in heating raw materials excessively,in terms of either time or temperature.One of the effects of such occurrence is a product with a variation of prior austenite grain size,even if after the heat treatment the end result is the same,martensite.The variation of the prior austenite grain size is believed to vary the end results of the martensite.This undesirable variation includes the variation of fatigue resistance,impact strength,yield strength,hardness,etc.This research studies the effect of the prior austenite grain size on the morphology of the martensite microstructure.The results show that within the typical industrial application of temperature and holding time set up,as holding time or the temperature increases,the prior austenite average diameter increases.The block and packet sizes in the martensite also increase.The variation of mechanical property dependence on the grain size is indeed due to the different characteristics reflected in the martensite morphology.With respect to the same area,smaller grain has more blocks and packets,which agrees with higher dislocation density verified with transmission electron microscopic evaluation.     

Stress relaxation behavior of Cu/Sn/Cu micro-connect after electrical current

The effect of electromigration on stress relaxation behavior of pure tin solder joints was investigated. It was found that the stress relaxation rate was accelerated significantly after the sample was subjected to current stressing. The accelerating effect increased with the current stressing time. Measurements of the activation energy and stress exponent suggested that the dominant mechanism of the stress relaxation of pure tin solder joint went from dislocation climb to grain boundary diffusion after electromigration. As a result of grain boundary diffusion and sliding, grain boundary grooves were observed on the surface of the tin solder joints after electromigration. The groove was associated with the divergence of vacancy concentration at the grain boundaries. The vacancy concentration at the grain boundaries, which increased with the current stressing time, promoted the atomic diffusion along the grain boundaries, resulting in a higher stress relaxation rate.     

The study of grain boundary density effect on multi-grain thin film under tension

The grain-size effect on the yield strength and strain hardening of thin film at sub-micron and nanometer scale closely relates to the interactions between grain boundary and dislocation. Based on higher-order gradient plasticity theory, we have systematically investigated the size effect of multi-grain thin film arising from the grain boundary density under tensile stress. The developed formulations employing dislocation density and slip resistance have been implemented into the finite element program, in which grain boundary is treated as impenetrable interface for dislocations. The numerical simulation results reasonably show that plastic hardening rate and yield strength are linear to the grain boundary density of multi-grain thin film. The aspect ratio of grain size and orientation of slip system have distinct influence on the grain plastic properties. The research of slip system including homogeneous and nonhomogeneous distribution patterns reveals that the hardening effect of low-angle slip system is greater than that of high-angle slip system. The results agree well with the experimentally measured data and the solutions by discrete dislocation dynamics simulation.     

用放电等离子技术烧结TiB2陶瓷

利用脉冲大电流快速烧结技术（也称放电等离子烧结SPS技术）研究了TiB2的烧结过程。结果表明：升温速率对烧结样品的相对密度、晶粒尺寸及烧结过程中真空室气压均有重要影响。最佳的升温速率使TiB2烧结晶粒相对最小、烧结体相对密度较高。分析认为，在SPS条件下的快速升温有利于颗粒表面活化，烧结体晶粒尺寸既受控于烧结时间，也受控于晶粒生长活化能。     

Interaction of lattice dislocations with a grain boundary during nanoindentation simulation

Interaction of dislocations with a Σ = 5 (210) [001] grain boundary was investigated using molecular dynamics simulation with EAM potentials. The results showed that the dislocation transmitted across the grain boundary during nanoindentation and left a step in the boundary plane. Burgers vector analysis suggested that a partial dislocation in grain I merged into the grain boundary and it was dissociated into another partial dislocation in grain II and a grain boundary dislocation, introducing a step in the grain boundary. Simulation also indicated that, after the transmission, the leading partial dislocation in the grain across the boundary was not followed by the trailing partials, expanding the width of the stacking fault. The results suggested that the creation of the step that accompanied grain boundary motion and expansion of the stacking fault caused resistance to nanoindentation.     

电流辅助高强钢板热成形工艺数值模拟研究

目的探究电流辅助高强钢板热成形工艺中坯料自阻加热的加热机理,揭示电一热一力三场耦合条件下金属板材的塑形变形规律,为工艺方案及工艺参数的制定提供理论依据。方法利用FEM软件对电流辅助高强钢板的热成形过程进行了数值模拟研究。结果获得了通电加热时坯料的温度场,并通过热一力耦合分析,得到了板材热成形时的应力及应变的分布规律。结论采用该加热方式可极大地提高加热速率,经过几十秒的加热即在变形坯料上获得了较均匀的温度场,满足板材热成形要求。应力、应变分析表明,加热时产生的压应力缓解了坯料变形时的应力集中,有助于板料塑性成形。     

镍基高温合金初始织构对电辅助拉伸宏微观行为的影响

目的研究织构对镍基高温合金电辅助成形的影响规律。方法通过准静态拉伸与电辅助拉伸对比实验,研究了不同初始织构对镍基高温合金电辅助成形宏观力学行为以及微观组织演化的影响规律。结果当初始织构为易变形织构时,拉伸后的纤维织构峰值较低,而电辅助拉伸过程中焦耳热使得试样温度升高,变形抗力得到下降,在一定程度上增大了纤维织构的强度。当初始织构为难变形织构时,材料变形抗力大,拉伸后纤维织构峰值较高,但材料变形过程晶粒细化程度高,缺陷的增多导致电辅助成形过程中焦耳热更为明显,焦耳热导致的高温使得难变形晶粒变形更为协调,最终的纤维织构强度有所下降。结论不同的初始织构对电辅助成形宏微观行为有较大的影响,因此合理利用织构在电辅助成形过程中的影响以完善电辅助成形工艺十分重要。     

