Dual-Gate MESFET Variable-Gain Constant-Output Power Amplifier

The use of a dual-gate GaAs FET as a broad-band variable gain and constant output power amplifier is described. A five-stage variable gain-constant output power amplifier has been realized which provides a constant output power of 3 dBm (/spl plusmn/2 dB) for a large dynamic range of input power of -45 dBm to 0 dBm over the 4-8-GHz band. The amplifier uses a feed-forward AGC circuit for preadjusting the gain of the amplifier stages depending upon the strength of the signal at the output of preceding stages. The amplifier has the capability of detecting two or more simultaneous RF pulses having different amplitudes and separated by more than 15-ns time intervals. Also it preserves any amplitude modulation of the individual pulse.     

165-GHz Transceiver in SiGe Technology

Two D-band transceivers, with and without amplifiers and static frequency divider, transmitting simultaneously in the 80-GHz and 160-GHz bands, are fabricated in SiGe HBT technology. The transceivers feature an 80-GHz quadrature Colpitts oscillator with differential outputs at 160 GHz, a double-balanced Gilbert-cell mixer, 170-GHz amplifiers and broadband 70-GHz to 180-GHz vertically stacked transformers for single-ended to differential conversion. For the transceiver with amplifiers and static frequency divider, which marks the highest level of integration above 100 GHz in silicon, the peak differential down-conversion gain is -3 dB for RF inputs at 165 GHz. The single-ended, 165-GHz transmitter output generates -3.5 dBm, while the 82.5-GHz differential output power is +2.5 dBm. This transceiver occupies 840 mum times 1365 mum, is biased from 3.3 V, and consumes 0.9 W. Two stand-alone 5-stage amplifiers, centered at 140 GHz and 170 GHz, were also fabricated showing 17 dB and 15 dB gain at 140 GHz and 170 GHz, respectively. The saturated output power of the amplifiers is +1 dBm at 130 GHz and 0 dBm at 165 GHz. All circuits were characterized over temperature up to 125degC. These results demonstrate for the first time the feasibility of SiGe BiCMOS technology for circuits in the 100-180-GHz range.     

A Low-Power Fullband 802.11a/b/g WLAN Transceiver With On-Chip PA

A low-power fullband 802.11a/b/g WLAN transceiver in 0.15-mum CMOS technology is described. The zero-IF transceiver achieves a receiver noise figure of 4.4/4 dB for the 2.4-GHz/5-GHz bands, respectively. The corresponding sensitivity at 54-Mb/s operation is -72 dBm for 802.11g and -74 dBm for 802.11a using actual PER measurement. An on-chip PA delivers 20 dBm output P1-dB. A new I/Q compensation scheme is implemented in local oscillator (LO) and an image rejection of better than 52 dB is observed. The transmitter delivers 10/1.5 dBm (2.4-/5-GHz) EVM-compliant output power for a 64-QAM OFDM signal at 54-Mb/s. The power consumption is 117/135 mW (1.8-V) in the receive mode and 570/233.1 mW in the transmit mode for 2.4/5 GHz, respectively. The low power consumption, high integration and robustness (-40 to 140degC) make this transceiver suitable for portable applications     

A fully integrated 0.5-5.5 GHz CMOS distributed amplifier

A fully integrated 0.5-5.5-GHz CMOS-distributed amplifier is presented. The amplifier is a four stage design fabricated in a standard 0.6-μm three-layer metal digital-CMOS process. The amplifier has a unity-gain cutoff frequency of 5.5 GHz, and a gain of 6.5 dB, with a gain flatness of ±1.2 dB over the 0.5-4 GHz band. Input and output are matched to 50 Ω, with worst-case return losses on the input and output of -7 and -10 dB, respectively. Power dissipation is 83.4 mW from a 3.0 V supply, input-referred 1-dB compression point varies from +6 dBm at 1 GHz to 8.8 dBm at 5 GHz. From a circuit standpoint, the fully integrated nature of the amplifier on the given substrate results in a heavily parasitic-laden design. Discussion emphasis is therefore placed on the practical design, modeling, and CAD optimization techniques used in the design process     

2～12GHz GaAs单片行波放大器

报道了一个全平面超宽带ＧａＡｓ单片行波放大器的研究结果。该单片电路的核心部件是四个３００μｍ栅宽的ＭＥＳＦＥＴ，整个电路拓扑结构简单，芯片面积为３．０ｍｍ×１．８ｍｍ。电路经优化设计后在２～１２ＧＨｚ范围内，小信号增益为５±１ｄＢ，输入输出电压驻波比≤１．７５。上述频率范围内输出功率≥１６ｄＢｍ，噪声系数≤８ｄＢ。采用全离子注入、全平面工艺，均匀性、一致性良好。实验结果与设计预计值十分一致。     

