Preparation of copper-coated fine molybdenum powders with electroless technique

The molybdenum powders with average particle size of 3 μm were coated with copper by electroless plating. The influence of pretreatment,solution composition and plating conditions on electroless copper plating was studied. The copper-coated molybdenum powders were examined by SEM and XRD. Results indicate that a series of optimization methods is used to add activated sites before electroless copper plating. Taking TEA and EDTA as chief and assistant complex agents respectively,2,2’-bipyridyl and PEG as double stabilizers,the Mo powders are coated with copper successfully with little Cu2O contained,at the same time,Mo-Cu composite powders with copper content of 15-85 wt% can be obtained. The optimal values of pH,temperature and HCHO concentration are 12-13,60-65 ℃ and 22-26 mL/L,respectively.     

Fabrication of W@Cu composite powders by direct electroless plating using a dripping method

A direct electroless copper (Cu) coating on tungsten powders method requiring no surface treatment or stabilizing agent and using glyoxylic acid (C₂H₂O₃) as a reducing agent was reported. The effects of copper sulfate concentration and the pH of the plating solution on the properties of the prepared W@Cu composite powders were assessed. The content of Cu in the composite powders was controlled by adjusting the concentration of copper sulfate in the electroless plating solution. A uniform, dense, and consistent Cu coating was obtained under the established optimum conditions (flow rate of C₂H₂O₃ = 5.01 mL/min, solution pH = 12.25 and reaction temperature 45.35 °C) by using central composite design method. In addition, the crystalline Cu coating was evenly dispersed within the W@Cu composite powders and Cu element in the coating existed as Cu0. The formation mechanism for the W@Cu composite powders by electroless plating in the absence of surface treatment and stabilizing agent was also proposed.     

Growth behavior of electroless copper on silicon substrate

The growth behavior containing deposit morphology, growth rate, activation energy, and growth mechanism of copper on silicon substrate, especially at the initial stage, in the electroless plating process was studied. Copper was deposited on the surface of the silicon substrate in an electloless plating bath containing formalin （CH2O 37vol%） as a reducing agent at a pH value of 12.5 and a temperature of 50-75℃. The copper deposit was characterized using a field emission scanning electron microscope and transmission electron microscope. The results showed that after the activation process, nanoscale Pd particles were distributed evenly on the surface of the silicon; in the deposition process, copper first nucleated at locations not only near the Pd particles but also between the Pd particles; the growth rate of electroless Cu ranged from 0.517 nm/s at 50℃ to 1.929 nm/s at 75℃. The activation energy of electroless Cu on Si was 52.97 kJ/mol.     

Ni/纳米Al2O3微粒复合电镀工艺的试验研究

采用复合电镀的方法在45#钢表面制备获得Ni/纳米Al2O3微粒复合镀层.利用正交试验法研究了电流密度、镀液pH值和镀液温度对Ni/纳米Al2O3微粒复合镀层性能和沉积过程的影响.结果发现,它们对镀层沉积过程及其性能都有影响,但影响的程度和规律不同.最后综合考虑各因素,制订出Ni和纳米Al2O3微粒在45#钢表面发生共沉积的较理想工艺.     

Ni系非晶态合金膜的晶化过程与吸氢性能（Ⅱ）——Ni系非晶态膜的XPS和XAES表征

利用改进的化学镀镍技术,制备了对氢具有高选择性和透过性Ni基非晶态合金膜,并通过XPS和XAES手段对Ni-P非晶态合金膜表面进行了考察。结果表明,Ni-P合金表面物种,Ni以Ni_2O_3,而P以P~(5+)的形式存在,体相以元素态Ni~0和P~0存在为主。Ni-P合金膜经高温晶化后,P由体相向表面扩散。     