Cu—Cr—Zr合金强化机理电子理论研究

通过自编软件建立了Cu合金液体、位错、晶界等原子集团模型,采用递归法计算了Cu合金电子结构。研究表明：Y在晶粒、表面、液体的环境敏感镶嵌能依次降低,Y从晶粒内向晶粒表面、液体Cu中扩散。扩散过程中Y原子填补在Cu晶粒表面缺陷处,阻碍Cu原子结晶,同时进入液体中的Y在晶粒周围形成含有高浓度Y的薄层,使晶粒生长受阻,晶粒细化。Sn向位错扩散,抑制Cr的沉淀析出,并能钉扎位错的攀移运动,推迟回复和再结晶。S在晶界偏析,使晶界结合强度降低。偏聚在晶界的S可将合金中的Zr吸附到晶界,使晶界得到强化。Cu晶粒、晶界与位错处的费米能级不同,电子在这些区域之间发生偏移,使合金内产生微电场。微电场对电子产生散射作用,使合金电阻增大。     

The effect of direct electric current on precipitation in a bulk Al-4 wt % Cu alloy

The effect of the stress of direct electric current on precipitation in a quenched Al-4.15 wt % Cu alloy is investigated by measurement of the change in electrical resistance of a bulk specimen as a function of current density up to about 3000 A cm^–2 at a given annealing time. A similar effect of d.c. stress is observed at 50, 75 and 100 C. For a lower current density, a constant or slightly increasing resistance is observed, while for a current density higher than a critical value, the resistance decreases with an increase in density. On the assumption that the temperature increase of a specimen due to the Joule heating is proportional to the square of the current density, it is concluded that there exists some effect of d.c. stress per se to prevent the precipitation reaction, aside from the effect of the temperature increase due to the Joule heating, and it is suggested that this retarding effect is related to the sweeping out of quenched-in excess vacancies into grain boundaries by electromigration.     

Modelling recovery and recrystallisation during annealing of AA 5754 aluminium alloy

Abstract

A microstructure model taking into account recovery and recrystallisation has been developed to predict the yield stress and the recrystallised grain size during continuous annealing of cold rolled AA 5754 sheet alloy. Using isothermal annealing tests, recovery and recrystallisation kinetics were quantified as a function of temperature and cold reduction. The model was formulated employing the internal state variable approach with the following three state variables: dislocation density, volume fraction recrystallised, and grain size. A rule of mixtures is adopted to separate the effect of recovery and recrystallisation in the overall softening. Model validation has been carried out by comparing the predicted softening curves with those obtained in continuous heating tests replicating heating rates of industrial continuous annealing lines. The model can be applied to non-isothermal processing routes of industrial cold rolled AA 5754 with thickness reduction in the range 40-80%.     

Dislocation interactions with tilt walls

The flow of plastic deformation in polycrystalline materials can be due to activation of sources in adjacent grains due to the effect of pile up dislocations against the grain boundary and also through the transmission of dislocations across the grain boundary. In this paper, we focus on these two issues by studying the evolution of resolved shear stress as a result of pile up dislocations against the boundary and understanding the basic phenomena of dislocation transmission through grain boundary. We also investigated the relaxed structures a grain boundary acquires after the process of dislocation transmission.     

Enhanced strengthening and hardening via self-stabilized dislocation network in additively manufactured metals

The advent of additive manufacturing (AM) offers the possibility of creating high-performance metallic materials with unique microstructure. Ultrafine dislocation cell structure in AM metals is believed to play a critical role in strengthening and hardening. However, its behavior is typically considered to be associated with alloying elements. Here we report that dislocations in AM metallic materials are self-stabilized even without the alloying effect. The heating–cooling cycles that are inherent to laser power-bed-fusion processes can stabilize dislocation network in situ by forming Lomer locks and a complex dislocation network. This unique dislocation assembly blocks and accumulates dislocations for strengthening and steady strain hardening, thereby rendering better material strength but several folds improvements in uniform tensile elongation compared to those made by traditional methods. The principles of dislocation manipulation and self-assembly are applicable to metals/alloys obtained by conventional routes in turn, through a simple post-cyclic deformation processing that mimics the micromechanics of AM. This work demonstrates the capability of AM to locally tune dislocation structures and achieve high-performance metallic materials.     

Temperature gradient and microstructure evolution in AC flash sintering of 3 mol% yttria-stabilized zirconia

Systematic statistical analysis of the microstructural changes in 3?mol% yttria-stabilized zirconia was performed after flash sintering by alternating current (AC). The micrographs in the gauge section of the specimen were identical to those from DC flash sintered samples while no evident electrode effect was present for AC flash sintered samples. However, finite element modeling revealed a temperature gradient from the surface to the volume of the sintered body. Microstructure gradients, across the width of gauge section, were revealed for the AC flash sintered sample. Classical grain growth models due to Joule heating were insufficient in justifying the microstructural evolution under the simulated temperature distribution. Bimodal grain diameter distributions in flash sintered samples were observed. Therefore, it is proposed that faster grain growth mechanisms activated on a fraction of the grains by electric field/current occurred during flash sintering, and is responsible for the instantaneous grain growth.