耐高温单组分环氧胶粘剂的制备

以3,3’-二氨基-4,4’-二羟基联苯（DADHBP）、2,2-双[4-（4-氨基苯氧基）苯基】丙烷（BAPOPP）、3,3’,4,4’-四羧基二苯醚二酐（ODPA）为主原料合成了合酚羟基的聚酰亚胺树脂（HPI）;以HPI为耐高温增韧剂,与N,N,N’,N’-四缩水甘油基-4,4’-二氨基二苯甲烷（TGDDM）、固化剂等配制了综合性能优异的耐高温单组分环氧胶粘剂。     

以BAPP为原料的热塑性PI薄膜的合成及性能

以芳香长链二胺2,2-双[4-(4-氨基苯氧基)苯基]丙烷(BAPP)为二胺原料,与最具商业价值的四种酸酐均苯四甲酸二酐(PMDA)、3,3′,4,4′-联苯四酸二酐(BPDA)、3,3′,4,4′-二苯酮四酸二酐(BTDA)、3,3′,4．4′-二苯醚四酸二酐(ODPA)为二酸酐原料,采用二步溶液缩聚法制得了一系列均聚和共聚聚酰亚胺薄膜。利用FTIR表征了聚酰亚胺的结构,并用DSC、TOA、TMA DMA等手段测得了不同聚酰亚胺的Tg、5%与10%热失重温度、线膨胀系数、拉伸强度、断裂延伸率、热压粘接T型剥离强度等性能数据。     

二层法双面挠性覆铜板用热塑性聚酰亚胺的合成与应用研究

选用合适的单体芳香二酐二苯甲酮四酸二酐（BTDA）、2,2’-双[4-（3,4-二羧基苯氧基）苯基]丙烷四羧酸二酐（BPADA）和芳香二胺3,3′,5,5′-四甲基-4,4′-二氨基二苯甲烷（AMD）、4,4′-二氨基二苯甲烷（MDA）、4,4′-二氨基二苯醚（ODA）,3,4＇-二氨基二苯醚（3,4＇-ODA）根据不同配比反应得到聚酰胺酸,用乙酸酐／三乙胺经化学亚胺化得到热塑性聚酰亚胺（TPI）,将其用N-甲基吡咯烷酮（NMP）溶解配成一定固含量的胶液,涂覆铜箔烘干溶剂得到二层挠性覆铜板（2L—FCCL）,然后将2L—FCCL高温压合制备双面挠性覆铜板,其剥离强度较高。     

3,3’,4,4’-二苯甲酮四甲酸二酐制备和提纯的研究进展

综述了3,3’,4,4’-二苯甲酮四甲酸二酐的应用及其制备和提纯的方法。第一种是硝酸法,用邻二甲苯和乙醛作原料,硫酸作催化剂在较低温度下进行缩合反应合成3,3’,4,4’-四甲基二苯乙烷,采用硝酸分2步对其进行氧化得到3,3’,4,4’-二苯甲酮四羧酸（简称酮酸）;第二种是采用液相空气氧化法制备酮酸。同时还分别介绍了提纯酮酸及酮酐的方法（1）醋酐法;（2）丙酮重结晶法;（3）硅胶吸附法;（4）乙醇洗涤法;（5）乙醚洗涤法;（6）升华法。     

3,3’,4,4’-联苯四甲酸二酐的合成

介绍了各种3,3’,4,4’-联苯四甲酸二酐的合成路线,包括4-氯(溴)-邻苯二甲酸(酐、酯、盐)的脱卤偶联法、邻苯二甲酸二甲酯的氧化偶联法、对苯二甲酰氯偶联法及其工艺特点,详细阐述了由钯催化对苯二甲酰氯与二硅烷直接一步反应制得3,3’,4.4’-联苯四甲酸二酐的方法,以及1,2-二氯四甲基二硅烷的主要制备方法,其中1,2-二氯四甲基二硅烷是合成3,3’,4,4’-联苯四甲酸二酐的重要试剂。     

