模具气囊抛光工艺规划方法

针对目前模具抛光工艺规划方法研究的不足,提出一种模具气囊抛光总体工艺规划方法.基于抛光实验,研究了不同磨粒粒度水平下工件表面粗糙度的变化规律及可达的最小粗糙度值,提出一种基于不同抛光阶段中磨粒粒度选取的模具气囊抛光工序规划方法,该方法有助于实现抛光工序的智能规划.最后基于此方法进行了抛光实验,抛光效果较好.     

传热界面真实接触面积计算与分析

在热流通过两相互接触材料尤其是金属材料的界面时，真实接触面积是界面传热的一个主要影响因素。当承受大应力的两接触体之间具有相对滑动或相对滑动趋势时，粗糙表面在压力和粘着力及剪切力的作用下接触粗糙峰发生弹性、弹一塑性或完全塑性变形，真实接触面积与压力之间的关系随变形机制而发生变化，在力的作用下材料的变形机制由表面微观几何形貌和力学性质决定。计算表明，单个粗糙峰接触面积与载荷的关系受变形机制的影响，粘着力对接触面积的影响可以忽略，表面相对滑动将增加真实接触面积。     

气囊抛光工具的研制及特性测试

气囊式抛光是一种新颖的非球面抛光方法。气囊是该方法的关键部件,为控制它的变形和柔性,采用层合复合材料的制作方法,对气囊结构进行改进,然后从机械特性和应用两个方面,对改进的气囊进行试验和分析。研究结果表明,改进后的气囊具有变形小、柔性好的特点,能满足实际应用要求。     

环形气囊抛光技术的研究

气囊式抛光是一种极具发展潜力的抛光方法,在精密光学元件的加工领域具有广阔的应用前景.针对现有气囊式抛光磨头加工方法的不足,提出了一种环形气囊抛光技术,设计了气囊式环形抛光磨头的机械结构.基于环形气囊抛光实验平台,利用气囊式环形抛光磨头进行了工艺试验.实验结果表明,此种抛光技术能够实现光学零件高精度表面质量的加工.     

气囊抛光进动机构的运动建模与仿真

气囊抛光工具的进动由一类特殊的2自由度空间机构实现。针对此2自由度空间机构运动,运用机构学理论,推导了这一空间机构的基本坐标变换,建立了各参数之间的内在关系。在此基础上,根据进动要求建立了这一空间机构的进动运动方程,通过仿真研究了气囊进动过程中运动参数的变化规律。结果表明在进动过程中,合成进动运动的2自由度运动有一定的运动规律,同时所建立的模型为该空间机构的进一步分析和运动控制提供了依据。     

气囊抛光去除函数的数值仿真与试验研究

为提高光学元件的面形精度,提高加工效率,对超精密气囊抛光方法的去除函数进行了理论和试验研究.通过分析气囊抛光的原理,以Preston方程为基础,应用运动学原理推导了气囊抛光"进动"运动的材料去除函数,利用计算机仿真的方法,得到近似高斯分布的去除函数,通过仿真分析几个主要参数对"进动"抛光运动去除特性的影响,总结得到三点气囊抛光工艺过程中重要的结论.通过在一台超精密气囊式智能抛光机上的试验对比,两者吻合很好,并得到面形精度 RMS=0.012 6 μm的超精密的光滑表面,为开展气囊抛光的工艺研究提供了理论依据.     

气囊抛光过程的运动精度控制

针对用于球面、非球面光学元件超精密光学加工的气囊抛光技术,提出了一套控制抛光过程中气囊运动精度的方法。该方法通过控制加工单元的温度,保证抛光过程中设备运动精度达到50μm;使用坐标传递法,使检测数据二维方向对准不确定度达到0.30~0.70mm。另外,基于磨头去除量估计与反馈修正法,提高精抛过程面形误差收敛效率。最后,通过磨头探测校准法,将磨头与加工工件法向位置精度提高至10μm。实际抛光实验显示:使用运动精度控制法在280mm口径的平面精密抛光中获得的面形加工精度为0.8nm(RMS),在160mm口径的凹球面精密抛光中获得的面形加工结果为1.1nm(RMS),实现了超高精度面形修正的目的,为超高精度球面、非球面光学元件加工提供了一套行之有效的方法。该方法同样适用于其他接触式小磨头数控抛光方法。     

一种新型气囊抛光设备及其位置分析

针对气囊抛光的运动特性和要求,提出了一种新型正交5-DOF并联气囊抛光机床,研究了该机床的位置正反解,推导出位置正反解方程,基于该并联机床的结构布局特点,绘制了该机床的工作空间轮廓图,仿真结果适合于气囊抛光的运动要求,为该并联机床的设计及气囊抛光的应用奠定了理论基础.新型5-DOF并联气囊抛光机床具有结构简单、承载能力强、精度高、运动稳定、惯性小、初始装配位姿解耦、工艺性好等优点,可用于空间曲面(磨具、叶片等)零件的加工及精密抛光等领域.     