Mechanism and Microstructure of Electroless Ni-Fe-P Plating on CNTs

Electroless Ni-Fe-P alloy plating on the surface of CNTs was carded out with a bath using citrate salt and lactic acid as complex agents. We proposed a chemical reaction mechanism. The morphology, structure and chemical composition of the Ni-Fe-P/CNTs were studied with the aid of a scanning electronic microscope （SEM）, X-ray diffraction （XRD） and an energy-dispersive X-ray spectral analysis （EDS）. The results show that through a correct pre-treatment and electroless plating, Ni-Fe-P/CNTs composite particles can be obtained. The optimum electroless plating parameters of 35-42℃ and pH of 8.5-9.7 were achieved. The as-plated Ni-Fe-P alloy is amorphous. After a heat treatment at 500℃ for 90 min in H2, the coating is transformed into crystalloid Ni3E Fe2NiP and （Fe,Ni）3R The Ni-Fe-P alloy coating on the surface of CNTs is smooth and unique. The amount of Ni on the surface （mass fraction） of the Ni-Fe-P/CNTs composite particles is 29.13%, that of Fe 3.19% and that of P 2.28%.     

Electroless copper plating process of N, N, N, N′-tetrakis (2-hydroxypropyl) ethylenediamine system with high plating rate

Electroless copper plating process of N, N, N′, N′-tetrakis (2-hydroxypropyl)ethylenediamine(THPED) chelating agent was researched comprehensively. The results indicate that plating rate decreases with the 3H2O has a bad effect on deposits quality, but 2, 2′-dipyridyl and PEG make deposits quality improve greatly. Low concentration of 2-mercaptobenzothiozole (2-MBT) increases plating rate and improves deposits quality, but decreases plating rate and worsens deposits quality when 2-MBT reaches 5 mg/L. The optimal conditions of this electroless MBT are 16.8 g/L, 16.0 mL/L, 13.3 g/L, 0.5 g/L, 5.0 mg/L and 2.0 mg/L, respectively, pH value is 12.75,bath temperature is 30 ℃. Plating rate reaches 9.54 μm/h plating for 30 min in the bath. The SEM images demonstrate that the surface of copper film is smooth and the crystal is fine.     

化学镀法制备Ni—P／Al2O3特种陶瓷及性能

采用化学镀方法在平均粒径为200nm的Al2O3粉体表面镀覆Ni-P合金,制备出了Ni-P／Al2O3复合粉体,再利用无压烧结将此种复合粉体制备成氧化铝基特种陶瓷。这一方法不仅降低了烧结温度,也进一步提高了陶瓷的性能,尤其是在提高韧性方面。结果表明,粉体镀层为晶态,主要由NiP2相和NiP相组成,镀层中含镍量为9．32％,含磷量为2．38％。为低磷合金镀层,制备特种陶瓷所需的烧结温度由制备单一氧化铝陶瓷所需的1700℃降低至1350℃;断裂韧性也从单一Al2O3陶瓷的3．0MPa·m^1/2提高到6．91MPa·m^1/2,增加了130．3％;耐磨性与纯氧化铝陶瓷相当。     

Al及Al合金化学镀Ni-P工艺及性能研究

研究了铝及铝合金表面化学镀Ｎｉ－Ｐ合金的预处理、镀液配方及镀后热处理。经除油、酸洗两道工序处理后,在铝及铝合金表面上直接进行酸性化学镀Ｎｉ－Ｐ合金,镀速最快可达到３２．５μｍ／ｈ,镀层光亮美观。经技术保护后,在空气电阻炉中进行热处理,硬度达ＨＶ１１００～１２００。     

镍离子注入Al2O3/1Cr18Ni9Ti钎焊界面成分分析

利用扫描电镜观察了镍离子注入Ａｌ２Ｏ３／１Ｃｒ１８Ｎｉ９Ｔｉ钎焊界面的形貌,并用ｘｌⅡ能谱分析仪对焊缝进行面、线和点扫描成分分析,结果表明,焊接面非常完整,在Ａｌ２Ｏ钎焊料／１Ｃｒ１８Ｎｉ９Ｔｉ相互界面处存在着元素扩散。     

Electroless copper plating process of N, N, N′, N′-tetrakis (2-hydroxypropyl) ethylenediamine system with high plating rate

