Copper nitride films deposited by dc reactive magnetron sputtering

Copper nitride (Cu₃N) films were deposited on glass substrates by sputtering of copper target under various substrate temperatures in the range 303–523 K using dc reactive magnetron sputtering. The substrate temperature highly influenced the structural, mechanical, electrical and optical properties of the deposited films. The X-ray diffraction measurements showed that the films were of polycrystalline nature and exhibit preferred orientation of (111) phase of Cu₃N. The microhardness of the films increased from 2.7 to 4.4 GPa with the increase of substrate temperature from 303 to 473 K thereafter decreased to 4.1 GPa at higher temperature of 523 K. The electrical resistivity of the films decreased from 8.7 × 10⁻¹ to 1.1 × 10⁻³ Ωcm and the optical band gap decreased from 1.89 to 1.54 eV with the increase of substrate temperature from 303 to 523 K respectively.     

Effect of deposition conditions on the InP thin films prepared by spray pyrolysis method

InP thin films were prepared by spray pyrolysis technique using aqueous solutions of InCl₃ and Na₂HPO₄, which were atomized with compressed air as carrier gas. The InP thin films were obtained on glass substrates. Thin layers of InP have been grown at various substrate temperatures in the range of 450–525°C. The structural properties have been determined by using X-ray diffraction (XRD). The changes observed in the structural phases during the film formation in dependence of growth temperatures are reported and discussed. Optical properties, such as transmission and the band gap have been analyzed. An analysis of the deduced spectral absorption of the deposited films revealed an optical direct band gap energy of 1.34–1.52 eV for InP thin films. The InP films produced at a substrate temperature 500°C showed a low electrical resistivity of 8.12 × 10³ Ω cm, a carrier concentration of 11.2 × 10²¹ cm⁻³, and a carrier mobility of 51.55 cm²/Vs at room temperature.     

Studies on tin oxide films prepared by electron beam evaporation and spray pyrolysis methods

Transparent conducting tin oxide thin films have been prepared by electron beam evaporation and spray pyrolysis methods. Structural, optical and electrical properties were studied under different preparation conditions like substrate temperature, solution flow rate and rate of deposition. Resistivity of undoped evaporated films varied from 2.65 × 10⁻² ω-cm to 3.57 × 10⁻³ ω-cm in the temperature range 150–200°C. For undoped spray pyrolyzed films, the resistivity was observed to be in the range 1.2 × 10⁻¹ to 1.69 × 10⁻² ω-cm in the temperature range 250–370° C. Hall effect measurements indicated that the mobility as well as carrier concentration of evaporated films were greater than that of spray deposited films. The lowest resistivity for antimony doped tin oxide film was found to be 7.74 × 10⁻⁴ ω-cm, which was deposited at 350°C with 0.26 g of SbCl₃ and 4 g of SnCl₄ (SbCl₃/SnCl₄ = 0.065). Evaporated films were found to be amorphous in the temperature range up to 200°C, whereas spray pyrolyzed films prepared at substrate temperature of 300– 370°C were poly crystalline. The morphology of tin oxide films was studied using SEM.     

Effects of substrate temperatures on the thermal stability of Al-doped ZnO thin films grown by DC magnetron sputtering

In this work, Al-doped (4 at%) ZnO(AZO) thin films were prepared by DC magnetron sputtering using a home-made ceramic target at different substrate temperatures. The microstructure, optical, electrical and thermal stability properties of these thin films were characterized systematically using scanning electron microscopy, UV–Vis-NIR spectrometry, X-ray diffraction, and Hall measurements. It was observed that the AZO thin films deposited at 350 °C exhibited the lowest resistivity of 5.76 × 10⁻⁴ Ω cm, high average visible transmittance (400–800 nm) of 92%, and the best thermal stability. Comparing with the AZO thin films deposited at low substrate temperatures, the AZO thin films deposited at 350 °C had the highest compact surface morphology which could hinder the chemisorbed and diffused oxygen. This was considered to be the main mechanism which was responsible for the thermal degradation of AZO thin films.     

