PE/多层石墨导热复合材料的制备与性能

PE、GPE为基材,多层石墨、石墨为填料,采用机械混炼法制备高导热塑料复合材料。SEM分析表明PE/多层石墨比GPE/多层石墨复合材料的插层效果更好。研究填料对复合材料的热导率和热稳定性的影响。结果表明:导热复合材料的热导率随填料填充量的增大而增大,多层石墨的填充量达到100%时,热导率为4.15 W.m-1.k-1。并且在相同填充量下PE/多层石墨较之GPE/多层石墨、PE/石墨、GPE/石墨的导热率更高。TGA分析表明:填充多层石墨、石墨的导热塑料复合材料热稳定性高于未填充的PE。经研究提出,形状比(径厚比)大和导热率高的导热填料更易形成导热网链;为了不影响导热填料的分散性,可先使基体材料与填料先混合均匀再增加其韧性、黏度等。     

PP/KPEG/MWNTs导热复合材料制备及性能

将可膨胀石墨(KPEG)和多壁碳纳米管(MWNTs)混合填料填充至聚丙烯(PP)制备PP/KPEG/MWNTs导热复合材料。保持混合填料总质量分数30%不变,改变两者质量比进行试验。结果表明,随着MWNTs填充比例增加,导热复合材料的拉伸强度呈先增大后减小趋势,而缺口冲击强度总体呈下降趋势。与纯PP相比,当MWNTs与KPEG质量比为1∶5(MWNTs质量分数为5%)时,导热复合材料的热导率提高了328.4%;MWNTs可提高复合材料热稳定性,但改变其与KPEG质量比在试验范围内对热稳定性影响较弱。     

高热导率聚丙烯/石墨复合材料的制备与性能

为了提高聚丙烯(PP)的导热性能,扩大其使用范围,采用价格低廉的商用石墨对PP进行改性,利用转矩流变仪制备了PP/石墨导热复合材料。研究了粒径为2μm和20μm的石墨及其复配对复合材料热导率及力学性能的影响。结果表明,复合材料的热导率随着石墨用量的增加而显著增大,20μm石墨填充的复合材料热导率高于2μm石墨填充的复合材料;由于石墨的各向异性,层内热导率远高于层间热导率;将两种粒径的石墨复配,固定石墨总质量分数为40%,当2μm石墨与20μm石墨质量比为1︰5时,复合材料层间和层内热导率达到最大,分别为1.125 W/(m·K)和2.897 W/(m·K),比相同用量下单一2μm石墨填充PP分别提高了121%和61%,比单一20μm石墨填充PP分别提高了3.6%和20%。随石墨用量增加,单一粒径石墨填充的复合材料拉伸强度和弯曲强度呈现先减小后增大的趋势,随复配填料中20μm石墨用量增加,复配填料填充复合材料的力学性能呈下降趋势,但弯曲强度变化不大,拉伸强度也在10 MPa以上。     

高分子复合材料导热性能研究

以Al2O3、MgO和BN三种无机填料作为尼龙6(PA6)的导热填料,研究填料的种类、填充量、粒径大小和粒径配比等对复合材料热导率的影响。结果表明:PA6基复合材料的热导率随导热填料填充量的增加而增大,随导热系数大的填料填充量的增加增大较快;导热系数大的填料的粒径对复合材料的导热系数的影响比较明显;导热系数大的填料,不同粒径的复配可以显著提高复合材料的导热系。     

热塑性聚酰亚胺复合材料导热性能研究

采用稳态热板法测定铜粉（Cu）填充热塑性聚酰亚胺（TPI）复合材料的热导率，研究了Cu填充量对复合材料的力学性能和导热性能的影响，初步探讨了温度与复合材料热导率的关系。通过扫描电子显微镜观察了复合材料的微观形态。在此基础上，理论计算复合材料热导率。研究表明，Cu填充TPI可有效提高复合材料力学性能和导热性能。当Cu体积分数提高到26％时，填料聚集形成导热链，Cu／TPI复合材料的热导率是纯TPI树脂的3．5倍；当填料含量低于10％时，Maxwell—Eucken模型适合预测复合材料热导率；基于导热链考虑的Y．Agan模型可较好地反映复合材料热导率随填料含量的变化情况；随着温度的升高，Cu／TPI复合材料热导率先增大后趋于平缓。     