A fully integrated 24-dBm CMOS power amplifier for 802.11a WLAN applications

A fully integrated 24-dBm complementary metal oxide semiconductor (CMOS) power amplifier (PA) for 5-GHz WLAN applications is implemented using 0.18-/spl mu/m CMOS foundry process. It consists of differential three-stage amplifiers and fully integrated input/output matching circuits. The amplifier shows a P/sub 1/ of 21.8 dBm, power added efficiency of 13%, and gain of 21 dB, respectively. The saturated output power is above 24.1 dBm. This shows the highest output power among the reported 5-GHz CMOS PAs as well as completely satisfying IEEE 802.11a transmitter back off requirement.     

A single-chip dual-band direct-conversion IEEE 802.11a/b/g WLAN transceiver in 0.18-/spl mu/m CMOS

This paper presents a single-chip dual-band CMOS direct-conversion transceiver fully compliant with the IEEE 802.11a/b/g standards. Operating in the frequency ranges of 2.412-2.484 GHz and 4.92-5.805 GHz (including the Japanese band), the fractional-N PLL based frequency synthesizer achieves an integrated (10 kHz-10 MHz) phase noise of 0.54/spl deg//1.1/spl deg/ for 2/5-GHz band. The transmitter error vector magnitude (EVM) is -36/-33 dB with an output power level higher than -3/-5dBm and the receiver sensitivity is -75/-74 dBm for 2/5-GHz band for 64QAM at 54 Mb/s.     

5-GHz CMOS radio transceiver front-end chipset

Incorporating the direct-conversion architecture, a 5-GHz band radio transceiver front end chipset for wireless LAN applications is implemented in a 0.25-μm CMOS technology. The 4-mm² 5.25-GHz receiver IC contains a low noise amplifier with 2.5-dB noise figure (NF) and 16-dB power gain, a receive mixer with 12.0 dB single sideband NF, 13.7-dB voltage gain, and -5 dBm input 1-dB compression point. The 2.7-mm² transmitter IC achieves an output 1-dB compression of -2.5 dBm at 5.7 GHz with 33.4-dB (image) sideband rejection by using an integrated quadrature voltage-controlled oscillator. Operating from a 3-V supply, the power consumptions for the receiver and transmitter are 114 and 120 mW, respectively     

A 1-V transformer-feedback low-noise amplifier for 5-GHz wireless LAN in 0.18-/spl mu/m CMOS

A low-noise amplifier (LNA) uses low-loss monolithic transformer feedback to neutralize the gate-drain overlap capacitance of a field-effect transistor (FET). A differential implementation in 0.18-/spl mu/m CMOS technology, designed for 5-GHz wireless local-area networks (LANs), achieves a measured power gain of 14.2 dB, noise figure (NF, 50 /spl Omega/) of 0.9 dB, and third-order input intercept point (IIP3) of +0.9 dBm at 5.75 GHz, while consuming 16 mW from a 1-V supply. The feedback design is benchmarked to a 5.75-GHz cascode LNA fabricated in the same technology that realizes 14.1-dB gain, 1.8-dB NF, and IIP3 of +4.2 dBm, while dissipating 21.6 mW at 1.8 V.     

A 2.7-V 1.8-GHz fourth-order tunable LC bandpass filter based on emulation of magnetically coupled resonators

A low-voltage fourth-order RF bandpass filter structure based on emulation of two magnetically coupled resonators is presented. A unique feature of the proposed architecture is using electric coupling to emulate the effect of the coupled inductors, thus providing bandwidth tuning with small passband ripple. Each resonator is built using on-chip spiral inductors and accumulation-mode pMOS capacitors to provide center frequency tuning. The filter has been implemented in HP 0.5-/spl mu/m CMOS process and occupies an area of 0.15 mm/sup 2/. It consumes 16 mA from a single 2.7-V supply at a center frequency of 1.84 GHz and a bandwidth of 80 MHz while providing a passband gain of 9 dB and more than 30 dB of image attenuation for an IF frequency of 100 MHz. The measured output 1-dB compression point and output noise power spectral densities are -16 dBm and -137 dBm/Hz, respectively. This results in a 1-dB compression dynamic range of 42 dB. The filter minimum power supply voltage for proper operation is 2 V. The chip experimental results are in good agreement with theoretical results.     