Structural and electrical studies of Cd<Subscript>1−x</Subscript>Zn<Subscript>x</Subscript> Te thin film by vacuum evaporation technique

Cd_1−xZn_xTe (where x = 0.02, 0.04, 0.06, 0.08) thin film have been deposited on glass substrate at room temperature by thermal evaporation technique in a vacuum at 2 × 10⁻⁵ torr. The structural analysis of the films has been investigated using X-ray diffraction technique. The scanning electron microscopy has been employed to know the morphology behaviour of the thin films. The temperature dependence of DC electrical conductivity has been studied. In low temperature range the thermal activation energy corresponding to the grain boundary—limited conduction are found to be in the range of 38–48 μeV, but in the high temperature range the activation energy varies between 86 and 1.01 meV. The built in voltage, the width of the depletion region and the operating conduction mechanism have been determined from dark current voltage (I–V) and capacitor-voltage (C–V) characteristics of Cd_1−xZn_xTe thin films.     

Deposition of AgGaS<Subscript>2</Subscript> thin films by double source thermal evaporation technique

In this study, polycrystalline AgGaS₂ thin films were deposited by the sequential evaporation of AgGaS₂ and Ag sources with thermal evaporation technique. Thermal treatment in nitrogen atmosphere for 5 min up to 700 °C was applied to the deposited thin films and that resulted in the mono phase AgGaS₂ thin films without the participation of any other minor phase. Structural and compositional analyses showed the structure of the films completely changes with annealing process. The measurements of transmittance and reflectance allowed us to calculate the band gap of films lying in 2.65 and 2.79 eV depending on annealing temperature. The changes in the structure with annealing process also modify the electrical properties of the films. The resistivity of the samples varied in between 2 × 10³ and 9 × 10⁶ (Ω-cm). The room temperature mobility depending on the increasing annealing temperature was in the range of 6.7–37 (cm² V⁻¹ s⁻¹) with the changes in carrier concentrations lying in 5.7 × 10¹³–2.5 × 10¹⁰ cm⁻³. Mobility-temperature dependence was also analyzed to determine the scattering mechanisms in the studied temperature range with annealing. The variations in the electrical parameters of the films were discussed in terms of their structural changes.     

Percolation threshold for electrical resistivity of Ag-nanoparticle/titania composite thin films fabricated using molecular precursor method

To find the percolation threshold for the electrical resistivity of metallic Ag-nanoparticle/titania composite thin films, Ag-NP/titania composite thin films, with different volumetric fractions of silver (0.26 ≤ φ_Ag ≤ 0.68) to titania, were fabricated on a quartz glass substrate at 600 °C using the molecular precursor method. Respective precursor solutions for Ag-nanoparticles and titania were prepared from Ag salt and a titanium complex. The resistivity of the films was of the order of 10⁻² to 10⁻⁵ Ω cm with film thicknesses in the range 100–260 nm. The percolation threshold was identified at a φ_Ag value of 0.30. The lowest electrical resistivity of 10⁻⁵ Ω cm at 25 °C was recorded for the composite with the Ag fraction, φ_Ag, of 0.55. X-ray diffraction (XRD), field-emission scanning electron microscope (FE-SEM), and transmission electron microscopic (TEM) evaluation of the effect of the morphology and the nanostructures of the Ag nanoparticles in the composite thin films on the electrical resistivity of the film revealed that the films consist of rutile, anatase, and metallic Ag nanoparticles homogeneously distributed in the titania matrix. It could be deduced that the electrical resistivity of the thin films formed at 600 °C was unaffected by the anatase/rutile content within the thin film, whereas the shape, size, and separation distance of the Ag nanoparticles strongly influenced the electrical resistivity of the Ag-nanoparticle/titania composite thin films.     