热塑性聚氨酯基导热纳米复合材料的制备及性能研究进展

简要介绍了本征型和填充型聚合物复合材料的导热机理,从氧化铝、碳纳米管和石墨烯三种导热填料方面,分别概述了这三种填料填充热塑性聚氨酯(TPU)基导热纳米复合材料的制备技术、导热性能及导热机理研究进展情况,论述了每种复合材料在不同填料改性、不同制备技术以及不同填料复合填充条件下带来的导热效率变化,最后对TPU基导热纳米复合材料研究趋势进行了展望。     

基于聚偏氟乙烯/石墨的换热板片材料的制备及导热性能研究

以聚偏氟乙烯（PVDF）为基体,石墨为填料,使用溶液共混法制备导热复合材料,研究了石墨填充量、混炼工艺等对复合材料导热性能的影响。结果表明,石墨填充量超过40 %（质量分数,下同）后,复合材料的热导率呈明显增大的趋势;当石墨填充量达到70 %时,PVDF/石墨复合材料的热导率达到2092 W/（m·K）,是纯PVDF热导率的110倍;270 μm：106 μm石墨含量比为1∶9时,热导率达到最大值;采用叠片式转子比腰鼓形转子可以制备出更高热导率的复合材料;转子转速和混炼时间对复合材料的热导率影响不大;设计并制备了板式换热器换热板片,实验验证了基于PVDF/石墨复合材料加工生产换热板片的可行性。     

导热PE-LD复合材料的制备与性能研究

采用低密度聚乙烯(PE-LD)为基体材料,石墨、Al N为导热填充材料,通过双辊混炼、模压制备了导热复合材料,并对该复合材料的导热性能、力学性能、热行为进行了分析。结果表明,随着石墨或Al N含量的增加,PE-LD/石墨复合材料和PE-LD/Al N复合材料的热导率逐渐增大;PE-LD/石墨复合材料的热导率高于PE-LD/Al N复合材料的热导率。当石墨与Al N的总质量分数为50%、石墨与Al N的质量比为4∶1时,PE-LD/石墨/Al N复合材料的拉伸强度、弯曲强度均达到最大值,分别为12.8,17.15 MPa;此时PE-LD/石墨/Al N复合材料的热导率达到最大值,为0.618 W/(m·K),略低于添加质量分数50%的石墨时的PE-LD/石墨复合材料的热导率[0.634 W/(m·K)];当石墨与Al N质量比为1∶4时,PE-LD/石墨/Al N复合材料的热导率为0.488 W/(m·K),高于只添加质量分数50%Al N的PE-LD/Al N复合材料的热导率[0.410 W/(m·K)]。当石墨和Al N总质量分数为50%时,随着Al N含量的增加,PE-LD的结晶度增大。     

BN填充PA6基导热绝缘复合材料导热性能研究

以聚酰胺6（PA6）为基体, 氮化硼（BN）作为导热填料,经双螺杆挤出机熔融共混,模压成型制得导热绝缘复合材料。研究了BN含量、粒径、形状和不同BN粒径复配对复合材料导热性能的影响,并研究了BN含量和粒径对复合材料绝缘性能的影响。结果表明,在各种粒径下,复合材料热导率均随BN填充量的增加而增大;在BN粒径为5 μm、填充量为25 %（体积分数,下同）时,复合材料热导率达到1.2187 W/(m·K);在BN填充量相同时,填料粒径对复合材料热导率的影响不是简单的单调规律,呈现50、100 μm时较小,1、5、15 μm时较大,150 μm时最大的规律;片状BN填料比球状BN填料更有利于提高复合材料的热导率;2种不同粒径填料复配所填充的复合材料的热导率大于单一粒径填充的复合材料;5 μm与150 μm粒径BN复配,在填充量为20 %,配比为1:3时,复合材料的热导率最大,达到1.3753 W/(m·K),为纯PA6的4.9倍;在不同BN含量和粒径下,复合材料体积电阻率均能达到10000000000000 Ω·cm以上,满足绝缘性能。     

