Influence of sulphur on the microstructure and properties of Ag–Cu–Zn brazing filler metal

Abstract

The effect of sulphur on the microstructure and properties of Ag45–Cu30–Zn25 brazing filler metal was investigated. Under the given experimental conditions, the sulphuration products mainly consisted of CuS, ZnS, Ag₂S, Cu₂S and Ag₃CuS₂. These sulphides not only distributed on the surface but also diffused into the interior of the filler metal and cut apart the matrix thereby significantly damaging the tensile strength of the filler metal from 658 to 283 MPa. The corresponding fracture characterisation turned from ductile fracture to brittle fracture. The sulphides existed as solid particles, which hinder the spreading of the liquid filler metal and the spreading area dramatically decreased from 317?09 to 18?55 mm², which indicates that the filler metal rarely wets the base metal.     

Effect of calcium on the microstructure and mechanical properties of brazed joint using Ag–Cu–Zn brazing filler metal

The induction brazing of 316LN stainless steel using Ag–Cu–Zn filler metal containing various content of Ca was carried out to investigate the influence of impurity element Ca on the microstructure and mechanical properties of the brazed joint. The results showed that Ca additions caused the coarser of the grains and their irregular distribution. Increase of the Ca content resulted in the formations of brittle intermetallic compounds (IMCs) CaCu which perhaps lead to the formations of voids. All of the calcium-containing brazed joints performed better in microhardness than calcium-free ones and brazed joints containing 0.003 wt.% Ca showed the highest microhardness of 203HV. While the tensile strength decreased with the increment of Ca, from 460 MPa to 400 MPa. The combination effects of coarser grains, brittle IMCs and voids conduced to the reduction of tensile strength and microhardness of the brazed joints.     

Effect of microstructure and Ag3Sn intermetallic compounds on corrosion behavior of Sn–3.0Ag–0.5Cu lead-free solder

In this paper, the effects of microstructure on the corrosion behavior of Sn–3.0Ag–0.5Cu (SAC305) lead-free solder were investigated by potentiodynamic polarization and atmospheric corrosion test. Scanning electron microscopy and X-ray diffraction were used to characterize the samples after the electrochemical and atmospheric corrosion tests. Results showed that commercial SAC305 solder exhibits better corrosion resistance than air-cooled and furnace-cooled SAC305 solders both in 3.5 wt% NaCl solution and at 60 °C/100 % relative humidity condition.     

Effect of Cu/Zn on microstructure and mechanical properties of extruded Mg–Sn alloys

In this paper, the effect of Cu and Zn addition on mechanical properties of indirectly extruded Mg–2Sn alloy was investigated. Mg–2Sn–0.5Cu alloy exhibits a moderate yield strength (YS) of 225?MPa and an ultimate strength of 260?MPa, which are much higher than those of the binary Mg–2Sn alloy, and the elongation (EL) evolves as ～15.5%. Mechanical properties of the Mg–2Sn–0.5Cu alloy are deteriorated with more 3 wt-% Zn addition, and YS and EL are reduced as 160?MPa and ～10%. The detailed mechanism is discussed according to the work-hardening rate and strengthening effect related to the grain sizes, second phases and macro-textures. Grain refinement and proper texture are believed to play a critical role in both strength and ductility optimisation.     

Effects of microstructure and temperature on corrosion behavior of Sn–3.0Ag–0.5Cu lead-free solder

The heterogeneous microstructure of solder could be obtained when cooling rate of the solder joint was not even, which would affect the corrosion behavior of solder during service. The ambient temperature would also affect the corrosion behavior of solder joint. In this paper, the effects of microstructure and temperature on the corrosion behavior of Sn–3.0Ag–0.5Cu (SAC305) lead-free solder were investigated. The various microstructures of SAC305 lead-free solder were obtained by cooling specimens in air and furnace. Compared to the fine-fibrous Ag₃Sn phase inside the commercial SAC305 solder, platelet-like Ag₃Sn formed as cooling speed decreasing. The polarization behavior of SAC305 solders in 3.5 wt.% NaCl solution was not significantly affected by various microstructures, but sensitive to temperature.     

