巨磁电阻隔离器中自旋阀材料及结构研究

为得到矫顽力和工作偏置点都合适的自旋阀结构,实验中采用NiFe/CoFe复合层作为自旋阀自由层并通过调节NiFe和CoFe的厚度来控制自旋阀的矫顽力和灵敏度,并通过调节自旋阀中金属隔离层的厚度来控制自旋阀工作偏置点的位置。结果表明得到合适的自旋阀结构。在此基础上,采用光刻剥离工艺,制作两组折线形自旋阀巨磁电阻条样品,其磁化方向分别沿电阻条的长轴和短轴。测试结果表明磁化方向沿电阻条长轴的样品,矫顽力大小和工作偏置点稳定,灵敏度在电阻条宽度很小时有所减小;磁化方向沿电阻条短轴的样品,矫顽力和灵敏度大小稳定,而工作偏置点的位置随着电阻条宽度的减小逐渐偏离自旋阀钉扎场的方向。     

基于非晶软磁层的巨磁电阻单元性能研究

采用剥离工艺制备了单元大小为10μm×18μm的CoNbZr/Co/Cu/Co和NiFe/Co/Cu/Co多层膜结构的3×3自旋阀单元阵列,并测试了自旋阀单元的静态和动态巨磁电阻特性.结果表明CoNbZr层对快速磁场变化具有良好的线性响应特性.与NiFe/Co/Cu/Co自旋阀单元相比,微米尺度的CoNbZr/Co/Cu/Co自旋阀单元具有更良好的自旋电子特性,可以应用到包括MRAM器件在内的自旋电子器件中.     

质子辐照对多层膜巨磁电阻结构磁性能的影响

研究了质子辐照对多层膜巨磁电阻结构磁性能的影响。利用5 MeV的不同辐照剂量和剂量率的质子对磁控溅射法制备的CoFe/(CoFe/Cu)₁₀/CoFe/Ta多层膜巨磁电阻结构进行辐照实验。XRD分析表明质子辐照没有改变CoFe/Cu的晶格结构。分析磁滞回线和磁电阻曲线得知在实验选取的辐照剂量范围内, 饱和磁化强度和本征电阻随着辐照剂量的增加而增加, 而矫顽场和磁电阻率随剂量的增加而减小。利用质子辐照对自旋相关散射、平均自由程的影响解释了本征电阻的变化, 并基于二流体模型对磁电阻率的变化进行了分析。由此得出, 多层膜巨磁电阻结构具有一定的抗辐照能力。     

磁控溅射法制备IrMn顶钉扎自旋阀研究

通过高真空直流磁控溅射的方法,在玻璃和硅上淀积了结构为Ta/NiFe/CoFe/Cu/CoFe/IrMn/Ta的IrMn顶钉扎自旋阀薄膜。通过结构的改善和工艺条件的优化,自旋阀的磁电阻率达到9.12％,矫顽力为1.04×(10~3/4π)A/m。研究了Ta缓冲层厚度(小于6nm)对晶格结构和自旋阀性能的影响。结果表明,Ta为3nm时自旋阀磁电阻率最大,而矫顽力随着Ta厚度增大而减小。利用CoFe/Cu/CoFe SAF结构替换掉与IrMn相邻的CoFe被钉扎层,使交换偏置场从原来没有SAF的180×(10~3/4π)A/m上升到600×(10~3/4π)A/m左右,且交换偏置场随着SAF结构中两层CoFe的厚度差减小而增大。研究了RIE对自旋阀性能的影响,发现2min的RIE能使矫顽力减小33％,而磁电阻率几乎不受影响。     

自旋阀多层膜磁化翻转场的调控和磁电阻特性

用磁控溅射方法制备Ta/CoFe/Fe/Au/Fe/IrMn/Ta和Ta/CoFe¹/Au/CoFe²/IrMn/Ta两种多层膜结构的自旋阀,并优化各功能层的溅射参数有效调控了磁化翻转场和磁电阻特性。根据TEM确定了样品多层膜的微观结构和膜厚,使用VSM和加磁场四探针法分别测量了样品的磁滞回线和磁电阻(MR)特性曲线。结果表明,样品中隔离层Au的厚度与MR值之间存在振荡衰减的关系;而钉扎层、自由层和被钉扎层的厚度直接影响各膜层的矫顽力和饱和磁化强度等磁学性能,进而改变MR值。各层厚度为6/6/3.8/6/9/6 nm的Ta/CoFe¹/Au/CoFe²/IrMn/Ta结构自旋阀,具有最佳的MR值。     