三氧化二铝/硅橡胶复合材料热导率的预测

应用最小热阻力法则和比等效热导率法则,建立颗粒填充聚合物基复合材料的导热模型并推导出等效热导率公式,并对三氧化二铝/硅橡胶复合材料热导率进行预测.结果表明,复合材料热导率预测值与实测值接近;三氧化二铝粒径较小时,预测值与实测值更为接近;三氧化二铝体积分数相同时,大粒子填充硅橡胶复合材料热导率更高.     

Electrical conductivity and EMI shielding effectiveness of polyurethane foam–conductive filler composites

The morphological, electrical, and thermal properties of polyurethane foam (PUF)/single conductive filler composites and PUF/hybrid conductive filler composites were investigated. For the PUF/single conductive filler composites, the PUF/nickel‐coated carbon fiber (NCCF) composite showed higher electrical conductivity and electromagnetic interference shielding effectiveness (EMI SE) than did the PUF/multiwall carbon nanotube (MWCNT) and PUF/graphite composites; therefore, NCCF is the most effective filler among those tested in this study. For the PUF/hybrid conductive fillers PUF/NCCF (3.0 php)/MWCNT (3.0 php) composites, the values of electrical conductivity and EMI SE were determined to be 0.171 S/cm and 24.7 dB (decibel), respectively, which were the highest among the fillers investigated in this study. NCCF and MWCNT were the most effective primary and secondary fillers, and they had a synergistic effect on the electrical conductivity and EMI SE of the PUF/NCCF/MWCNT composites. From the results of thermal conductivity and cell size of the PUF/conductive filler composites, it is suggested that a reduction in cell size lowers the thermal conductivity of the PUF/conductive filler composites. © 2016 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017 , 134, 44373.     

SiC/Al2O3/MVQ导热复合材料的制备与性能研究

分别使用碳化硅(SiC)、氧化铝(Al2O3)和SiC/Al2O3复配物制备了导热甲基乙烯基硅橡胶材料(MVQ),研究了SiC,Al2O3和SiC/Al2O3用量及表面改性对MVQ导热系数和力学性能的影响,结果表明,随导热填料用量的增大,MVQ导热系数增大;同等用量下,SiC/Al2O3/MVQ复合材料的导热性能均优于SiC/MVQ和Al2O3/MVQ;当SiC/Al2O3总用量为50份且SiC/Al2O3质量比为3/1时,复合材料导热系数为0.76 W/mK;随SC/Al2O3用量的增加,拉伸强度与拉断伸长率均降低,邵尔A硬度增大.表面处理后,复合材料导热性能得到进一步改善.     

LED用低热阻硅脂的制备

选用合适粒径的氮化铝和氧化铝为混杂导热填料、使用自制的硅烷低聚物为表面处理剂,以溶液插层法对混杂导热填料进行表面改性;然后与甲基苯基硅油混合制备了LED用低热阻导热硅脂。研究了导热填料的种类、粒径、表面处理剂种类及用量对导热硅脂的热导率和黏度的影响。采用LED灯作为实际测试平台表征了导热硅脂的导热性能。结果表明,当填料总质量分数为90.9%,粒径为5μm的氮化铝与粒径为1μm的氧化铝作混合填料且质量比为2.8∶1时,导热硅脂的热导率和黏度有较好的平衡;使用填料质量0.5%的硅烷低聚物对氮化铝和氧化铝混合填料进行表面处理有较好的处理效果;自制10号硅脂样品的黏度（25℃）为174 Pa·s,热阻为1.94℃/W,热导率为4.31 W/m·K。     

