基于熵模型镀锡银钎料钎焊性能的定量表征

以BAg50CuZn钎料和BAg34CuZnSn钎料为基材，采用镀覆扩散组合工艺制备了两类镀锡银钎料，利用综合热分析仪、润湿试验炉、万能拉力试验机测定镀锡银钎料的熔化温度区间、润湿面积及钎焊接头抗拉强度，建立了钎料润湿熵和接头强度熵的数学模型，并与熔炼合金化制备的相同Sn含量的传统钎料进行对比. 结果表明，与相同Sn含量的传统钎料相比，镀锡银钎料的润湿熵值更小、强度熵值略高. 同等Sn含量条件下，镀锡银钎料和传统钎料润湿熵值的变化趋势，与对应钎料在316LN不锈钢表面的润湿面积随Sn含量的变化趋势基本一致，强度熵值的变化趋势与对应钎料钎焊316LN不锈钢接头的抗拉强度随Sn含量的变化趋势几乎吻合；润湿熵和强度熵的模型在一定程度上可定量预测镀锡银钎料的钎焊工艺性和接头力学性能.     

锡镀层对BAg50CuZn钎料性能的影响

以BAg50CuZn钎料为研究对象,在其表面电镀锡,借助扫描电镜(SEM)观察锡镀层的表面形貌,采用差热分析仪(differential scanning calorimetry,DSC)和润湿试验炉分析锡镀层对合金钎料熔化温度和润湿性能的影响,并对镀覆锡后合金钎料的成分进行了讨论.结果表明,随着钎料表面镀覆Sn元素含量增加,合金钎料的DSC吸热峰向左偏移、熔化温度降低,钎料的润湿铺展性能呈上升趋势.在镀覆Sn元素含量为4.8%(质量分数)时,合金钎料表面锡镀层平整、致密,钎料的铺展面积最大,为236 mm2.镀覆元素Sn后的钎料中,Ag,Cu,Zn元素含量均减少,元素含量降低幅度大小顺序依次为Cu,Ag,Zn.     

Sn改性Ti-Zr-Cu-Ni钎料的微观组织和力学性能

采用自制Ti-Zr-Cu-Ni-Sn钎料钎焊TA2钛合金,研究了不同Sn元素含量改性Ti-Zr-Cu-Ni钎料的熔化特性、微观组织及物相、润湿及熔蚀性、接头拉伸强度。研究表明,Sn含量增加,Ti-Zr-Cu-Ni-Sn钎料固、液相线温度基本升高,但温度差值基本变窄,可更好地抑制钎焊界面脆性化合物形成。Ti-Zr-Cu-Ni-5Sn钎料组织由Ti、Zr基体和晶体相构成,Sn倾向与Ti、Zr结合形成Ti₂Sn₃、Ti₆Sn₅、Zr₅Sn₃等低熔点共晶相。Sn≤1.5%时,随Sn含量增加,钎料对TA2钛合金的润湿性逐渐变差;继续增加Sn,钎料润湿性改善,添加5%Sn的钎料对基体润湿最佳。添加5%Sn并降低Cu、Ni总量的改性钎料对TA2钛合金熔蚀减弱。相同钎焊工艺下,添加5%Sn接头的强度和塑性均有提升。钎焊温度升高,Ti-Zr-Cu-Ni钎料产生更多强化物相,致接头强度大幅提升,而Ti-Zr-Cu-Ni-5Sn钎料产生的含Sn物相强化作用对接头强度提升有限;相...     

镀锡AgCuZnSn钎料熔化特性的热力学分析

以BAg50CuZn钎料为基材,采用电镀热扩散组合工艺制备了镀锡AgCuZnSn钎料。为了揭示镀锡银钎料的热力学特性,借助差示扫描量热仪(DSC)测定了镀锡银钎料的熔化温度,运用热分析动力学中的非等温微分法和积分法分析了镀锡银钎料的相变热力学特性,并利用金相显微镜和X射线衍射仪(XRD)对钎料熔化后润湿界面的显微组织和物相进行了分析。研究表明,随着Sn含量升高,在吸热峰镀锡银钎料由固态向液态转变的温度区间变窄,非等温微分法和积分法得到的钎料相变活化能均逐渐增大。在Sn含量为7.2%时,镀锡银钎料的相变活化能和指前因子最大,分别为555.56kJ/mol、1.41×10~(32),此时镀锡银钎料相变速率方程的表达式为:k=1.41×10~(32)exp(-5.56×10~5/RT)。7.2%Sn含量的镀锡银钎料在304不锈钢表面熔化后,润湿界面组织主要由Ag相、Cu相、CuZn相、Cu_5Zn_8相、Cu_(41)Sn_(11)相、Ag_3Sn相组成。     