3,3＇4,4＇-二苯甲酮四酸二酐的合成及应用研究

综述了2种合成3,3’,4,4’-二苯甲酮四酸二酐的方法,即由邻二甲苯与甲醛经缩合后,用高锰酸钾氧化,再脱水得3,3’,4,4＇-二苯甲酮四酸二酐;第2种方法是用邻二甲苯与乙醛缩合,再分别用稀硝酸和浓硝酸分2步进行氧化,最后再高温脱水,从而得到较前一种方法产率更高的3,3’,4,4’-二苯甲酮四酸二酐。同时还介绍了3,3’,4,4’-二苯甲酮四酸二酐作为一种具有特殊结构的单体在合成一类具有特殊结构及性能的高分子材料中的应用。比如可以用来合成聚酰亚胺材料及光敏聚酰亚胺光刻胶。     

含烷基取代基柔性聚酰亚胺薄膜的制备

以柔性二胺单体1,3-双(4-氨基苯氧基)苯(134BAPB)和含支链二胺单体3,3′-二乙基-4,4′-二氨基二苯甲烷(DEMMD)与3,3′,4,4′-二苯酮四酸二酐(BTDA)进行三元共聚,制备了一系列聚酰亚胺(PI)薄膜。通过傅里叶红外光谱、差示扫描量热仪、热重分析仪、热机械分析仪及电子万能材料试验机对材料的结构、热性能和力学性能进行了表征。结果表明PI薄膜已经成功制备,热性能与力学性能良好。     

聚硫醚酰亚胺树脂的合成及改性环氧胶粘剂的研制

利用4,4’-二羟基二苯硫醚（44DHDPS）、碳酸钾和4-氯硝基苯（4CNB）,在N,N-二甲基甲酰胺和甲苯的混合溶剂中回流反应,合成得到了4,4’-双（4-硝基苯氧基）二苯硫醚（DNDPS）：随后,在钯／炭和水合肼体系中还原得到4,4’-双（4-氨基苯氧基）二苯硫醚（DADPS）,并与2,2-双（4-（3,4-二羧基苯氧基）苯基1丙烷二酐（BPADA）进行聚合反应,脱水亚胺化,得到聚硫醚酰亚胺（PTEI）树脂。采用聚硫醚酰亚胺树脂对环氧胶粘剂进行改性,效果良好。     

含氟聚吡啶酰亚胺的合成及性能研究

以4-(4-三氟甲基苯基)-2,6-双[3-(4-胺基苯氧基)苯基]吡啶(m,p-3FPAPP)作为二胺单体,3,3’,4,4’-二苯醚四甲酸二酐(ODPA)和2,2-双[4-(3,4-二羧基苯氧基)苯基]丙烷二酐(BPADA)作为二酐单体,通过两步法成功的制备了3种含氟聚吡啶酰亚胺。利用FTIR、XRD、TGA、DSC、UV-vis以及溶解性测试对其结构和性能进行了表征。结果表明,所得聚合物都具有优异的溶解性能,玻璃化转变温度为234～259.3℃,5%失重温度为526.5～558.2℃,800℃下质量保持率为63.6%～64.7%,且聚酰亚胺膜在400～800 nm的可见光区间有很好的透过性能。     

燃料电池用磺化聚酰亚胺质子交换膜的合成及性能

制备的磺化二胺单体4,4′-二(4-氨基苯氧基)联苯-3,3′-二磺酸(BAPBDS)、2,2′-双(4-磺酸基苯氧基)对二氨基联苯(2,2-′BSPOB)、1,4-双(4-氨基苯氧基)苯(BAPB)或者1,3-双(4-氨基苯氧基)苯(BAPBz)与1,4,5,8-萘四甲酸二酐(NTDA)进行缩合聚合反应生成磺化聚酰亚胺。以间甲酚为溶剂,通过溶液浇铸法成膜,研究了聚合物膜的吸水率、尺寸变化、机械性能和质子电导率。结果表明,该类磺化聚酰亚胺膜具有良好的综合性能。     

侧链含硫的联苯四酸二酐及其聚酰亚胺的合成

以3,3′,4,4′-联苯四酸二酐(BPDA)为原料合成了2,2′-苯硫醚-4,4′,5,5′-联苯四酸二酐,然后分别与对苯二胺和4,4′-二胺基二苯醚通过高温缩聚法制备出两种侧链含硫的新型聚酰亚胺(PI)(PI-1和PI-2).与文献报道的直接由BPDA为二酐制备的PI相比,PI-1和PI-2均表现出良好的有机可溶性...     

