Thermal properties of MoSi2 and SiC whisker-reinforced MoSi2

The heat capacity, thermal conductivity and coefficient of thermal expansion of MoSi₂ and 18 vol % SiC whisker-reinforced MoSi₂ were investigated as a function of temperature. The materials were prepared by hot isostatic pressing between 1650 and 1700 °C, the hold time at temperature being 4 h. The heat capacity of MoSi₂ showed an increase from about 0.44 Wsg^–11K^–1 at room temperature to 0.53 at 700 °C. Whisker reinforcement increased heat capacity by about 10%. Thermal conductivity exhibited a decreasing trend from 0.63 Wcm^–1 K^–1 at room temperature to 0.28 Wem^–1 K^–1 at 1400°C. Whiskers reduced conductivity by about 10%. The thermal expansion coefficient increased from 7.42 °C^–1 between room temperature and 200 °C to 9.13 °C^–1 between room temperature and 1200 °C. There was a 10% decrease resulting from the whiskers. The measured data are compared with literature values. The trends in the data and their potential implications for high-temperature aerospace applications of MoSi₂ are discussed.     

Thermal and dielectric properties of zirconyl phosphate compact

Experimental results are presented on the measurements of thermal expansion (up to 1500°C), thermal conductivity (up to 1000°C), dielectric constant (up to 450 °C) and tan (up to 800 °C) of zirconyl phosphate compacts obtained by sintering at 1600°C. The thermal expansion coefficient of the samples at the temperature below 1100°C was less than 1.7 × 10^–6°C^–1. The samples showed a definite shrinkage at temperatures of 1110 and 1470°C due to the phase transformations. The expansion at 1500°C was less than that at 1100°C probably because of the phase transformation. The thermal conductivity at room temperature was a very small value (0.0046 to 0.0065 cal s^–1 cm°C^–1 cm^–2). The dielectric constant was close to 9. The value of tan° (–0.0001) measured is one of the lowest values for ceramic materials.     

The structural degradation and lamellar to rod transition in the Bi-Cd eutectic during unidirectional growth

The Bi-Cd eutectic system is a prototype quasi-regular eutectic in which the bismuth-rich phase has a volume fraction of 57%. It shows a high degree of regularity but, clearly, is not a normal (regular) eutectic. Microstructural observations of unidirectionally-grown specimens show that the minor cadmium-rich phase degrades at small temperature gradients and small growth rates. However, the structural refinement resulting from rapid freezing or chemical addition is found to be analogous to that of the F/NF eutectics. A lamellar rod transition has been achieved at intermediate growth rates by adding 2.0 wt % Sn as a modifier to the eutectic alloy. However, this was accompanied by the bismuth phase showing cellular facets of the solid-liquid interface.Nomenclature G _L temperature gradient in the melt ahead of the solid/liquid interface (° C cm^–1) - G _S temperature gradient in the solid behind the solid-liquid interface (° C cm^–1) - R growth rate of solid (cm sec^–1) - S cooling rate (° C sec^–1, ° C h^–1) - K _S thermal conductivity in the solid (W m^–1 K^–1) - K _L thermal conductivity in the melt (W m^–1 K^–1) - L latent heat of fusion (J mol^–1) - T temperature difference, undercooling (° C) - K ₁ constant in Equation 2 - K ₂ constant in Equation 3 - D diffusion coefficient of solute in solid (m² sec^–1) - C solubility in solid (wt %, at %) - M molecular weight (g mol^–1) - density (g cm^–3) - interfacial energy, surface tension (J mm^–2) - R gas constant, 8.314J mol^–1 K^–1 - r radius of curvature (m) - T temperature (K) - t time (sec) - F faceted - NF non-faceted     

High thermal expansion KAlSiO4 ceramic

Orthorhombic kalsilite (KAlSiO₄) was prepared by solid-state reaction from K₂CO₃, Al₂O₃, and SiO₂. The axial thermal expansion coefficients of the orthorhombic kalsilite were 1.6×10^–5°C^–1 for the a-axis, 1.6×10^–5°C^–1 for the b-axis, 2.8×10^–5°C^–1 for the c-axis, and 2.0×10^–5°C^–1 for the average from room temperature to 1000°C. A high thermal expansion ceramic consisting of the orthorhombic kalsilite was prepared by sintering. The densification was promoted by adding Li₂CO₃. The KAlSiO₄ ceramic sintered at 1200°C for 2 h with 5 wt% Li₂CO₃ had a bending strength of 65 MPa and linear thermal expansion coefficient of 2.2×10^–5 °C^–1 from room temperature to 600°C.     