热扩散对镀锡银钎料界面组织及熔化特性的影响

对带锡镀覆层的银钎料进行热扩散处理,采用差示扫描量热仪(DSC)、扫描电镜(SEM)、X射线衍射仪(XRD)研究热扩散工艺对其熔化温度和扩散界面组织、物相的影响. 结果表明,在扩散时间一定条件下,随着扩散温度升高,扩散界面层厚度增加;随着扩散温度升高或扩散时间延长,钎料的固、液相线温度均降低,熔化温度区间缩小;扩散界面层物相主要由棒状Ag₃Sn相和块状Cu₃Sn相组成;最佳热扩散工艺为220 ℃,24 h. 经最佳工艺处理后,扩散界面层厚度为9.1 μm,钎料中Sn含量为7.2%,此时钎料熔化温度区间为642.34 ℃~676.37 ℃. 与传统熔炼合金化方法相比,钎料中Sn含量提高近31%.     

Physical properties of selected brazing filler metals

Abstract

A suitable selection of the filler metal is vital for producing satisfactory brazed joints. The wettability of brazing alloys with base metals depends on physical properties such as surface tension, density, melting point, and viscosity. Thermal conductivity and electrical resistivity are also important since the filler metal is frequently required to have similar values to those of the base metal. In the present paper, the physical properties of liquid alloys relevant to brazing have been evaluated. Six different filler metal systems were analysed, comprising alloys based on Ag, Al, Au, Cu, Ni, and Ti. Results show that the viscosity values for most binary brazing filler alloys are of the order of 2–8 mPa s, with Cu and Al alloys exhibiting the lowest viscosities. The surface tensions of brazing alloys vary from 800 to 1800 mN m^-1, with the lowest surface tension values corresponding to the Ag and Al alloys. Thermal conductivity and electrical resistivity values fall in the range 10–200 W m^-1 K^-1 and 17–300 μΩ cm, respectively.     

Laser brazing of alloy 600 with precious filler metals

Abstract

The diode laser brazing of Ni base heat resistant alloy with precious filler metals has been conducted using the tandem beam for preheating and brazing. A couple of 1 mm thick plates of alloy 600 (Inconel 600) were butt brazed using Au–18Ni, Ag–10Pd and Ag–21Cu–25Pd filler metals of 0·5 mm diameter with a brazing flux. Sound butt joints which were free from brazing defects such as porosity and lack of penetration could be obtained at brazing clearances of 0·1–1·5 mm. The tensile strength of the braze joint produced using Ag–Pd filler metal increased with decreasing brazing clearance and reached ～70% of the base metal strength at a brazing clearance of 0·1 mm while those obtained by using Au–Ni and Ag–Cu–Pd filler metals were comparable with the base metal strength at any clearances between 0·1 and 1·5 mm. The laser brazing technique could be successfully applied to the brazing of Ni base superalloy to attain a joint with high performance and reliability.     

快速凝固Al-Si基粉末钎料的研制

设计了系列铝硅基合金钎料，采用超音速气体雾化技术制备了钎料粉末。系统地研究了快凝钎料微观组织和焊接性能，优化出一种具有较高综合性能的钎料合金Al-10Si-5Cu-5Zn-0、3RE。研究表明：Al-10Si-5Cu-5Zn-0．3RE快凝粉末钎料的平均直径为0、11mm，组织细小，焊接强度达到了95．8MPa。Zn元素使快凝钎料的熔点显著降低，稀土元素明显改善钎料的润湿性。     

Cu-Ag-Si-Ga系低蒸气压钎料合金研究

研究了Cu-Ag-Si-Ga系钎料合金的熔化特性、加工性能和在Cu、Ni和不锈钢母材上的铺展性、钎焊接头强度以及Ga对钎料合金微观组织的影响.推荐一种典型的钎料,其成分为40Ag-2Si-2Ga-余量Cu(质量分数%),熔化温度为786.1～823.0℃,在500℃的条件下的蒸气压低于5.51×10~(-8)Pa,该钎料适合用于850～870℃电真空器件分级钎焊.     

