An embedded 32-b microprocessor core for low-power andhigh-performance applications

An embedded RISC microprocessor core fabricated in a six-layer metal 0.18-μm CMOS process implementing the ARM^TM V.5TE instruction set is described. The core described is the first implementation of the Intel XScale Microarchitecture^TM. The microprocessor core, which includes caches, memory management units, and a bus controller, comprises a hard-embedded block 16.77 mm² in size. The implementation is primarily custom logic in a variety of circuit styles. The processor dissipates 450 mW at 1.3 V, 600 MHz, and scales between 55 mW at 0.7 V, 200 MHz, and 900 mW at 1.65 V 800 MHz. Architectural performance is 1000 MIPS at 800 MHz with efficiency ranging from over 850 MIPS/W at 1.65 V to over 4500 MIPS/W at 0.75 V. Architectural and circuit design approaches for low power and high performance are described and measured results from the initial implementation are shown. The first implementation VLSI chip has a 3.3-V pin interface and supports a 0.75-1.65-V core voltage range     

CMOS/SOS serial-parallel multiplier

A 24-bit serial-parallel multiplier was integrated in CMOS/silicon-on-sapphire (SOS) technology on a 155 mil/spl times/170 mil chip. The operation of this multiplier is described, showing how the parallel loaded multiplier x combines with the serial loaded multiplicand, a, to form the serial product. An addend, b, can also be accommodated to produce ax+b. The design of the multiplier cells are based on functional majority logic adders and weak or trickle inverter master-slave latches. The chip operates at clock rates up to 18 MHz. Power dissipation at 10 MHz and V/SUB DD/ of 5 V is about 20 mW, and the energy consumption for multiplying two 16-bit numbers is about 64 nJ. Typical application areas are mentioned.     

A 1-V programmable DSP for wireless communications [CMOS]

In an effort to extend battery life, the manufacturers of portable consumer electronics are continually driving down the supply voltages of their systems. For example, next-generation cellular phones are expected to utilize a 1-V power supply for their digital component. To address this market, an energy-efficient, programmable digital signal processing (DSP) chip that operates from a 1-V supply has been designed, fabricated, and tested. The DSP features an instruction set and micro-architecture that are specifically targeted at wireless communication applications and that have been carefully optimized to minimize power consumption without sacrificing performance. The design utilizes a 0.35-μm dual-V_t technology with 0.25-μm minimum gate lengths that enables good performance at 1 V. Specifically, the chip dissipates 17 mW at 1 V, achieving 63-MHz operation with a power-performance metric of 0.21 mW/MHz     

A 160-MHz, 32-b, 0.5-W CMOS RISC microprocessor

This paper describes a 160 MHz 500 mW 32 b StrongARM(R) microprocessor designed for low-power, low-cost applications. The chip implements the ARM(R) V4 instruction set and is bus compatible with earlier implementations. The pin interface runs at 3.3 V but the internal power supplies can vary from 1.5 to 2.2 V, providing various options to balance performance and power dissipation. At 160 MHz internal clock speed with a nominal Vdd of 1.65 V, it delivers 185 Dhrystone 2.1 MIPS while dissipating less than 450 mW. The range of operating points runs from 100 MHz at 1.65 V dissipating less than 300 mW to 200 MHz at 2.0 V for less than 900 mW. An on-chip PLL provides the internal clock based on a 3.68 MHz clock input. The chip contains 2.5 million transistors, 90% of which are in the two 16 kB caches. It is fabricated in a 0.35-μm three-metal CMOS process with 0.35 V thresholds and 0.25 μm effective channel lengths. The chip measures 7.8 mm×6.4 mm and is packaged in a 144-pin plastic thin quad flat pack (TQFP) package     

A Chip for Linearization of RF Power Amplifiers using Predistortion based on a Bit-Parallel Complex Multiplier

This paper presents a custom chip for linearization of RF power amplifiers using digital predistortion. The chip has been implemented in a standard digital 0.8 m CMOS process with standard static cells and single-phase clocking. A systolic complex multiplier based on distributed arithmetic constitutes the core of the chip. The nonlinear function is realized with a look-up table containing complex gain factors applied to the complex multiplier. Maximum clock frequency was found by means of simulation to be 105 MHz corresponding to 21 Msamples/s throughput with 3 W power consumption using 5 V supply voltage. The fabricated chip is fully functional and has been measured up to 60 MHz clock frequency with 825 mW power consumption with 3.3 V supply voltage. Operation at 1.5 V supply voltage allows 10 MHz clock frequency with 35 mW power consumption.     