La-Ca-Mn-O巨磁电阻薄膜的电阻变化

研究了类钙铁矿结构La0.67Ca033MnOx巨磁电阻薄膜(生长在LaAlO3衬底)的电阻变化,观察到负巨磁电阻效应,讨论了优化制备工艺提高巨磁电阻效应和最大电阻温度,其效应可用于设计新电磁器件。同时讨论了巨磁电阻效应的机理,给出合理解释。     

NiO／NiFeCo／Cu／NiFeCo自旋阀结构的巨磁电阻效应及影响因素的研究

用电子蒸发的方法制备ＮｉＯ／ＮｉＦｅＣ／Ｃｕ／ＮｉＦｅＣｏ自旋阀多层膜,通过磁场中退火得到好的偏置型自旋阀ＧＭＲ效应。通过对制备态以及磁场退火后样品的ＭＲ曲线的研究,讨论了交换耦合作用,单层磁性能以及层间耦合作用对材料ＧＭＲ效应的大小和磁场灵敏度的影响,得出提高交换耦合作用,改善单层磁性能和尽可能减小层间耦合将有得于得到高性能的偏置型自旋阀ＧＭＲ材料的结论。     

磁性多层膜的正巨磁电阻特性

采用离子束溅射方法制备了正巨磁电阻多层膜，在制备过程中采用外加磁场和退火处理。在室温条件下多层膜的巨磁电阻效应达到200％～300％，并用磁矩取向的双电流导电模型对正磁电阻的机理进行了解释。     

磁控溅射法制备IrMn底钉扎自旋阀研究

采用高真空直流磁控溅射的方法,在玻璃衬底上制备了结构为Ta／buffer layer／IrMn／CoFe／Cu／CoFe／NiFe／Ta的IrMn底钉扎自旋阀。研究了NiFe和Cu作为缓冲层对自旋阀磁性能的影响,并对缓冲层厚度进行了参数优化,当缓冲层厚度为2nm时自旋阀各项性能达到最佳。研究了退火制度对底钉扎自旋阀性能的影响,得到了30000e强磁场下200℃保温1h为最佳处理条件。通过结构的改善和工艺的优化,得到的底钉扎自旋阀的磁电阻率8．51％,矫顽场为0．50e,交换偏置场超过8000e。最后对自旋阀的底钉扎和顶钉扎结构进行了比较。     

多晶La-Pb-Mn-O体材料的巨磁电阻效应

利用固相反应法制备了多晶立方结构的Ｌａ－Ｐｂ－Ｍｎ－Ｏ体材料,材料的铁磁相变温度ＴＣ为２５７Ｋ,其金属－半导体转变温度ＴＰ为２５１Ｋ,外加磁场分别为５Ｔ和１３Ｔ时,材料的巨磁电阻（ＧＭＲ）峰值分别达到了７２％和８５％,在７７Ｋ￣室温的温度范围内,材料都具有ＧＭＲ效应,ＴＰ附近具有ＧＭＲ峰值效应,ＧＭＲ效应与自旋极化行为有关,而ＴＰ附近的ＧＭＲ峰值效应除了与自旋极化子行为有关外,与磁场作用下勒流子自     

First-principles calculations-based model for the reactive ion etching of metal oxide surfaces

A model for the RIE process design of metal oxide surfaces based on density functional theory-based total energy calculations has been developed. Cluster and periodic systems were employed in order to develop the model and hence gain a deeper understanding of the process mechanisms on an atomic scale. In the present study, Fe₃O₄ was used for the cluster system, and NiO for the periodic system as metal oxide surfaces. Possible gas combinations and by-products were studied with the aim of producing a more efficient and effective RIE process for metal oxide thin films. This study can be considered as fundamental groundwork required for the understanding of the reactivity in the etching of metal oxide surfaces and a means of decreasing the processing period of RIE for metal oxide thin films by optimum selection of gas combinations with a knowledge of their probable by-products.     

平行板反应离子刻蚀系统均匀磁场的数值计算

在平行板反应离子刻蚀系统的圆筒形腔体的侧壁上绕上电流线圈后,系统中的磁场强度和均匀性都可进行调节。本文根据螺线管线圈内部磁场的分布规律,通过数值计算的方法在该系统中获得均匀的磁场。     

Etching characteristics of LiNbO3 crystal by fluorine gas plasma reactive ion etching

The etching characteristics of a LiNbO₃ single crystal have been investigated using plasma reactive ion etching (RIE) with a mixture of CF₄/Ar/H₂. The etching rate of LiNbO₃ with the mixture of CF₄/Ar/H₂ gases was evaluated. The etching surface was evaluated by atomic force microscopy, X-ray diffraction and X-ray photoelectron spectroscopy methods. The rate-determining process of RIE is the supply of F radicals in RIE. The surface morphology of the etched LiNbO₃ changed with the increase in the H₂ gas flow ratio. The surface profile became flat, on optimizing the etching conditions, similar to the surface of non-etched LiNbO₃. The X-ray diffraction peakfor etched LiNbO₃ using the mixture of CF₄ and Ar gases did not appear, because a non-crystalline layer was formed. It was found that the crystallinity of the surface is dependent on both, the flow rate of H₂ gas and the etching time. F atoms exist in the contamination layer of the sample etched, using the mixture of CF₄, Ar and H₂ gases. Optimum etching conditions, considering both the surface flatness and the crystallinity, were determined.     