合金元素锡和磷对低银钎料钎焊性能的影响

针对Sn和P对低银钎料的钎焊性能的影响进行了研究,发现Sn和P的添加使低银钎料的熔点降低,Sn的添加同时使低银钎料的钎焊性能变好。     

Microstructural characterization of diamond/CBN grains steel braze joint interface using Cu–Sn–Ti active filler alloy

In order to develop the new generation superhard abrasive tools of diamond and cubic boron nitride (CBN), the brazing joint experiments of diamond/CBN crystals and AISI 1045 steel matrix using Cu–Sn–Ti active filler powder alloy were investigated in vacuum furnace. The brazing temperature was 930 °C and the dwelling time was 20 min. Interfacial characteristics of the brazing joint among the diamond/CBN grains, the active filler layer and the steel substrate were analyzed using scanning electron microscopy, energy dispersive spectroscopy and X-ray diffraction techniques. The results indicated that Ti element in the Cu–Sn–Ti alloys diffused preferentially to the surface of diamond/CBN grits to form a Ti-rich reaction layer in the brazed joints by microanalyses. Moreover, the TiC, TiN and TiB₂ phases in diamond/CBN interface and Cu–Ti phase in steel interface were confirmed by X-ray diffraction phase analysis. The wetting and bonding reactions on diamond/CBN by melting Cu–Sn–Ti alloy were realized through the interfacial reaction products like TiC, TiN and TiB₂ compounds during the brazing process. The adhesive strength experiments of the joint interfaces revealed that the grains were not pulled out from the bond interface. The reliable bonding strength of brazed diamond/CBN grains to the steel substrate can meet the application requirements of high efficiency machining in the industrial field.     

微量In对AgCuZn钎料组织和性能的影响

研究了不同In含量银钎料的熔化温度、铺展性能、钎料显微组织以及钎缝力学性能的变化规律.以紫铜、黄铜为母材,采用火焰钎焊方法,用对接和搭接接头形式进行钎焊试验.结果表明,在银钎料中添加微量In元素,能够降低钎料的熔化温度,改善钎料的铺展性能,并显著改变钎料显微组织.对于黄铜对接来说,钎焊接头的抗拉强度,随银钎料中In含量的增加而呈抛物线方式增加;除黄铜对接接头外,其它形式的接头断裂位置均在母材上,说明含In银钎料的力学性能优良.     

腐蚀对复合银钎料的影响

采用恒温浸泡腐蚀、电化学腐蚀、润湿铺展测试和扫描电子显微镜(SEM)、万能力学试验机等手段研究了复合银钎料中钎剂与钎料合金的腐蚀及钎料腐蚀对钎焊性能的影响。结果表明,银钎料处于含水钎剂环境中,会被钎剂腐蚀。在钎料中加入1.5%~2.5%的Sn,缩小了Ag-Cu-Zn合金中Ag-Zn相与Cu-Zn相之间的电位差,降低了两相之间的微电池效应,Sn细化Ag-Cu-Zn钎料中的共晶相,降低银钎料发生腐蚀的敏感性;用被腐蚀的银钎料钎焊钢,钎焊接头抗拉强度损失,在钎料中添加Sn可抑制损失程度。     

AgCuTi合金钎焊单层立方氮化硼砂轮

为研制我国新一代单层钎焊CBN(立方氮化硼 )磨料砂轮 ,尝试Ni-Cr和Ag -Cu-Ti两种活性钎料 ,在真空炉中钎焊。试验结果表明 ,Ni-Cr合金钎料对CBN磨料不浸润 ,钎焊后CBN磨料全部脱落 ;而Ag -Cu -Ti合金钎料对CBN则表现出良好的浸润性并将CBN牢牢钎焊住。借助扫描电镜、X射线能谱和X射线衍射对界面微区组织的分析研究表明 ,钎焊过程中Ag -Cu -Ti合金钎料中的Ti向CBN磨料界面富集 ,并与CBN磨料表面的N和B元素反应生成TiN和TiB ,这是实现Ag -Cu -Ti合金钎料与CBN磨料高结合强度的关键因素。断口形貌的分析研究表明 ,CBN与Ag -Cu -Ti合金钎料间的断口发生在Ag -Cu -Ti合金钎料层 ,说明CBN磨料与Ag -Cu -Ti合金钎料的结合强度已超过了Ag-Cu -Ti合金钎料本身强度。最后将研制出的单层钎焊CBN磨料砂轮与传统电镀CBN砂轮进行了重负荷磨削对比试验 ,钎焊砂轮表现出明显的优势     

PCD用钎料及钎焊工艺的研究

PCD的广泛应用给钎焊技术提出了更高的技术要求，常规钎料已不能满足高疲劳，高温抗剪的要求，根据Ag,Cu,Zn,Cd,Ni,Co,Mn等元素在钎料中的作用和特点，进行分析和选择从而配制了十几种牌号的钎料，并对其熔点，强度，钎焊工艺进行了研究，研制出一系列新型的银基钎料，研究和使用结果表明，研制的系列钎料分别适宜不同工作条件下的PCD工具的钎焊。     

SnAg1.0Cu0.5对Ag30CuZnSn药芯钎料润湿性能及钎焊接头力学性能的影响

向Ag30CuZnSn药芯钎料药粉中添加SnAg1.0Cu0.5(SAC105)粉末,研究了不同SAC105含量对Ag30CuZnSn药芯钎料钎缝组织及钎焊接头性能的影响.结果表明,SAC105的加入可以显著提高Ag30CuZnSn药芯银钎料的润湿铺展性能,随着SAC105的添加量增加,Ag30CuZnSn药芯银钎料的...     