Effect of aging treatment on microstructure and creep behaviour of Sn–Ag and Sn–Ag–Bi solder alloys

Abstract

The present study was undertaken to investigate the influence of aging temperature on the creep behaviour of Sn–Ag and Sn–Ag–Bi solder alloys at testing temperatures ranging from 333 to 363 K under constant stress of 7·80 MPa. The steady state creep rate was found to increase continuously with increasing aging temperature at all testing temperatures. Results show that addition of Bi to the binary Sn–Ag solder alloy led to a significant increase in the strength and improvement in the creep resistance. The activation energy for the creep process of Sn–Ag and Sn–Ag–Bi solder alloys was found to have an average value of 36 and 45 kJ mol^?1 respectively. This might be characterised by diffusion of Ag in Sn. The microstructure of the aged samples for both alloys examined by X-ray diffraction measurements supported the improvement in the creep resistance for Sn–Ag alloy by adding a small trace of Bi.     

Combined effects of Ag content and cooling rate on microstructure and mechanical behavior of Sn–Ag–Cu solders

Sn–0.7 wt%Cu–1.0 wt%Ag and Sn–0.7 wt%Cu–2.0 wt%Ag alloys were directionally solidified under transient conditions undergoing cooling rates varying from 0.1 to 25 K/s. The microstructure was characterized along the castings lengths and the present experimental results include the secondary dendrite arm spacing (λ₂) and its correlation with: the tip cooling rate ($\dot{T}$) during solidification and microhardness (HV), yield tensile strength (σ_y), ultimate tensile strength (σ_u) and elongation to fracture (δ). The aim is to examine the effects of Ag content and tip cooling rate on both the microstructure and mechanical properties. The initiation of tertiary branches within the dendritic arrangement, as well as the distinct morphologies of the intermetallic compounds (IMC) related to the solidification cooling rate was also assessed for both examined alloys. While the Cu₆Sn₅ phase appeared as large faceted crystals along the entire casting length, very fine Ag₃Sn spheroids prevailed at higher cooling rates (>7.5 K/s and > 4.0 K/s for 1.0 wt%Ag and 2.0 wt%Ag alloying, respectively) with a mixture of Ag₃Sn coarser spheroids and fibers predominating at lower cooling rates. The Sn–0.7 wt%Cu–2.0 wt%Ag alloy exhibited smaller dendritic spacings and HV of about two times higher than the corresponding values of the Sn–0.7 wt%Cu–1.0 wt%Ag alloy. A single Hall–Petch equation is proposed relating δ to λ₂ for both alloys, which means that the increase in Ag content from 1.0 to 2.0 wt% does not affect the elongation. It is shown that δ decreases with the increase in λ₂.     

Effect of Bi content on spalling behavior of Sn–Bi–Zn–Ag/Cu interface

The effect of the Bi content on the formation of intermetallic compounds (IMCs) layers between the Sn-xBi-0.9Zn-0.3Ag lead-free solder (with x = 1, 2, 3 and 4, in weight percent, hereafter) and Cu substrate was investigated. The structure of the IMC layer in the soldered interface varies apparently with increasing the Bi content. When the Bi content is 1 wt%, the interface soldered is consisted of CuZn and Cu₆Sn₅ IMC layers, which are separated by an intermediate solder layer. As the Bi content increases, the spalling phenomenon tends to disappear. Moreover, the layer between the Sn-2Bi-0.9Zn-0.3Ag solder and Cu substrate is thicker than others. The evolution of the soldered interfacial structure could be attributed to the existence of Bi.     

