共查询到20条相似文献,搜索用时 218 毫秒
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研究了能量为1 MeV的电子辐照对三结GaAs激光电池(LPC)性能的影响。不同剂量电子辐照后三结GaAs LPC光照下的I-V特性测试结果表明,三结GaAs LPC短路电流、开路电压和最大输出功率的衰减随电子辐照剂量的提高而增大。通过测量不同波长激光照射下三结GaAs LPC的宽电压范围I-V曲线,确定了各子电池对应的光生电流,结果显示各子电池光生电流衰减随辐照剂量增加而不同程度地增大,越靠近衬底的子电池电流衰退越严重。利用wxAMPS软件模拟了各子电池光生电流随缺陷密度的变化关系,结合实验和模拟结果得到了各子电池辐照后的缺陷密度及缺陷引入率,结果表明各子电池受电子辐照后的缺陷引入率大致相同,约为6.7。可通过优化各结子电池厚度达到提高三结GaAs LPC抗辐照性能的目的。 相似文献
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本文对异质结双极晶体管(HBT)电压比较器进行了理论分析,设计并制作了国内第一个AlGaAs/GaAs HBT电压比较器电路。首先,分析了HBT的基本工作原理;然后比较详细地分析了ECL电压比较器的工作原理并进行了设计。随后介绍了HBT的E-M模型,提取了模型参数,并对电路进行了模拟;最后全面介绍了AlGaAs/GaAs HBT电压比较器的制作过程。测试结果表明,HBT器件直流电流增益大于100,f_T为15.2GHz,f_(max)为14.8GHz;电路具有取样和锁存能力,并具有电压比较器的初步功能。 相似文献
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研究了国产SiGe异质结双极晶体管(HBT)60Co γ射线100Gy(Si)~10kGy(Si)总剂量辐照后的辐照效应及辐照后的退火特性.测试了辐照及退火后的直流电参数.实验结果显示,辐照后基极电流(Ib)明显增大,而集电极电流(Ic)基本不变,表明Ib的增加是电流增益退化的主要原因.退火结果表现为电流增益(β=Ic/Ib)继续衰降,表明SiGe HBT具有"后损伤"效应.对其机理进行了探讨,结果表明其主要原因是室温退火中界面态继续增长引起的. 相似文献
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Chen J.J. Gao G.-B. Chyi J.-I. Morkoc H. 《Electron Devices, IEEE Transactions on》1989,36(10):2165-2172
Avalanche breakdown behavior at the collector junction of the GaAs/AlGaAs HBT (heterojunction bipolar transistor) has been studied. Junction breakdown characteristics displaying hard breakdown, soft breakdown, and negative resistance breakdown behavior were observed and are interpreted by analysis of localized microplasma effects, uniform microplasma-free behavior, and associated current gain measurements. Light emission from the collector-base junction of the GaAs/AlGaAs HBT was observed and used to investigate breakdown uniformity. Using a simple punchthrough breakdown model, the theoretical breakdown curves at different collector doping concentrations and thicknesses were computed and found to be in agreement with maximum breakdown voltages measured from devices displaying the most uniform junction breakdown. The serious current gain degradation of GaAs/AlGaAs HBTs at low current densities was analyzed in connection with the measurement of a large collector-emitter breakdown voltage. The unexpected functional relationship between the collector-emitter breakdown voltage and collector-base breakdown voltage is explained by the absence of a hole-feedback effect for devices not exhibiting transistor action 相似文献
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Jing-Yuh Chen Der-Feng Guo Shiou-Ying Cheng Kuan-Ming Lee Chun-Yuan Chen Hung-Ming Chuang Ssu-Yi Fu Wen-Chau Liu 《Electron Device Letters, IEEE》2004,25(5):244-246
The dc characteristics of an interesting InP-InGaAs heterojunction bipolar transistor (HBT) with a superlattice (SL) structure incorporated in the base-collector (B-C) junction are demonstrated. In the SL structure, holes injected from the collector collide with holes confined in the SL and impact them out of the SL across the valence-band discontinuities. With a collector-emitter (C-E) voltage V/sub CE/ less than the C-E breakdown voltage BV/sub CE0/, the current gain can be increased at base-current inputs because the released holes from the SL inject into the base to cause the emitter-base junction operating under more forward-biased condition. An ac current gain up to 204 is obtained. At base-emitter voltage V/sub BE/ inputs, the released holes travel to the base terminal to decrease the base current. The studied HBT exhibits common-emitter current gains exceeding 47 at low current levels and useful gains spreading over seven orders of magnitude of collector current. 相似文献
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Mochizuki K. Welty R.J. Asbeck P.M. Lutz C.R. Welser R.E. Whitney S.J. Pan N. 《Electron Devices, IEEE Transactions on》2000,47(12):2277-2283