Synergistic effect of boron nitride and tetrapod‐shaped zinc oxide whisker hybrid fillers on filler networks in thermal conductive HDPE composites

In this paper, in order to investigate and predict the synergistic effect of the tetra‐needle‐shaped zinc oxide whisker (T‐ZnO) and boron nitride (BN) hybrid fillers in the thermal conductive high‐density polyethylene (HDPE) composites, the filler networks were studied through dynamic rheological measurement. Moreover, the crystallinity of the HDPE in the composites, and the thermal and electrical conductivity of the composites were also investigated. It was found that when the ratio of the BN and T‐ZnO in hybrid fillers was 20:10, the HDPE/hybrid fillers composite not only had the highest thermal conductivity but also can maintain the electrically insulating. Furthermore, the gel point of the HDPE/hybrid fillers composites was 11.2 wt%, and it was close to the 10 wt%. Therefore, the synergistic effect of the T‐ZnO and BN hybrid fillers in the HDPE/hybrid fillers composites can be successfully predicted through dynamic rheology date. Simultaneously, the Scanning electron microscope results showed that the T‐ZnO and BN particles can contact each other to form the thermal conductive paths so that the thermal conductivity of the HDPE can be enhanced through addition of the hybrid fillers. In addition, it was also found that the improved thermal conductivity of the HDPE/hybrid fillers composites was not because of a change in the crystallinity of the HDPE in the HDPE/hybrid fillers composites. POLYM. COMPOS., 38:1902–1909, 2017. © 2015 Society of Plastics Engineers     

Piezoresistive behavior of graphene nanoplatelets/carbon black/silicone rubber nanocomposite

Silicon rubber (SR) filled with carbon black (CB) and carbon black (CB)/graphene nanoplatelets (GNPs) hybrid fillers are synthesized via a liquid mixing method. The effects of filler type on the electrical properties and piezoresistive properties (near the region of the percolation) of the conductive SR composites are studied. It is suggested that the conductivity of the composite filled with CB/GNPs hybrid fillers in the mass ratio of 2 : 4 is much higher than that in other ratio. Percolation threshold for CB/GNPs/SR is found to be 0.18 volume fractions lower than CB/SR. Moreover, force rang and linearity of GNPs/CB/SR is higher than CB alone filling system. And the repeatability of the GNPs/CB/SR composites is better than CB/SR. Not repetitive index () of them is 0.1 and 0.18, respectively. The results suggest that the GNPs/CB/SR composites provide a new route toward fabrication of flexible piezoresistive sensors with high performance. © 2013 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014 , 131, 39778.     

聚合物基导热复合材料的性能及导热机理

采用不同品种、粒径的导热填料和基体树脂,以熔融共混方法制备聚合物/填料体系导热功能复合材料。研究了复合材料热导率λ和体积电阻率ρ_v随不同填料、粒径等因素的变化规律及其内在原因。不同填充体系的热导率均随填料粒径的减小而降低,而电导率则相反;复合体系热导率随填料含量的增加始终呈逐步上升趋势,未表现出电导率那样的急剧变化。研究表明：复合体系热导率和电导率变化的差异主要是由于二者具有不同的传导机理;复合材料热导率的变化规律可以用热弹性复合增强机制进行合理解释。     

Effects of carbon fillers on the rheology of highly filled liquid‐crystal polymer based resins

