Nano-Processing Techniques Applied in GaN-Based Light-Emitting Devices With Self-Assembly Ni Nano-Masks

We have developed a simple method to fabricate nanoscale masks by using self-assembly Ni clusters formed through a rapid thermal annealing (RTA) process. The density and dimensions of the Ni nano-masks could be precisely controlled. The nano-masks were successfully applied to GaN-based light-emitting diodes (LEDs) with nano-roughened surface, GaN nanorods, and GaN-based nanorod LEDs to enhance light output power or change structure properties. The GaN-based LED with nano-roughened surface by Ni nano-masks and excimer laser etching has increased 55% light output at 20 mA when compared to that without the nano-roughened process. The GaN nanorods fabricated by the Ni nano-masks and ICP-RIE dry etching showed 3.5 times over the as-grown sample in photoluminescence (PL) intensity. The GaN-based nanorod LEDs assisted by photo-enhanced chemical (PEC) wet oxidation process were also demonstrated. The electroluminescence (EL) intensity of the GaN-based nanorod LED with PEC was about 1.76 times that of the as-grown LED. The fabrication, structure properties, physical features, and the optical and electrical properties of the fabricated devices will be discussed.     

Enhanced output power of (indium) gallium nitride light emitting diodes by a transparent current spreading-film composed of a disordered network of indium tin oxide nanorods

A thin film consisting of a disordered nanorod network of indium tin oxide (ITO) and conventional ITO films are fabricated on gallium nitride (GaN) based-light emitting diodes (LEDs) by electron beam evaporation. The surface morphologies are observed by scanning electron microscopy (SEM). The disordered nanorod network of ITO is grown in vacuum without oxygen. It can be applied directly on the LED as the current spreading film unlike other nanorods which require growth on a conductive layer. The transmittance, current–voltage characteristic, and the dependence of light output power on current are measured for disordered nanorod network ITO LEDs and conventional ITO LEDs, respectively. The measurement results indicate that the nanorod network provides a significant improvement in the light output power of GaN-based LEDs. The influence of the structure of ITO films on the light output power of GaN-based LEDs is discussed.     

Electrical-efficiency analysis of GaN-based light-emitting diodes with interdigitated-mesa geometry

We propose a novel method to analyze the current-voltage (I-V) characteristics of GaN-based light-emitting diodes (LEDs) with different p-type electrodemesa geometries. The electrical efficiency is analyzed by calculating the electric field under the quasi-coplanar electrodes of GaN-based LEDs. The experimental results for GaN-based LEDs of chip sizes of 350×350 μm² and 1,000 × 1,000 μm² with interdigitated fingers are compared. A good agreement is obtained between the experimental and theoretical electrical efficiency of the GaN LEDs with a chip size of 1,000×1,000 μm². The current-crowding effect is analyzed by measuring the electroluminescence spectra of the devices. The result indicates that the current-crowding effect is largely reduced by increasing the number of interdigitated fingers. The electrical efficiency of a LED with a chip size of 1,000×1,000 μm² can be also enhanced by increasing the number of interdigitated fingers, showing the advantages of GaN LED with interdigitated-mesa geometries.     

Progress in Group Ⅲ nitride semiconductor electronic devices

Recently there has been a rapid domestic development in groupⅢnitride semiconductor electronic materials and devices.This paper reviews the important progress in GaN-based wide bandgap microelectronic materials and devices in the Key Program of the National Natural Science Foundation of China,which focuses on the research of the fundamental physical mechanisms of group III nitride semiconductor electronic materials and devices with the aim to enhance the crystal quality and electric performance of GaN-based electronic materials, develop new GaN heterostructures,and eventually achieve high performance GaN microwave power devices.Some remarkable progresses achieved in the program will be introduced,including those in GaN high electron mobility transistors(HEMTs) and metal-oxide-semiconductor high electron mobility transistors(MOSHEMTs) with novel high-k gate insulators,and material growth,defect analysis and material properties of InAlN/GaN heterostructures and HEMT fabrication,and quantum transport and spintronic properties of GaN-based heterostructures,and highelectric -field electron transport properties of GaN material and GaN Gunn devices used in terahertz sources.     

