Preparation and electrical properties of Bi2Zn2/3Nb4/3O7 thin films deposited at room temperature for embedded capacitor applications

Bi₂Zn_2/3Nb_4/3O₇ thin films were deposited at room temperature on Pt/Ti/SiO₂/Si(1 0 0) and polymer-based copper clad laminate (CCL) substrates by pulsed laser deposition. Bi₂Zn_2/3Nb_4/3O₇ thin films were deposited in situ with no intentional heating under an oxygen pressure of 4 Pa and then post-annealed at 150 °C for 20 min. It was found that the films are still amorphous in nature, which was confirmed by the XRD analysis. It has been shown that the surface roughness of the substrates has a significant influence on the electrical properties of the dielectric films, especially on the leakage current. Bi₂Zn_2/3Nb_4/3O₇ thin films deposited on Pt/Ti/SiO₂/Si(1 0 0) substrates exhibit superior dielectric characteristics. The dielectric constant and loss tangent are 59.8 and 0.008 at 10 kHz, respectively. Leakage current density is 2.5 × 10^?7 A/cm² at an applied electric field of 400 kV/cm. Bi₂Zn_2/3Nb_4/3O₇ thin films deposited on CCL substrates exhibit the dielectric constant of 60 and loss tangent of 0.018, respectively. Leakage current density is less than 1 × 10^?6 A/cm² at 200 kV/cm.     

High tunability in (1 1 0)-oriented BaZr0.2Ti0.8O3 (BTZ) lead-free thin films fabricated by pulsed laser deposition

Using a pulsed laser deposition method the BaZr_0.2Ti_0.8 O₃ (BTZ) lead–free thin films with a thickness of ~250 nm were grown on FTO, ITO and Pt–Si substrates, respectively. The analysis results of microstructural, dielectric properties and leakage current reveal that the thin films deposited on Pt–Si substrates are oriented growth along the (1 1 0) direction and exhibit the optimal performance characteristics. Calculations of figure of merit (FoM) and dielectric tunability display a maximum value of ~42.8 and ~68.5% at E = 400 kV/cm at room temperature, respectively. The excellent tunable properties, high dielectric constant (~635@ 100 kHz) and low leakage current density of (9.3 × 10^–8 A/cm² at 400 kV/cm) make the (1 1 0)–oriented BaZr_0.2Ti_0.8 O₃ thin film to be an attractive material for applications of tunable devices.     

Effect of excess Bi2O3 on structures and dielectric properties of Bi1.5Zn1.0Nb1.5O7 thin films deposited at room temperature by RF magnetron sputtering

To compensate for bismuth loss that occurred during the film deposition process, Bi_1.5Zn_1.0Nb_1.5O₇ (BZN) thin films were deposited at room temperature from the ceramic targets containing various excess amounts of bismuth (0–20 mol%) on Pt/TiO₂/SiO₂/Si substrates by using RF magnetron sputtering technique. The effect of bismuth excess content on the microstructure and electrical properties of BZN thin films was studied. The microstructure and chemical states of the thin films were studied by SEM and XPS. EPMA was employed to assess the film stoichiometry. The X-ray diffraction analysis reveals that the BZN thin films exhibit the amorphous structure in nature. An appropriate amount of excess bismuth improves the dielectric and electrical properties of BZN thin films, while too much excess bismuth leads to deterioration of the properties. BZN thin film with 5 mol% excess bismuth exhibits a dielectric constant of 61 with a loss of 0.4% at 10 kHz and leakage current of 7.26×10^?7 A/cm² at an electric field of 200 kV/cm.     

Synthesis and electrical properties of lead-free piezoelectric Bi0.5Na0.5TiO3 thin films prepared by Sol-Gel method

Lead-free Bi_0.5Na_0.5TiO₃ (BNT) piezoelectric thin films were deposited on Pt/TiO_x/SiO₂/Si substrates by Sol-Gel method. A dense and well crystallized thin film with a perovskite phase was obtained by annealing the film at 700 °C in a rapid thermal processing system. The relative dielectric constant and loss tangent at 12 kHz, of BNT thin film with 350 nm thickness, were 425 and 0.07, respectively. Ferroelectric hysteresis measurements indicated a remnant polarization value of 9 μC/cm² and a coercive field of 90 kV/cm. Piezoelectric measurements at the macroscopic level were also performed: a piezoelectric coefficient (d_33effmax) of 47 pm/V at E = 190 kV/cm was obtained. The piezoresponse force microscopy data confirmed that BNT thin films present ferroelectric and piezoelectric behavior at the nanoscale level.     

