一种带高阶温度补偿的片内时钟振荡器设计

本文基于0.18μm CMOS工艺,设计了一款适用于片上系统SoC的无需晶振的片内12MHz时钟信号产生电路。利用高阶温度补偿方案,该时钟振荡器能在较宽的温度范围内实现振荡频率的高稳定性。此外,电路的稳压器设计使得振荡器频率在电源电压变化时也能保持相当好的稳定性。仿真结果表明,在-40℃~125℃温度范围内,此振荡器振荡频率的温度系数仅为40ppm/℃,电源电压变化±10%时,振荡频率的相对误差仅为±0.012%,完全能够满足常规数字系统的要求。     

一种用于电子标签的低功耗高精度时钟电路设计

设计了一种适合射频电子标签的高精度时钟产生电路,在分析影响输出频率稳定性各因素的基础上,针对标签电路低功耗宽工作环境的要求,提出一种全CMOS结构带隙基准做偏置的电流受限型环形振荡器.全MOS自偏置PTAT迁移率和阈值电压互补偿带隙基准源的设计,使时钟电路受电源电压和温度的影响极小.全电路采用TSMC 0.18 μm CMOS工艺实现.HSpice仿真结果表明:电源电压为1.2～2 V,温度从-10～ 70 ℃变化时,带隙基准温度系数和电源电压抑制比分别为12 ppm/℃和59 dB,时钟稳定度在±2.5%以内,电路平均功耗仅为4 μw.     

LCD驱动控制时钟电路的设计

介绍了一种用于STN LCD（超扭曲液晶显示）驱动控制芯片的时钟产生电路。该电路能方便地实现片内时钟的精确产生,其特点为片内产生基准电压源。振荡频率在一定的范围内与电源电压无关,可满足移动通信的需要。该电路有一定的温度补偿功能,输出矩形波的占空比可调,并且设有数字开关,可以在需要的时候切断整个电路,使该模块的功耗降为零。     

一款用于LED驱动芯片的CMOS振荡器

研究一款适用于LED驱动芯片的CMOS振荡器电路.其工作原理是在环路振荡器中加入恒定电流源,以恒定电流对电容充电、MOS管对电容快速放电以产生锯齿波再经锁存器产生周期脉冲信号.与传统的环路振荡器相比,此电路的优点是振荡频率精确、波形稳定,振荡频率在一定的电源电压范围内对电源电压变化不敏感.此振荡器电路已经成功应用于一款LED驱动芯片中.     

一种用于流水线ADC的可调节多相时钟产生电路

设计了一种应用于10位80 MS/s流水线A/D转换器的可调节多相时钟产生电路.该电路采用一种电流镜结构,通过调节可变电阻的阻值来实现对单位延迟时间的精确控制.芯片采用IBM 0.13μm CMOS工艺实现,电源电压为2.5 V.在各种条件下仿真所得的最大延迟时间偏差为4%,时钟电路功耗为0.68 mW.仿真结果表明,该时钟产生电路适用于高速流水线A/D转换器.     

用于10M/100M以太网的NRZ数据时钟恢复电路

文中采用双环系统,基于改进的Hogge鉴相器,差分电荷泵,以及一个四级环形压控振荡器实现了一种全集成的CMOS时钟恢复电路,时钟恢复的频率为125 MHz,该电路最大程度上的减小了电荷注入、电荷分享等寄生效应的影响.增加一个偏置电路使各模块的工作电源电压降低到2.94 V.整个芯片的功耗降低10%.     

与工艺、电源电压和温度无关的低功耗振荡环设计

分析了传统片外时钟和片内时钟各自的特点和应用背景,在Chartered 0.35μm CMOS工艺下实现了一个低功耗PVT(工艺、电源电压、温度无关)振荡环,对片内时钟的稳定性和功耗进行改进。该振荡环无需精准的电压源,采用了误差补偿技术,通过偏置电压和延时单元的相互补偿,使得振荡频率对于工艺、温度和电源电压均有较大的容差能力。并且由于针对延时单元补偿的方式,令周期大小易于调整。蒙特卡罗仿真显示,工艺误差引起的偏差要比补偿前的偏差减小了60%。流片测试结果表明,在工作温度变化范围0~100°C时,振荡环输出的频率偏差为±3.22%;在电源电压变化范围为2.8~3.8 V时,振荡环输出的频率偏差为±3.36%;在电源电压3.3 V的情况下,整个芯片消耗的电流为950μA。     

一种超低功耗RC振荡器设计

基于SMIC 55 nm CMOS工艺,设计并制备了工作在1.2V电源电压下的超低功耗RC振荡器.该振荡器主要包括运算放大器、压控振荡器(VCO)、基准电流源、低温漂电阻和可修调开关电容以及非交叠时钟产生电路.该振荡器用工作在亚阈值区的运算放大器和VCO取代了传统单比较器型RC振荡器中的比较器,显著降低了功耗;用开关电容取代了充放电电容,并且将输出时钟的频率转换成了阻抗,与参考电阻进行比较.利用负反馈环路锁定了输出时钟信号频率,从而得到了稳定的时钟信号.测试结果表明,1.2V电源电压、27℃环境下,该RC振荡器的输出时钟信号频率为32.63 kHz,功耗为65 nW;在-10 ～ 100℃,其温度系数为1.95×10-4/℃;在0.7～1.8 V电源电压内,其电源电压调整率为3.2％/V.芯片面积为0.168 mm2.     

