一种新的β-锂霞石增强铜基复合材料热性能

采用热压烧结工艺成功制备了一种新的β-锂霞石增强铜基复合材料.利用扫描电镜和透射电镜对复合材料的微观组织进行了分析,并对不同体积分数复合材料的致密性,热膨胀性能和热传导性能进行了测试.结果表明:β-锂霞石颗粒在铜基体中分布均匀,界面清晰,不发生界面反应;体积分数对复合材料致密性、热膨胀系数和热导率有明显影响,当β-锂霞石颗粒体积分数超过40%时,复合材料的致密性有明显下降,热膨胀系数在(9～15.4)×10-6/K,同时热导率在50～170W/m·K.     

高体积分数的 SiCp/Al复合材料的 SPS致密化机理研究

运用放电等离子烧结（SPS）技术制备出体积分数达60％，致密度达99％的SiCp／Al复合材料．从烧结工艺的控制及电场的影响两方面对SPS烧结SiC，／Al复合材料的机理进行了研究，认为SPS烧结SiCp／Al复合材料的致密化过程主要依靠烧结温度、压力及升温速率的合理搭配，使Al熔融粘结SiC颗粒，而又不溢出模具；烧结过程中未发现明显的放电现象，可能由于电场太弱不足以引发放电．     

高导热金属基复合材料的热物理性能

分别采用无压浸渗、气压浸渗、内氧化技术制备了高导热Al/SiC、Al/C、Cu/Al2O3复合材料.研究了增强相和界面对这三种复合材料的热导率和热膨胀系数的影响,并对这些性能进行了理论分析和数值模拟.当颗粒尺寸与界面层厚度之比固定时,颗粒尺寸对Al/SiC复合材料热导率影响很小,但界面热导率对其影响很大;Al/SiC复合材料的CTE随温度的升高而增加,随SiO2层厚度的增加而减小;碳纤维中混杂3%SiC颗粒有利于改善纤维的分布,降低Al/C复合材料的缺陷,并提高其热导率;压力加工增加了Cu/Al2O3的致密度,也提高了其热导率;可用Schapery和Kerner模型计算复合材料的热膨胀系数,用Hasselman-Johnson模型计算热导率.     

高体积分数SiC_p/Al-Si复合材料的微观组织与导热性能

通过对SiC颗粒进行表面改性处理,并向Al基体中添加Si元素合金化采用热压烧结方法制备了Al-10Si-50%(质量分数)SiC复合材料,研究了复合材料的微观组织和导热性能。结果表明,复合材料中SiC颗粒在基体中分布均匀,复合材料组织致密;SiC-Al界面清晰、平直,无过渡层和其它附加物,复合材料界面结合良好;复合材料导热性能优异,其热导率可达189W/(m·K),能够满足电子封装材料的日常使用要求。     

镀钛金刚石／铜复合材料的热导率

采用粉末冶金法在高温热压炉中制备金刚石／铜复合材料,研究了钛镀层、烧结温度、金刚石颗粒体积分数对金刚石／铜复合材料热导率的影响。结果表明：钛镀层能改善金刚石／铜复合材料的界面浸润性,降低孔隙率,提高热导率。烧结温度低于980℃时,烧结驱动力不足,致使金刚石／铜复合材料的致密度下降,热导率降低;烧结温度高于980℃时,由...     

Al_2O_3修饰3D-SiC/Al复合材料的制备与性能

用Al_2O_3作为界面修饰剂,通过反应烧结,在SiC颗粒之间形成莫来石界面,制备SiC预制件,采用无压熔渗法制备3D-SiC/Al互穿式连续结构复合材料。基于正交实验研究了Al_2O_3添加量、预制件烧结时间、熔渗温度和熔渗时间对3D-SiC/Al复合材料抗弯强度和热导率的影响。实验结果表明,Al_2O_3添加量对复合材料抗弯强度和热导率影响显著,复合材料获得最大抗弯强度344 MPa和热导率165 W/(m·K)的制备工艺为:氧化铝添加量2.0%(原子分数),预制件烧结时间2h,熔渗温度950℃,熔渗时间1h。     

SiC颗粒体积分数对SiCp/Al复合材料疲劳裂纹扩展的影响

本文通过对疲劳裂纹扩展速率的测试和对疲劳裂纹扩展路径及疲劳断口的观察分析,研完了SiC颗粒体积分数对SiCp/Al复合材料疲劳裂纹扩展的影响.结果表明:随着SiC颗粒体积分数的增加,复合材料疲劳裂纹扩展抗力增加,但只有SiC颗粒体积分数为15％时,复合材料的疲劳裂纹扩展抗力才优于基体.      

