Effective thermal conductivity of Cu/diamond composites containing connected particles

An analytical model for the thermal conductivity of Cu/diamond composites with connected particles is presented by replacement of a cluster of connected particles with an equivalent polycrystal subsequently using a multiple effective medium approach. By applying this model to the measured thermal conductivity of Cu/diamond composites prepared by high pressure high temperature sintering technique reported in the literature, we show that it quite well describes the observed thermal conductivity enhancement induced by the connected particles. We estimate the value of connected particle loading in real composites and show that large particles are easier to form the bonding contact than small particles. The present work also demonstrates that the sensitivity of thermal conductivity contribution from the connected particles strongly depends on the particle size, and their pronounced thermal conductivity enhancement should lie within the certain particle size range.     

Modeling the thermal conductivity of diamond reinforced aluminium matrix composites with inhomogeneous interfacial conductance

A reasonable model for describing the thermal conductivity of diamond reinforced aluminium matrix composites behaving a distinctive character of inhomogeneous distribution of interfacial thermal conductance on diamond surfaces is proposed in terms of an equivalent diameter approach combined with a double effective-medium approximation scheme. Theoretical analyses for the thermal conductivity of diamond reinforced Al (Si) composites prepared by different infiltration techniques (squeeze casting (SQ), gas pressure infiltration (GPI)) are given for rediscovering the existing experimental results considering inhomogeneous conductance behavior. Numerical results using present model agree reasonably well with the experimental observations and explore new findings, i.e. the diffusion bonding also occurs at Al–diamond {1 1 1} interfaces of GPIed composites; the interconnected particles is possibly existed in GPIed Al/diamond composites.     

Thermal conductivity and mechanical properties of high density polyethylene composites filled with silicon carbide whiskers modified by cross-linked poly (vinyl alcohol)

A thin layer of poly (vinyl alcohol) (PVA) was coated on the surface of silicon carbide whiskers (SCWs) and crosslinked by glutaraldehyde, and then these modified whiskers (mSCWs) were incorporated into high density polyethylene (HDPE) to prepare HDPE/mSCW composites with a high thermal conductivity. The thermal conductivity, mechanical properties, heat resistance, thermal stability and morphology of HDPE/mSCW and HDPE/SCW composites were characterized and compared. The results reveal that the thermal conductivity of both HDPE/SCW and HDPE/mSCW composites increases with the increase of filler loading, and reaches a maximum of 1.48 and 1.69?W/(m?K) at 40?wt% filler loading, which is 251.2% and 300.75% higher than that of HDPE, respectively. Significantly, HDPE/mSCW composites have a higher thermal conductivity than their HDPE/SCW counterparts with the same filler loading. In addition, the heat resistance, Young’s modulus and yield strength of both HDPE/SCW and HDPE/mSCW composites are also improved compared with that of HDPE. mSCW can be homogenously dispersed in the HDPE matrix, which contributes to the formation of thermally conductive networks by the inter-connection of mSCWs.     

镀Ti金刚石/Al复合材料的热性能

通过盐浴镀方法实现金刚石表面镀Ti,并采用模压铸造方法制备镀Ti金刚石/Al复合材料。研究镀层对复合材料微观结构和热性能的影响。结果表明金刚石表面镀Ti改善了复合材料的界面结合,降低界面热阻,从而提高了复合材料的热性能,包括降低热膨胀系数,提高复合材料的热导率。采用850℃盐浴镀Ti,镀覆时间180min得到的镀Ti金刚石/Al复合材料热导率高达488W/(m.K),在温度范围50～300℃之间,其平均热膨胀系数为9×10-6/K。     

Thermal conductivity of Cu/diamond composites prepared by a new pretreatment of diamond powder

Cu/diamond composites were fabricated by spark plasma sintering (SPS) after the surface pretreatment of the diamond powders, in which the diamond particles were mixed with copper powder and tungsten powder (carbide forming element W). The effects of the pretreatment temperature and the diamond particle size on the thermal conductivity of diamond/copper composites were investigated. It was found that when 300 μm diamond particles and Cu–5 wt.% W were mixed and preheated at 1313 K, the composites has a relatively higher density and its thermal conductivity approaches 672 W (m K)⁻¹.     