This paper describes a novel heterojunction bipolar transistor (HBT) structure, the collector-up tunneling-collector HBT (C-up TC-HBT), that minimizes the offset voltage V/sub CE,sat/ and the knee voltage V/sub k/. In this device, a thin GaInP layer is used as a tunnel barrier at the base-collector (BC) junction to suppress hole injection into the collector, which results in small V/sub CE,sat/. Collector-up configuration is used because of the observed asymmetry of the band discontinuity between GaInP and GaAs depending on growth direction. To minimize V/sub k/, we optimized the epitaxial layer structure as well as the conditions of ion implantation into the extrinsic emitter and post-implantation annealing. The best results were obtained when a 5-nm-thick 5/spl times/10/sup 17/-cm/sup -3/-doped GaInP tunnel barrier with a 20-nm-thick undoped GaAs spacer was used at the BC junction, and when 2/spl times/10/sup 12/-cm/sup -2/ 50-keV B implantation was employed followed by 10-min annealing at 390/spl deg/C. Fabricated 40/spl times/40-/spl mu/m/sup 2/ C-up TC-HBTs showed almost zero V/sub CE,sat/ (<10 mV) and a very small V/sub k/ of 0.29 V at a collector current density of 4 kA/cm/sub 2/, which are much lower than those of a typical GaInP/GaAs HBT. The results indicate that the C-up TC-HBT's are attractive candidates for high-efficiency high power amplifiers. 相似文献
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Mochizuki K. Tanaka K.-I. Uchiyama H. Ohta H. Terano A. Kikawa T. Taniguchi T. Mita R. 《Electron Devices, IEEE Transactions on》2005,52(10):2144-2149
To characterize and model the degradation of collector-up (C-up) heterojunction bipolar transistors (HBTs), we bias stress InGaP/GaAs C-up tunneling-collector HBTs (TC-HBTs) fabricated under various conditions for etching the collector mesas and of implanting boron ions into the extrinsic emitter. Contrary to the previous reports on reduction in collector current I/sub C/ of bias-stressed emitter-up HBTs fabricated with ion implantation, no I/sub C/ Gummel shift is observed in the case of C-up TC-HBTs, probably due to the lower damage resulting from the lower ion dosage. On the other hand, the base current of the bias-stressed C-up TC-HBTs increases with the decrease of the ion dose and with the increase of the collector mesa undercut under the collector electrode that is also used as an implant mask. We attribute the increased base current to the increased carrier recombination at the extrinsic base surface. Making the area of the emitter-base junction smaller than that of the base-collector junction-using electron-cyclotron resonance plasma etching together with lateral spreading of heavily implanted boron ions-results in a stable current gain even after a 1030-h testing at a junction temperature of 210/spl deg/C and a collector current density of 40/sup 2/kA/cm. 相似文献
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An AlGaAs/GaAs double-heterostructure-emitter bipolar transistor (DHEBT) fabricated by molecular beam epitaxy (MBE) is presented. The use of a structure symmetrical with respect to the base layer results in bidirectional transistor and switching behavior. Due to a significant area difference between emitter-base and base-collector junction, an asymmetrical property is observed. With an emitter edge-thinning design, the transistor performance may be further improved. A common-emitter current gain of up to 140 with a negligible collector-emitter offset voltage (~40 mV) is achieved. A bidirectional S-shaped negative-differential-resistance (NDA) phenomenon occurs at high V CE bias voltage. The temperature dependence of the NDR is investigated. A three-terminal-controlled switching device is found to perform well when the control current is introduced into the base electrode 相似文献
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Yong Zhong Xiong Geok-Ing Ng Hong Wang Fu J.S. 《Electron Devices, IEEE Transactions on》2001,48(10):2192-2197