Microstructure,optical and electrical properties of sputtered HfTiO high-k gate dielectric thin films

The microstructure, optical and electrical properties of HfTiO high-k gate dielectric thin films deposited on Si substrate and quartz substrate by RF magnetron sputtering have been investigated. Based on analysis from x-ray diffraction (XRD) measurements, it has been found that the as-deposited HfTiO films remain amorphous regardless of the working gas pressure. Meanwhile, combined with characterization of ultraviolet-visible spectroscopy (UV–vis) and spectroscopy ellipsometry (SE), the deposition rate, band gap and optical properties of sputtered HfTiO gate dielectrics were determined. Besides, by means of the characteristic curves of high frequency capacitance–voltage (C–V) and leakage current density–voltage (J–V), the electrical parameters, such as permittivity, total positive charge density, border trap charge density, and leakage current density, have been obtained. The leakage current mechanisms are also discussed. The energy band gap of 3.70 eV, leakage current density of 1.39×10⁻⁵ A/cm² at bias voltage of 2 V, and total positive charge density and border trap charge density of 9.16×10¹¹ cm⁻² and 1.3×10¹¹ cm⁻², respectively render HfTiO thin films deposited at 0.6 Pa, potential high-k gate dielectrics in future CMOS devices.     

Preparation and ferroelectric properties of (Na0.5Bi0.5)0.94Ba0.06TiO3 thin films deposited on Pt electrodes using LaNiO3 as buffer layer

(Na_0.5Bi_0.5)_0.94Ba_0.06TiO₃ thin films were deposited on Pt/Ti/SiO₂/Si (1 1 1) and LaNiO₃/Pt/Ti/SiO₂/Si (1 1 1) substrates by a sol–gel process. The phase structure and ferroelectric properties were investigated. The X-ray diffraction pattern indicated that the (Na_0.5Bi_0.5)_0.94Ba_0.06TiO₃ thin film deposited on Pt/Ti/SiO₂/Si (1 1 1) substrates is polycrystalline structure without any preferred orientation. But the thin film deposited on LaNiO₃/Pt/Ti/SiO₂/Si substrates shows highly (1 0 0) orientation (f ≥ 81%). The leakage current density for the two thin films is about 6 × 10^?3 A/cm² at 250 kV/cm, and thin film deposited on LaNiO₃/Pt/Ti/SiO₂/Si substrates possessed a much lower leakage current under high electric field. The hysteresis loops at an applied electric field of 300 kV/cm and 10 kHz were acquired for the thin films. The thin films deposited on LaNiO₃/Pt/Ti/SiO₂/Si substrates showed improved ferroelectricity.     

Low-temperature fabrication of Ba1−xSrxTiO3 thin films with good dielectric properties on platinized silicon substrates

Ba_0.7Sr_0.3TiO₃ (BST) thin films 500 nm in thickness were prepared on technologically desirable Pt/TiO₂/SiO₂/Si(1 0 0) substrates by ion beam sputtering (IBS) and post-deposition annealing method. The effect of annealing temperature on the structural and dielectric properties of BST thin films was systematically investigated. A sharp transition in their tunable dielectric behaviours was observed in good agreement with the evolution of crystal structure from amorphous to crystalline phase. It was demonstrated that the perovskite phase could crystallize in BST films at a very low temperature, around 450 °C. The lowering of perovskite crystallization temperature in the BST films was explained in terms of the high energetic process nature of IBS technique. A high dielectric tunability of 42% at E (electric field intensity) = 500 kV/cm and a low loss tangent of 0.013 at zero bias were both obtained in the 450 °C-annealed film, thereby resulting in the highest figure-of-merit factor among all the different temperature annealed films. Moreover, the 450 °C-annealed film showed superior leakage current characteristics with a low leakage current density of about 10^?4 A/cm² at E = 800 kV/cm.     

Enhanced dielectric and energy-storage properties in BiFeO3-modified Bi0.5(Na0.8K0.2)0.5TiO3 thin films

Lead free Bi_0.5(Na_0.8K_0.2)_0.5TiO₃ thin films doped with BiFeO₃ (abbreviated as BNKT-xBFO) (x = 0, 0.02, 0.04, 0.08, 0.10) were deposited on Pt(111)/Ti/SiO₂/Si substrates by sol-gel/spin coating technique and the effects of BiFeO₃ content on the crystal structure and electrical properties were investigated in detail. The results showed that all the BNKT-xBFO thin films exhibited a single perovskite phase structure and high-dense surface. Reduced leakage current density, enhanced dielectric and ferroelectric properties were achieved at the optimal composition of BNKT-0.10BFO thin films, with a leakage current density, dielectric constant, dielectric loss and maximum polarization of < 2 × 10⁻⁴ A/cm³, ~ 978^, ~ 0.028 and ~ 74.13 μC/cm² at room temperature, respectively. Moreover, the BNKT-0.10BFO thin films possessed superior energy storage properties due to their slim P-E loops and large maximum polarization, with an energy storage density of 22.12 J/cm³ and an energy conversion efficiency of 60.85% under a relatively low electric field of 1200 kV/cm. Furthermore, the first half period of the BNKT-0.10BFO thin film capacitor was about 0.15 μs, during which most charges and energy were released. The large recoverable energy density and the fast discharge process indicated the potential application of the BNKT-0.10BFO thin films in electrostatic capacitors and embedded devices.     