Effect of Al on the microstructure and properties of Sn–0.7Cu solder alloy

Effect of Al on the microstructure and mechanical properties were investigated. The results showed that Al could depress the formation of eutectic phase in Sn–Cu–Al solder alloy. The intermetallic compounds of Sn–0.7Cu–0.03Al were refined compared with that of Sn–0.7Cu–0.015Al. Segregated CuAl intermetallic compound was observed in Sn–0.7Cu–0.15Al and Sn–0.7Cu–0.5Al solder alloy. Sn-whisker was observed on the polished surface of Sn–0.7Cu–0.15Al and Sn–0.7Cu–0.5Al. The ultimate tensile strength of Sn–0.7Cu–0.03Al and Sn–0.7Cu–0.5Al was found to be higher than that of Sn–0.7Cu–xAl (x = 0, 0.015 and 0.15). The elongation of Sn–0.7Cu–0.015Al was the highest. The creep performance of Sn–0.7Cu–0.03Al and Sn–0.7Cu–0.5Al was similar and higher than that of Sn–0.7Cu and Sn–0.7Cu–0.15Al.     

Effects of Ga addition on microstructure and properties of Sn–0.5Ag–0.7Cu solder

The effects of rare element Ga on solderability, microstructure, and mechanical properties of Sn–0.5Ag–0.7Cu lead-free solder were investigated. The experimental results show that Ga plays a positive role in improving the wettability and the microstructure of the solder. When the content of Ga is at 0.5 wt%, the grain size of the solder is smaller and the shear force is enhanced greatly. It is also found that the thickness of the IMCs at the solder/Cu interface is reduced with proper addition of Ga. The increase of mechanical properties may be related to the refining of IMCs of the solder due to Ga addition.     

Effect of adding Ce on interfacial reactions between Sn–Ag solder and Cu

We investigated the effect of adding cerium (Ce) to low Ag content Sn–1.0wt.%Ag solder on the interfacial reactions between the Sn–1.0Ag solder and Cu substrate. The formation and growth of interfacial intermetallic compounds (IMCs) between the Sn–1.0Ag–0.3Ce solder and Cu substrate were studied and the results were compared to those obtained for the Ce-free Sn–1.0Ag/Cu and most promising Sn–3.0Ag–0.5Cu/Cu systems. The addition of Ce to the Sn–Ag solder significantly reduced the growth of the interfacial Cu–Sn IMCs, retarded the interfacial reactions between the solder and the substrate, and prevented the IMC from spalling from the interface. The Sn–1.0Ag–0.3Ce solder alloy had a good interfacial stability with the Cu substrate during solid-state isothermal aging in the viewpoint of IMC growth.     

Effect of trace additions of Sn on microstructure and mechanical properties of Al–Cu–Mg alloys

The work is aimed at investigating the influence of trace additions of Tin (Sn) on the microstructure, mechanical properties and age-hardening behavior of Al–6.2%Cu–0.6%Mg alloy system. Al–6.2%Cu–0.6%Mg alloys containing varying weight percentages (from 0 to 0.1 wt.%) of Sn were prepared by casting technique. The mechanical properties and microstructure of these alloys were investigated in the as-cast as well as different heat treated conditions. The composition of the different phases present in the microstructure was determined by energy dispersive X-ray (EDS) analysis. The average grain size of the annealed alloy was found to be maximum with trace content of 0.06 wt.% Sn. The hardness and strength of the alloy increased but the ductility reduced with increase in Sn content up to 0.06 wt.%. Precipitation hardening behavior of the alloys was investigated by analyzing the aging time required to attain the peak hardness value. Addition of trace percentage of Sn was observed to have no significant influence on the peak ageing time of the investigated alloy system.     