DC and microwave noise transient behavior of InP/InGaAs double heterojunction bipolar transistor (DHBT) with polyimide passivation is reported in this paper for the first time. The base transient current is believed to be due to the change of surface potential near the base-emitter junction perimeter at the polyimide/emitter interface resulting from a decrease in the amount of trapped electrons in the polyimide. We also find that the surface potential on the sidewall of collector-emitter affected by the charge trapping and detrapping in polyimide may induce a parasitic polyimide field effect transistor along the surface of the base-collector junction which results in an excess collector transient current. These base and collector current transients result in associated transient of broadband shot noise. The time dependence of microwave noise figures due to the excess transients is also investigated. The better understanding of the mechanisms of the noise transient behavior of the InP HBT device is very useful to improve the device and circuit reliability 相似文献
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In0.49Ga0.51P/GaAs double-barrier bipolar transistors (DBBTs) grown by gas-source molecular beam epitaxy (GSMBE) have been fabricated and measured. This structure has two InGaP barrier layers (100 Å in thickness): one is inserted between the emitter-base (e-b) junction and the other between the base-collector (b-c) junction. An offset voltage of 26 mV and a differential current gain of 120 at room temperature were obtained with a heavily doped p+ (2×1019 cm-3) base (500 Å in thickness). The small offset voltage was attributed to the similar structure of the e-b and b-c junctions and to the suppression of the hole injection current into the collector by the InGaP hole barrier at the b-c junction 相似文献
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Liu W. Seabaugh A.C. Henderson T.S. Yuksel A. Beam E.A. III Fan S. 《Electron Devices, IEEE Transactions on》1993,40(8):1384-1389
Negative differential resistance (NDR) has been observed at room temperature in GaInP/GaAs double-heterojunction bipolar transistors (DHBTs). Both the common-emitter and common-base current-voltage characteristics and their magnetic field dependence have been studied to confirm that the observed NDR is due to resonant tunneling. The collector-base voltages at which the collector current resonances occur are calculated and are consistent with the measured values. The devices exhibit an offset voltage of 57 mV and saturation voltage of ⩽ 2-V, both of which are the lowest reported values for GaInP/GaAs DHBTs. The collector-base breakdown voltage in these DHBTs is 31 V, and its variation with junction temperature is measured and described 相似文献
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Fregonese S. Avenier G. Maneux C. Chantre A. Zimmer T. 《Electron Devices, IEEE Transactions on》2006,53(2):296-303
Heterojunction bipolar transistor (HBT) fabrication on thin-film silicon-on-insulator (SOI) has been recently demonstrated. Due to the space volume constraint (thin film) for the device fabrication, the HBT structure is different from bulk HBT. In fact, compared to a bulk device, the buried layer has been suppressed and a lateral collector contact configuration is introduced. This device features a vertical expansion followed by a lateral expansion of the base-collector space charge region. This nonconventional charge behavior induces a kink in the base-collector junction capacitance characteristics, and as a consequence a modified Early effect. Furthermore, the low current transit time is modified compared to a bulk HBT. In this paper, all these effects are analyzed and a compact model for SOI-HBT is proposed. The model is validated on real SOI-HBTs with different collector doping levels. 相似文献