Thermal conductivity of aligned CNT/polymer composites using mesoscopic simulation

Thermal conductivity of CNT/polymer composites depends on alignment, dispersion, volume fraction and size of CNTs as well as polymer size. By coupling smoothed particle hydrodynamics and dissipative particle dynamics, thermal conductivities of random and aligned composites along with their meso morphologies are studied in detail. Thermal conductivity along the alignment of CNT can be significantly enhanced to 16 times that of polymer by increasing volume fraction, dispersion degree and length of CNT, meanwhile thermal conductivity perpendicular to the alignment of CNT is affected modestly by these factors. Enhancement of thermal conductivity of random composites could only be efficiently achieved by increasing the volume fraction of CNT. Particularly, thermal conductivity $\kappa$ is proportional to the square of volume fraction of CNT v in well dispersed random and aligned composites, i.e. $\kappa \propto v^2$.     

热处理温度对二维高导热炭/炭复合材料结构及热导率的影响（英文）

以高导热沥青基炭纤维布为增强体,中间相沥青为黏结剂,采用热模压成型及液相浸渍裂解工艺增密,并经高温石墨化处理制备二维高导热炭/炭复合材料。利用X射线衍射仪和透射电子显微镜对经不同温度处理后的沥青基炭纤维及二维高导热炭/炭复合材料的结构和形貌变化进行表征,并考察石墨化处理温度对复合材料热导率的影响。结果表明,随着热处理温度的升高,纤维及复合材料内部石墨微晶尺寸增大、取向度变好,纤维与基体间界面结合紧密、裂纹减少,而基体碳层间裂纹则呈扩大趋势。此外,二维高导热炭/炭复合材料的热导率随热处理温度的升高而线性增加,经3 000℃处理后,材料热导率高达443 W/m·K。     

基体中Ti元素含量对金刚石/Cu-Ti复合材料热导率的影响

采用真空热压法制备了金刚石体积分数为63%的金刚石/Cu-Ti复合材料,研究了基体中Ti含量对金刚石/Cu-Ti复合材料界面显微结构和热导率的影响。随着Ti含量的增加,金刚石/Cu-Ti复合材料热导率先增加后减小。当基体中Ti含量为1.1wt%时热导率最高,为511 W/（m·K）。Ti含量小于1.1wt%时,烧结过程中两相界面间生成的碳化物数量和面积随Ti含量的增加而增加,优化了界面结合,提高了界面结合强度,增加了界面传热通道数量,使金刚石/Cu-Ti复合材料导热性能提高。Ti含量的增加同时伴随着碳化物热阻增加和基体导热性能的恶化。过量的Ti元素使低导热性能的碳化物层厚度增加,碳化物层本身热阻增加,界面热导降低,金刚石/Cu-Ti复合材料导热性能下降。     

金刚石/Al(或AlSi合金)复合材料性能衰退及抑制

采用气体压力浸渗法制备了金刚石/Al、金刚石/AlSi7和金刚石/AlSi9复合材料,对比研究了其暴露在空气中的性能衰退行为。研究表明,界面反应产物Al₄C₃会潮解生成Al（OH）₃,增大界面热阻,导致金刚石/Al复合材料性能衰退。Al基体中添加Si元素可以显著降低其性能衰退速率,其机制为:金刚石中C元素在Al液中溶解度的降低和Si在金刚石颗粒表面的优先析出,抑制了Al₄C₃的生成量;此外,金刚石/AlSi复合材料致密度的提高,对Al₄C₃与水汽的接触起到阻碍作用。讨论了抑制金刚石/Al复合材料性能衰退的几种可行方法,有望进一步提高其在潮湿环境中的使用寿命。      

Thermal conductivity of liquid crystalline epoxy/BN filler composites having ordered network structure

BN filler was added to a liquid crystalline (LC) epoxy resin to obtain a high thermal conductive material. The LC epoxy/BN composites, which were cured at different temperatures, formed an isotropic or LC polydomain phase structure. The relationship between the network orientation containing mesogenic groups and the dispersibility of the BN filler was discussed. As a result, the thermal conductivity of the LC polydomain system was drastically enhanced even at a relatively low volume fraction of BN (30 vol%), regardless of the fact that both the LC and isotropic phase systems consisted of the same resin and filler content combination. This result is due to the formation of thermal conductive paths by the BN filler by exclusion of the BN filler from the LC domain formed during the curing process in the composite having the LC polydomain matrix.     