Dielectric properties of composition spread SiO2–Al2O3 mixed phase thin films deposited at room temperature by off-axis RF magnetron sputtering

The dielectric properties of composition spread SiO₂–Al₂O₃ thin films deposited by off-axis radio-frequency magnetron sputtering at room temperature were explored to obtain optimized compositions, which have low dielectric constants and losses. The specific points (compositions) showing superior dielectric properties of low dielectric constants (8.13 and 9.12) and losses (tanδ ～0.02) at 1 MHz were found in area of the distance of 25.0 mm (Al₂Si₃O₈) and 42 mm (Al_2.4Si₃O₈) apart from SiO₂ target side in 75 mm × 25 mm sized Pt/Ti/SiO₂/Si(1 0 0) substrates, respectively. The specific thin films were amorphous phase and the compositions were Al₂Si₃O₈ (k ～8.13) and Al_2.4Si₃O₈ (k ～9.12).     

Growth of highly c-axis oriented LaNiO3 films with improved surface morphology on Si substrate using chemical solution deposition and rapid heat treatment process

LNO (LaNiO₃) thin films were directly deposited onto Si substrates with a thin layer of amorphous natural oxide (SiO₂) using three different precursor solutions. Effects of the constitution of precursor solution and the annealing heating rate on the surface morphology and the orientation were investigated. The LNO film derived from the mixture of a methanol solvent and an acetylacetone chelating agent had the flat surface with no cracks and pinholes. The heating rate of rapid annealing process had a critical effect on the oriented growth of the LNO film, and its c-axis orientation degree increased with the annealing heating rate. The LNO film with the heating rate of 40 ℃/s exhibited the highest degree of c-axis orientation (99.57%) and the lowest resistivity (9.35 × 10^?4 Ω cm). It would be a potential bottom electrode and/or seed layer to integrate perovskite-type films on it for functional devices.     

Controlling microstructure and film growth of relaxor-ferroelectric thin films for high break-down strength and energy-storage performance

The relaxor ferroelectric Pb_0.9La_0.1(Zr_0.52Ti_0.48)O₃ (PLZT) thin films were deposited using pulsed laser deposition, and their microstructures, break-down field strengths and energy storage performances were investigated as a function of the buffer layer and electrode. A large recoverable energy-storage density (U_reco) of 23.2 J/cm³ and high energy-storage efficiency (η) of 91.6% obtained in the epitaxial PLZT film grown on SrRuO₃/SrTiO₃/Si are much higher than those in the textured PLZT film (U_reco = 21.9 J/cm³, η = 87.8%) on SrRuO₃/Ca₂Nb₃O₁₀-nanosheet/Si and the polycrystalline PLZT film (U_reco = 17.6 J/cm³, η = 82.6%) on Pt/Ti/SiO₂/Si, under the same condition of 1500 kV/cm and 1 kHz, due to the slim polarization loop and significant antiferroelectric-like behavior. Owing to the high break-down strength (BDS) of 2500 kV/cm, a giant U_reco value of 40.2 J/cm³ was obtained for the epitaxial PLZT film, in which U_reco values of 28.4 J/cm³ (at BDS of 2000 kV/cm) and 20.2 J/cm³ (at BDS of 1700 kV/cm), respectively, were obtained in the textured and polycrystalline PLZT films. The excellent fatigue-free properties and high thermal stability were also observed in these films.     

The phase formation process of Bi0.5(Na0.8K0.2)0.5TiO3 thin films prepared using the sol-gel method

Lead-free Bi_0.5(Na_0.8K_0.2)_0.5TiO₃ (abbreviated as BNKT) thin films were grown on Pt(111)/Ti/SiO₂/Si substrates using a sol-gel/spin coating technique and were then annealed at different temperatures (350 °C, 550 °C, 750 °C and 850 °C). Analysis of the XRD patterns and FT-IR spectra were used to determine the main reactions and the phase formation process of BNKT thin films during the sol-gel process. The results show that the dielectric constant of the thin films attains a maximum at a set temperature and then decreases at higher annealing temperatures, which can be attributed to phase formation and transformation. Moreover, the morphologies of the BNKT thin films improve with the increase in grain size and the formation of distinct grain boundaries. Furthermore, through increasing the pH of the precursor solutions, the size of the sol-gel colloidal particles increases slightly and the grains formed from the corresponding solutions tend to be small and uniform.     