A high-IP3 RF receiver chip set for mobile radio base stations upto 2 GHz

We present a monolithically integrated high third-order intercept point (IP3) radio frequency (RF) receiver chip set for mobile radio base stations up to 2 GHz, in a 25-GHz f_T Si bipolar production technology. The chip set consists of a RF preamplifier, active mixer circuits, and an intermediate frequency (IF) limiter. The preamplifier gain is 12 dB, the noise figure is 5.5 dB at 900 MHz, and the output (OIP3) is up to +24 dBm depending on supply voltage. The two different mixers provide a conversion gain of 1.5 dB up to 3 dB, an OIP3 in the range of +21 dBm up to +29 dBm, and a minimal single sideband (SSB) noise figure of 13 dB. The IF limiter shows an excellent limiting characteristic at 10 dBm output power and has a high bandwidth of more than 1 GHz     

A 2.4-GHz 0.18-/spl mu/m CMOS self-biased cascode power amplifier

A two-stage self-biased cascode power amplifier in 0.18-/spl mu/m CMOS process for Class-1 Bluetooth application is presented. The power amplifier provides 23-dBm output power with a power-added efficiency (PAE) of 42% at 2.4 GHz. It has a small signal gain of 38 dB and a large signal gain of 31 dB at saturation. This is the highest gain reported for a two-stage design in CMOS at the 0.8-2.4-GHz frequency range. A novel self-biasing and bootstrapping technique is presented that relaxes the restriction due to hot carrier degradation in power amplifiers and alleviates the need to use thick-oxide transistors that have poor RF performance compared with the standard transistors available in the same process. The power amplifier shows no performance degradation after ten days of continuous operation under maximum output power at 2.4-V supply. It is demonstrated that a sliding bias technique can be used to both significantly improve the PAE at mid-power range and linearize the power amplifier. By using the sliding bias technique, the PAE at 16 dBm is increased from 6% to 19%, and the gain variation over the entire power range is reduced from 7 to 0.6 dB.     

基于GaN 的3. 4~ 3. 6 GHz 高增益Doherty 功率放大器

基于两级功率放大器架构,设计了一款平均输出功率为37 dBm(5 W)的高增益Doherty 功率放大器。 该器件通过增加前级驱动功率放大器提高Doherty 功率放大器的增益,采用反向Doherty 功率放大器架构,将λ/4 波 长传输线放置在辅助功放后端,相位补偿线放置在主功放前端,并使主功放输出匹配网络采用双阻抗匹配技术实现 阻抗变换,如此可扩宽功率放大器的工作带宽。连续波测试结果显示:3. 4~3. 6 GHz 工作频段内,饱和输出功率在 44. 5 dBm 以上,功率饱和工作点PAE 在43. 9%以上;在平均输出功率(37 dBm,5 W)工作点,回退量大于7. 5 dB,功 率附加效率PAE 为36. 8%以上,功率增益在31 dB 以上。     

The design of a 3-V 900-MHz CMOS bandpass amplifier

A new bandpass amplifier which performs both functions of low-noise amplifier (LNA) and bandpass filter (BPF) is proposed for the application of 900-MHz RF front-end in wireless receivers. In the proposed amplifier, the positive-feedback Q-enhancement technique is used to overcome the low-gain low-Q characteristics of the CMOS tuned amplifier. The Miller-capacitance tuning scheme is used to compensate for the process variations of center frequency. Using the high-Q bandpass amplifier in the receivers, the conventional bulky off-chip filter is not required. An experimental chip fabricated by 0.8-μm N-well double-poly-double-metal CMOS technology occupies 2.6×2.0 mm² chip area. Under a 3 V supply voltage, the measured quality factor is tunable between 2.2 and 44. When the quality factor is tuned at Q=30, the measured center frequency of the amplifier is tunable between 869-893 MHz with power gain 17 dB, noise figure 6.0 dB, output 1 dB compression point at -30 dBm, third-order input intercept point at -14 dBm, and power dissipation 78 mW     

A 0.6-V 1.6-mW transformer-based 2.5-GHz downconversion mixer with +5.4-dB gain and -2.8-dBm IIP3 in 0.13-/spl mu/m CMOS

On-chip transformers are best suited to lower the supply voltage in RF integrated circuits. A design method to achieve a high current gain with an on-chip transformer operating in resonance is presented. The proposed method will be proven analytically and has been applied to a downconversion mixer. Thereby part of the overall gain of the mixer has been shifted from the RF input stage to the transformer. Thus, the power consumption has been reduced and, in spite of the low supply voltage, moderate linearity has been achieved. Although the transformer has a bandpass behavior, a 3-dB bandwidth of 900 MHz at a center frequency of 2.5 GHz has been achieved. The downconversion mixer has been realized in 0.13-mum CMOS. It consumes 1.6 mW from a 0.6-V supply. A gain of +5.4 dB, a third-order intercept point of -2.8 dBm, an input 1-dB compression point of -9.2 dBm, and a single-sideband noise figure of 14.8 dB have been achieved     