AsAP: An Asynchronous Array of Simple Processors

An array of simple programmable processors is implemented in 0.18 mum CMOS and contains 36 asynchronously clocked independent processors. Each processor occupies 0.66 and is fully functional at a clock rate of 520-540 MHz at 1.8 V and over 600 MHz at 2.0 V. Processors dissipate an average of 32 mW under typical conditions at 1.8 V and 475 MHz, and 2.4 mW at 0.9 V and 116 MHz while executing applications such as a JPEG encoder core and a fully compliant IEEE 802.11 a/g wireless LAN baseband transmitter.     

嵌入式Flash CISC/DSP微处理器的研究与实现

本文研究一种新的既具有微控制器功能,又有增强DSP功能的高性能微处理器的实现架构.在统一的增强CISC指令集下,我们将基于哈佛和寄存器-寄存器结构的微处理器模块和单周期乘法/累加器、桶形移位寄存器、无开销循环及跳转硬件支持模块、硬件地址产生器等DSP功能模块以及嵌入式Flash Memory和指令队列缓冲器有机的集成起来,在统一架构下通过单核实现CISC/DSP微处理器,有效地提高了处理器的性能.该微处理器采用0.35μm CMOS工艺实现,芯片面积为25mm².在80M工作频率下,动态功耗为425mW,峰值数据处理能力可达80MIPS.该处理器核可满足片上系统(SOC)对高性能处理器的需求.     

A single-chip, 1.6-billion, 16-b MAC/s multiprocessor DSP

An MIMD multiprocessor digital signal-processing (DSP) chip containing four 64-b processing elements (PE's) interconnected by a 128-b pipelined split transaction bus (STBus) is presented. Each PE contains a 32-b RISC core with DSP enhancements and a 64-b single-instruction, multiple-data vector coprocessor with four 16-b MAC/s and a vector reduction unit. PEs are connected to the STBus through reconfigurable dual-ported snooping L1 cache memories that support shared memory multiprocessing using a modified-MESI data coherency protocol. High-bandwidth data transfers between system memory and on-chip caches are managed in a pipelined memory controller that supports multiple outstanding transactions. An embedded RTOS dynamically schedules multiple tasks onto the PEs. Process synchronization is achieved using cached semaphores. The 200-mm², 0.25-μm CMOS chip operates at 100 MHz and dissipates 4 W from a 3.3-V supply     

Design and Implementation of a High-Performance and Complexity-Effective VLIW DSP for Multimedia Applications

This paper presents the design and implementation of a novel VLIW digital signal processor (DSP) for multimedia applications. The DSP core embodies a distributed & ping-pong register file, which saves 76.8% silicon area and improves 46.9% access time of centralized ones found in most VLIW processors by restricting its access patterns. However, it still has comparable performance (estimated in cycles) with state-of-the-art DSP for multimedia applications. A hierarchical instruction encoding scheme is also adopted to reduce the program sizes to 24.1∼26.0%. The DSP has been fabricated in the UMC 0.13 μm 1P8M Copper Logic Process, and it can operate at 333 MHz while consuming 189 mW power. The core size is 3.2 × 3.15 mm² including 160 KB on-chip SRAM.

A 2 V 1.8 GHz fully integrated CMOS dual-loop frequency synthesizer

A 2 V 1.8 GHz fully integrated CMOS dual-loop frequency synthesizer is designed in a standard 0.5 /spl mu/m digital CMOS process for wireless communication. The voltage-controlled oscillator (VCO) required for the low-frequency loop is designed using a ring-type VCO and achieves a tuning range of 89% from 356 to 931 MHz and a phase noise of -109.2 dBc/Hz at 600 kHz offset from 856 MHz. With an active chip area of 2000/spl times/1000 /spl mu/m/sup 2/ and at a 2 V supply voltage, the whole synthesizer achieves a tuning range from 1.8492 to 1.8698 GHz in 200 kHz steps with a measured phase noise of -112 dBc/Hz at 600 kHz offset from 1.86 GHz. The measured settling time is 128 /spl mu/s and the total power consumption is 95 mW.     

