共查询到20条相似文献,搜索用时 125 毫秒
1.
2.
3.
TCLL多层微波互连基板布局布线设计及制造技术 总被引:2,自引:0,他引:2
采用低温共烧陶瓷(LTCC)技术制造多层微波互连基板,可以研制出高密度的T/R组件.讨论了多层基板中微带线和带状线的结构及其优化设计技术,介绍了制造工艺流程和关键工艺难点. 相似文献
4.
研制一种用于无线传感网的多芯片组件(3D-MCM).采用层压、开槽等工艺获得埋置式高密度多层有机(FR-4)基板,通过板上芯片(COB)、板上倒装芯片(FCOB)、球栅阵列(BGA)等技术,并通过引线键合、倒装焊等多种互连方式将不同类型的半导体芯片三维封装于一种由叠层模块所形成的立体封装结构中;通过封装表层的植球工艺形成与表面组装技术(SMT)兼容的BGA器件输出端子;利用不同熔点焊球实现了工艺兼容的封装体内各级BGA的垂直互连,形成r融合多种互连方式3D-MCM封装结构.埋置式基板的应用解决了BGA与引线键合芯片同面组装情况下芯片封装面高出焊球高度的关键问题.对封装结构的散热特性进行了数值模拟和测试,结果表明组件具有高的热机械可靠性.电学测试结果表明组件实现了电功能,从而满足了无线传感网小型化、高可靠性和低成本的设计要求. 相似文献
5.
本文研究了采用LTCC多层布线与铝阳极氧化多层布线工艺相结合的方法制作出三维高密度MCM组件(3D—MCM—C/A)。阐述了3D—MCM—C/A组件的结构,研究分析了LTCC基板与铝阳极氧化工艺之间的兼容性问题。通过LTCC工艺和LTCC基板抛光清洗工艺的控制以及过渡Ta层的设计解决了两者之间的兼容问题;采用LTCC隔板的方式实现组件的垂直互连。在LTCC基板表面采用薄膜淀积的方法以及特殊的“双刻蚀法”制作焊接区,满足了表面器件及垂直互连的焊接,实现了四层2D—MCM—C/A垂直互连。。 相似文献
6.
传统的超宽带T/R组件采用的是两维砖块式结构,体积和重量已不适应目前小型化、低剖面、易共形的相控阵天线要求。文中提出的基于硅基堆叠系统级封装(SIP)技术,将四通道的射频芯片高度集成在硅基介质基板上,将多层介质基板厚金压合,实现多层堆叠的三维封装。通过采用芯片多功能集成技术和超宽带射频信号的垂直互连技术,设计出三维堆叠的四通道超宽带T/R组件。T/R组件带宽为6 GHz~18 GHz,单通道的发射功率优于23 dBm,接收增益优于20 dB,可实现6位数控衰减及6位数控移相,尺寸仅有13.0 mm×13.0 mm×3.4 mm。该技术可以实现多通道超宽带T/R组件的SIP封装,有利于工程应用。 相似文献
7.
基于埋置式基板的3D-MCM封装结构的研制 总被引:2,自引:0,他引:2
研制一种用于无线传感网的多芯片组件(3D-MCM) . 采用层压、开槽等工艺获得埋置式高密度多层有机(FR-4)基板,通过板上芯片(COB) 、板上倒装芯片(FCOB) 、球栅阵列(BGA)等技术,并通过引线键合、倒装焊等多种互连方式将不同类型的半导体芯片三维封装于一种由叠层模块所形成的立体封装结构中;通过封装表层的植球工艺形成与表面组装技术(SMT)兼容的BGA器件输出端子;利用不同熔点焊球实现了工艺兼容的封装体内各级BGA的垂直互连,形成了融合多种互连方式3D-MCM封装结构. 埋置式基板的应用解决了BGA与引线键合芯片同面组装情况下芯片封装面高出焊球高度的关键问题. 对封装结构的散热特性进行了数值模拟和测试,结果表明组件具有高的热机械可靠性. 电学测试结果表明组件实现了电功能,从而满足了无线传感网小型化、高可靠性和低成本的设计要求. 相似文献
8.
低温共烧陶瓷(LTCC)技术可以实现真正意义上的三维微波互连基板,已经成为实现机载、星载、舰载相控阵雷达收/发组件小型化、轻量化、高性能、高可靠和低成本的理想方法之一。文中对基于国产钙硼硅系LTCC生瓷带微波基板制造技术进行了深入研究,剖析了影响基板外形尺寸和腔体翘曲度的工艺因素,提出了相应的解决方法。 相似文献
9.
11.
卷对卷制备出聚酰亚胺(PI)衬底柔性 硅(Si)基薄膜太阳电池集成串联组件。对卷对卷制备柔性Si基薄膜电池集成串联的优势 进行了分析,讨论了制约柔性薄膜电 池集成串联组件的主要因素;设计了两种柔性薄膜电池集成串联组件结构;进行了柔性 薄膜电池集成串联组件研制,并进行了对比分析。采用卷对卷工艺制备了非晶硅(a-Si)电 池,采用 卷对卷激光刻划、卷对卷丝网印刷与卷对卷精密点胶实现集成串联,形成柔性薄膜电池集成 串联组件,柔性a-Si单结集成串联组件全面积转换效率达到5.96%(AM1.5,全面积为117.3 cm2)。 相似文献
12.
