Effect of bonding temperature on transient liquid phase bonding behavior of a Ni-based oxide dispersion-strengthened superalloy

The effect of joining temperature on the transient liquid phase (TLP) bonding of MA758 superalloy was investigated. The TLP bonds were made at temperatures of 1100 and 1200 °C. Analysis was undertaken to determine the changes within the joint microstructure. The bonding temperature affected the extent of parent metal dissolution, the time for isothermal solidification, and the attainment of microstructural continuity across the joint region. Bonding at 1100 °C did not result in extensive parent metal dissolution, and subsequent shear testing showed failure through the center of the joint. However, bonding at 1200 °C increased parent metal dissolution resulting in significant agglomeration of Y₂O₃ particles at the joint interface. Failure was observed along the joint interface in regions depleted of strengthening particles. Bonding at a higher temperature reduced the time for isothermal solidification but also reduced the strain energy of the oxide dispersion-strengthened alloy so that grain growth across the joint region could not be achieved.     

Transient liquid phase diffusion bonding of Al/Al2O3 nanostructured metal matrix composites

Transient liquid phase (TLP) diffusion bonding was carried out on nanostructured metal matrix composite sheets of Al-1100 alloy with 5 wt-% alumina particles at various bonding temperatures and process durations. A thin layer of 5 μm pure copper was electrodeposited as an interlayer. Joint formation was first attributed to the solid state diffusion of copper into the aluminium metal matrix followed by eutectic formation; then, base metal dissolution and isothermal solidification was completed at the joint interface. Joint area was characterised using scanning electron microscopy (SEM) and X-ray diffraction (XRD). Diffraction patterns showed the formation of intermetallic phases like CuAl₂. The concentration of Al₂O₃ particles increases across the interface as the bonding temperature increases. As a result, the highest bond strength of 123 MPa was achieved after a bonding duration of 30 min at 590°C.     

A two-step transient liquid phase diffusion bonding process of T91 steels

In this study,a two-step heating process is introduced for transient liquid phase( TLP) diffusion bonding for sound joints with T91 heat resistant steels. At first,a short-time higher temperature heating step is addressed to melt the interlayer,followed by the second step to complete isothermal solidification at a low temperature. The most critical feature of our new method is producing a non-planar interface at the T91 heat resistant steels joint. We propose a transitional liquid phase bonding of T91 heat resistant steels by this approach. Since joint microstructures have been studied,we tested the tensile strength to assess joint mechanical property. The result indicates that the solidified bond may contain a primary solid-solution,similar composition to the parent metal and free from precipitates. Joint tensile strength of the joint is not lower than parent materials. Joint bend's strengths are enhanced due to the higher metal-to-metal junction producing a non-planar bond lines.Nevertheless,the traditional transient liquid phase diffusion bonding produces planar ones. Bonding parameters of new process are 1 260 ℃ for 0.5 min and 1 230 ℃ for 4 min.     

Bonding phenomena of transient liquid phase bonded joints of a Ni base single crystal superalloy

The bonding phenomena of Ni base single crystal superalloy CMSX-2 during transient liquid phase (TLP) bonding have been investigated using MBF-80 and F-24 insert metals. TLP bonding of the superalloy was carried out at 1373-1548K for 0-19.6ks in vacuum and the (100) plane of each test specimen was always aligned perpendicular to the joint interface. The dissolution width increased when the bonding temperature and holding time increased. The eutectic width decreased linearly with the square root of holding time during isothermal solidification. After homogenization treatment, the microstructure, distributions of hardness and alloying elements in the bonded interlayer become similar to those of the base metal.     

The effect of grain boundary on the dissolution of base metal into insert metal during TLP bonding of Ni-base superalloys

The dissolution of base metal into insert metal during TLP bonding of Ni base CMSX-2 superalloys, was studied. The effect of grain size on the dissolution phenomenon was also investigated. TLP bonding of single crystal, coarse grained and fine grained CMSX-2 specimens was carried out at 1373–1548 K for 019.6 ks under 2.3 MPa. During TLP bonding, the dissolution of the base metal into insert metal occurred very rapidly, leading to constant dissolution width at a given holding time. The dissolution width of the base metal broadened with increasing bonding temperature and holding time in all samples used. The dissolution of the base metal into the insert melt pool was governed by Nernst-Brunner’s theory in any grain size of base metal. The saturation time for dissolving base metal shortened, but its width broadened with increasing bonding temperature. The dissolution rate of the base metal increased with decreasing grain size of the base metals.     