压力浸渗制备石墨/铝复合材料及其热学性能

采用压力浸渗法制备了石墨/铝复合材料,研究了不同体积分数鳞片石墨对复合材料热学性能和组织的影响。结果表明,加入石墨片明显提高复合材料水平热导率,同时降低复合材料热膨胀系数和密度。当复合材料中石墨体积分数从23.9%增加到73.4%,复合材料水平热导率从234 W/(m·K)提高到402 W/(m·K),同时热膨胀系数降低至5×10-6/K,兼顾高热导率和低热膨胀系数的特点。     

增强体含量对Sip/LD11复合材料热物理性能影响

为研究增强体含量对电子封装用Si颗粒增强铝基复合材料热物理性能的影响,采用挤压铸造法制备了以高纯Si粉为增强体,LD11铝合金为基体,体积分数分别为55%、60%和65%的3种复合材料.利用金相显微镜、热膨胀分析仪、热导率测试仪等多种手段对复合材料的微观组织及热物理性能进行了研究,并对试验结果进行数值模拟.显微组织观察表明,复合材料的铸态组织均匀、致密.通过改变复合材料增强体的含量,复合材料的热膨胀系数介于(8.1～12)×10-6/℃之间可调,热导率大于87.7 W/m·℃,满足电子封装用材料的要求.Sip/LD11复合材料的热膨胀系数介于Rom模型和Turner模型之间,Kerner模型能够更好地预测Sip/LD11复合材料的热膨胀系数.热导率计算结果均大于测试值.     

碳化硅颗粒增强石墨/铝复合材料的热物理性能

片层石墨/铝复合材料具有低密度、高热导率的优点,但力学性能较差,目前无法作为一种可商业化应用的电子封装材料。为了改善片层石墨/铝复合材料的热物理性能,采用真空热压法制备了碳化硅颗粒增强石墨/铝复合材料,研究了碳化硅的含量对复合材料热导率、热膨胀系数和抗弯强度的影响。结果表明,经过高频振荡工艺,碳化硅-石墨/铝复合材料中石墨的排列取向良好。添加碳化硅颗粒能明显降低复合材料的热膨胀系数,提高抗弯强度,略微降低热导率。随着碳化硅颗粒体积分数增加,碳化硅-石墨/铝复合材料内部会逐渐出现孔洞缺陷,相对密度下降。当碳化硅和石墨的体积分数分别为15vol%、50vol%时,碳化硅-石墨/铝复合材料具有最优热物理性能,此时x-y方向热导率为536 W/(m·K)、热膨胀系数为6.4×10^-6m/K,抗弯强度为102 MPa,是一种十分具有商业前景的电子封装材料。     

Processing of Al/SiC composites in continuous solid–liquid co-existent state by SPS and their thermal properties

Silicon carbide (SiC)-particle-dispersed-aluminum (Al) matrix composites were fabricated in a unique fabrication method, where the powder mixture of SiC, pure Al and Al–5mass% Si alloy was uniquely designed to form continuous solid–liquid co-existent state during spark plasma sintering (SPS) process. Composites fabricated in such a way can be well consolidated by heating during SPS processing in a temperature range between 798 K and 876 K for a heating duration of 1.56 ks. Microstructures of the composites thus fabricated were examined by scanning electron microscopy and no reaction was detected at the interface between the SiC particle and the Al matrix. The relative packing density of the Al–matrix composite containing SiC was higher than 99% in a volume fraction range of SiC between 40% and 55%. Thermal conductivity of the composite increased with increasing the SiC content in the composite at a SiC fraction range between 40 vol.% and 50 vol.%. The highest thermal conductivity was obtained for Al–50 vol.% SiC composite and reached 252 W/mK. The coefficient of thermal expansion of the composites falls in the upper line of Kerner’s model, indicating strong bonding between the SiC particle and the Al matrix in the composite.     

