Hopping conduction and its photoquenching in molecular beam epitaxial GaAs grown at low temperatures

As the growth temperature of molecular beam epitaxial GaAs is increased from 250 to 400°C, the dominant conduction changes from hopping conduction to band conduction with a donor activation energy of 0.65 eV. A 300°C grown layer is especially interesting because each conduction mechanism is dominant in a particular temperature range, hopping below 300K and band conduction above. Below 140K, the hopping conduction is greatly diminished (quenched) by irradiation with either infrared (hv≤1.12 eV) or 1.46 eV light, but then recovers above 140K with exactly the same thermal kinetics as are found for the famous EL2. Thus, the 0.65 eV donor, which is responsible for both the hopping and band conduction, is very similar to EL2, but not identical because of the different activation energy (0.65 eV vs 0.75 eV for EL2).     

A chromium-free etchant for delineation of defects in heavily doped n-type silicon wafers

Delineation of defects in the heavily doped n-type Czochralski silicon wafers by preferential etching is an issue not having been essentially solved. Herein, a chromium-free etchant based on HNO₃–HF–H₂O system, with an optimum volume ratio of V_HNO3%:V_HF%:V_H2O%=20%:45%:35%, has been developed. It can reveal well the defects such as dislocation and oxygen precipitation-induced bulk microdefects (BMDs) in the heavily doped n-type silicon wafers with resistivities even lower than 1 mΩ cm. Moreover, this etchant is appropriate to delineate the defects on (1 1 1), (1 1 0) or (1 0 0) surface of silicon crystal. Furthermore, the density of oxygen precipitation-induced BMDs in the heavily doped n-type silicon wafers derived from the preferential etching using this newly developed etchant correlates well with that derived from scanning infrared microscopy (SIRM) within its detection limit.     

Effects of tail states on the conduction mechanisms in silicon carbide thin films with high carbon content

Hydrogenated amorphous silicon carbide (a-SiC_x:H) films of different carbon content (x) were deposited by radio frequency plasma enhanced chemical vapor deposition (PECVD) system. Apart from the X-ray photoelectron spectroscopy (XPS) and UV-Visible transmission analyses, the resistivity measurements between 293 K and 450 K were emphasized to assess the eventual transport mechanisms. The film resistivities are unexpectedly found relatively low, especially for high carbon content. In the frame of exclusive band conduction, the apparent thermal activation energies, evaluated from Arrhenius type plot remain too low compared to half values of the optical gaps.Numerical analyses were undertaken by extending conduction from the band conduction about the mobility edge inside the band gap by including the nearest neighbor hopping (NNH) conduction across the localized tail states. By successfully fitting the formulated conductivity expression to the experimental results, parameters such as tail states distributions, true activation energies to the mobility edge have been retrieved.     

Electronic properties of boron in p-type bulk 6H-SiC

The electronic properties of boron in bulk 6H-SiC have been studied by temperature dependent Hall effect, thermal admittance spectroscopy, and optical absorption. A single acceptor level located between 0.27 and 0.35 eV above the valence band is associated with boron on a silicon lattice site. The deep nature of this acceptor level prevents complete thermal activation of the level at room temperature and thus carrier concentration measurements at this temperature will not give the total boron concentration. A spread in the measured activation energy for boron is reported. Measurement of optical absorption is suggested as a nondestructive measure of boron concentration. No evidence for the D-center was observed in this material.     

碳化硅薄膜及压阻效应研究

研究了SiC薄膜的制备及其压阻特性。利用热丝化学气相沉积(HFCVD)法在硅(111)晶面制备SiC薄膜,对制备的薄膜进行X射线衍射分析和其它测试。结果表明:SiC薄膜晶向取向一致,薄膜生长速率为3 m / h,厚度约为5 m。同时,利用高阻仪研究该薄膜的压阻特性,测得应变量()在(2~6)×104范围内,电阻的相对变化量(ΔR·R1)和压阻灵敏度因子(k)随应变量()的变化曲线。结果表明该薄膜有明显的压阻效应。     

Formation of heavily doped n-type layers in GaAs by multiple ion implantation

N-type layers in GaAs with high free electron concentrations have been produced by multiple implantation of Ga, As, or P with dopant species such as Se, Si, or Ge. The implants that have been investigated include Si, Si + P, Ge, Ge + As, Se, and Se + Ga. The multiple implants Si + P, Ge + As, and Se + Ga gave higher peak carrier concentrations, especially at lower anneal temperatures, than did the respective single implants Si, Ge, and Se. In fact, Ge when implanted alone produced a p-type layer while the Ge + As multiple implant produced an n-type layer. Multiple implants with Si and Ge as dopants showed significant thermal diffusion during the anneal. Multiple implants of Ga with Se, on the other hand, resulted in reduced thermal diffusion in comparison with single Se implants.     