铝基复合材料与铝合金的TLP扩散连接

采用TLP扩散连接方法对铝合金与SiC颗粒增强Al基复合材料进行了连接试验研究，应用扫描电镜和能谱分析技术对TLP连接接头进行了微观组织观察和接头区域各元素的浓度分布测试。结果表明，SiC颗粒增强铝基复合材料与铝合金连接接头区域连接界面向铝合金一侧偏移，接头区域溶质原子浓度分布非常不均匀，由于溶质原子扩攻速度以及中间层和母材冶金反应的不同，导致铝基复合材料与铝合金的TLP扩散连接过程存在明显的非对称性。     

Effect of solidification mechanism on microstructure and mechanical properties of joint in TLP bonded Al2024‐T6 alloy

Abstract

Transient liquid phase (TLP) bonding of Al2024‐T6 alloy, using gallium (Ga) interlayer, has been investigated. Bonding process was carried out at 470°C for 6?min, and homogenising temperature and time were 495°C and 2?h respectively. Conventional TLP bonding using Ga interlayer was not an appropriate method for joining of Al2024. In this method, the boundary between two Al2024 specimens was not fully eliminated during bonding because of solidification with planar front. In addition, bonding zone was depleted of copper, and as a result, tensile and shear strength of joint decreased to 200 and 110?MPa respectively. TLP bonding under temperature gradient offered very good results in bonding of Al2024. In this method, solidification mechanism change from planar to dendritic, and tensile and shear strength of joint increased to about 460 and 220?MPa respectively. Microstructure of bonding zone changed basically by changing solidification mechanism.     

焊接温度对10Cr9Mo1VNb钢TLP接头性能的影响

采用氩气保护,在1230～1260℃、3～5MPa下,用镍基合金作中间层对10Cr9Mo1VNb钢管进行瞬时液相扩散焊,分析了不同焊接温度对其接头力学性能和显微组织的影响.结果表明:在焊接温度为1240℃时,接头的组织与母材最接近,力学性能最好.得出:中间层的扩散速度与焊接温度呈正比,母材的成分对焊接温度选择有重要影响.     

New insights into microstructural changes during transient liquid phase bonding of GTD-111 superalloy

The effects of joining temperature (T_J) and time (t_J) on microstructure of the transient liquid phase (TLP) bonding of GTD-111 superalloy were investigated. The bonding process was applied using BNi-3 filler at temperatures of 1080, 1120, and 1160 °C for isothermal solidification time of 195, 135, and 90 min, respectively. Homogenization heat treatment was also applied to all of the joints. The results show that intermetallic and eutectic compounds such as Ni-rich borides, Ni−B−Si ternary compound and eutectic-γ continuously are formed in the joint region during cooling. By increasing t_J, intermetallic phases are firstly reduced and eventually eliminated and isothermal solidification is completed as well. With the increase of the holding time at all of the three bonding temperatures, the thickness of the athermally solidified zone (ASZ) and the volume fraction of precipitates in the bonding area decrease and the width of the diffusion affected zone (DAZ) increases. Similar results are also obtained by increasing T_J from 1080 to 1160 °C at t_J=90 min. Furthermore, increasing the T_J from 1080 to 1160 °C leads to the faster elimination of intermetallic phases from the ASZ. However, these phases are again observed in the joint region at 1180 °C. It is observed that by increasing the bonding temperature, the bonding width and the rate of dissolution of the base metal increase. Based on these results, increasing the homogenization time from 180 to 300 min leads to the elimination of boride precipitates in the DAZ and a high uniformity of the concentration of alloying elements in the joint region and the base metal.     

瞬间液相扩散焊与钎焊主要特点之异同

从焊接进程、凝固、氧化物的破碎、中间层与钎料的区别、接头组成、脆性相的形成与消除、压力的作用、接头强化机理等方面总结分析了瞬间液相扩散焊与钎焊的区别。强调指出了下述关键点 :(1)中间层的选取是获得两种不同焊接方法接头的首要前提 ;(2 )在钎焊中侧重点是润湿性 ,它是保证接头获得一定强度的首要前提与主要手段 ;(3 )在瞬间液相扩散焊过程中 ,除了润湿性之外 ,更为关注的是降熔元素的扩散。中间层中降熔元素向母材的持续扩散是TLP接合中液态区增宽、破碎氧化膜、等温凝固、均匀化现象的本质原因 ;降熔元素向母材的充分扩散及由此而出现的中间层成分的合理改变是TLP焊接成败的命脉     

Ni3Al单晶高温合金过渡液相扩散焊工艺

采用KNi3中间层,对Ni3Al单晶高温合金进行过渡液相扩散焊,分析不同焊接保温时间的接头和基体组织的变化,测试接头的高温持久性能.结果表明,1 240℃保温12 h,TLP扩散焊接头局部区域有少量的γ＋γ＇共晶组织及小块状的硼化物组织,其它区域均为与基体组织一致的γ＋γ＇双相组织;基体γ＇相由四方形转变成不规则状.焊接接头在1 000℃高温持久强度达到标准状态的基体强度90%.试样组织出现γ＇相筏形化,焊缝区域筏形组织粗化,且形状不规则,与持久应力方向呈一定角度.     