用于模具自由曲面的新型气囊抛光中磨粒场的分析

为提高模具自由曲面抛光的效率和品质,提出一种基于柔性抛光理念的新型气囊抛光技术。研究了气囊抛光接触区内磨粒的运动轨迹、压力分布和抛光力的分布情况,建立了气囊抛光接触区内磨粒的运动模型、压力模型,揭示了气囊抛光接触区内磨粒直径对抛光力和被加工工件内部剪切应力的影响规律,研究了抛光过程中工件内部的剪切应力分布,明确了材料疲劳去除机理。为气囊抛光的应用奠定了理论基础。     

基于接触特性优化的模具曲面气囊抛光实验研究

为提高模具自由曲面上的气囊抛光加工效果,在六自由度气囊抛光实验平台上对不同曲率半径的二维曲面模具进行了气囊抛光实验研究。首先,研究了模具自由曲面上不同曲率表面对于气囊抛光过程中接触区域的接触面积、接触宽度,接触力和抛光效果的影响规律;在此基础上,提出了在气囊抛光过程中通过调节气囊抛光头的下压量和内部充气压力来改变接触面积、接触宽度和接触力值的方法,使抛光时不同曲率表面接触区域内的平均接触压力相同,且沿运动方向的接触宽度也相同,从而使不同曲率表面在抛光后的抛光质量接近,使整个模具自由曲面的抛光效果达到最佳;最后,运用上述方法对二维曲面模具进行了抛光实验。实验研究结果表明,经过接触特性优化,不同模具曲率表面气囊抛光后接触区域内的抛光质量接近,抛光效果得到提高。     

Hydrodynamic analysis of chemical mechanical polishing process

Chemical Mechanical Polishing (CMP) refers to a material removal process done by rubbing a work piece against a polishing pad under load in the presence of chemically active abrasive containing slurry. The CMP process is a combination of chemical dissolution and mechanical action. The mechanical action of CMP involves hydrodynamic lubrication. The liquid slurry is trapped between the work piece (wafer) and pad (tooling) forming a lubricating film. For the first step to understand the mechanism of the CMP process, hydrodynamic analysis is done with a semiconductor wafer. Slurry pressure distribution, resultant forces and moments acting on the wafer are calculated in typical conditions of the wafer polishing, and then nominal clearance of the slurry film, roll and pitch angles at the steady state are obtained.     

Numerical analysis of hydrodynamic process of circular-translational-moving polishing (CTMP)

By keeping a pad moving relative to a wafer along a circular path without rotation, we developed a polishing technique called circular-translational-moving polishing (CTMP), which permits multidirectional polishing of the work piece and thus bears the advantage of isotropic polishing and a potential increase of material removal rate (MRR) on the wafer. To illuminate the mechanisms of CTMP and determine the optimum process variables in a CTMP process, a three-dimensional hydrodynamic lubrication model for CTMP with a smooth and rigid pad under a quasi-stable state is established in a polar coordinate system. The model equations are further calculated numerically by the finite difference method. The instantaneous distribution of fluid pressure is obtained, which shows that a negative pressure exists. The reason for negative pressure in CTMP and its effect on polishing is discussed. Moreover, the nominal clearance of the fluid film, roll, and pitch angles under different working conditions are obtained in terms of the applied load, moments, and polishing velocity. The obtained numerical analysis can be used as guidance for choosing operation parameters in a practical CTMP application.     

刻面型水晶玻璃研抛工艺研究

针对刻面型水晶玻璃传统磨削加工过程中所用研磨盘、抛光盘存在的缺陷,提出了一种新型的结构化复合弹性研抛盘。通过对刻面型水晶玻璃的传统磨削加工工艺的研究,阐述了水晶玻璃上、下料,研磨和抛光的方法并深入分析其原理。针对不同发展时期的不同类型水晶磨削设备进行了详细地对比和分析,总结了现有水晶加工设备在工作过程中对水晶玻璃球上下料、粗磨、细磨、抛光时所用机构的结构和特点,提出了能进一步提高加工效率、加工精度、自动化程度的意见。研究结果指出了传统加工工艺存在的缺陷,并就其未来的发展进行了展望。     