Microtrenching effect of SiC ICP etching in SF6/O2 plasma

Inductively coupled plasma (ICP) etching of single crystal 6H-silicon carbide (SIC) is investigated using oxygen (O2)-added sulfur hexafluoride (SF6) plasmas. The relations between the microtrenching effect and ICP coil power, the composition of the etch gases and different bias voltages are discussed. Experimental results show that the microtrench is caused by the formation of a SiFxOy layer, which has a greater tendency to charge than SiC, after the addition of O2. The microtrenching effect tends to increase as the ICP coil power and bias voltage increase. In addition, the angular distribution of the incident ions and radicals also affects the shape of the microtrench.     

SF6/O2气氛中SiC ICP刻蚀的微沟槽效应

本文采用SF6 + O2作为刻蚀气体,对单晶6H-SiC 材料的感应耦合等离子体( ICP) 刻蚀工艺进行了研究。着重分析了ICP 功率、偏置电压、气体混合比等工艺参数对微沟槽效应的影响。结果表明,O2的加入对于微沟槽的形成起到了极其重要的作用,微沟槽是加入氧气后形成的SiFxOy中间层的充电造成的。ICP功率与偏置电压的增大会增强微沟槽效应,进一步促进微沟槽的形成,另外入射离子的角度分布也会影响微沟槽的形成.     

SiC 器件在雷达电源中的应用

现代雷达的发展迫切需要电源提升功率密度和效率。基于第三代半导体碳化硅(SiC)材料的功率器件在耐压等级、高频工作、高温性能等方面有较大优势。文中详细阐述了SiC 器件的特性和各类型SiC 功率器件的发展现状,分析了SiC功率器件在雷达电源中的应用方向,并基于SiC 金属氧化物半导体场效应晶体管(MOSFET)设计了阵面电源样机,完成了高开关频率性能测试。实验结果表明:SiC MOSFET 的高频工作能降低系统损耗,并提升电源功率密度。     

SiG高温氧化的研究

热氧化是碳化硅晶片工艺中一种常用的工艺,但基于硅工艺的氧化温度一般都相对较低,此温度下,碳化硅氧化缓慢,在很多情况下很难满足工艺需求.利用新设计的高温氧化设备对碳化硅晶片进行不同温度下的氧化实验.实验结果显示,高温下,碳化硅氧化速度加快,温度的增加对氧化速度影响极大,以1 200℃时的氧化速率为基准,1 250℃时的氧化速率是1 200℃时的1.5倍;1 300℃下的氧化速率能达到1 200℃的2倍;而在1 350 ℃时,氧化速度已经将近1 200 ℃时的3倍.     

硅片线锯砂浆中硅粉与碳化硅粉的泡沫浮选分离回收

以对碳化硅表面有选择性的脂肪酸作为捕收剂,采用泡沫浮选分离方法来分离回收硅片线锯砂浆中的和碳化硅粉。研究了捕收剂浓度、起泡剂浓度、浮选溶液的温度及pH值对分离效果的影响。当浮选溶液中捕收浓度为0.315mol/L,起泡剂浓度为0.18mol/L,温度为70℃,pH值为4.5时,分离效果最佳:浮起产物中碳化粉质量分数为99.3%,沉淀产物中硅粉质量分数为95.9%。     

Electrical transport in n-type ZnMgSSe grown by molecular beam epitaxy on GaAs

Significant progress in improving the performance of blue-green II-VI semiconductor injection lasers has come about from advances in the epitaxial growth and doping of ZnMgSSe on GaAs substrates. This paper investigates electrical transport and its relation to structural quality in n-type Zn_1-yMg_y S_xSe_1-x epilayers doped with Cl, grown by molecular beam epitaxy. The composition parameters x and y vary from about 0.12-0.18 and 0.08-0.15, respectively. The quaternary epilayers studied are lattice-matched (or nearly so) to the GaAs substrate. Temperature-dependent Hall-effect measurements are performed on seven n-type ZnMgSSe:Cl epilayers, and a technique is presented whereby the resulting mobility-vs-temperature data is compared with data for ZnSe to obtain a structural figure of merit that is useful in characterizing the quaternary epilayer.     