A low-power 128-tap digital adaptive equalizer for broadband modems

This paper describes a modem receiver chip containing two 64-tap adaptive finite impulse response (FIR) filters configured in parallel as in-phase and quadrature-phase filters. Each filter has a span of 16 symbols and can be configured for T/2, T/3, or T/4 fractional spacing. A zero-latency pipeline technique is used that allows adaptive filters of arbitrary length without degrading the speed. Power is saved at the algorithmic, architectural, and circuit levels. The chip has support for dynamically tuning coefficient precision, updating rates and filter lengths to reduce power consumption. The chip was fabricated in 0.5-μm CMOS technology and consumes 535 mW of power when operating at 50 MHz with 128 taps, T/4 spacing, and symbol-rate power-of-two LMS updating. This can be further reduced to 280 mW using dynamic power reduction techniques. The power in the FIR filter is 162 mW with maximum precision converged coefficients which corresponds to 5.1 mW per multiply-accumulate operation     

A 64-point Fourier transform chip for high-speed wireless LAN application using OFDM

In this paper, we present a novel fixed-point 16-bit word-width 64-point FFT/IFFT processor developed primarily for the application in an OFDM-based IEEE 802.11a wireless LAN baseband processor. The 64-point FFT is realized by decomposing it into a two-dimensional structure of 8-point FFTs. This approach reduces the number of required complex multiplications compared to the conventional radix-2 64-point FFT algorithm. The complex multiplication operations are realized using shift-and-add operations. Thus, the processor does not use a two-input digital multiplier. It also does not need any RAM or ROM for internal storage of coefficients. The proposed 64-point FFT/IFFT processor has been fabricated and tested successfully using our in-house 0.25-/spl mu/m BiCMOS technology. The core area of this chip is 6.8 mm/sup 2/. The average dynamic power consumption is 41 mW at 20 MHz operating frequency and 1.8 V supply voltage. The processor completes one parallel-to-parallel (i.e., when all input data are available in parallel and all output data are generated in parallel) 64-point FFT computation in 23 cycles. These features show that though it has been developed primarily for application in the IEEE 802.11a standard, it can be used for any application that requires fast operation as well as low power consumption.     

A 640-Mb/s 2048-bit programmable LDPC decoder chip

A 14.3-mm/sup 2/ code-programmable and code-rate tunable decoder chip for 2048-bit low-density parity-check (LDPC) codes is presented. The chip implements the turbo-decoding message-passing (TDMP) algorithm for architecture-aware (AA-)LDPC codes which has a faster convergence rate and hence a throughput advantage over the standard decoding algorithm. It employs a reduced complexity message computation mechanism free of lookup tables, and features a programmable network for message interleaving based on the code structure. The chip decodes any mix of 2048-bit rate-1/2 (3,6)-regular AA-LDPC codes in standard mode by programming the network, and attains a throughput of 640 Mb/s at 125 MHz for 10 TDMP-decoding iterations. In augmented mode, the code rate can be tuned up to 14/16 in steps of 1/16 by augmenting the code. The chip is fabricated in 0.18-/spl mu/m six-metal-layer CMOS technology, operates at a peak clock frequency of 125 MHz at 1.8 V (nominal), and dissipates an average power of 787 mW.     

基于FPGA技术的板间DSP高速数据通道链路口的设计

提出并实现了DSP板问的高速数据通道链路(Link)口。它采用低电压差分信号(LVDS)协议，把DSP的64b*30MHz数据流转换成4b*600MHz数据流进行板间传输。链路口基于Altera公司的APEXII系列FPGA实现，并很好地应用于TI公司C6414DSP的板问高速数据传输。该设计已成功应用在运动目标红外凝视探测识别跟踪处理器上。     

Chip for wideband digital predistortion RF power amplifierlinearisation

The authors present a custom chip for use in digital predistortion linearisation of RF power amplifiers. The chip is mainly implemented with systolic arrays. At maximum clock-rate, 130 MHz, the throughput is 16 Msamples/s with a 5 V supply voltage and power consumption of 1 W. A throughput of 2 Msamples/s is achieved at a 1.2 V supply voltage with 6 mW power consumption     