Reactive ion etching of Pt electrode using O2-based plasma

We have studied the reactive ion etching (RIE) of Pt electrode using O₂ plasma with additional gases. Dual frequency RIE tool was used to obtain a high-energy ion bombardment. We have investigated the Pt etching profile using O₂/HBr/Ar plasma. We reveal that there is a optimal gas flow ratio for attaining the node separation of Pt electrodes at small critical-dimension (CD) pattern.     

Influence of composition and particle size on spin dynamics and thermodynamic properties of magnetoresistive perovskites

The thermodynamic behavior and spin dynamics of the colossal magnetoresistive (CMR) perovskites of general formula La(1-x)(A)xMn(1-y)(B)yO3 (where A is an alkaline earth, and B = Al, In) have been studied in order to evidence the effect of composition and the influence of nanocrystallinity on the thermodynamic and magnetic characteristics. By using electron paramagnetic resonance (EPR) spectroscopy, the behavior of the exchange coupling integral (J) between Mn spins and the polaron activation energy (Ea) have been investigated. The thermodynamic properties represented by the relative partial molar free energies, enthalpies and entropies of oxygen dissolution in the perovskite phase, as well as the equilibrium partial pressures of oxygen have been obtained by using solid electrolyte electrochemical cells method. The influence of the oxygen stoichiometry change on the thermodynamic properties was examined using the data obtained by a coulometric titration technique coupled with measurements of the electromotive force (EMF). The results were correlated with the average Mn valence values as determined by redox titration. The properties of the rare-earth manganites are strongly affected by the A- and B-site substitution and by the oxygen nonstoichiometry. New features related to the modifications in properties connected with the nanocrystalline state were evidenced. The correlation existing between the magnetic and thermodynamic characteristics were discussed in relation to significant changes in the overall concentration of defects.     

Etch characteristics of FePt magnetic thin films using inductively coupled plasma reactive ion etching

Etch characteristics of L10 FePt thin films masked with TiN films were investigated using an inductively coupled plasma (ICP) reactive ion etching in a CH₃OH/Ar plasma. As the CH₃OH gas was added to Ar, the etch rates of FePt thin films and TiN hard mask gradually decreased, and the etch profile of FePt films improved with high degree of anisotropy. With increasing ICP rf power and dc-bias voltage to substrate and decreasing gas pressure, the etch rate increased and the etch profile becomes vertical without any redepositions or etch residues. Based on the etch characteristics and surface analysis of the films by X-ray photoelectron spectroscopy, it can be concluded that the etch mechanism of FePt thin films in a CH₃OH/Ar gas does not follow the reactive ion etch mechanism but the chemically assisted sputter etching mechanism, due to the chemical reaction of FePt film with CH₃OH gas.     

Fabrication of nano-scale phase change materials using nanoimprint lithography and reactive ion etching process

Phase change random access memory (PRAM) is one of the most promising non-volatile memories due to its ability to store digital data in the form of crystalline and amorphous phases of phase change materials. As a phase change material, Ge₂Sb₂Te₅ (GST225) is usually used, due to its reversible phase transition capability with speeds of less than 100 ns between the crystalline and amorphous phases. In order to fabricate highly integrated PRAM devices, sub micron- to nanometer-sized patterning of GST225 layer must be accomplished. In this study, 70 nm-sized polymer patterns were fabricated using partial filling nanoimprint lithography (NIL) on a GST225 layer, which was deposited by RF sputtering. Then GST225 was etched using Ar/Cl₂ plasma with an ICP etcher. Etch conditions, including Cl₂ concentration, were optimized to obtain the vertical etch profile of the GST patterns.     

反应离子刻蚀工艺仿真模型的研究

以ＳＦ６／Ｎ２混合气体对Ｓｉ反应离子刻蚀工艺研究为例提出干法刻蚀计算机工艺模拟的方法：在分段拟合优化工艺条件下采用人工神经网络该当建立干法刻蚀仿真模型,可以预测绘定射频功率、总气流量下刻蚀速率和纵横比,并且以仿真实验数据训练模型学习,模型具有通用性,与设备无关。