Electrical conduction in implanted polycrystalline silicon

Undoped polycrystalline silicon (poly-Si) films, 0.5 μm thick, have been prepared at 700‡C by chemical vapor deposition (CVD) onto thermally oxidized n⁺-Si substrates. The impurity concentration was varied by implanting with As, P, and Sb ions, accelerated to 30 keV; total doses ranged from 2×10¹¹ to 3×10¹⁵ ions/cm². Sheet resistance measurements, spanning 8 orders of magnitude, were made as a function of implantation dose. A reduction of 6 orders of magntiude in poly-Si sheet resistance took place within the implantation dose range between 10¹² and 10¹⁴ ions/cm². Some samples also exhibited large reductions in sheet resistance following the standard heat treatment for Al contact sintering and surface state reduction, which is normally at 450‡C for 0.5 hr in H₂. Sheet resistance measurements were also made as a function of temperature in the range 0 to 315‡C. The effective activation energy for electrical conduction depends upon implantation dose. At low doses (2×10¹¹cm₋₂) the poly-Si is intrinsic, withE _A = 0.65 eV. At a dose of 10¹⁵ cm⁻², electrical conduction is a weak function of temperature, withE _A = 0.027 eV.     

SiC中基态施主能级分裂对杂质电离的影响

对SiC中基态施主能级分裂对杂质电离的影响,与温度、掺杂浓度和杂质能级深度的关系进行了系统研究.发现只有在高温且掺杂浓度低的情况下,能级分裂的影响很小可忽略不计,其他条件下均需考虑能级分裂因素.随掺杂浓度的增加,能级分裂的影响增强;随温度的升高,能级分裂影响的整体趋势下降,但存在峰值.当杂质能级深度发生变化时,能级分裂的影响显得比较复杂;曲线上的峰值随着能级深度的增加而向高温方向移动,能级越浅峰就越小;并且在高于某一温度时,随能级的加深能级分裂的影响逐渐增强.     

Monolithic Si nanocrystal/crystalline Si tandem cells involving Si nanocrystals in SiC

Monolithic tandem cells involving a top cell with Si nanocrystals embedded in SiC (Si NC/SiC) and a c‐Si bottom cell have been prepared. Scanning electron microscopy shows that the intended cell architecture is achieved and that it survives the 1100 °C anneal required to form Si NCs. The cells exhibit mean open‐circuit voltages V_oc of 900–950 mV, demonstrating tandem cell functionality, with ≤580 mV arising from the c‐Si bottom cell and ≥320 mV arising from the Si NC/SiC top cell. The cells are successfully connected using a SiC/Si tunnelling recombination junction that results in very little voltage loss. The short‐circuit current densities j_sc are, at 0.8–0.9 mAcm⁻², rather low and found to be limited by current collection in the top cell. However, equivalent circuit simulations demonstrate that in current‐mismatched tandem cells such as the ones studied here, higher j_sc, when accompanied by decreased V_oc, can arise from shunts or breakdown in the limiting cell rather than improved current collection from the limiting cell. This indicates that V_oc is a better optimisation parameter than j_sc for tandem cells where the limiting cell exhibits poor junction characteristics. The high‐temperature‐stable cell architecture developed in this work, coupled with simulations highlighting potential pitfalls in tandem cell analysis, provides a suitable route for optimisation of Si NC layers for photovoltaics on a tandem cell device level. Copyright © 2016 John Wiley & Sons, Ltd.     

掺杂硅微通道板的帕尔贴效应

The Seebeck coefficient is determined from silicon microchannel plates (Si MCPs) prepared by photo-assisted electrochemical etching at room temperature (25 ℃). The coefficient of the sample with a pore size of 5 × 5 μm², spacing of 1 μm and thickness of about 150 μm is -852 μV/K along the edge of the square pore. After doping with boron and phosphorus, the Seebeck coefficient diminishes to 256 μV/K and -117 μV/K along the edge of the square pore, whereas the electrical resistivity values are 7.5 × 10^-3 Ω·cm and 1.9 × 10^-3 Ω·cm, respectively. Our data imply that the Seebeck coefficient of the Si MCPs is related to the electrical resistivity and is consistent with that of bulk silicon. Based on the boron and phosphorus doped samples, a simple device is fabricated to connect the two type Si MCPs to evaluate the Peltier effect. When a proper current passes through the device, the Peltier effect is evidently observed. Based on the experimental data and the theoretical calculation, the estimated intrinsic figure of merit ZT of the unicouple device and thermal conductivity of the Si MCPs are 0.007 and 50 W/(m·K), respectively.     

