共查询到20条相似文献,搜索用时 109 毫秒
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Chen Cichang 《机械工程学报(英文版)》1995,(3)
UNSTEADYFLOWANALYSISINACROSS-FLOWFANWITHACASINGUNSTEADYFLOWANALYSISINACROSS-FLOWFANWITHACASINGChenCichang(JiangsuUniversityof... 相似文献
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SOLIDIFICATIONPROCESSINGANDFRACTUREMORPHOLOGYOFSiCp/ZL108COMPOSITE①ZhaoYutaoJiangsuUniversityofScienceandTechnologyAbstractTh... 相似文献
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《机械工程学报(英文版)》1997,(1)
GENETICALGORITHMSINSTRUCTURALOPTIMIZATIONWITHMIXEDDISCRETEDESIGNVARIABLESChenXindu,ChenXin,SunJianGunagdongUniversityofTechno... 相似文献
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SIMULATIONSTUDYONCAPACITORDISCHARGEPERCUSIONWELDINGShanPingWangXuTianjinUniversityAbstractBasedonthenetworktheory,thedischarg... 相似文献
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《机械工程学报(英文版)》1997,(1)
INVESTIGATIONONCOMPRESSIBILITYANDBULKMODULUSOFFLUIDCaoBinggangXi'anJiaotongUniversityAbstractTheproblemsinthetraditionaldefin... 相似文献
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Li Zhongyou Jao JudongShandong University of Technology South China University of Technology 《机械工程学报(英文版)》1997,(2)
EDGEPROCESSONARCWELDINGINVERTERCOMMUTATINGLiZhongyou,JaoJudongShandongUniversityofTechnology,SouthChinaUniversityofTechnology... 相似文献
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NEWAUTOREGRESSIVEMOVINGAVERAGESPECTRUMESTIMATIONANDCEPSTRUMALGORITHMZhouZhaojing,ChengJieChinaInstituteofMetrologyAbstractBas... 相似文献
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《机械工程学报(英文版)》1997,(3)
NEWAPPROACHFORSOLVINGRESTRICTEDTORSIONPROBLEMSLiuJianjun,FuBaolianYanShanUniversityAbstractThereciprocaltheoremmethod(RTM)isp... 相似文献
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ANALOGSIMULATIONOFDYNAMICRESPONSEINDRYFRICTIONPAIRBYTHERMODYNAMICS¥JinChangshan;EKannatey-Asibu,Jr(HarbininstituteofTechnolog... 相似文献
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《机械工程学报(英文版)》1996,(1)
SHAKINGMOMENTBALANCINGOFSPATIALLINKAGESBYADDINGPLANARCAMSHanJianyou;(BeijingUniversityofScienceandTechnology)HuangZhen(Yansha... 相似文献
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光纤连接器端面研磨装置运动分析 总被引:4,自引:1,他引:3
分析了一种具有两个自由度的双驱动行星式光纤连接器端面研磨装置的运动原理,并求解出光纤连接器在研磨时相对于研磨盘(研磨砂纸)的运动轨迹。通过引入定义"速比",建立了研磨装置两个独立主动件之间的转速关系。针对光纤连接器研磨中存在的问题,从速比入手,以运动轨迹曲线、研磨运动路程偏差、切削速度、速度周期变换系数为纽带,将研磨运动、研磨工艺以及研磨质量联系起来,得出了一组优化的光纤连接器研磨装置的运动参数。当系杆的转速设定为132 r/min时,根据粗、精研磨不同的工艺要求,其内齿轮的转速应在31~54 r/min调整。此时,速度周期变换系数小于2.2;运动路程偏差小于0.5%;研磨运动轨迹密集而不重复。实验证明了分析结果的正确。 相似文献
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本文探讨了固着麻料研磨机械密封中,一些主要研磨参数,如产粒度,研磨压力和研磨速度等对工件已加工表面磨耐磨性的影响规律,为合理选择研磨参数提供依据。 相似文献
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Double-sided lapping is an precision machining method capable of obtaining high-precision surface. However, during the lapping process of thin pure copper substrate, the workpiece will be warped due to the influence of residual stress, including the machining stress and initial residual stress, which will deteriorate the flatness of the workpiece and ultimately affect the performance of components. In this study, finite element method (FEM) was adopted to study the effect of residual stress-related on the deformation of pure copper substrate during double-sided lapping. Considering the initial residual stress of the workpiece, the stress caused by the lapping and their distribution characteristics, a prediction model was proposed for simulating workpiece machining deformation in lapping process by measuring the material removal rate of the upper and lower surfaces of the workpiece under the corresponding parameters. The results showed that the primary cause of the warping deformation of the workpiece in the double-sided lapping is the redistribution of initial residual stress caused by uneven material removal on the both surfaces. The finite element simulation results were in good agreement with the experimental results. 相似文献
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