一种高精度高稳定性的片内振荡电路设计

作为系统时钟源,振荡电路的频率特性会影响芯片工作性能。为提高片内振荡器输出时钟的精度及稳定性,设计一种基于RC结构的振荡电路。该振荡电路采用带隙基准产生电容充电电流及基准电压,通过调整镜像管比例进行频率粗调校正,通过调整基准电压大小和温度系数以实现频率细调校正及温度特性校正。电路基于55 nm CMOS工艺设计实现,仿真结果表明,典型条件下电路工作输出为30 MHz,50%占空比时钟,在1.6～5.5 V、-40～125℃工作范围内,振荡频率偏移位0.6%以内,中心校准精度为0.5%,可作为片内高精度时钟源或参考时钟。     

宽电源范围的高精度振荡器设计技术研究

为解决CMOS振荡器频率稳定性差的问题,提出一种基于阈值电压的高精度宽电源范围振荡器电路结构。利用与电源无关的恒流源和MOS管开通关断对电容进行充放电,产生占空比50%的时钟信号,设计熔丝电阻控制可修调电流镜电路实现工艺修调。基于0.25μm BCD工艺,对提出的方法进行了具体电路设计与物理实现验证,结果表明：在电源电压3 V典型情况下,时钟信号中心频率为36.5 kHz,工艺修调范围为54.14%～219.18%,修调精度为-0.82%～+2.53%。电源电压2～4 V变化范围内,频率变化系数为0.97%/V;电源电压1.8～5.8 V变化范围内,频率变化系数为2.47%/V;电源电压在1.8～12 V范围内,频率变化系数为1%/V,具有较宽的电源适应特性。     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Development of the readout system for waveguide multilayer optical card

Waveguide multilayer optical card （WMOC） is a novel storage device of three-dimensional optical information. An advanced readout system fitting for the WMOC is introduced in this paper. The hardware mainly consists of the light source for reading, WMOC, motorized stages addressing unit, microscope imaging unit, CCD detecting unit and PC controlling ＆ processing unit. The movement of the precision motorized stage is controlled by the computer through Visual Basic （VB） language in software. A control panel is also designed to get the layer address and the page address through which the position of the motorized stages can be changed. The WMOC readout system is easy to manage and the readout result is directly displayed on computer monitor.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

A method for calculating the center position of collimated light

It is a key problem to accurately calculate beam spots＇ center of measuring the warp by using a collimated laser. A new method, named double geometrical center method （DGCM）, is put forward for the first time. In this method, a plane wave perpendicularly irradiates an aperture stop, and a charge couple device （CCD） is employed to receive the diffraction-beam spots, then the geometrical centers of the fast and the second diffraction-beam spots are calculated respectively, and their mean value is regarded as the center of datum beam. In face of such adverse instances as laser intension distributing defectively, part of the image being saturated, this method can still work well. What＇s more, this method can detect whether an unacceptable error exits in the courses of image receiving, processing and calculating. The experimental results indicate the precision of this method is high.     

Collinear phase-matching study of terahertz-wave generation via difference frequency mixed in GaAs and Inp

The collinearly phase-matching condition of terahertz-wave generation via difference frequency mixed in GaAs and InP is theoretically studied. In collinear phase-matching, the optimum phase-matching wave hands of these two crystals are calculated. The optimum phase-matching wave bands in GaAs and lnP are 0.95-1.38μm and 0.7-0.96μm respectively. The influence of the wavelength choice of the pump wave on the coherent length in THz-wave tuning is also discussed. The influence of the temperature alteration on the phase-matching and the temperature tuning properties in GaAs crystal are calculated and analyzed. It can serve for the following experiments as a theoretical evidence and a reference as well.     

Effects of the alloy compositions on the phonon-polaritons in ternary mixed crystals

Composition dependence of bulk and surface phonon-polaritons in ternary mixed crystals are studied in the framework of the modified random-element-isodisplacement model and the Bom-Huang approximation. The numerical results for Several Ⅱ - Ⅵ and Ⅲ- Ⅴ compound systems are performed, and the polariton frequencies as functions of the compositions for ternary mixed crystals AlxGa1-xAs, GaPxAS1-x, ZnSxSe1-x, GaAsxSb1-x, GaxIn1-xP, and ZnxCd1-xS as examples are given and discussed. The results show that the dependence of the energies of two branches of bulk phonon-polaritons which have phonon-like characteristics, and surface phonon-polaritons on the compositions of ternary mixed crystals are nonlinear and different from those of the corresponding binary systems.