Multi-composition oxidation resistant coating for SiC-coated carbon/carbon composites at high temperature

This work proposes a multi-composition oxidation resistant coating for SiC-coated carbon/carbon (C/C) composites by slurry method using the mixture of Y₂O₃, ZrO₂, Al₂O₃, Si and C. XRD analysis shows that the phases of the composite coating are composed of SiC, Al₂O₃, Y₂O₃, ZrO₂, Al₄SiC₄ and Y₃Al₂(AlO₄)₃. SEM analysis of the cross section of the coating displays the microstructure with 500 μm thickness which filled the porous SiC. Oxidation test shows that, after 19 h oxidation in air at 1873 K, the weight loss of the coated SiC-C/C is only 1.76%. The oxidation of the coated C/C composites was primarily due to the reaction of C/C matrix and oxygen diffusing through the penetrable cracks and bubble holes in the coating.     

Thermal conductivity and dielectric properties of Al/PVDF composites

Polymeric composites with relatively high thermal conductivity, high dielectric permittivity, and a low dissipation factor are obtained in the present study. Three types of core-shell-structured aluminum (Al) particles are incorporated in poly(vinylidene fluoride) (PVDF) by melt-mixing and hot-pressing processes. The morphological, thermal, and dielectric properties of the composites are characterized using thermal analysis, a scanning electron microscope, and a dielectric analyzer. The results indicate that the Al particles decrease the degree of crystallinity of PVDF, and that the particle size and shape of the filler affect the thermal conductivity and dielectric properties of Al/PVDF. No variation in the dissipation factor is observed up to 60 wt.% Al. Thermal conductivity and dielectric permittivity values as high as 1.65 W/m K and 230, respectively, as well as a low dissipation factor of 0.25 at 0.1 Hz, are realized for the composites with 80 wt.% spherical Al.     

纳米Ag链的制备及其在聚氨酯基柔性导电复合材料中的应用

针对柔性聚合物基导电复合材料的导电性差和柔性差这2个关键问题,分别从导电填料的柔性化及降低填料含量2方面着手,以脱氧核糖核酸（DNA）大分子链作为模板,制备了大小均一、链状排列的柔性纳米Ag链及纳米Ag链填充的聚氨酯基柔性导电复合材料。利用SEM对纳米Ag链/Ag包Cu粉/聚氨酯导电复合材料的界面结构进行了表征,探讨了纳米Ag链/Ag包Cu粉/聚氨酯导电复合材料导电性及柔性的机制。研究发现:保持导电填料总质量分数为76%、纳米Ag链的质量分数为4%时,纳米Ag链/Ag包Cu粉/聚氨酯导电复合材料的电阻率及形变前后的电阻变化比值达到最佳值,分别为2.13×10-4 Ω·cm和3.6;当以纳米Ag链为单一填料时,制得的纳米Ag链/聚氨酯导电复合材料具有优异的柔性;泡沫法制备的纳米Ag链/聚氨酯导电复合材料可以在低填料质量分数时达到更高的导电性,当纳米Ag链质量分数为60%时,方阻为56 Ω/sq,低于共混法制备的填料质量分数为65%时的纳米Ag链/聚氨酯导电复合材料（98 Ω/sq）。      

Bulk thermal conductivity studies of Sn/SnO coated and filled multiwalled carbon nanotubes for thermal interface material

Multiwalled carbon nanotubes (MWCNTs) were successfully coated and filled with Sn using a simple method. Bulk thermal conductivity of Sn/SnO filled and coated multiwalled carbon nanotubes (MWCNTs) of ～1 mm thickness pellet by laser method reveals surge in hybrid carbon nanotubes in comparison to pristine nanotubes. The thermal diffusivity and thermal conductivity of hybrid nanotubes are increased to 4.41 mm²/sec, 5.39 Wm^?1K^?1 of as compared to 0.36 mm²/sec and 0.28 Wm^?1K^?1 of the pristine nanotubes. The enhancement in thermal conductivity is attributed to the presence of Sn coating on surface and inside the carbon nanotubes and the formation of compact structures by reducing the air gaps between nanotubes because of their joining during compression and sintering.     