热浸镀锡铜磷钎料的性能

以Cu93P钎料为基体,在其表面热浸镀锡,制备CuPSn钎料,采用扫描电镜、万能力学试验机、显微硬度计、差热分析仪、箱式电阻炉和体视显微镜分析锡镀层的界面形貌,钎料的抗拉强度、显微硬度、熔化温度和润湿性。结果表明：在Cu93P钎料表面热浸镀锡过程中,液态锡与钎料发生了界面反应,生成Cu₆Sn₅金属间化合物,即钎料基体与锡镀层形成良好的冶金结合;随着热浸镀温度的升高和时间的延长,CuPSn钎料的抗拉强度和显微硬度均呈降低趋势,抗拉强度的降低源于界面处产生的Cu₆Sn₅脆性化合物和孔洞,显微硬度的降低源于热浸镀的去应力退火作用;Cu93P钎料表面热浸镀锡可降低钎料的熔化温度,提高钎料的润湿性,Cu93P钎料表面热浸镀5.20%（质量分数）锡之后,Cu88.16P6.64Sn5.20在纯铜板上的润湿铺展面积比基体Cu93P钎料增加43.15%。     

热解还原法制备镀镍ZrO2增强低银SnAgCu系复合钎料及其钎焊

本文采用热分解-还原法制备镀镍ZrO2增强相,粉末冶金法制备镀镍ZrO2增强Sn1.0Ag0.5Cu复合钎料,研究了ZrO2纳米颗粒表面金属化以及其对Sn1.0Ag0.5Cu复合钎料的微观结构、材料性能及钎焊接头的影响。结果表明:经机械预处理的ZrO2粒径减小、团聚降低;采用热分解-还原法成功地制备出了镀镍ZrO2增强相,Ni粒子以8-11 nm间距均匀附着于ZrO2表面,ZrO2(02)和Ni(11)界面呈半共格关系;添加适量镀镍ZrO2对Ni/ZrO2-Sn1.0Ag0.5Cu复合材料的熔点、电阻率影响不大,提高了润湿性和抗拉强度,在镀镍ZrO2增强相添加量为0.7 wt.%时Ni/ZrO2-Sn1.0Ag0.5Cu复合钎料抗拉强度、钎焊接头剪切强度均达峰值,较基体材料的相比提高了43.3%、40%。随着Ni-ZrO2增强相的添加,复合钎料钎焊接头的断裂位置由界面IMC层向过渡区的近钎缝侧移动,断裂机制由韧-脆混合断裂逐渐转为韧窝为主的韧性断裂。     

微量铟和锡对银合金抗变色及耐烧损性能的影响

针对饰品用斯特林银合金易发生硫化及氧化等变色现象,研究了添加微量In、Sn后合金的耐烧损、抗变色等性能。结果表明,添加0.375%的In代替Cu,可增加银合金的抗硫化变色和抗汗液腐蚀能力,但当In含量较低时反而会对抗汗液腐蚀能力造成不利影响;Sn元素对银合金的抗变色性能影响并不明显;补口合金中添加的In与Sn对925银合金中Zn的耐烧损性能影响规律及机理较为复杂;熔化次数较少、时间较短时In效果优于Sn,但Sn对Zn的保护时间较长;In与Sn含量降至一定程度都会加速Zn的烧损,而Zn对提高银合金抗变色能力上有着重要作用。可根据银合金需要重熔次数、熔化时间、服役环境来确定银合金中添加In、Sn、Zn的含量,达到所需效果。     

Brazing method to join a novel Cu54Ni6Zr22Ti18 bulk metallic glass to carbon steel

This study joined a novel Cu-based bulk metallic glass (BMG) to carbon steel using a brazing process. Cu₅₄Ni₆Zr₂₂Ti₁₈ BMG was brazed to SS400 carbon steel using filler metal at 713?K under a compressive stress of 15?MPa for 3?min. Considering the relatively low glass-forming ability, pure Zn and Zn–Ag–Al filler metals were selected to suppress the crystallisation during a reheating thermal cycle. A sound bonding interface without notable chemical diffusion was obtained using the suggested brazing method, particularly with the Zn–Ag–Al filler. This gave rise to considerable improvement in shear bonding strength, from 9 to 45?MPa, when replacing the Zn filler with the Zn–Ag–Al filler. The present method also induced no marked change in phase composition of the BMG due to the low bonding temperature and short bonding time. Slight variations in glass transition temperature and crystallisation temperature would result from a thermal annealing effect.