Preparation and properties of ALCON (Al28C6O21N6) ceramics

The synthesis of Al₂₈C₆O₂₁N₆ powder (ALCON), starting from the binary compounds is described. The powder is resistant to oxidation in air up to 760°C. From the prepared powder, fully dense ceramics have successfully been prepared using hot pressing. The as-prepared ceramics had a thermal conductivity of 20 W m^–1 K^–1. Experiments showed that it is also possible to prepare ALCON ceramics by reactive hot-pressing, starting from Al₂O₃, AlN and Al₄C₃. Further optimization is expected to raise the thermal conductivity significantly. The strength, about 300 MPa, is similar to that of AlN. The thermal expansion coefficient of 4.8 × 10^–6K^–1 closely matches that of silicon, making application of ALCON ceramics as heat sinks an interesting possibility.     

Low-thermal expansion polycrystalline tantalum tungstate ceramics

The synthesis of thermal-shock-resistant materials from the system Ta₂O₅WO₃ was investigated. Ta₂WO₈ had a very low unit-cell thermal expansion coefficient (+0.5 X 10^–6° C^–1). Ta₃₀W₂O₈₁ also had a relatively low coefficient (+4.0 X 10^–6 ° C^–1) and a thermal durability over 1600° C. The thermal expansion curves of these polycrystalline ceramics were lowered because of microcracks caused by the large thermal expansion anisotropy of the crystal axes and were accompanied by hysteresis loops. The densification of Ta₂WO₈ ceramic was promoted by the addition of some metal oxides, and the strong ceramic of Ta₃₀W₂O₈₁ was obtained by controlling grain growth.     

Properties of high reinforcement-content aluminum matrix composite for electronic packages

Aluminum matrix composites reinforced by a high volume fraction of ceramic particles provide a novel solution to electronic packaging technology, because of their high thermal conductivity, compatible and tailorable coefficient of thermal expansion (CTE) with chips or substrates, low weight, enhanced specific stiffness, and low cost. In this paper, SiC-particle-reinforced aluminum matrix composites are fabricated by the cost-effective squeeze-casting technology, and their microstructure characteristics, thermo-physical, and mechanical properties are investigated. The reinforcement volume fraction is as high as 70% and composites with linear CTE of 6.9–9.7×10^–6 °C^–1 and thermal conductivity of 120–170 W m^–1 °C^–1 are produced. The composites can be electric-discharge machined, ground, and electric-spark drilled. An electroless nickel layer is plated on the composite by the conventional procedures. Finally, their potential applications in electronic packaging and thermal management are illustrated via prototype examples.     

Thermal expansion of TiAl + TiB2 alloys and model calculations of stresses and expansion of continuous fiber composites

Thermal expansion values for three TiAl alloys with different additions of TiB₂ can be represented using a third-order equation at temperatures between 20 and 800°C. Expansion values were obtained on both heating and cooling temperature cycles. The total expansion at 800°C is between 0.917 and 0.931% for three different samples. The expansivity increases from about 10×10^–6°C^–1 at 80°C to 14×10^–6°C^–1 at 750°C. A five-coaxial cylinder elastic model for multizone-coated continuous fiber composites is developed for predicting stresses and thermal expansion of composites. Either isotropic or transversely isotropic material properties can be assigned to the various cylinder zones.Paper presented at the Tenth International Thermal Expansion Symposium, June 6–7, 1989, Boulder, Colorado, U.S.A.     

Sintering and characterization of fully dense aluminium nitride ceramics

Aluminium nitride ceramics with no sintering additives could be densified to close to theoretical density (99.6% theoretical) by pressureless sintering of tape-cast green sheets at 1900 °C for 8 h. The thermal conductivity and bending strength of the specimens were 114 Wm^–1 K^–1 and 240 MPa, respectively. The effect of Y₂O₃ additive on sinterability, thermal conductivity and microstructure of aluminium nitride ceramics was investigated. Thermal conductivity increased with increasing amount of Y₂O₃ additive, sintering temperature and holding time at the sintering temperature. Samples with a thermal conductivity up to 258 Wm^–1 K^–1 were fabricated by elimination of the grain-boundary phase.     

Carbon fibre-reinforced silicon nitride composite

The processing of silicon nitride reinforced with carbon fibre was studied. The problems of physical and chemical incompatibility between carbon fibre and the silicon nitride matrix were solved by addition of a small amount of zirconia to the matrix and by low-temperature hot-pressing. The composite material possesses a much higher toughness than hot-pressed silicon nitride. Its work of fracture increased from 19.3 J m^–2 for unreinforced Si₃N₄, to 4770 J m^–2; its fracture toughness,K _lc , increased from 3.7 MN m^–3/2 for unreinforced material, to 15.6 MN m^–3/2. The strength remains about the same as unreinforced Si₃N₄ and the thermal expansion coefficient is only 2.51×10^–6 ° C^–1 (RT to 1000° C). It is anticipated that this composite may be promising because of its mechanical and good thermal shock-resistance properties.     