Adding conductive carbon fillers to insulating resins increases the composite electrical and thermal conductivity. Often, enough of a single type of carbon filler is added to achieve the desired conductivity while still allowing the material to be molded into a bipolar plate for a fuel cell. In this study, various amounts of three different carbons (carbon black, synthetic graphite particles, and carbon fiber) were added to Vectra A950RX liquid‐crystal polymer. The rheological properties of the resulting single‐filler composites were measured. In addition, the rheological properties of composites containing combinations of different carbon fillers were studied via a factorial design. In all cases, the viscosity increased with increasing filler volume fraction and followed a shear‐thinning power‐law model. The factorial design results indicated that each of the single fillers and all the filler combinations caused a statistically significant increase in the composite viscosity when compared at a shear rate of 500 s^?1 or at a stress of 10⁵ Pa. For composites containing synthetic graphite particles and/or carbon fiber, the viscosity variation with the volume fraction of carbon followed a modified Maron–Pierce equation. When compared at a constant volume fraction of carbon, composites containing carbon black showed viscosity enhancement above and beyond that shown by the other composites. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

导热氧化铝改性工艺对界面材料导热性能的影响研究

为提高界面材料的导热性能,采用不同工艺对界面材料用导热氧化铝填料进行改性研究,通过考察导热氧化铝填料的形貌、添加量、复配比例对界面材料导热性能的影响,选取导热氧化铝填料最佳性价比配方和改性工艺。实验结果表明：当导热氧化铝填料以45 μm球形、45 μm类球形、5 μm角形按2∶3∶2质量比进行复配并进行干法-湿法联合改性时,其添加量可以达到95%（占有机硅油体系的质量分数）,导热系数可以达到4.25 W/（m·K）。     

Synergistic thermal conductivity enhancement of PC/ABS composites containing alumina/magnesia/graphene nanoplatelets

Graphene nanoplatelets (GNPs) have attracted considerable attention in the field of thermal management materials due to their unique structure and exceptional thermal conductive properties. In this work, we demonstrate a significant synergistic effect of GNPs, alumina (Al₂O₃), and magnesia (MgO) in improving the thermal conductivity of polycarbonate/acrylonitrile‐butadiene‐styrene polymer alloy (PC/ABS) composites. The thermal conductivity of the composites prepared through partial replacement of Al₂O₃ and MgO with GNPs could increase dramatically compared with that without GNPs. The maximum thermal conductivity of the composite is 3.11 W mK⁻¹ at total mass fraction of 70% with 0.5 wt% GNPs loading. It increases 60% compared with that without GNPs (1.95 W mK⁻¹). The synergistic effect results from the compact packing structure formed by Al₂O₃/MgO and the bridging of GNPs with Al₂O₃/MgO, thus promoting the formation of effective thermal conduction pathways within PC/ABS matrix. More importantly, together with the intrinsically high thermal conductivity of GNPs, boosted and effective pathways for phonon transport can be created, thus decrease the thermal resistance at the interface between fillers and PC/ABS matrix and increase the thermal conductivity of composites. POLYM. COMPOS., 38:2221–2227, 2017. © 2015 Society of Plastics Engineers     

Self-healable and reprocessible liquid crystalline elastomer and its highly thermal conductive composites by incorporating graphene via in-situ polymerization

The booming of modern electronic devices featuring increasing power and multi-functionalization demands novel high thermal conductive materials with various functions, such as self-healing property and high deformability, while traditional polymer-based or metallic-based materials could hardly provide. Therefore, we report a high thermal conductive and disulfide-based self-healable and reprocessible liquid crystalline elastomer (SHLCE) composite by incorporating graphene nanoplates (GNPs) fillers. The obtained GNPs/SHLCE composites exhibited desired thermal conductivity (5.08 Wm⁻¹ K⁻¹) when the content of GNPs was 20 wt% to the composites. Moreover, the GNPs/SHLCE composites showed intriguing recycled performance (Tensile strength after recycle could maintain over 93% compared with that of original composites). Furthermore, we concluded that the improved thermal conductivity of GNPs/SHLCE composites was beneficial to the thermal induced reprocessible and shelf-healable systems.