Efficiency droop behavior of GaN-based light emitting diodes under reverse-current and high-temperature stress

The efficiency droop behavior of GaN-based light emitting diodes (LEDs) is studied when the LEDs are under reverse-current and high-temperature stress tests respectively. It is found that reverse-current stress mainly induces additional non-radiative recombination centers within the active region of InGaN/GaN multiple quantum wells, which degrade the overall efficiency of the GaN LED under test but push the peak-efficiency-current towards higher magnitude. The up-shift of peak-efficiency-current can be explained by a rate-equation model in which the newly-created defects by reverse-current stress enlarge the dominant low-current region of non-radiative recombinations. Comparatively, high-temperature stress mainly increases the series resistance of the LED under test. Although the overall efficiency of the GaN LED also drops, there is no shift of peak-efficiency-current induced by the high-temperature stress.     

氮化物半导体电子器件的若干研究进展

近年来,氮化物半导体电子器件和材料研究有了重大的进展。在国家自然科学基金资助下,西安电子科技大学、北京大学和中科院微电子所完成了国家自然科学基金重点项目《GaN宽禁带微电子材料和器件重大基础问题研究》。致力于通过氮化物电子材料和器件的基础物理机理研究提高GaN电子材料的结晶质量和电学性能、发展新结构GaN异质结材料研究,获得高性能的GaN HEMT微波功率器件。本文主要介绍该项目在GaN微波功率HEMT和新型高k栅介质MOS-HEMT、InAlN/GaN材料的生长和物性缺陷分析以及HEMT器件研制、GaN异质结的量子输运和自旋性质研究以及GaN材料高场输运性质和耿氏器件等几个方面取得的研究进展。     

氮化镓功率半导体器件技术

作为第三代半导体材料的典型代表,宽禁带半导体氮化镓(GaN)具有许多硅材料所不具备的优异性能,是高频、高压、高温和大功率应用的优良半导体材料,在民用和军事领域具有广阔的应用前景。随着GaN技术的进步,特别是大直径硅(Si)基GaN外延技术的逐步成熟并商用化,GaN功率半导体技术有望成为高性能低成本功率技术解决方案,从而受到国际著名半导体厂商和研究单位的关注。总结了GaN功率半导体器件的最新研究,并对GaN功率器件发展所涉及的器件击穿机理与耐压优化、器件物理与模型、电流崩塌效应、工艺技术以及材料发展等问题进行了分析与概述。     

Nitride-based MQW LEDs with multiple GaN-SiN nucleation layers

Nitride-based light emitting diodes (LEDs) separately prepared with a conventional single low-temperature (LT) GaN nucleation layer and multiple GaN-SiN nucleation layers were both prepared. It was found that we could reduce defect density and thus improve crystal quality of the GaN-based LEDs by using multiple GaN-SiN nucleation layers. With a 20-V applied reverse bias, it was found that the reverse leakage currents measured from the LED with a single LT GaN nucleation layer and the one with 10-pair GaN-SiN nucleation layers were 1.5/spl times/10/sup -4/ and 2.5/spl times/10/sup -6/ A, respectively. It was also determined that we could use the multiple GaN-SiN nucleation layers to enhance the output intensity of near ultraviolet (UV) LEDs and to improve the reliability of nitride-based LEDs.     