Diffusion bonding of two phase γ-TiAl alloys with duplex microstructure

Abstract

Solid state diffusion bonding of TiAl was carried out with different bonding parameters within the superplastic temperature range. The effect of post-bond heat treatment (PBHT) on the mechanical properties of the bonds was also studied. Defect free sound bonds were achieved within the temperature range 925–1150°C and the pressure range 20–40 MPa. Transverse microtensile specimens extracted from the bonds were tested to evaluate room temperature tensile properties of the bonds and to correlate them with bonding parameters. The bond strength increased with an increase in bonding temperature and pressure. All the specimens of the bond made at 925°C and 40 MPa, and most of the specimens of bonds made at 1000°C and 30 MPa and at 1100°C and 20 MPa, failed in the bond area; all the specimens of bonds made at 1100°C and 30 MPa and at 1150°C and 20 MPa failed in the base metal. Post-bond heat treatment at 1350°C for 1 h led to the transformation of the recrystallised γ grains at the bond inteface formed during bonding to a lamellar microstructure, resulting in an indiscernible bond line in all cases. This resulted in an improvement in the bond strength in most of cases. Moreover, the recrystallised γ grains were also formed away from the bond area in the bonds made at 1100°C and 30 MPa and at 1150°C and 20 MPa. After PBHT, these bonds exhibited slightly lower tensile strength values owing to the change in the base metal microstructure away from the bond area.     

Optimizing Diffusion Bonding Parameters in AA6061-T6 Aluminum and AZ80 Magnesium Alloy Dissimilar Joints

The main difficulty when joining magnesium (Mg) and aluminum (Al) alloys by fusion welding lies in the formation of oxide films and brittle intermetallic in the bond region which affects the integrity of the joints. However, diffusion bonding is a suitable process to join these two materials as no such characteristic defects are produced at the joints. The diffusion bonding process parameters such as bonding temperature, bonding pressure, holding time, and surface roughness of the specimen play a major role in determining the joint strength. In this investigation, an attempt was made to develop empirical relationships to predict the strengths of diffusion bonded AZ80 magnesium and AA6061 aluminum alloys dissimilar joints from the process parameters based on central composite factorial design. Response surface methodology was applied to optimize the process parameters to attain the maximum shear strength and bonding strength of the joint. From this investigation, it was found that the bonds produced with the temperature of 405.87?°C, pressure of 7.87?MPa, holding time of 29.02?min and surface roughness of 0.10???m exhibited maximum shear strength and bonding strength of 57.70 and 76.90?MPa, respectively. The intermetallic formation at the interface was identified.     

Effect of bonding temperatures on the transient liquid phase bonding of a directionally solidified Ni-based superalloy,GTD-111

The bonding phenomenon and the mechanism involved in the transient liquid phase bonding (TLP Bonding) of directionally solidified Ni-based superalloy GTD-111 was investigated. At a bonding temperature of 1403 K, the liquid insert metal was eliminated by isothermal solidification, which was controlled by the diffusion of B and Si into the base metal. The solids in the bonded interlayer simultaneously grew epitaxially from the mating base metal inward from the insert metal. The number of grain boundaries formed at the bonded interlayer corresponded with those of the base metal. Liquefaction at the grain boundary and dendrite boundary occurred at a temperature of 1433 K. At a bonding temperature of 1453 K which is higher than the liquefaction temperature of the grain boundary, liquids of the insert metal were connected with liquated grain boundaries; this connection extended as far as the grain boundary, which was approximately 1.5 mm from the interface. The composition of this liquid was a mixture of the insert metal and phase that existed at the grain boundary. At extended holding times, liquid phases gradually decreased, and liquids with a continuous band shape develop into distinct islands. However, the liquid phases did not disappear after a holding period of 7.2 ks at 1453K. The extended isothermal solidification process at the bonding temperature, which is higher than the liquefaction temperature for the grain boundary, was controlled by the diffusion of Ti. This resulted in its preferential liquefaction compared to B or Si in the insert metal.     