Development of nanostructured CdS sensor for H2S recognition: structural and physical characterization

In the present work, we report on the performance of a nanostructured CdS gas sensor. The sensor was fabricated using spin coating technique on glass substrate. The CdS sensor was characterized for their, structural microstructural as well as optoelectronic and H₂S response was studied. The XRD analysis showed formation of nanocrystalline CdS. Morphological analysis using SEM revealed nanostructured morphology with average grain size in the range of 40–50nm. Optical investigations showed a high absorption coefficient (10⁴ cm⁻¹) with a direct band gap of 2.54 eV. Electrical transport studies revealed films shows n-type conduction mechanism with room temperature dc electrical conductivity 10⁻⁶ (Ω cm)⁻¹. The CdS sensors showed the maximum response of 13.2% upon exposure to 100 ppm H₂S at operating temperature 100 °C.     

Sol–gel derived Co<Subscript>3</Subscript>O<Subscript>4</Subscript> thin films: effect of annealing on structural,morphological and optoelectronic properties

Nanocrystalline Co₃O₄ thin films were prepared on glass substrates by using sol–gel spin coating technique. The effect of annealing temperature (400–700 °C) on structural, morphological, electrical and optical properties of Co₃O₄ thin films were studied by X-ray diffraction (XRD), Scanning Electron Microscopy, Electrical conductivity and UV–visible Spectroscopy. XRD measurements show that all the films are nanocrystallized in the cubic spinel structure and present a random orientation. The crystallite size increases with increasing annealing temperature (53–69 nm). These modifications influence the optical properties. The morphology of the sol–gel derived Co₃O₄ shows nanocrystalline grains with some overgrown clusters and it varies with annealing temperature. The optical band gap has been determined from the absorption coefficient. We found that the optical band gap energy decreases from 2.58 to 2.07 eV with increasing annealing temperature between 400 and 700 °C. These mean that the optical quality of Co₃O₄ films is improved by annealing. The dc electrical conductivity of Co₃O₄ thin films were increased from 10⁻⁴ to 10⁻² (Ω cm)⁻¹ with increase in annealing temperature. The electron carrier concentration (n) and mobility (μ) of Co₃O₄ films annealed at 400–700 °C were estimated to be of the order of 2.4–4.5 × 10¹⁹ cm⁻³ and 5.2–7.0 × 10⁻⁵ cm² V⁻¹ s⁻¹ respectively. It is observed that Co₃O₄ thin film annealing at 700 °C after deposition provide a smooth and flat texture suited for optoelectronic applications.     

Effects of hydrogen annealing on the structural, optical and electrical properties of indium-doped zinc oxide films

Indium-doped zinc oxide (IZO) films were fabricated by radio-frequency magnetron sputtering. The effects of hydrogen annealing on the structural, optical and electrical properties of the IZO films were investigated. The hydrogen annealing may deteriorate the crystallinity of the films. The surfaces of the films would be damaged when the annealing temperature was higher than 350 °C. After the annealing, the surface roughness of the films would decrease, and high transparency of 80–90% in the visible and near-infrared wavelength would be kept. Meanwhile, the resistivity decreased from 1.25 × 10⁻³ Ωcm of the deposited films to 6.70 × 10⁻⁴ Ωcm of the annealed films. The work function of the IZO films may be modulated between 4.6 and 4.98 eV by varying the hydrogen annealing temperature and duration.     

The effect of growth conditions and N<Subscript>2</Subscript>/O<Subscript>2</Subscript> ambient on LO-phonon replicas during epitaxial growth of ZnO on c-sapphire