New kinds of phenylethynyl-terminated polyimide oligomers with low viscosity and good hydrolytic stability

In continuing studies to develop low melt viscosity phenylethynyl end-capped imide oligomers for aerospace applications, new kinds of all-aromatic phenylethynyl-terminated imide oligomers were prepared by the reaction of 3,3′,4,4′-benzophenonetetracarboxylic dianhydride (BTDA) or biphenylenetetracarboxylic dianhydride (s-BPDA) with 2,5-bis(4-aminophenoxy)-biphenyl (p-TPEQ) and 4-phenylethynylphthalic anhydride (PEPA) or 4-(1-phenylethynyl)1,8-naphthalic anhydride (PENA). The oligomers bearing pendant phenyl groups exhibit much lower melt viscosities at low temperatures, and thus provide wide processing window. The thermal curing process of the oligomers was investigated with DSC. The tensile and thermal properties of the cured films were evaluated. Oligomers derived from PENA cured at lower temperatures and the corresponding cured polymers show better hydrolytic stability than those of PEPA. Results showed that the utilization of diamine monomer (p-TPEQ) can improve the processability and solubility of phenylethynyl-terminated imide oligomers without sacrificing their thermo-oxidative stability.     

一种三元共聚型聚酰亚胺的制备与表征

以3,3'-二甲基-4,4'-二氨基二苯甲烷、1,3-双(4-氨基苯氧基)苯(1,3-APB)与3,3',4,4'-二苯醚四羧酸二酐(ODPA)进行缩聚反应,制得一种新型的三元共缩聚型聚酰亚胺。将此聚合物与两种二元共缩聚型聚酰亚胺的性能进行对此,发现三元共聚型聚酰亚胺的溶解性能、力学性能和热性能皆较好,且使用范围扩大。     

Imide oligomers having internal acetylene units in the backbone

Imide oligomers having internal acetylene groups in the backbone were prepared utilizing bis(3-aminophenyl)acetylene as an internal acetylene source. 2,2′-Bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA), pyromellitic dianhydride (PMDA), 3,3′,4,4′-benzophenontetracarboxylic dianhydride (BTDA), and 3,3′,4,4′-biphenyltetracarboxylic dianhydride (BPDA) were used as acid dianhydride monomers. Amine-terminated oligomers with average degree of polymerization (DP) of 3, 5, and I 1 were prepared by controlling the ratio of monomers, and were end-capped with phthalic anhydride. Anhydride-terminated oligomers were similarly prepared and were end-capped with aniline. Imidization was conducted by refluxing in toluene. The DSC of the oligoimides containing internal acetylene units showed exotherm due to the crosslinking reaction of acetylene units. Onset temperature of the exotherm was 300–370°C, depending on the chemical structure and DP of oligoimide. By the thermal cure at high temperatures, the amount of exotherm decreased and exotherm shifted to higher temperature. Melt-processing of the oligoimides was carried out using a hydraulic press at 400°C. Melt-processed films were dark brown, opaque, and somewhat brittle. The films became less brittle with the increase of the DP of the oligomers. The films showed excellent thermal properties; T_g's were above 375°C, and their films maintained their mechanical properties aboveT_g.     

氯代苯酐制3,3′4,4′-二苯醚四甲酸二酐及设备

介绍了3,3',4,4'-二苯醚四甲酸二酐的合成方法,合成进展,精制方法、应用领域、发展前景以及当前在实验室和工业化中面临的问题,影响醚酐生产的主要因素及解决办法,工业生产中所需设备的条件,并分析了各种方法的优缺点。强调采用氯代苯酐制醚酐的合成路线、真空升华的精制方法是工业生产醚酐的切实可行的方法。选用完全密闭式的可调速螺旋加料器加入碱金属碳酸盐,防止了水分的进入,在搅拌反应釜的搅拌桨上安装条形除沫器,以消除反应过程产生的泡沫,从而提出并解决了3,3',4,4'-二苯醚四甲酸二酐工业生产中遇到的问题。     