Effect of holding time on microstructure and mechanical properties of ZrO2/TiAl joints brazed by Ag–Cu filler metal

Reliable joining of ZrO₂ ceramic to TiAl alloy is crucial for the success of the engine industrial application. However, there have been few systematic investigations on joining of ZrO₂ ceramic and TiAl alloy. In this study, reliable brazing of ZrO₂ ceramic and TiAl alloy was achieved using inactive AgCu filler metal. The interfacial microstructure of the joints was characterized by SEM, XRD and TEM. Effects of holding time on the microstructure and mechanical properties of the joints were investigated in details. The results revealed that Cu₃Ti₃O + TiO layers were formed adjacent to ZrO₂ ceramic while AlCu₂Ti layer was formed at TiAl substrate. The thickness of Cu₃Ti₃O + TiO layers increased and the granular AlCu₂Ti coarsened gradually with the prolongation of holding time. The hardness and Young's modulus of reaction phases were characterized by nano-indentation to reveal the plastic deformability. The highest shear strength of 48.4 MPa was achieved when brazed at 880 °C for 10 min.     

Effects of package geometry on thermal fatigue life and microstructure of Sn–Ag–Cu solder joint

Abstract

Soldering experiments of chip scale package devices were carried out by means of diode laser soldering system with Sn–Ag–Cu solders. In addition, pull tests and a scanning electron microscope were used to analyse the effect of processing parameters on mechanical strength of solder joints. Viscoplastic finite element simulation was utilised to predict solder joint reliability for different package geometry under accelerated temperature cycling conditions. The results indicate that under the conditions of laser continuous scanning mode as well as the fixed soldering time, an optimal power and package geometry exists, while the optimal mechanical properties of microjoints are gained.     

Influence of alumina bubble particles on microstructure and mechanical strength in porous Cu–Sn–Ti metals

In order to obtain high porosity and satisfactory strength simultaneously for the porous metallic layer of the grinding tools, alumina bubble particles were added into Cu–Sn–Ti alloy powders to fabricate porous metals using a vacuum sintering method. The influence of the alumina bubble particles on the microstructure and the mechanical strength of the porous Cu–Sn–Ti metal blocks were investigated. Results show that adding alumina bubble particles into Cu–Sn–Ti alloy powder generate closed pore structures for the metal blocks. Good bonding interface between alumina bubble particles and Cu–Sn–Ti alloy is formed mainly dependent on the chemical resultants of TiAl and TiO. A relationship between the bending strength of the porous Cu–Sn–Ti metal blocks and the size and volume fraction of the alumina bubble particles is established.     

Effects of trace amount addition of rare earth on properties and microstructure of Sn–Ag–Cu alloys

Ternary lead free solder alloys Sn–Ag–Cu were considered as the promising alternatives to conventional SnPb alloys comparing with other solders. In the present work, effects of trace amounts of rare earth Ce on the wettability, mechanical properties and microstructure of Sn–Ag–Cu solder have been investigated by means of scanning electron microscopy and energy dispersive X-ray analysis systematically. The results indicate that adding trace amount of rare earth Ce can remarkably improve the wettability, mechanical strength of Sn–Ag–Cu solder joint at different temperature, especially when the content of rare earth Ce is at about 0.03%, the tensile strength will be 110% times or more than that of the lead free solder joint without rare earth Ce addition. Moreover, it was observed that the trace amount of rare earth Ce in Sn–Ag–Cu solder may refine the joint matrix microstructure, modify the Cu₆Sn₅ intermetallic phase at the copper substrate/solder interface, and the intermetallic compound layer thickness was reduced significantly. In addition, since rare earth Ce possesses a higher affinity to Sn in the alloy, adding of rare earth Ce can also lead to the delayed formation and growth of the intermetallic compounds of Ag₃Sn and Cu₆Sn₅ in the alloy.     