Carbonization of coal-tar pitch into lump needle coke in a tube bomb

The carbonization of coal-tar pitches and their QI (quinoline insoluble)-free fractions was studied by evaluating their lump cokes produced in a tube bomb at various temperatures (470 to 550° C) and pressures (0 to 75 kg cm^–2 gauge). The lump coke from QI-free fractions had a comparable anisotropic development and coefficient of thermal expansion (CTE). The carbonization temperature and pressure were found to influence strongly the properties of the cokes. At the highest temperature of 550° C, the most appropriate pressure for the best needle coke was 15 kg cm^–2 G (gauge). Either higher or lower pressure increased the CTE value of coke. In contrast, at a moderate temperature of 500° C, the higher pressure produced the better coke. At the lowest temperature of 470° C, it took 10 h to complete the carbonization, and the lowest pressure allowed the best extent of uniaxial arrangement. Among the cokes prepared under the present conditions, the Carbonization at 500° C under 40 kg cm^–2 G produced the best needle coke with a CTE value as low as 0.1 × 10^–6° C^–1. The carbonization scheme leading into the needle coke is discussed for a better understanding of how the carbonization temperature and pressure cooperatively influence the quality of the resultant coke, in relation to the carbonization reactivity of coal-tar pitch.     

Electrical conductivity of reduced barium titanate crystals

The conductivity, Seebeck coefficient and Curie point have been measured in reduced crystals of barium titanate. The results have been interpreted in terms of a polaron hopping model, leading to an estimated mobility of 5×10^–4 cm² V^–1 sec^–1 at 300° K, and an activation energy of 0.074 eV. The Curie point falls as a result of reduction, probably due to the formation of oxygen vacancies. The decrease can be correlated with the changes in conductivity through the estimated carrier density.     

Electrical properties of high purity tin dioxide doped with antimony

The electrical conductivity of high purity tin dioxide doped with antimony was studied at temperatures of 900 to 1200° C and partial pressures of oxygen between 10^–8 and 1 atm. For specimens having a dopant concentration over 1 × 10¹⁹Sb cm^–3, the electrical conductivity decreased slightly with temperature and independent of oxygen partial pressure. The electrical conductivity of specimens having a dopant concentration under 1 × 10^–8Sb cm^–3 increased with temperature and with decreasing partial pressure of oxygen. The significance of the dopant and the thermally created defects is discussed.     

Synthesis and characterization of (Sr1−x′K2x)Zr4(PO4)6 ceramics

Single phase (Sr_1–x K_2x )Zr₄(PO₄)₆, where x lies between 0.0 and 1.0, ceramic powder with a submicron scale particle size has been synthesized successfully at calcination temperatures as low as 650–750°C by a sol-gel technique. The formation of the powder strongly depends on calcination temperature, but is independent of solution pH in the studied range. Dilatometric measurement shows an ultra-low linear coefficient of thermal expansion of 0.1×10^–6°C^–1 when x=0.5 at temperature intervals of 25–1000°C. Thermal conductivity and flexural strength of the materials were determined at ambient temperature to be 1.0 Wm^–1K^–1 and as high as 280 MPa, respectively, indicating that this material can be an excellent candidate in many applications, especially those subjected directly to severe environments.     

Diffusion of alcohol-rhodamine 6G in polymethyl methacrylate

Rhodamine 6G (Rh6G) is impregnated in polymethyl methacrylate by concentration difference diffusion method. The diffusion behaviour of ethanoic and methanoic Rh6G in polymethyl methacrylate at temperatures between 35 and 70° C were studied. The following results were obtained: (a) Visually observed sharp boundary, characteristic of Case II transport, during diffusion of alcohol penetrates at a rate of 1.7×10^–6 cm sec^–1 with an activation energy of 23 kcal mol^–1 for ethanol-polymethyl methacrylate system and 1.0×10^–5 cm sec^–1, with 23 kcal mol^–1 for methanol-polymethyl methacrylate, respectively, at 60° C. (b) Diffusion of alcoholic Rh6G in polymethyl methacrylate is greatly hindered since internal stresses exist in the swollen region of the glassy polymer. (c) Diffusion of alcoholic Rh6G in swollen polymethyl methacrylate with equilibrium alcohol concentration followed Fickian kinetics. The diffusion coefficient of Rh6G at 60° C is determined as 5.2×10^–8 cm² sec^–1 with an activation energy of 41 kcal mol^–1 for the wet ethanol-polymethyl methacrylate and 6.1×10^–8 cm² sec^–1, with 34 kcal mol^–1 for the wet methanol-polymethyl methacrylate systems, respectively.     