Synthesis of pyrrones based on the reduction and cyclization of their o-nitrosubstituted polyimides precursors

Pyrrones derived from 1,2,4,5-tetraaminobenzene and pyromellitic dianhydride or 3,3′,4,4′-benzophenonetetracarboxylic dianhydride were prepared by catalytic reduction and cyclization of the poly(o-nitro)imides, obtained by polycondensation of 1,3-dichloro-4,6-dinitrobenzene with the dipotassium salt of pyromellitic diimide or 3,3′,4,4′-benzophenonetetracarboxylic diimide. These polymers were characterized by slightly better thermal stability as compared with the polymers of the same structure obtained by conventional methods. The model compound for these polymers has been also synthesized by catalytic reduction and cyclization of 1,3-bis(phthalimido)-4,6-dinitrobenzene.     

含羟基聚酰亚胺改性环氧胶的制备及性能研究

将3,3'-二氨基-4,4'-二羟基联苯(DADHBP)、2,2-双(3-氨基-4-羟基苯基)六氟丙烷(BAH-PFP)和3,3',4,4'-四羧酸二苯醚二酐(ODPA)、3,3',4,4'-四羧酸二苯甲酮二酐(BTDA)单体聚合,再经亚胺化得到含羟基聚酰亚胺(HPI)粉末,采用傅里叶红外光谱对其进行了表征。由HPI、烯丙基双酚A、双马来酰亚胺、2-乙基-4-甲基咪唑与N,N,N',N'-四缩水甘油基-4,4'-二氨基二苯甲烷(TGDDM)共聚反应制得胶粘剂,并对胶粘剂的热性能、力学性能及吸水性进行了研究,结果表明:该胶拉伸剪切强度为21.1 MPa,固化后吸水率为0.49%。通过凝胶化时间法计算胶粘剂的表观活化能为64.5 kJ/mol。     

浅色耐高温抗静电涂料的制备及性能检测

以3,3＇,4,4＇-联苯四甲酸二酐、4,4＇-二氨基二苯醚、1,3-双（3-氨丙基）-1,1,3,3-四甲基二硅氧烷为原料,二甲基甲酰胺为溶剂制备了聚（酰胺-硅氧烷）共聚物,并以该硅氧烷改性聚酰胺为基本成膜物,以纳米ATO（掺锑二氧化锡）为导电粒子,并掺入耐高温TiO2和聚四氟乙烯微粉,同时加入超分散剂、溶剂等制备了浅色耐高温抗静电涂料。该涂料不仅具有良好的抗静电性能和耐高温性能,同时还具有很好的装饰性。     

Preparation and Properties of Cyano-Containing Polyimide Films Based on 2,6-Bis(4-aminophenoxy)- benzonitrile

Summary A series of cyano-containing polyimides were synthesized from 2,6-bis(4-amino- phenoxy)benzonitrile and some aromatic dianhydride monomers by solution polycondensation. The poly(amic acid) films could be obtained by solution-cast from N-methyl-2-pyrrolidinone solutions and thermally converted into tough polyimide films. Structure and physical properties of thin films of those polyimides were measured by FTIR, TGA, dynamic mechanical analysis and LCR hitester et al. Results showed that the polyimides prepared from 2,6-bis(4-aminophenoxy)- benzonitrile and 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride or 4,4’-(hexafluoropropylidene)diphthalic anhydride exhibited more excellent energy-damping characteristic and excellent solubility in NMP, DMF, DMAc, DMSO, THF and CHCl₃, whereas the polyimides from 2,6-bis(4-aminophenoxy)benzonitrile and 3,3’,4,4’-biphenyltetracarboxylic dianhydride or Pyromellitic dianhydride were insoluble in polar and nonpolar organic solvents. All polyimides indicated higher glass transition temperatures, excellent thermal stability and tensile properties. Incorporating a nitrile group into the polyimide backbone would enhance the dielectric constant of the polyimide films.