A 342 mW Mobile Application Processor With Full-HD Multi-Standard Video Codec and Tile-Based Address-Translation Circuits

A full-HD (1080p30) 500 MHz mobile application processor with an H.264 HP/MPEG-2/MPEG-4 video codec is integrated on a 6.4 × 6.5 mm² die in 65 nm low-power CMOS. With two parallel pipelines for macroblock processing and tile-based address translation circuits, the processor consumes 342 mW in real-time playback of a full-HD H.264 stream from a 64 b width low-power DDR-SDRAM at an operating frequency of 166 MHz at 1.2 V.     

An 800-MHz quadrature digital synthesizer with ECL-compatibleoutput drivers in 0.8 μm CMOS

An 800 MHz quadrature direct digital frequency synthesizer (QDDFS4) chip is presented. The chip synthesizes 12 b sine and cosine waveforms with a spectral purity of -84.3 dBc, The frequency resolution is 0.188 Hz with a corresponding switching speed of 5 ns and a tuning latency of 47 clock cycles. The chip is also capable of frequency and phase modulation. ECL-compatible output drivers are provided to facilitate I/O compatibility with other high speed devices. A high gain amplifier at the clock input enables the QDDFS4 chip to be clocked with ac-coupled RF signal sources with peak-to-peak voltage swings as small as 0.5 V. The 0.8 μm triple level metal N well CMOS chip has a complexity of 94000 transistors with a core area of 5.9×6.7 mm². Power dissipation is 3 W at 800 MHz and 5 V     

A 2.6-V, 44-MHz all-digital QPSK direct-sequence spread-spectrumtransceiver IC [wireless LANs]

In this paper, an all-digital differentially encoded quaternary phase shift keying (DEQPSK) direct sequence spread-spectrum (DSSS) transceiver is proposed. The transceiver consists of two parts: a baseband/IF spread-spectrum transmitter and a coherent intermediate frequency (IF) receiver. The center frequency of this IF receiver is 11 MHz and the sampling rate is 44 Msamples/s. Modulation/demodulation, carrier recovery, PN acquisition, and differential coding are all provided within a single chip. Functional optimization and architecture design were performed before layout implementation. The 0.8-μm N-well CMOS chip has a complexity of 56000 transistors with a core area of 3.5×3.5 mm². Power dissipation is 92 and 145 mW at 2.6 and 3.3 V, respectively     

A 14 mW 2.5 MS/s 14 bit Σ∆ Modulator Using Split-Path Pseudo-Differential Amplifiers

This paper presents the design and experimental results of a 1.25 MHz signal bandwidth 14 bit CMOS SigmaDelta modulator. With our proposed switched-capacitor split-path pseudo-differential amplifiers, this modulator achieves high power efficiency, high sampling frequency, and small die area. A new signal and reference front-end sampling network eliminates the input common-mode voltage and reduces power consumption and linearity requirement of the opamp. A prototype chip has been designed and fabricated in a 0.25 mum CMOS technology with a core area of 0.27 mm². Experimental results show that an 84 dB dynamic range is achieved over a 1.25 MHz signal bandwidth when clocked at 125 MHz. The power dissipation is 14 mW at 2.4 V including on-chip voltage reference buffers.     

用于高能物理实验电子读出芯片的低噪声锁相环芯片设计

基于TSMC 180 nm工艺设计并流片测试了一款用于高能物理实验的电子读出系统的低噪声、低功耗锁相环芯片。该芯片主要由鉴频鉴相器、电荷泵、环路滤波器、压控振荡器和分频器等子模块组成,在锁相环电荷泵模块中,使用共源共栅电流镜结构精准镜像电流以减小电流失配和用运放钳位电压进一步减小相位噪声。测试结果表明,该锁相环芯片在1.8 V电源电压、输入50 MHz参考时钟条件下,可稳定输出200 MHz的差分时钟信号,时钟均方根抖动为2.26 ps(0.45 mUI),相位噪声在1 MHz频偏处为-105.83 dBc/Hz。芯片整体功耗实测为23.4 mW,锁相环核心功耗为2.02 mW。