James Keating 《Microelectronics Reliability》1999,39(9):1399
Rigid flex circuits have historically been used in military and high-end performance electronic packaging to improve reliability, reduce weight and save space. This type of interconnect offers higher reliability and a tighter form factor when compared to more conventional interconnect techniques. Improvements in printed circuit fabrication processes and laminate materials have made possible unique opportunities for high density rigid flex circuitry. Recently MCM-L or laminate based multi chip modules have been gaining in popularity as a lower cost packaging alternative to traditional MCM-C or ceramic substrate based multi chip modules. This paper describes the steps taken to redesign existing modules from MCM-C technology to MCM-L(F). Several actual products that have been redesigned from ceramic substrate technology to laminate based packaging using rigid flex as the enabling technology are shown. Data is presented on thermal dissipation, mechanical reliability, electrical performance, and thermal reliability of the laminate substrate as well as assembly information. 相似文献
13.
加速度计是以加速度的观点来测量物体运动的传感器,它通过检测质量块的惯性力来测量载体的线加速度或角加速度。文中介绍的有源磁悬浮控制电路与陀螺浮子构成磁悬浮摆式积分陀螺加速度计,该加速度计具有量程大、测量精度高等优点。受整机系统内部装配空间的限制,在电路集成化产品的设计中,采用系统集成封装(SiP)技术设计与制作有源磁悬浮控制电路,减小电路产品的底面积和高度,适应整机系统对产品的装配和使用要求。同时详细介绍了基于SiP技术的电路设计方法,对HTCC工艺的SiP结构设计进行了阐述,并简述了HTCC工艺的SiP产品达到的技术性能和应用情况。 相似文献
14.
微波组件用带腔体LTCC基板制造技术 总被引:3,自引:2,他引:1
机载、星载、舰载相控阵雷达由于其特定的使用环境,需要体积小、重量轻、高性能、高可靠、低成本的微波组件,带腔体LTCC基板具有高密度布线、电阻、电容、电感的内埋以及芯片的埋置等特性,是制作机载、星载、舰载相控阵雷警警波组件的理想的高密度基板。该文介绍了带腔体LTCC集成基板的制造技术,并对微带线、带状线、内埋电阻、腔体等关键技术进行了分析,提出了相应的解决方法。 相似文献
15.
16.
The technology of high power IGBT modules has been significantly improved these last years against thermal fatigue. The most frequently observed failure modes, due to thermal fatigue, are the solder cracks between the copper base plate and the direct copper bonding (DCB) substrate and bond wire lift-off. Specific simulation tools are needed to carry out reliability researches and to develop device lifetime models. In other respects, accurate temperature and flux distributions are essential when computing thermo-mechanical stresses in order to assess the lifetime of high power modules in real operating conditions. This study presents an analysis method based on the boundary element method (BEM) to investigate thermal behavior of high power semiconductor packages subjected to power cycling loads. The paper describes the boundary integral equation which has been solved using the BEM and applied to the case of a high power IGBT module package (3.3 kV–1.2 kA). A validation of the numerical tool is presented by comparison with experimental measurements. Finally, the paper points out the effect on the thermal stress of the IGBT chips position on the DCB substrate. In particular, a light shifting of the silicon chips may be sufficient to delay significantly the initiation and the propagation of the cracks, allowing a higher device lifetime of the studied module. 相似文献
17.
18.
19.
Magnin V. Giraudet L. Harari J. Decobert J. Pagnot P. Boucherez E. Decoster D. 《Lightwave Technology, Journal of》2002,20(3):477-488
We describe the design, optimization and fabrication of side-illuminated p-i-n photodetectors, grown on InP substrate, suitable for surface hybrid integration in low-cost modules. The targeted functionalities of these photodetectors were a very high responsivity at 1.3- and 1.55-μm wavelengths and quasi-independent on the optical polarization, and had a high alignment tolerance. Moreover, in order to avoid any reliability problem, the principle of evanescent coupling was adopted. Two photodetectors were optimized, fabricated, and tested; the first was for classical cleaved fiber, and the second was for lensed fiber. Because the considered epitaxial structures were complicated to optimize, the method of the genetic algorithm was used, associated with a beam propagation method (BPM). The photodetectors are based on multimode diluted waveguides, which are promising structures in the field of optoelectronics and integrated optics. Starting from the presented comparisons between experimental and theoretical results, the interest of the design method is discussed and the complete performances of newly fabricated devices are presented. The aspect of the cutoff frequency is also considered 相似文献
20.
A. L. Roes E. A. Alsema K. Blok M. K. Patel 《Progress in Photovoltaics: Research and Applications》2009,17(6):372-393
The use of polymer materials for photovoltaic applications is expected to have several advantages over current crystalline silicon technology. In this paper, we perform an environmental and economic assessment of polymer‐based thin film modules with a glass substrate and modules with a flexible substrate and we compare our results with literature data for multicrystalline (mc‐) silicon photovoltaics and other types of PV. The functional unit of this study is ‘25 years of electricity production by PV systems with a power of 1 watt‐peak (Wp)’. Because the lifetime of polymer photovoltaics is at present much lower than of mc‐silicon photovoltaics, we first compared the PV cells per watt‐peak and next determined the minimum required lifetime of polymer PV to arrive at the same environmental impacts as mc‐silicon PV. We found that per watt‐peak of output power, the environmental impacts compared to mc‐silicon are 20–60% lower for polymer PV systems with glass substrate and 80–95% lower for polymer PV with PET as substrate (flexible modules). Also in comparison with thin film CuInSe and thin film silicon, the impacts of polymer modules, per watt‐peak, appeared to be lower. The costs per watt‐peak of polymer PV modules with glass substrate are approximately 20% higher compared to mc‐silicon photovoltaics. However, taking into account uncertainties, this might be an overestimation. For flexible modules, no cost data were available. If the efficiency and lifetime of polymer PV modules increases, both glass‐based and flexible polymer PV could become an environment friendly and cheap alternative to mc‐silicon PV. Copyright © 2009 John Wiley & Sons, Ltd. 相似文献