Microwave dielectric properties of the BaTi5O11 thin film grown on the poly-Si substrate using rf magnetron sputtering

BaTi₅O₁₁ thin films were grown on the poly-Si/SiO₂/Si substrate using rf magnetron sputtering. The BaO-TiO₂ thin film deposited on the poly-Si substrate had an amorphous phase even though the growth temperature was high at 550 °C. The amorphous film was crystallized into the BaTi₅O₁₁ phase when the film was post annealed above 800 °C. The post annealing temperature is one of the most important factors for the formation of the crystalline BaTi₅O₁₁ thin film. The homogeneous BaTi₅O₁₁ thin film was obtained when the film was grown at 550 °C and rapid thermal annealed (RTA) at 900 °C for 3 min. The dielectric constant (ɛ_r) of the BaTi₅O₁₁ film measured at 100 kHz was about 35 and the dissipation factors of all the films were smaller than 4.0%. The dielectric properties of the BaTi₅O₁₁ thin film were also measured at microwave frequencies. For the BaTi₅O₁₁ thin film grown at 550 °C and RTA at 900 °C for 3 min, the ɛ_r of 34–30 and dielectric loss of 0.025 ± 0.005 were obtained at 1–6 GHz.     

Pulsed laser deposition BTS thin films: The role of substrate temperature

BaSn_0.15Ti_0.85O₃ (BTS) thin films were deposited on Pt/Ti/SiO₂/Si(1 0 0) substrate by pulsed laser deposition and the effects of substrate temperature on their structure, dielectric properties and leakage current density were investigated. The results indicate that the substrate temperature has a significant effect on the structural and dielectric properties of the BTS thin films which exhibit a polycrystalline perovskite structure if the substrate temperature ranges within 550–750 °C. The dielectric constant and loss tangent of the BTS thin films deposited at 650 °C are 341 and 0.009 at 1 MHz, respectively, the tunability is 72.1% at a dc bias field of 400 kV/cm, while the largest figure of merit (FOM) is 81.1. The effect of the substrate temperature on the leakage current of the BTS thin films is discussed.     

Structural and electrical properties of Sr2NaNb4O13 thin film grown by electrophoretic method using nanosheets synthesized from K(Sr2Na)Nb4O13 compound

Sr₂NaNb₄O₁₃⁻ (SNNO⁻) nanosheets were exfoliated from the K(Sr₂Na)Nb₄O₁₃ compound that was synthesized at 1200 °C. The SNNO⁻ nanosheets were deposited on a Pt/Ti/SiO₂/Si substrate at room temperature by the electrophoretic method. Annealing was conducted at various temperatures to remove organic defects in the SNNO film. A crystalline SNNO phase without organic defects was formed in the film annealed at 500 °C. However, a SrNb₂O₆ secondary phase was formed in the films annealed above 600 °C, probably due to the evaporation of Na₂O. The SNNO thin film annealed at 500 °C showed a dielectric constant of 74 at 1.0 MHz with a dielectric loss of 2.2%. This film also exhibited a low leakage current density of 9.0 × 10⁻⁸ A/cm² at 0.6 MV/cm with a high breakdown electric field of 0.72 MV/cm.     

Dielectric properties of sol–gel derived CaCu3Ti4O12 thin films onto Pt/TiO2/Si(1 0 0) substrates

The ultrahigh relative dielectric constant (K′) values reported for the CaCu₃Ti₄O₁₂ bulk ceramics (10⁴ at RT) joined to their low thermal dependence, no phase transitions are expected between −173 and 330 °C, make this material very promising for capacitor applications and certainly for microelectronics. The interest in the preparation of this material in thin film form is twofold, the understanding of its physical properties and the integration of this high K′ oxide with the Si technology. In this work, the preparation of CCTO thin films onto Pt/TiO₂/SiO₂/Si(1 0 0) substrates is attempted using sol–gel processing and rapid thermal processing (RTP) at 650 °C. Structural, microstructural and dielectric characterization of the films is performed. The results are commented and discussed on the light of the grain boundary effect on the dielectric constant and the possibility of application of these thin films in microelectronic devices.     