Pressure infiltration casting process and thermophysical properties of high volume fraction SiCp/Al metal matrix composites

Abstract

SiC_p/Al composites containing high volume fraction SiC particles were fabricated using a pressure infiltration casting process, and their thermophysical properties, such as thermal conductivity and coefficient of thermal expansion (CTE), were characterised. High volume fraction SiC particulate preforms containing 50–70 vol.-%SiC particles were fabricated by ball milling and a pressing process, controlling the size of SiC particles and contents of an inorganic binder. 50–70 vol.-%SiC_p/Al composites were fabricated by high pressure infiltration casting an Al melt into the SiC particulate preforms. Complete infiltration of the Al melt into SiC preform was successfully achieved through the optimisation of process parameters, such as temperature of Al melt, preheat temperature of preform, and infiltration pressure and infiltration time after pouring. Microstructures of 50–70 vol.-%SiC_p/Al composites showed that pores resided preferentially at interfaces between the SiC particles and Al matrix with increasing volume fraction of SiC particles. The measured coefficients of thermal expansion of SiC_p/Al composites were in good agreement with the estimated values based on Turner's model. The measured thermal conductivity of SiC_p/Al composites agreed well with estimated values based on the 'rule of mixture' up to 70 vol.-% of SiC particles, while they were lower than the estimated values above 70 vol.-% of SiC particles, mainly due to the residual pores at SiC/Al interfaces. The high volume fraction SiC_p/Al composite is a good candidate material to substitute for conventional thermal management materials in advanced electronic packages due to their tailorable thermophysical properties.     

Mg-Si-Sn基热电器件电极材料的优化选择与连接工艺

研究了采用不同放电等离子烧结(SPS)工艺获得的单质金属(Ni、Cu、Ag、Al)电极与Mg-Si-Sn基热电材料结合界面的微观形貌和成分分布特征, 测试了合金(Ni-Al、Cu-Al)、金属/合金复合电极材料的热膨胀系数、电导率和热导率等物性参数。实验结果表明: 通过SPS烧结可以有效实现电极材料与Mg-Si-Sn基材料的连接, 复合电极材料Ni-Al/Al(60:40)和Cu-Al/Cu(45:55)具有高的电导率和热导率, 并且热膨胀系数与Mg-Si-Sn基热电材料相匹配, 有可能成为Mg-Si-Sn基材料的较理想电极材料。     

Fabrication process and thermal properties of SiCp/Al metal matrix composites for electronic packaging applications

The fabrication process and thermal properties of 50–71 vol% SiC_p/Al metal matrix composites (MMCs) for electronic packaging applications have been investigated. The preforms consisted with 50–71 vol% SiC particles were fabricated by the ball milling and pressing method. The SiC particles were mixed with SiO₂ as an inorganic binder, and cationic starch as a organic binder in distilled water. The mixtures were consolidated in a mold by pressing and dried in two step process, followed by calcination at 1100 °C. The SiC_p/Al composites were fabricated by the infiltration of Al melt into SiC preforms using squeeze casting process. The thermal conductivity ranged 120–177 W/mK and coefficient of thermal expansion ranged 6–10 × 10^–6/K were obtained in 50–71 vol% SiC_p/Al MMCs. The thermal conductivity of SiC_p/Al composite decreased with increasing volume fraction of SiC_p and with increasing the amount of inorganic binder. The coefficient of thermal expansion of SiC_p/Al composite decreased with increasing volume fraction of SiC_p, while thermal conductivity was insensitive to the amount of inorganic binder. The experimental values of the coefficient of thermal expansion and thermal conductivity were in good agreement with the calculated coefficient of thermal expansion based on Turner's model and the calculated thermal conductivity based on Maxwell's model.     

混杂填料填充导热硅橡胶性能研究

以甲基乙烯基硅橡胶为基胶,选用不同粒径氮化硅粒子和碳化硅晶须为填料制备了导热硅橡胶.研究表明:大小粒子以最佳比例进行混合填充时橡胶可获较高热导率,并采用Hasselman模型和等效粒径概念来研究混合粒子体系的热导率;将碳化硅晶须和氮化硅粒子并用,在较低用量下体系呈现较高热导率.此外,随混合填料用量增加橡胶热膨胀系数降低,热稳定性提高.     