High temperature diffusion induced liquid phase joining of a heat resistant alloy

Transient liquid phase bonding (TLP) of a nickel base superalloy, Waspaloy, was performed to study the influence of holding time and temperature on the joint microstructure. Insufficient holding time for complete isothermal solidification of liquated insert caused formation of eutectic-type microconstituent along the joint centerline region in the alloy. In agreement with prediction by conventional TLP diffusion models, an increase in bonding temperature for a constant gap size, resulted in decrease in the time, t_f, required to form a eutectic-free joint by complete isothermal solidification. However, a significant deviation from these models was observed in specimens bonded at and above 1175 °C. A reduction in isothermal solidification rate with increased temperature was observed in these specimens, such that a eutectic-free joint could not be achieved by holding for a time period that produced complete isothermal solidification at lower temperatures. Boron-rich particles were observed within the eutectic that formed in the joints prepared at the higher temperatures. An overriding effect of decrease in boron solubility relative to increase in its diffusivity with increase in temperature, is a plausible important factor responsible for the reduction in isothermal solidification rate at the higher bonding temperatures.     

T91钢管TLP与TIG+MIG焊接接头组织与性能

分别采用瞬时液相扩散焊(TLP)和TIG+MIG对T91钢管进行焊接,通过对比试验,分析了TLP和TIG+MIG焊接接头在力学性能和显微组织上的差异.结果表明:采用TLP焊接T91钢管时,接头抗拉强度和抗弯强度均强于TIG+MIG焊接;接头组织更加均匀细小,与母材接近.得出更低的焊接温度、更短的高温停留时间、合金元素均匀扩散和等温凝同使得TLP焊接接头性能优于TIG+MIG焊接接头.     

Formation process, microstructure and mechanical property of transient liquid phase bonded aluminium-based metal matrix composite joint

1　INTRODUCTIONThealuminium basedmetalmatrixcomposites(MMCs)areadvancedmaterialsthathavesuperiorproperties ,especiallyincreasedstiffness ,highstrength ,goodwearresistanceandsuperiorelevatedtemperatureproperties .Theyhavereceivedconsider ableattentionascandidatesforadvancedindustrialapplications[1,2 ] .But ,theirapplicationshavebeenseverelyrestrictedbythelackofasuitablejoiningmethod[3] .AlthougthfusionweldingmethodscanbeusedtojointheMMCs ,themethodsnormallytendtoresultinunfavourablejoint…     

"相变-扩散钎焊(T/DB)"新工艺及其接头界面形貌

为减小相变超塑性扩散连接的循环次数,提出了一种新型焊接工艺"相变-液相扩散焊(T/DB)",即在待焊母材间预先放入液相扩散焊用的中间层,然后按传统相变超塑性扩散连接工艺施焊,但要求温度循环的峰值温度须同时大于母材的相变点与中间层的熔点.试验以低碳钢为母材,以镍基非晶箔带(BNi2)为中间层,进行了低碳钢的相变-扩散钎焊(循环3次)与液相扩散焊接(1200℃×3 min)的对比试验.结果表明相变-液相扩散焊所需温度循环次数少,接头无界面空洞,其接合线呈非平面状;而液相扩散焊接头的接合线较平直.分析认为,界面的起伏是母材的适度溶解与超塑性流变共同作用的结果;非平面状界面有利于增大金属-金属接触面积及扩散通道的面积,为获得合格接头做出了相应贡献.     

Interface evolution of TiAl／Ti6242 transient liquid phase joint using Ti, Cu foils as insert metals

The interface evolution of TiAl/Ti6242 joint produced by transient liquid phase(TLP) bonding with Ti,Cu foils as insert metals was investigated. The results show that the surface oxide layer on TiAI plays a very important role in the formation process of the joint. A ‘bridge‘ effect is observed because of the presence of the oxide layer on the surface of TiAl. The diffusion behavior of Cu atoms in TiAl is strongly controlled by the vacancies beneath the surface of TiAl. Based on the interface diffusion and interface wettability, a mechanism for the effect of bonding pressure, bonding temperature, holding time and stacking sequence of the insert foils on the joint formation process were proposed.     

TLP bonding of Ti-6Al-4V and Mg-AZ31 alloys using pure Ni electro-deposited coats

Transient liquid phase (TLP) bonding of Mg-AZ31 and Ti-6Al-4V alloys was performed using pure thin Ni electro-deposited coat interlayer (12 μm). The effect of bonding temperature, time and pressure on microstructural developments and subsequent mechanical properties across joint interface was studied at a temperature range from 500 to 540 °C, bonding time from 1 to 60 min and bonding pressure from 0 to 0.8 MPa. The mechanisms of bond formation varied across the joint region, with solid-state diffusion dominant at the Ti-6Al-4V interface and eutectic diffusion at the Mg-AZ31 interface. Joint microstructure was examined by scanning electron microscopy (SEM), and energy dispersive spectroscopy (EDS). X-ray diffraction (XRD) was used to detect the formation of intermetallic phases at the fracture surface. The maximum joint shear strength of 61 MPa was obtained at a temperature of 520 °C, 20 min and at a bonding pressure of 0.2 MPa. This joint strength was three times the bond strength reported for joints made using adhesives and represents 50% of the Mg-AZ31 alloy shear strength.