NiFe2O4/Ag复合材料的制备及其耐蚀和导电性能

以Fe2O3、NiO和Ag2O为主要原料,采用固相烧结工艺制备了NiFe2O4/Ag复合材料,用X射线衍射和扫描电子显微镜对材料的组成和微观结构进行了研究,并测量了样品在冰晶石熔盐中的静态热腐蚀速率及其高温电导率.结果表明,复合材料由NiO、NiFe2O4尖晶石和Ag三相组成.随着Ag2O含量的增多,复合材料的致密化程度先增加而后降低,当Ag2O含量为6%时,试样的致密化程度最高.Ag2O的加入在不提高试样在冰晶石熔盐中的静态热腐蚀速率的前提下,提高了试样的高温电导率.     

Modeling of the thermal conductivity and thermomechanical behavior of diamond reinforced composites

Semi-analytical Mori-Tanaka methods and numerical models for studying the overall thermal conduction behavior of metal matrix composites reinforced by diamond particles are presented, special emphasis being put on the effects of finite interfacial conductances. Good agreement between the simulation approaches is obtained and the influence of particle shapes and homogeneous vs. inhomogeneous interfacial conductances on local and global responses is studied. Analogous methods are applied to modeling the elastic and thermoelastoplastic behavior of diamond reinforced metals.     

短切炭纤维-炭复合材料的制备及传导性能和微观结构的研究

以中间相沥青基短切炭纤维和中间相沥青为原料,采用模压成型、炭化、致密化、高温石墨化等一系列常规工艺,制备了传导性能良好的炭/炭复合材料.主要考察了中间相沥青与中间相沥青基炭纤维质量配比对材料密度及传导性能的影响,并进一步研究了材料微晶参数的变化与材料性能的相关性.结果表明中间相沥青与纤维质量配比对材料的导热、导电性能以及微晶参数有很大影响.随着中间相沥青用量的增大,材料导热、导电性能均提高,石墨层间距d002减小,石墨微晶尺寸La、Lc增大;当中间相沥青与炭纤维质量比为 0.8时,制备出的炭/炭复合材料石墨微晶尺寸最大,常温传导性能最佳(垂直于压制方向的面向热导率为385W/(m·K),电阻率为2.85μΩ·m);进一步提高中间相沥青用量,石墨微晶尺寸La、Lc减小,材料的传导性能降低.     

Experiments and modeling for thermal conductivity of graphite nanoplatelets/carbon composites

In this work, the graphite nanoplatelets/carbon composites were fabricated from graphite nanoplatelets and pitch powders by a hot-pressing technology followed by carbonization and graphitization. The XRD and pole figure results show that the incorporation of pitch induces the decrease of size (L_a) and orientation degree of graphitic crystallites, while the in-plane thermal conductivity of graphitized sample is increased with the increasing pitch content up to 6 wt.%, achieving a maximum value of 405 W/m K. The pitch binders are filled into the voids to bridge two or more graphite nanoplatelets particles together to form extra thermal paths, which makes a great contribution to the enhancement of thermal conductivity. A thermal conductivity model for the graphitized composites is constructed based on a bridging mechanism, and the predicted results fit well with the experimental results.     

Self-assemblies of linearly aligned diamond fillers in polysiloxane/diamond composite films with enhanced thermal conductivity

The relocation of diamond fillers was performed in polysiloxane-based composite films under different electric fields. The microscale diamond filler particles were dispersed by sonication in a prepolymer mixture of polysiloxane, followed by high-speed mixing. The homogeneous suspension was cast onto a polyamide spacer of microscale thickness and subjected to three different electric fields: AC, DC, and switched DC, before the mixture became cross-linked. Analysis revealed that self-assemblies of linearly aligned diamond fillers (LADFs) were fabricated in the composite film, connecting the film planes as bridges with different thicknesses depending on the applied electric field. Composites with assemblies of LADFs exhibited enhanced thermal conductivity and electrical insulation, and are attractive for application as thermal interface materials in the semiconductor industry.     

The influence of interface and thermal conductivity of filler on the nonisothermal crystallization kinetics of polypropylene/natural protein fiber composites

The nonisothermal crystallization kinetics of polypropylene/down feather fiber composites were investigated using a Differential Scanning Calorimeter at five different cooling rates. The Avrami and Liu models were able to satisfactorily describe the crystallization behavior of composites, which indicated the entirely unique mechanism. It was found that fiber/matrix interface and thermal conductivity of fiber had key roles for the crystallization behavior of composites and had a close relationship with the properties of the industrial product reinforced with natural protein fiber. The nucleation activity and activation energies were also calculated by different theoretical models and also proved the experimental results.