Preparation of cordierite glass by the sol-gel process

Cordierite glass was prepared by the sol-gel process from magnesium, Al(OC₄H₉)₃ and Si(OC₂H₅)₄. The solution having cordierite-like structure was formed by refluxing the raw materials, followed by gelling and drying to 150° C in the saturated water vapour to hydrolyse completely. On heating the gel, AlO₆ groups transformed into AlO₄ groups, in which aluminium ions were incorporated in SiO₄ tetrahedra units to form a Si-O-Al network structure. The gel was converted into the transparent dense glass by heating above 850° C. The glass transition temperature, 820° C, thermal expansion coefficient, 3.1×10^–6° C^–1, Vickers hardness, 6.22 GPa and density, 2.59 g cm^–3 were almost the same as those of the conventional glass.     

Fabrication process and thermal properties of SiCp/Al metal matrix composites for electronic packaging applications

The fabrication process and thermal properties of 50–71 vol% SiC_p/Al metal matrix composites (MMCs) for electronic packaging applications have been investigated. The preforms consisted with 50–71 vol% SiC particles were fabricated by the ball milling and pressing method. The SiC particles were mixed with SiO₂ as an inorganic binder, and cationic starch as a organic binder in distilled water. The mixtures were consolidated in a mold by pressing and dried in two step process, followed by calcination at 1100 °C. The SiC_p/Al composites were fabricated by the infiltration of Al melt into SiC preforms using squeeze casting process. The thermal conductivity ranged 120–177 W/mK and coefficient of thermal expansion ranged 6–10 × 10^–6/K were obtained in 50–71 vol% SiC_p/Al MMCs. The thermal conductivity of SiC_p/Al composite decreased with increasing volume fraction of SiC_p and with increasing the amount of inorganic binder. The coefficient of thermal expansion of SiC_p/Al composite decreased with increasing volume fraction of SiC_p, while thermal conductivity was insensitive to the amount of inorganic binder. The experimental values of the coefficient of thermal expansion and thermal conductivity were in good agreement with the calculated coefficient of thermal expansion based on Turner's model and the calculated thermal conductivity based on Maxwell's model.     

Structural, optical and photoelectrochemical properties of brush plated CdSe x Te1 − x thin films

CdSe _x Te_{1 – x} films have been deposited by the brush plating technique for the first time, on titanium and conducting glass substrates at room temperature. These films were annealed in argon atmosphere at 475°C for 15 min. Their structural, optical and photoelectrochemical (PEC) properties are presented and discussed. The power conversion efficiency has been found to be 9.0% at 60 mW cm^–2white light illumination. A peak quantum efficiency of 0.7 has been obtained for the films of composition CdSe_0.7Te_0.3. Donor concentration of 10¹⁷cm^–3and electron mobility of 60 cm²V^–1sec^–1were obtained.     

Oxygen self-diffusion in single and polycrystalline magnesio-ferrites

Self-diffusion coefficients of oxygen ion in polycrystalline and single-crystal magnesioferrites have been measured by a gas-solid isotopic exchange technique using¹⁸O as a tracer at temperature in the range 975 to 1465° C. A new method was considered for the oxygen volume diffusion in polycrystalline magnesio-ferrite, and its reliability is discussed. The volume diffusion coefficients of polycrystalline magnesio-ferrite (MgO/Fe₂O₃=0.95 in mole ratio) can be expressed asD=1.51×10^–1exp (–78 600/RT) cm² sec^–1 (1135 to 1465° C) andD=1.2×10^–7exp (–38 000/RT) cm²sec^–1 (975 to 1135° C). The volume diffusion coefficients of the polycrystal in the high temperature range were very close to those of single crystal ferrite of the same composition as the polycrystal. The activation energy of grain-boundary diffusion in this polycrystal was expected to be greater than that of the volume diffusion. A possible interpretation of this unusual behaviour is given in terms of an increased enrichment of Fe²⁺ ion along the grain boundary with temperature elevation, by which oxygen vacancies increase.     

Silicon carbide whisker copper-matrix composites fabricated by hot pressing copper coated whiskers

Copper-matrix SiC whisker composites containing 33–54 vol % SiC whiskers and with < 5 vol % porosity were fabricated by hot pressing SiC whiskers that had been coated with copper by electroless plating followed by electroplating. The highest Brinell hardness of 260 was attained at 50 vol % SiC whiskers. The lowest coefficient of thermal expansion (CTE) of 9.6 × 10^–6°C^–1 (at 25–150°C) was attained at 54 vol % SiC whiskers. The composites exhibited lower porosity, higher hardness, higher compressive yield strength, lower CTE, lower electrical resistivity and higher thermal conductivity than the corresponding composites made by hot pressing mixtures of copper powder and bare SiC whiskers.