GaN-based light emitting diodes on nano-hole patterned sapphire substrate prepared by three-beam laser interference lithography

Nano-hole patterned sapphire substrates (NHPSSs) were successfully prepared using a low-cost and high-efficiency approach, which is the laser interference lithography (LIL) combined with reactive ion etching (RIE) and inductively coupled plasma (ICP) techniques. Gallium nitride (GaN)-based light emitting diode (LED) structure was grown on NHPSS by metal organic chemical vapor deposition (MOCVD). Photoluminescence (PL) measurement was conducted to compare the luminescence efficiency of the GaN-based LED structure grown on NHPSS (NHPSS-LED) and that on unpatterned sapphire substrates (UPSS-LED). Electroluminescence (EL) measurement shows that the output power of NHPSS-LED is 2.3 times as high as that of UPSS-LED with an injection current of 150 mA. Both PL and EL results imply that NHPSS has an advantage in improving the crystalline quality of GaN epilayer and light extraction efficiency of LEDs at the same time.     

图形化蓝宝石衬底GaN基LED的研究进展

蓝宝石衬底作为发光二极管最常用的衬底,经过不断发展,在克服其与GaN间晶格失配和热膨胀失配问题上,研究人员不断提出解决方案。近期发展起来的图形化衬底技术,除了能减少生长在蓝宝石衬底上GaN之间的差排缺陷,提高磊晶质量以解决失配问题,更能提高LED的出光效率。从衬底图形的形状、尺寸、制备工艺出发,回顾了图形化蓝宝石衬底GaN基LED的研究进展,详细介绍了近年来关于图形化衬底技术与其他技术在提高LED性能方面的结合,总结了图形化蓝宝石衬底应用于大尺寸芯片的优势,并对其未来在大功率照明市场的应用进行了展望。     

n型GaN欧姆接触的研究进展

Ⅲ-Ⅴ族GaN基材料以其在紫外光子探测器、发光二极管、高温及大功率电子器件等方面的应用潜能而被广为研究.其中,低阻欧姆接触是提高GaN基器件光电性能的关键.金属/GaN界面上较大的欧姆接触电阻一直是影响器件性能及可靠性的一个问题.对于各种应用来说, GaN的欧姆接触需要得到改进.通过对相关文献的归纳分析,本文主要介绍了近年来在改进n-GaN工艺,提高欧姆接触性能等方面的研究进展.     

High efficiency and improved ESD characteristics of GaN-based LEDs with naturally textured surface grown by MOCVD

The following paper presents a study on GaN-based light-emitting diodes (LEDs) with naturally textured surface grown by metal-organic chemical vapor deposition. The study utilizes a well-known approach of increasing light extraction efficiency. The approach is based on naturally formed V-shaped pits on surface that originate from low-temperature-growth (LTG) conditions of topmost p-GaN contact layer. In our experiment, the high-temperature-grown (HTG) p-GaN layer was inserted between the p-AlGaN electron-blocking layer and the LTG p-GaN contact layer, in order to suppress pit-related threading dislocations (TDs). These TDs may intersect the underlying active layer. The results of the experiment show that GaN-based LEDs with the HTG p-GaN insertion layer can effectively endure negative electrostatic discharge voltage of up to 7000 V. We also noted that application of 20-mA current injection yields output power of about 16 mW for the LEDs emitting around 465 nm. The output power results correspond to an external quantum efficiency of around 30%.     

AlGaN/GaN层叠结构插入层改善氮化镓基发光二极管抗静电性能研究

在GaN基发光二极管的uGaN与nGaN之间插入AlGaN/GaN层叠结构,增大了外延层的张应力,降低了外延层中的穿透位错密度,改善了外延材料的质量。对比了AlGaN/GaN层叠结构中不同Al组分对LED的抗静电能力的影响,含6.8%铝组分AlGaN/GaN层叠结构的LED人体模式抗静电能力提高到了6000V,合格率超过了95%。     

Improved III-nitrides based light-emitting diodes anti-electrostatic discharge capacity with an AlGaN/GaN stack insert layer

Through insertion of an AlGaN/GaN stack between the u-GaN and n-GaN of GaN-based light-emitting diodes(LEDs),the strain in the epilayer was increased,the dislocation density was reduced.GaN-based LEDs with different Al compositions were compared.6.8%Al composition in the stacks showed the highest electrostatic discharge(ESD) endurance ability at the human body mode up to 6000 V and the pass yield exceeded 95%.     