A 15/30-GHz Dual-Band Multiphase Voltage-Controlled Oscillator in 0.18- μm CMOS

A multiphase oscillator suitable for 15/30-GHz dual-band applications is presented. In the circuit implementation, the 15-GHz half-quadrature voltage-controlled oscillator (VCO) is realized by a rotary traveling-wave oscillator, while frequency doublers are adopted to generate the quadrature output signals at the 30-GHz frequency band. The proposed circuit is fabricated in a standard 0.18-mum CMOS process with a chip area of 1.1times1.0 mm². Operated at a 2-V supply voltage, the VCO core consumes a dc power of 52 mW. With a frequency tuning range of 250 MHz, the 15-GHz half-quadrature VCO exhibits an output power of -8 dBm and a phase noise of -112 dBc/Hz at 1-MHz offset frequency. The measured power level and phase noise of the 30-GHz quadrature outputs are -16 dBm and -104 dBc/Hz, respectively     

A 65 mW, 0.4–2.3 GHz Bandpass Filter for Satellite Receivers

A monolithic tunable bandpass filter for satellite receiver front-ends is presented. The center frequency of the bandpass filter can be tuned from 0.4 GHz to 2.3 GHz. The filter is constructed using four transconductor-C poly-phase filter sections and has a 50 dB variable gain range. At 20 dB attenuation and at 30 dB gain the measured 1 dB compression point is –21 dBm and –56 dBm, respectively. Measured input IP3 is –12 dBm. The noise figure is 15 dB at maximum gain. An on-chip I/Q oscillator tracks the center frequency and enables automatic tuning. The bandpass filter dissipates 65 mW with 5 Volt supply voltage and occupies 0.16 mm² chip area. The filter is realized in a standard 11 GHz f _t bipolar technology.     

A dual-band 5.15-5.35-GHz, 2.4-2.5-GHz 0.18-/spl mu/m CMOS transceiver for 802.11a/b/g wireless LAN

A single-chip dual-band 5.15-5.35-GHz and 2.4-2.5-GHz zero-IF transceiver for IEEE 802.11a/b/g WLAN systems is fabricated on a 0.18-/spl mu/m CMOS technology. It utilizes an innovative architecture including feedback paths that enable digital calibration to help eliminate analog circuit imperfections such as transmit and receive I/Q mismatch. The dual-band receive paths feature a 4.8-dB (3.5-dB) noise figure at 5.25 GHz (2.45 GHz). The corresponding sensitivity at 54 Mb/s operation is -76 dBm for 802.11a and -77 dBm for 802.11g, both referred at the input of the chip. The transmit chain achieves output 1-dB compression at 6 dBm (9 dBm) at 5 GHz (2.4 GHz) operation. Digital calibration helps achieve an error vector magnitude (EVM) of -33 dB (-31 dB) at 5 GHz (2.4 GHz) while transmitting -4 dBm at 54Mb/s. The die size is 19.3 mm/sup 2/ and the power consumption is 260 mW for the receiver and 320 mW (270 mW) for the transmitter at 5 GHz (2.4 GHz) operation.     

A 77-GHz MMIC power amplifier for automotive radar applications

A MMIC 77-GHz two-stage power amplifier (PA) is reported in this letter. This MMIC chip demonstrated a measured small signal gain of over 10 dB from 75 GHz to 80 GHz with 18.5-dBm output power at 1 dB compression. The maximum small signal gain is above 12 dB from 77 to 78 GHz. The saturated output power is better than 21.5 dBm and the maximum power added efficiency is 10% between 75 GHz and 78 GHz. This chip is fabricated using 0.1-/spl mu/m AlGaAs/InGaAs/GaAs PHEMT MMIC process on 4-mil GaAs substrate. The output power performance is the highest among the reported 4-mil MMIC GaAs HEMT PAs at this frequency and therefore it is suitable for the 77-GHz automotive radar systems and related transmitter applications in W-band.     

A fully integrated 5.3-GHz 2.4-V 0.3-W SiGe bipolar power amplifier with 50-/spl Omega/ output

A radio frequency power amplifier for 4.8-5.7 GHz has been realized in a 0.35-/spl mu/m SiGe bipolar technology. The balanced two-stage push-pull power amplifier uses two on-chip transformers as input-balun and for interstage matching. Further, it uses three coils for the integrated LC-output balun and the RF choke. Thus, the power amplifier does not require any external components. At 1.0-V, 1.5-V, and 2.4-V supply voltages, output powers of 17.7 dBm, 21.6 dBm, and 25 dBm are achieved at 5.3 GHz. The respective power-added efficiencies (PAE) are 15%, 22%, and 24%. The small-signal gain is 26 dB. The output 1-dB compression point at 2.4 V is 22 dBm with a PAE of 14%.