舟山特定海域三维水流数值模拟研究

舟山海域为长江径流水体南下的必经之路,该海域的水动力条件受周围地形、长江径流以及杭州湾-东海潮流的综合影响,极具特殊性。针对目前缺少特定海域模拟分析的情况,对舟山岛南部至宁波穿山半岛之间特定海域进行了研究。通过建立该海域三维网格模型,结合ADCP走航实验获取实际流速数据,使用Fluent软件进行了数值模拟,以获得该海域流速模型。并在此基础上,对所得模型中流速较大的海域进行了分析研究。研究结果表明:涨潮时,螺头水道最高流速为1.6 m/s~2.1 m/s,出现在摘箬山岛及小猫山南部海域;退潮时,最高流速为1.5 m/s~2.1 m/s,出现在宁波穿山半岛的北侧及螺头水道东段出口边界处,并在宁波穿山半岛北部发现存在近岸"回流"。通过该模型可获得舟山海域实际流速,对于工程应用具有一定的参考价值。     

TI蜗杆传动齿面接触误差的计算与分析

采用CAD三维造型技术与数值计算相结合的方法计算分析了各种加工误差及装配误差对TI蜗杆传动齿面接触的影响。其结果对有效提高TI蜗杆副的制造精度有指导意义。     

Modelling and simulation of structure surface generation using computer controlled ultra-precision polishing

The applications of structured surfaces have been more widespread. However, research on the fabrication of these surfaces is still far from complete. The paper presents a theoretical and experimental investigation of the generation of structured surfaces by using Computer Controlled Ultra-precision Polishing (CCUP). A surface topography simulation model and hence a model-based simulation system for the modelling and simulation of the generation of structure surfaces by using CCUP have been established and verified through a series of simulation and practical polishing experiments. The results of experiments demonstrate the capability of the model-based simulation system in predicting the form error and the pattern of the 3D-texture generated by using CCUP.     

Cutter mark cross method for improvement of contact stiffness by controlling distribution of real contact area

Contact surfaces do not make contact perfectly because such surfaces have a lot of asperities. The real contact area is much smaller than the nominal contact area, and the real contact areas has a non-uniform distribution because of the waviness in the contact surface. The contact stiffness is influenced not only by the deformation of the asperities, but also by the distribution of the real contact areas. In general, a contact surface with a uniform distribution of the real contact areas has greater contact stiffness. However, this requires a grinding finish and costs more than the cutting finish. In this study, a method for uniformly distributing the real contact areas easily, is proposed to improve the contact stiffness of a contact surface finished by cutting. The method is called the cutter mark cross (CMC) method. The allowable waviness in the CMC method is shown. In addition, the effect of the CMC method is investigated by experimentation. The results show that the real contact areas can be distributed uniformly using the CMC method. The horizontal and vertical contact stiffness can also be improved.     

考虑接触特性的滚动轴承系统建模与仿真分析

根据Hertz接触理论和滚动轴承功能原理,以SKF6208深沟球轴承为参考,在ADAMS/View软件环境下设计建立了基于Impact函数的滚动轴承多体动力学仿真模型。通过实体接触条件下的轴承运转过程动态仿真分析,计算获得了滚珠与内圈、外圈及保持架之间的接触力动态分布规律。指出:轴承系统在启动瞬间(0~0.22 s)存在一定滑动,且接触力变化频率较大;进入滚动阶段(0.22~0.4 s)后,接触力变化频率减小,且呈周期性分布。仿真结果验证了滚动轴承的启动打滑现象,符合实际运行工况。为深入研究滚动轴承系统的接触机理及动态载荷提供了技术参考。     

基于有限元法的滚动轴承接触问题研究

依据某汽车专用轴承厂提供的设计图纸利用SolidWorks三维设计软件对轴承代号为30615的汽车专用轴承建立三维几何模型,然后将其导入到SolidWorks设计软件的Simulation仿真模块中,根据轴承实际工作情况对模型添加约束、施加载荷、接触设置等前处理,通过求解计算获得该滚动轴承的接触应力和变形结果云图,可直...     

Review on mechanism and process of surface polishing using lasers

Laser polishing is a technology of smoothening the surface of various materials with highly intense laser beams. When these beams impact on the material surface to be polished, the surface starts to be melted due to the high temperature. The melted material is then relocated from the ‘peaks to valleys’ under the multidirectional action of surface tension. By varying the process parameters such as beam intensity, energy density, spot diameter, and feed rate, different rates of surface roughness can be achieved. High precision polishing of surfaces can be done using laser process. Currently, laser polishing has extended its applications from photonics to molds as well as bio-medical sectors. Conventional polishing techniques have many drawbacks such as less capability of polishing freeform surfaces, environmental pollution, long processing time, and health hazards for the operators. Laser polishing on the other hand eliminates all the mentioned drawbacks and comes as a promising technology that can be relied for smoothening of initial topography of the surfaces irrespective of the complexity of the surface. Majority of the researchers performed laser polishing on materials such as steel, titanium, and its alloys because of its low cost and reliability. This article gives a detailed overview of the laser polishing mechanism by explaining various process parameters briefly to get a better understanding about the entire polishing process. The advantages and applications are also explained clearly to have a good knowledge about the importance of laser polishing in the future.