Improved ⅢI-nitrides based light-emitting diodes anti-electrostatic discharge capacity with an AlGaN/GaN stack insert layer

Through insertion of an AlGaN/GaN stack between the u-GaN and n-GaN of GaN-based light-emitting diodes (LEDs),the strain in the epilayer was increased,the dislocation density was reduced.GaN-based LEDs with different Al compositions were compared.6.8％ A1 composition in the stacks showed the highest electrostatic discharge (ESD) endurance ability at the human body mode up to 6000 V and the pass yield exceeded 95％.     

p型GaN器件欧姆接触的研究进展

Ⅲ-Ⅴ族GaN基材料以其在紫外光子探测器、发光二极管、高温及大功率电子器件方面的应用潜能而被广为研究.低阻欧姆接触是提高GaN基器件光电性能的关键.由于低掺杂和空穴电离等原因,p-GaN上的低阻接触难于制备.制备稳定的P-GaN欧姆接触一直是一个挑战.主要通过对有关英语期刊文献的归纳分析,介绍了近年来在改进P-GaN工艺、提高欧姆接触性能等方面的研究进展.     

Nanofabrication of gallium nitride photonic crystal light-emitting diodes

We describe a comparison of nanofabrication technologies for the fabrication of 2D photonic crystal structures on GaN/InGaN blue LEDs. Such devices exhibit enhanced brightness and the possibility of controlling the angular emission profile of emitted light. This paper describes three nano lithography techniques for patterning photonic crystal structures on the emitting faces of LEDs: direct-write electron beam lithography, hard stamp nanoimprint lithography and soft-stamp nanoimprint lithography with disposable embossing masters. In each case we describe variations on the technique as well as its advantages and disadvantages. Complete process details have been given for all three techniques. In addition, we show how high performance GaN dry etch techniques, coupled with optical process monitoring can transfer resist patterns into underlying GaN material with high fidelity.     

GaN基功率LED高低温特性研究

首次对自制的GaN基大功率白光和蓝光发光二极管在-30~100°C的温度下进行了在线的光电特性测试,对两种不同LED的正向电压、相对光强、波长、色温等参数随温度变化的关系进行了数据曲线拟合,对比分析了参数变化的原因,以及这些变化对实际应用的影响。结果表明,温度对大功率LED的光电特性有很大影响,通过对比发现白光LED的部分光参数随温度的变化不仅与GaN芯片有关,同时受到荧光粉的影响。低温环境下,要考虑LED的正向电压升高和峰值波长蓝移对应用的影响;而高温条件下要考虑光功率降低和峰值波长红移对应用的影响。     

高亮度GaN基蓝色LED的研究进展

超高亮度GaN基蓝色LED的发展将会引起照明技术的一场革命，它是目前全球半导体领域研究和投资的特点。本文综合分析了GaN材料的特性及相应的材料生长和欧姆接触、刻蚀工艺等关键技术，并对GaN基蓝色LED器件的进一步改进及应用前景作了展望。     

Enhanced Light Output in Roughened GaN-Based Light-Emitting Diodes Using Electrodeless Photoelectrochemical Etching

We have demonstrated enhanced output power from roughened GaN-based light-emitting diodes (LEDs) by using electrodeless photoelectrochemical etching with a chopped source (ELPEC-CS etching). It was found that the 20-mA output power of the ELPEC-CS treated LED (with roughened surfaces on the top p-type and bottom n-type GaN surface as well as the mesa sidewall) was 1.41 and 2.57 times as high as those LEDs with a roughened p-type GaN surface and a conventional surface, respectively. The light output pattern of the ELPEC-CS treated LED was five times greater than the conventional LED at 0deg which was caused by the roughened GaN surface that improved the light extraction efficiency of the LED