立方相SiC MEMS器件研究进展

主要介绍了近年来国内外出现的有市场推广潜力的立方相碳化硅(3C-SiC)MEMS器件,详细描述了其中一些典型器件的基本结构、加工工艺及初步测试结果,并指出了要想提高器件的可靠性,需要获得低残余应力、低应力梯度的薄膜材料,应当采用合适的刻蚀方法,还需保证金属与碳化硅欧姆接触的稳定性,同时高温引线键合与封装工艺亦不能忽视。随着材料生长和加工成本的不断降低,3C-SiC基MEMS器件将会逐步走向商品化。     

S波段连续波输出功率20W的SiC MESFET

采用自主开发的SiC外延材料和工艺技术,相继实现了S波段连续波状态下输出功率瓦级和10 W的SiC MESFET。经过版图设计的改进和工艺条件的优化,取得了S波段连续波状态下输出功率大于20 W,功率增益大于12 dB,功率附加效率大于30%的SiC MESFET研制结果。器件的功率增益和输出功率较以往的研制结果均得到显著提高,器件的反向截止泄漏电流也大幅度降低。由于器件未采用内匹配结构,其体积也比一般内匹配器件的体积小。研制结果为多胞合成实现更大功率输出的器件创造了条件,也使S波段连续波大功率输出器件的研制水平上了一个新的台阶。     

Peltier effect in doped silicon microchannel plates

The Seebeck coefficient is determined from silicon microchannel plates（Si MCPs） prepared by photoassisted electrochemical etching at room temperature（25℃）.The coefficient of the sample with a pore size of 5×5μm²,spacing of 1μm and thickness of about 150μm is -852μV/K.along the edge of the square pore.After doping with boron and phosphorus,the Seebeck coefficient diminishes to 256μV/K and -117μV/K along the edge of the square pore,whereas the electrical resistivity values are 7.5×10^-3Ω·cm and 1.9×10^-3Ω·cm,respectively. Our data imply that the Seebeck coefficient of the Si MCPs is related to the electrical resistivity and is consistent with that of bulk silicon.Based on the boron and phosphorus doped samples,a simple device is fabricated to connect the two type Si MCPs to evaluate the Peltier effect.When a proper current passes through the device,the Peltier effect is evidently observed.Based on the experimental data and the theoretical calculation,the estimated intrinsic figure of merit ZT of the unicouple device and thermal conductivity of the Si MCPs are 0.007 and 50 W/（m·K）, respectively.     

Band gap tuning and p to n-type transition in Mn-doped CuO nanostructured thin films

Here we discuss the synthesis of copper(II)oxide(CuO)and manganese(Mn)-doped CuO thin films varying with 0 to 8 at%Mn using the spray pyrolysis technique.As-deposited film surfaces comprised of agglomerated spherical nanoparticles and a semi-spongy porous structure for 4 at%Mn doping.Energy dispersive analysis of X-rays confirmed the chemical composi-tion of the films.X-ray diffraction spectra showed a polycrystalline monoclinic structure with the predominance of the(11)peak.Optical band gap energy for direct and indirect transitions was estimated in the ranges from 2.67-2.90 eV and 0.11-1.73 eV,respectively.Refractive index and static dielectric constants were computed from the optical spectra.Electrical resistivity of CuO and Mn-doped CuO(Mn:CuO)thin films was found in the range from 10.5 to 28.6Ω·cm.The tiniest electron effective mass was calculated for 4 at%Mn:CuO thin films.P to n-type transition was observed for 4 at%Mn doping in CuO films.Carrier con-centration and mobility were found in the orders of 10¹⁷cm^-3and 10^-1cm²/(V·s),respectively.The Hall coefficient was found to be between 9.9 and 29.8 cm³/C.The above results suggest the suitability of Mn:CuO thin films in optoelectronic applications.