High quality heteroepitaxial thin films of ZnO:N were grown by pulsed laser deposition using a two-step growth method and annealed in situ at different temperatures and ambient conditions. Films were analyzed by X-ray diffraction (XRD), electrical measurements, and photoluminescence experiments at low temperatures to investigate the effect of nitrogen doping. The XRD results demonstrate epitaxial growth on the c-sapphire substrates, with average grain size of 57 nm. Photoluminescence spectra reveals a peak at 3.061 eV (405.1 nm) which is part of the longitudinal-optical-phonon replicas of excitons bound to neutral acceptors \textA₁⁰  \textX_\textA {\text{A}}_{1}^{0} \,{\text{X}}_{\text{A}} at 3.348 eV (370.4 nm), attributed in recent investigations to a newly reported donor–acceptor pair. Electrical resistivity and Hall effect measurements were performed using standard four point van der Pauw geometry at room temperature. Fresh films exhibited a resistivity of 3.1 × 10⁻³ Ω cm, a carrier density of 1.3 × 10¹⁹ cm⁻³, and a mobility of 53 cm²/V s. During approximately 2 weeks the as-deposited films presented a p-type behavior, as shown by the positive sign of the Hall constant measured. Thereafter, films reverted to n-type. From electrical measurements and photoluminescence spectra, the acceptor energy was determined to be 150 meV, in close agreement with reported values. These results are consistent with those presented in the literature for high purity crystals or homoepitaxial thin films, even though samples for the present study were processed at lower annealing temperature.     

Preparation and thermoelectric properties of BP films on SOI and sapphire substrates

The chemical vapor deposited (CVD) BP films on Si(100) (190 nm)/SiO _x (370 nm)/Si(100) (625 μm) (SOI) and sapphire (R-plane) (600 μm) substrates were prepared by the thermal decomposition of the B₂H₆–PH₃–H₂ system in the temperature range of 800–1050 °C for the deposition time of 1.5 h. The BP films were epitaxially grown on the SOI substrate, but a two-step growth method, i.e., a buffer layer at lower temperature and sequent CVD process at 1000 °C for 1.5 h was effective for obtaining a smooth film on the sapphire substrate. The electrical conduction types and electrical properties of these films depended on the growth temperature, gases flow rates and substrates. The thermal conductivity of the film could be replaced by the substrate, so that the calculated thermoelectric figure-of-merit (Z) for the BP films on the SOI substrate was 10⁻⁴–10⁻³/K at 700–1000 K. Those on the sapphire substrate were 10⁻⁶–10⁻⁵/K for the direct growth and 10⁻⁵–10⁻⁴/K for the two-step growth at 700–900 K, indicating that the film on a sapphire by two-step growth would reduce the defect concentrations and promote the electrical conductivity.     

Preparation of titanium-dioxide films by heating titanium/silicon-dioxide structures on silicon in oxygen

 When titanium/silicon-dioxide (Ti/SiO₂) structures prepared by depositing titanium (Ti) on thermally oxidized silicon in vacuum were heated to temperatures of 800–1000°C in flowing oxygen gas, silicon surfaces were covered with a mixture films containing preferentially (110)-oriented Ti0₂ instead of the SiO₂ films. The thickness of the mixture films could be determined by that of the deposited Ti films. Titanium silicide grew only in the region near between the grown mixture film and the silicon substrate. The dielectric constants of the grown mixture films increased exponentially with increasing oxidation temperature and increased slowly with increasing the Ti film thickness, while the breakdown field strength increased slowly with increasing oxidation temperature and increased exponentially with increasing the Ti film thickness. The oxide films prepared at 1000°C had dielectric constants of (15–25)ɛ_o resistivities of 10¹⁰–10¹¹ Ω cm, and breakdown field strengths of about 10⁶ V/cm. Received: 10 February 1998 / Accepted: 10 March 1998     

Investigations on the structural, optical and electrical properties of Nb-doped SnO2 thin films

Niobium-doped tin oxide thin films were deposited on glass substrates by the chemical spray pyrolysis method at a substrate temperature of 400 °C. Effects of Nb doping on the structural, electrical and optical properties have been investigated as a function of niobium concentration (0–2 at.%) in the spray solution. X-ray diffraction patterns showed that the films are polycrystalline in nature and the preferred growth direction of the undoped film shifts to (200) for Nb-doped films. Atomic force microscopy study shows that the surface morphology of these films vary when doping concentration varies. The negative sign of Hall coefficient confirmed the n-type conductivity. Resistivity of ~4.3 × 10⁻³ Ω cm, carrier concentration of ~5 × 10¹⁹ cm⁻³, mobility of ~25 cm² V⁻¹ s⁻¹ and an average optical transmittance of ~70% in the visible region (500–800 nm) were obtained for the film doped with 0.5 at.% niobium.     