Electroless copper plating process of N, N, N′, N′-tetrakis (2-hydroxypropyl) ethylenediamine (THPED) chelating agent was researched comprehensively. The results indicate that plating rate decreases with the increase of concentration for THPED, CuSO₄ · 5H₂O and HCHO, pH value and bath temperature. The additive of K₄[Fe(CN)₆] · 3H₂O, 2, 2′-dipyridyl and polyethylene glycol(PEG) decrease plating rate and K₄[Fe(CN)₆] · 3H₂O has a bad effect on deposits quality, but 2, 2′-dipyridyl and PEG make deposits quality improve greatly. Low concentration of 2-mercaptobenzothiozole (2-MBT) increases plating rate and improves deposits quality, but decreases plating rate and worsens deposits quality when 2-MBT reaches 5 mg/L. The optimal conditions of this electroless copper plating process are that the concentration of THPED, HCHO, CuSO₄ · 5H₂O, PEG, 2, 2′-dipyridyl and 2-MBT are 16.8 g/L, 16.0 mL/L, 13.3 g/L, 0.5 g/L, 5.0 mg/L and 2.0 mg/L, respectively, pH value is 12.75, bath temperature is 30 °C. Plating rate reaches 9.54 μm/h plating for 30 min in the bath. The SEM images demonstrate that the surface of copper film is smooth and the crystal is fine. Foundation item: Project supported by Hubei Daye Nonferrous Metal Corporation of China     

Ni-P/Al_2O_3复合镀层性能的表征与测试

为了提高镀层的耐磨性和硬度,在45碳钢基材上实施Ni-P/Al2O3化学复合镀,使纳米Al2O3微粒均匀分布于Ni-P基体中.研究了化学复合镀工艺条件和镀液组分对镀层性能的影响.镀件的耐蚀性实验和XRD分析表明:当硫酸镍25 g/L,次亚磷酸钠30 g/L,纳米Al2O3微粒加入量为5 g/L,乳酸20 mL/L和柠檬酸5 g/L,在pH=5.5,施镀温度为(85±2)℃,获得的Ni-P/Al2O3复合镀层表面光滑、胞状物致密,镀层的耐腐蚀性较高、硬度可达600HV,有利于得到综合性能较高的镀层.     

超细ATC陶瓷制备及其干滑动磨损研究

为提高陶瓷刀具材料的耐磨性能和断裂韧性，制备新型超细Al2O3-TiC-8%Co（ATC）陶瓷样品.采用低温化学镀方法对亚微米级Al2O3和TiC粉末表面进行金属钴包覆，热压烧结复合粉体制备该ATC样品.在销盘式磨损试验机上对ATC陶瓷的耐磨性能进行考察，采用SEM对ATC陶瓷的磨损形貌进行分析.结果表明，干滑动摩擦条件下，断裂韧性对陶瓷材料耐磨性能的影响非常明显.各摩擦副磨损过程中，随磨损时间延长ATC陶瓷样品表面微细突起脱落，磨损面趋于平滑，相对磨损率降低.金属钴的独特复合方式抑制了烧结过程中晶粒长大,并增大ATC陶瓷的断裂韧性和耐磨性能.     

比色法测量化学镀镍液中Ni~（2＋）浓度的A－C数学模型

通过数学分析的方法建立起化学镀镍液的Ａ－Ｃ数学模型。本模型基于朗伯－比尔定律，成功地扣除了副产物对测量的干扰，使直接比色法适用于化学镀镍过程中Ｎｉ２＋浓度的测定。     

Effect of copper ions implantation on the corrosion behavior of ZIRLO alloy in 1 mol/L H2SO4

1. IntroductionZIRLO alloy is widely used in the nuclear industrybecause of its low thermal neutron capture cross sec-tion, favorable mechanical properties, and good corro-sion resistance. For example, ZIRLO alloy can serve asfuel cladding, spreaders for …     

Load Dependence of Nanohardness in Nitrogen Ion Implanted Ti6Al4V Alloy and Fractal Characterization

Three different nitrogen ion doses were implanted into a Ti6Al4V alloy to improve its mechanical surface properties for the application of artificial joints. The titanium nitride phase and nitrogen element distribution profile were characterized with X-ray photoelectron spectroscopy (XPS). Nano-indentation tests were carried out on the surface of the Ti6Al4V alloy and implanted samples on a large scale of applied loads. The XPS analysis results indicate that nitrogen diffuses into the titanium alloy and forms a hard TiN layer on the Ti6Al4V alloy. The nanohardness results reveal that nitrogen ion implantation effectively enhances the surface hardness of Ti6Al4V. In addition, the nanohardness clearly reveals load dependence over a large segment of the applied loads. Thus a concept of nanohardness fractal dimension is first proposed and the dual fractal model can effectively describe nonlinear deformation in indentation areas on the Ti6Al4V surface. The fractal dimension shows a decreased trend in two regions of applied loads, indicating a decrease of the self-similarity complexity in surface indentation owing to an increase in nanohardness after nitrogen ion implantation.     