A comparative study of the coated filler method and the admixture method of powder metallurgy for making metal–matrix composites

Copper–matrix composites were made by powder metallurgy (PM). The reinforcements were molybdenum particles, silicon carbide whiskers and titanium diboride platelets. The coated filler method, which involves a reinforcement coated with the matrix metal, was used. In contrast, conventional PM uses the admixture method, which involves a mixture of matrix powder and reinforcement. For all the composite systems, the coated filler method was found to be superior to the admixture method in providing composites with lower porosity, greater hardness, higher compressive yield strength, lower coefficient of thermal expansion (CTE), higher thermal conductivity and lower electrical resistivity, though the degree of superiority was greater for high than low reinforcement contents. In the coated filler method, the coating on the reinforcement separated reinforcement units from one another and provided a cleaner interface and stronger bond between reinforcement and matrix than the admixture method could provide. The highest reinforcement content attained in dense composites (<5% porosity) made by the coated filler method was 70 vol% Mo, 60 vol% TiB2 and 54 vol% SiC. The critical reinforcement volume fraction above which the porosity of composites made by the admixture method increases abruptly is 60% Mo, 42% TiB2 and 33% SiC. This fraction increases with decreasing aspect ratio of the reinforcement. Among Cu/Mo, Cu/TiB2 and Cu/SiC at the same reinforcement volume fraction (50%), Cu/Mo gave the lowest CTE, highest thermal conductivity and lowest electrical resistivity, while Cu/SiC gave the greatest hardness and Cu/TiB2 and Cu/SiC gave the highest compressive yield strength. Compared to Cu/SiC, Cu/TiB2 exhibited much higher thermal conductivity and much lower electrical resistivity. This revised version was published online in November 2006 with corrections to the Cover Date.     

Thermal properties of diamond/SiC/Al composites with high volume fractions

The diamond/SiC/Al composites with high volume fractions and a large ratio of diamond to SiC particle size (7.8:1) were fabricated by gas pressure infiltration. The results show that the fine SiC particles occupy efficiently the interstitial positions around coarse diamond particles; the main fracture mechanism of the composite is matrix ductile fracture, and diamond brittle fracture was observed which confirms a high interfacial bonding strength; the diamond/SiC/Al composites with 80% and 66.7% volume fraction of diamond in the reinforcement have the higher volume fraction in the reinforcement and lower coefficient of thermal expansion compared to the diamond/Al composite. Turner and Kerner models are not in good agreement with the experimental data for the composites based on reinforcement with two phases different in shape and component. When the effect of the coating layer considered, differential effective medium (DEM) model is confirmed a reliable model in designing a composite with a given thermal conductivity based on reinforcement with two phases different in size.     

Preparation and thermal properties of zirconium tungstate/copper composites

ZrW₂O₈/Cu composites were prepared by the powder metallurgy method. Electroless plating was used to deposit copper on ZrW₂O₈ powder before sintering. The thermal expansion and thermal conductivity of composites were measured in the temperature range from 25 ^oC to 200 ^oC and compared with those predicted from various theoretical models. The results show that the coefficient of thermal expansion of ZrW₂O₈/ Cu composites with a different volume fraction of ZrW₂O₈ is greater than the theoretically calculated value. The thermal conductivities of ZrW₂O₈/ Cu composites increase with a higher copper content and decrease upon elevated temperature. The thermal conductivity of composites with a different volume fraction of ZrW₂O₈ is lower than the theoretically calculated value.     

Fabrication of C/SiC composites by an electrodeposition/sintering method and the control of the properties

Carbon fibre reinforced SiC matrix composites (C/SiC composites) were fabricated using an electrodeposition/sintering method and the control of properties such as flexural strength. Young's modulus and thermal expansion coefficient was investigated in order to fabricate C/SiC-based functionally gradient materials. By means of choosing the condition of electrodeposition and sintering, C/SiC composites with volume fraction of fibre (V _f) ranging from 45 to 78% were fabricated. Maximum flexural strength and Young's modulus were 185 MPa and 47.5 GPa with V _f of 75%, but both properties decreased with the decrease in V _f. Conversely, the thermal expansion coefficient increased with the decrease in V _f; the value varied from 0.2 to 2.75 × 10^–6K^–1.