Structural, optical, and electric properties of BNT–BT0.08 thin films processed by sol–gel technique

Thin films with the composition [(Bi_0.5Na_0.5)TiO₃]_0.92–[BaTiO₃]_0.08 (hereafter BNT–BT_0.08) were deposited on Pt–Si by spin-coating from a stable sol precursor. The BNT–BT_0.08 film, crystallized on the Bi_0.5Na_0.5TiO₃ rhombohedral lattice, was obtained after annealing the film-gel at 700 °C. The films have a smooth surface (Rms = 2.76 nm) and grains with ferroelectric domains. The film showed a bandgap of 3.25 eV and a refractive index of 2.20 at a wavelength of 630 nm. The dielectric characteristics of BNT–BT_0.08 thin films were measured at room temperature and 10 kHz the dielectric constant (ε _r) was 243 and the loss tangent (tanδ) was 0.38. The remnant polarization (P _r) was 0.87 μC/cm² and the coercive field (E _c) was 220 kV/cm at 10 kHz and room temperature. The current density was approximately 2.7 × 10⁻⁵ A/cm² at low electric fields (100 kV/cm). BNT–BT_0.08 thin films shown piezoelectric properties (d _33eff = 100 pm/V) comparable to those of PZT thin films.     

Structural,optical, and electrical properties of flash-evaporated copper indium diselenide thin films

Copper indium diselenide (CuInSe₂) compound was synthesized by reacting its elemental components, i.e., copper, indium, and selenium, in stoichiometric proportions (i.e., 1:1:2 with 5% excess selenium) in an evacuated quartz ampoule. Structural and compositional characterization of synthesized pulverized material confirms the polycrystalline nature of tetragonal phase and stoichiometry. CuInSe₂ thin films were deposited on soda lime glass substrates kept at different temperatures (300–573 K) using flash evaporation technique. The effect of substrate temperature on structural, morphological, optical, and electrical properties of CuInSe₂ thin films were investigated using X-ray diffraction analysis (XRD), atomic force microscopy (AFM), optical measurements (transmission and reflection), and Hall effect characterization techniques. XRD analysis revealed that CuInSe₂ thin films deposited above 473 K exhibit (112) preferred orientation of grains. Transmission and reflectance measurements analysis suggests that CuInSe₂ thin films deposited at different substrate temperatures have high absorption coefficient (~10⁴ cm⁻¹) and optical energy band gap in the range 0.93–1.02 eV. Results of electrical characterization showed that CuInSe₂ thin films deposited at different substrate temperatures have p-type conductivity and hole mobility value in the range 19–136 cm²/Vs. Variation of energy band gap and resistivity of CuInSe₂ thin films deposited at 523 K with thickness was also studied. The temperature dependence of electrical conductivity measurements showed that CuInSe₂ film deposited at 523 K has an activation energy of ~30 meV.     

Structural and electrical properties of swift heavy ion beam irradiated Fe/Si interface

The present work deals with the mixing of iron and silicon by swift heavy ions in high-energy range. The thin film was deposited on a n-Si (111) substrate at 10⁻⁶ torr and at room temperature. Irradiations were undertaken at room temperature using 120 MeV Au⁺⁹ ions at the Fe/Si interface to investigate ion beam mixing at various doses: 5 × 10¹² and 5 × 10¹³ ions/cm². Formation of different phases of iron silicide has been investigated by X-ray diffraction (XRD) technique, which shows enhancement of intermixing and silicide formation as a result of irradiation. I-V measurements for both pristine and irradiated samples have been carried out at room temperature, series resistance and barrier heights for both as deposited and irradiated samples were extracted. The barrier height was found to vary from 0·73–0·54 eV. The series resistance varied from 102·04–38·61 kΩ.     