Load Dependence of Nanohardness in Nitrogen Ion Implanted Ti6AI4V Alloy and Fractal Characterization

Three different nitrogen ion doses were implanted into a Ti6A14V alloy to improve its mechanical surface properties for the application of artificial joints. The titanium nitride phase and nitrogen element distribution profile were characterized with X-ray photoelectron spectroscopy （XPS）. Nano-indentation tests were carried out on the surface of the Ti6A14V alloy and implanted samples on a large scale of applied loads. The XPS analysis results indicate that nitrogen diffuses into the titanium alloy and forms a hard TiN layer on the Ti6A14V alloy. The nanohardness results reveal that nitrogen ion implantation effectively enhances the surface hardness of Ti6A14V. In addition, the nanohardness clearly reveals load dependence over a large segment of the applied loads. Thus a concept of nanohardness fractal dimension is first proposed and the dual fractal model can effectively describe nonlinear deformation in indentation areas on the Ti6A14V surface. The fractal dimension shows a decreased trend in two regions of applied loads, indicating a decrease of the self-similarity complexity in surface indentation owing to an increase in nanohardness after nitrogen ion implantation.     

梯度(Ti,Al)N涂层的微观结构与机械性能研究

利用电弧离子镀技术在航空发动机压气机用1Cr11Ni2W2MoV在不锈钢上沉积了（Ti,Al）N梯度涂层,X射线衍射的结果表明涂层为B1型（Nacl）单相结构,具有（220）择优取向．扫描电镜观察表明,涂层均匀致密,与基体结合良好．电子探针元素线分析和截面面分布表明,所制备的涂层是内层富TiN、外层富（Ti,Al）N的梯度涂层,试验结果表明,（Ti,Al）N梯度涂层具有良好的耐磨性等机械性能．     

镍催化剂对加氢石油树脂性质的影响

分别以ＳｉＯ_２,Ａｌ_２Ｏ_３和Ａｌ_２Ｏ_３－ＳｉＯ_２复合材料为载体制备了Ｎｉ基石油树脂加氢催化剂（Ｎｉ／ＳｉＯ_２,Ｎｉ／Ａｌ_２Ｏ_３和Ｎｉ／Ａｌ_２Ｏ_３－ＳｉＯ_２）,并在微型加氢反应装置上对石油树脂进行加氢脱色活性评价。评价结果表明,Ｎｉ／ＳｉＯ_２,Ｎｉ／Ａｌ_２Ｏ_３和Ｎｉ／Ａｌ_２Ｏ_３－ＳｉＯ_２催化剂均能达到石油树脂脱色的效果,以Ｎｉ／ＳｉＯ_２为石油树脂加氢催化剂的产品软化点下降幅度最小,下降４℃,以Ｎｉ／Ａｌ_２Ｏ_３－ＳｉＯ_２为石油树脂加氢催化剂得到的加氢石油树脂软化点下降幅度较大。     

STUDY ON COMPLEX IMPEDANCE SPECTROSCOPY OF CU-IMPLANTED SEMICONDUCTING (BaO.72PbO.28)TiO3 CERAMICS

The ac impedance of Nb-doped semicon-ducting (Bao.72Pbo.28)TiO3 ceramics implanted with copper ions(200keV,6X1015 and 1X1017 ions/cm2) in the temperature range 25-320C and the frequency range 10 Hz -13MHz was measured. According to the change of impedance spectroscopy and the equivalent circuit model of semiconducting(Ba, Pb)TiO3 ceramics, the dependence of resistance of bulk and grain-boundary on temperature was analyzed. The results show that relatively low dose must be used to increase the magnitude of the positive temperature coeffieient of resistance(PTCR)effects in the cermmics. In addition,the effects of Cu ion implantation on the PTCR behavior of the ceramics was studied by raststance-tempera-ture measurement.