Aqueous chemical solution deposition of ultra high-k LuFeO3 thin films

Thin orthorhombic ultra high-k LuFeO₃ (LFO) films on Si₃N₄/SiO₂/Si substrates were obtained by means of aqueous chemical solution deposition (CSD). Prior to thin film deposition, the precursor synthesis, thermal decomposition and crystallization behavior of the bulk material were studied. It was shown that phase-pure hexagonal LFO powder could be formed at 650 °C while a higher temperature of 900 °C was required to obtain the orthorhombic phase. Deposition on SiO₂/Si resulted in the development of silicates in this temperature range, thus preventing the formation of the orthorhombic LuFeO₃ phase. The use of Si₃N₄/SiO₂/Si as the substrate shifted the silicate formation to higher temperature, allowing the synthesis of phase-pure orthorhombic LuFeO₃ as a thin film at 1000 °C. Impedance spectroscopy analyses confirmed its associated ultra high dielectric constant (>10,000) at room temperature for frequencies lower than or equal to 1 kHz.     

On the mechanical,thermophysical and dielectric properties of Nextel™ 440 fiber reinforced nitride matrix (N440/Nitride) composites

The Nextel? 440 fiber reinforced nitride matrix (N440/Nitride) composites were fabricated by precursor infiltration and pyrolysis (PIP) route. The results demonstrated that the original N440 fiber had a phase composition of amorphous SiO₂ and γ-Al₂O₃. Its single filament tensile strength was 3.03 GPa (at room temperature), while it dropped to 72.6% and 35.1% at 1200 °C and 1400 °C, respectively. The phase content of N440/Ntride composites was mainly γ-Al₂O₃ and amorphous BN, as well as mullite phase (formed at > 1100 °C). The composites owned a flexural strength up to 76.0 MPa at room temperature. The stair-stepping decrease in the load-displacement curve and fiber pull-outs in the fracture surface indicated a good fiber/matrix interface and toughness. By heating at 1400 °C, the composites still possessed 67.4% of original bending strength. It was found that the high temperatures caused strong fiber-matrix bonding and severe fiber degradation. The specific heat, CTE and thermal conductivity of the composites were 0.325–0.586 J g^?1 K^?1, (3.2–4.0) × 10^?6 K^?1 and 0.78–3.47 W m^?1 K^?1, respectively. The composites possessed a dielectric constant of 4.25–4.35 and loss tangent of 0.004–0.01 at 8–12 GHz. The good overall performances enabled the N440/Nitride composites advanced high-temperature wave-transparent applications.     

Preparation of IGZO sputtering target and its applications to thin-film transistor devices

Nano-scale In₂O₃, Ga₂O₃ and ZnO powder mixture prepared by a hybrid process of chemical dispersion and mechanical grinding was adopted for the In–Ga–Zn–O (IGZO) sputtering target fabrication. A pressure-less sintering at 1300 °C for 6 h yielded the target containing sole InGaZnO₄ phase with relative density as high as 93%. Consequently, the thin-film transistor (TFT) devices containing amorphous IGZO channels were prepared by using the self-prepared target and the electrical measurements indicated the TFT subjected to a post annealing at 300 °C exhibits the best device performance with the saturation mobility = 14.7 cm²/V s, threshold voltage = 0.57 V, subthreshold gate swing = 0.45 V/decade and on/off ratio = 10⁸. Capacitance–voltage measurement indicated that post annealing effectively suppresses the interfacial traps density at the IGZO/SiO₂ interface and thus enhances the electrical performance of TFT.     

Dielectric properties and bright red emission of Y3+/Eu3+-codoped ZrO2 thin films prepared by chemical solution deposition

We report on an effective combination of good dielectric properties with bright red emission in Y³⁺/Eu³⁺-codoped ZrO₂ thin films. The thin films were deposited on fused silica and Pt/TiO₂/SiO₂/Si substrates using a chemical solution deposition method. The crystal structure, surface morphology, electrical and optical properties of the thin films were investigated in terms of annealing temperature, and Y³⁺/Eu³⁺ doping content. The 5%Eu₂O₃–3%Y₂O₃–92%ZrO₂ thin film with 400 nm thickness annealed at 700 °C exhibits optimal photoluminescent properties and excellent electrical properties. Under excitation by 396 nm light, the thin film on fused silica substrate shows bright red emission bands centered at 593 nm and 609 nm, which can be attributed to the transitions of Eu³⁺ ions. Dielectric constant and dissipation factor of the thin films at 1 kHz are 30 and 0.01, respectively, and the capacitance density is about 65.5 nf/cm² when the bias electric field is less than 500 kV/cm. The thin films also exhibit a low leakage current density and a high optical transmittance with a large band gap.