Physicochemical and structural characteristics of TiC and VC thin films deposited by DC reactive magnetron sputtering

Vanadium carbide and titanium carbide films were deposited on Si substrates by direct current reactive magnetron sputtering, varying the substrate temperature during deposition and the reactive gas (CH₄) pressure. The physicochemical and structural properties of the films were characterized for stoichiometric films (V/C = 1 and Ti/C = 1), which display good performance concerning wear, friction, and corrosion. The techniques used to characterize the films were Rutherford backscattering spectrometry in channeling geometry, ¹²C(α,α)¹²C nuclear resonant scattering, glancing angle X-ray diffraction, X-ray reflectometry, and X-ray photoelectron spectroscopy. The results revealed that the ideal conditions for deposition of these films are a CH₄ partial pressure of 0.5 × 10⁻³ mbar and a substrate temperature of 400 °C. In such conditions, the deposition rates are 7 nm s⁻¹ for TiC and 8.5 nm s⁻¹ for VC at a target power density of 5.5 W cm⁻². The density of the films, as determined here by X-ray reflectometry, are slightly higher than those for the bulk materials.     

Influence of sputtering power on the physical properties of magnetron sputtered molybdenum oxide films

Thin films of molybdenum oxide were formed on glass and silicon substrates by sputtering of molybdenum target under various sputtering powers in the range 2.3–6.8 W/cm², at a constant oxygen partial pressure of 2 × 10⁻⁴ mbar and substrate temperature 523 K employing DC magnetron sputtering technique. The effect of sputtering power on the core level binding energies, chemical binding configurations, crystallographic structure, surface morphology and electrical and optical properties was systematically studied. X-ray photoelectron spectroscopic studies revealed that the films formed at sputtering powers less than 5.7 W/cm² were mixed oxidation states of Mo⁵⁺ and Mo⁶⁺. The films formed at 5.7 W/cm² contained the oxidation state Mo⁶⁺ of MoO₃. Fourier transform infrared spectra contained the characteristic optical vibrations. The presence of a sharp absorption band at 1,000 cm⁻¹ in the case of the films formed at 5.7 W/cm² was also conformed the existence of α-phase MoO₃. X-ray diffraction studies also confirmed that the films formed at sputtering powers less than 5.7 W/cm² showed the mixed phase of α-and β-phase of MoO₃ where as at sputtering power of 5.7 W/cm² showed single phase α-MoO₃. The electrical conductivity of the films increased from 8 × 10⁻⁶ to 1.2 × 10⁻⁴ Ω⁻¹ cm⁻¹, the optical band gap decreased from 3.28 to 3.12 eV and the refractive index decreased from 2.12 to 1.94 with the increase of sputtering power from 2.3 to 6.8 W/cm², respectively.     

Electrical Properties and Leakage Current Mechanisms of Bi<Subscript>3.2</Subscript>Gd<Subscript>0.8</Subscript>Ti<Subscript>3</Subscript>O<Subscript>12</Subscript> Thin Films Prepared by a Sol-Gel Method

Bi_3.2Gd_0.8Ti₃O₁₂ (BGTO) thin films were deposited on Pt(111)/Ti/SiO₂/Si(100) substrates using the sol-gel method and rapid thermal annealing in an oxygen atmosphere. The effects of annealing temperature (500–800°C) on microstructure and electrical properties of thin films were investigated. X-ray diffraction analysis shows that the BGT thin films have a bismuth-layered perovskite structure with preferred (117) orientation. The intensities of (117) peaks increases with increasing annealing temperature. The leakage current density (J) was 3.69×10⁻⁸ A/cm² at 200 kV/cm. It was found that the leakage current was affected not only by the microstructure but also by the interface between the Pt electrode and BGTO thin films. In the low electric field region, the leakage current was controlled by Poole–Frenkel emission. In addition, the mechanism can be explained by Schottky emission from the Pt electrode in the high electric field region.