Effect of pulsed current on the microstructure evolution of Cu–Sn intermetallic compounds

The dissolution behaviour between Cu and Sn during spark plasma sintering (SPS) was investigated with emphasis on the intrinsic effect of the applied pulsed current. Metallographic analyses revealed that the phase formation of Cu–Sn intermetallics was significantly influenced by the applied pulsed current as a series of phase evolutions along the sintering temperature occurred: Cu₆Sn₅?+?Sn?→?Cu₆Sn₅?+?Cu₃Sn?→?Cu₃Sn. The evolution of Cu–Sn intermetallic compounds (IMCs) was analysed by considering the accelerated atomic diffusion and the increased flux of Cu into the IMCs with a pulsed current, which can provide new insights into the basic understanding of the SPS process and promote the development of rapid forming process of IMCs joints for applications at higher temperatures.     

Effect of the soldering time on the formation of interfacial structure between Sn–Ag–Zn lead-free solder and Cu substrate

The evolution of interfacial structure between the Sn–3.7%Ag–0.9%Zn lead-free solder and Cu substrate were systematically explored for different soldering times (1, 5, and 10 min). According to microstructural observations, it is found that the longer the soldering time is, the thicker the soldered interface becomes. The interface soldered for 1 min is composed of the Cu₅Zn₈ intermetallic compounds (IMCs) layer locating above the Cu₆Sn₅ IMCs layer. The interfaces soldered for 5 and 10 min are mainly made up of the Cu₆Sn₅ IMCs with some bulk Ag₃Sn IMCs randomly distributing within it. The evolution of the IMCs layer in the soldered interface can be divided into three stages: the Cu₅Zn₈ IMCs firstly forms, then Cu₆Sn₅ IMCs separated out from the bottom (controlled by diffusion of Sn in the Cu₅Zn₈), finally, subsequent growth of the Cu₆Sn₅ IMCs layer is controlled by diffusion of Sn in Cu₆Sn₅ IMCs.     

Wetting behaviour and interfacial microstructure of Sn–Ag–Zn solder alloys on nickel coated aluminium substrates

Abstract

Wetting behaviours of two lead free solders (Sn–2·625Ag–2·25Zn and Sn–1·75Ag–4·5Zn) on nickel coated aluminium substrates were investigated. Sn–2·625Ag–2·25Zn exhibited better wettability compared to Sn–1·75Ag–4·5Zn solder. Contact angles of the solders increased with increasing roughness of the substrate. The Young–Dupre equation was used to evaluate the work of adhesion of solder on the substrate. Sn–2·625Ag–2·25Zn solder exhibited higher work of adhesion than Sn–1·75Ag–4·5Zn. A thin continuous layer of Ni₃Sn was detected at the interface between Sn–2·625Ag–2·25Zn solder and nickel coated Al substrate. Sn–1·75Ag–4·5Zn solder exhibited scallop intermetallic compounds (IMCs) growing into the solder field as well as a thin continuous IMC in some cases. Ni₃Sn and Ni₃Sn₄ IMCs were observed at the interface of Sn–1·75Ag–4·5Zn solder and nickel coated Al.     

Effect of the addition of Sb and rare-earth elements La and Nd on the properties of Cu/6061Al with Zn–10Al–5Cu filler metals

The wetting ability, mechanical properties and microstructure distribution of a new solder based on a Zn–10Al–5Cu alloy with different amounts of Sb and rare earths added were studied. The results indicate that the spreading area of solder alloy decreases first and then increases and the shear strength of the Copper–aluminum joint increases with the increase of Sb element. The microstructure of the brazed weld matrix was refined. The Zn–10Al–5Cu–1.5Sb solder obtained by the test had better properties. Then, the rare earth (La and Nd) was added in Zn–10Al–5Cu–1.5Sb filler metal. It makes the wettability further improved. The wetting property of solder was the best with the 0.15 wt% RE addition. The large black eutectoid microstructure in the matrix become smaller and the number of IMC near the copper side increases with the addition of rare earth elements. The shear strength of brazed seam reaches the maximum when the content of rare earth element is 0.15%. Therefore, the optimum addition amount of the rare earth in Zn–10Al–5Cu–1.5Sb is about 0.15%.