微管道散热器换热性能的有限元分析

利用伽辽金有限元公式计算了微管道散热器中的管道表面温度分布、流体温度分布及流动阻力系数和换热系数等。与现有的分析方法对比发现，利用有限元方法可对热负荷任意分布工况下的微管道散热器进行传热性能分析，而且使用范围比现行的大型CFD软件更广，也可用于分析微管道散热器的几何参数对散热器传热性能的影响。     

芯片冷却用微通道散热结构热流耦合场数值研究

对4种微通道散热结构(平行结构、网格结构、螺旋结构和树型结构)在相等传热面积、相同边界条件下的流场与温度场进行数值研究。通过热流耦合场数值分析,得出了不同微通道散热结构的电子芯片温度分布和微通道内的速度场,分析了微通道拓扑结构对电子芯片散热效果的影响。使用平行微通道散热的芯片温度均低于80℃,其中有81%的面积在60℃以下;使用网格和螺旋散热结构的芯片最高温度均在90℃以上,其中温度在20～60℃之间所占比例分别约为62%和61%;使用树型微通道散热的电子芯片温度均低于70℃,其中有94%的面积在60℃以下,且温度分布最均匀。此外,芯片微通道内的流体平均流速大的微通道系统能带走更多的热量。     

Forced air cooling by using manifold microchannel heat sinks

A study of manifold microchannel (MMC) heat sinks for forced air cooling was performed experimentally. The manifold microchannel heat sink differs from a traditional microchannel (TMC) heat sink in that the flow length is greatly reduced to a small fraction of the total length of the heat sink. In other words, the MMC heat sink features many inlet and outlet channels, alternating at a periodic distance along the length of the microchannels while the TMC heat sink features one inlet and one outlet channels. The present study primarily focused to investigate the effects of geometrical parameters on the thermal performance of the manifold microchannel heat sinks for optimal design. Also, the thermal resistances of the MMC heat sinks were compared with those of the TMC heat sinks. Experimental results showed the thermal resistances of MMC heat sinks were affected strongly by the pumping power, the microchannel width and the manifold inlet/outlet channel width, but weakly by the microchannel thickness-width ratio and the microchannel depth coorporated with the manifold inlet/outlet channel width. However, it was found that there existed the optimum values of the latter parameters. Under the optimum condition of geometrical parameters in the present study, the thermal resistance of the MMC heat sink was approximately 35% lower than that of a TMC heat sink, which clearly demonstrated the effectiveness of using a manifold.     

树形微通道热沉仿生建模及三维热流特性数值分析

对几种典型树叶进行参数测量,获得了各级叶脉直径、交角值及直径比例关系,在此基础上建立了树形微通道热沉的CAD模型,并对不同分形级数的双层微通道系统内的温度和流动特性分布进行了数值分析。结果表明,树形微通道具有更好的均温性,7级分形的树形微通道与6级和8级分形的树形微通道相比,所冷却芯片的温度更低,压降更小,具有更好的冷却效果。     

微管道换热器多孔介质模型分析及应用

将微管道换热器抽象成多孔介质模型,由Brinkman-extended Darcy方程出发,分别按照双方程模型和单方程模型进行求解,以得到微管道内流体的速度场和温度场分布,并对单方程模型和双方程模型的解析解进行了对比,讨论了微管道高宽比和有效导热系数比对流动与传热的影响。证明了由基于多孔介质双方程、单方程模型所得的解析解均可用于预测微管道换热器中的容积平均速度与温度分布。利用基于多孔介质双方程模型还可得出微管道换热器的总热阻和优化设计结构,结合硅衬底上的多路感应耦合等离子体刻蚀工艺加工出了经结构优化的硅制微管道换热器。在满足局部热平衡条件下,基于多孔介质单方程模型更适用于实际工程计算,不必经由预先的试验确定换热系数。     

Optimization of triangular microchannel heat sinks using constructal theory

The present paper examines the optimization of triangular microchannel heat sinks. The impact of volume fraction of solid material and pressure drop on the maximum temperature of the microchannel heat sinks are investigated and their optimum operating conditions are compared. From the results, it is seen that increasing the side angle of the triangular microchannel, improves its performance. Furthermore, there is an appropriate agreement between the analytical and numerical results. Finally, the effect of degrees of freedom on the performance of microchannels is investigated. To accomplish this end, the triangular microchannels with the side angle of 60 degree have been chosen as it has the best performance compared to other microchannels. It is observed that the minimized maximum temperatures of optimized microchannel heat sinks with three degrees of freedom are 10% lower than the ones with two degrees of freedom.

     

Analysis of the flow rate characteristics of valveless piezoelectric pump with fractal-like Y-shape branching tubes

Microchannel heat sink with high heat transfer coefficients has been extensively investigated due to its wide application prospective in electronic cooling. However, this cooling system requires a separate pump to drive the fluid transfer, which is uneasy to minimize and reduces their reliability and applicability of the whole system. In order to avoid these problems, valveless piezoelectric pump with fractal-like Y-shape branching tubes is proposed. Fractal-like Y-shape branching tube used in microchannel heat sinks is exploited as no-moving-part valve of the valveless piezoelectric pump. In order to obtain flow characteristics of the pump, the relationship between tube structure and flow rate of the pump is studied. Specifically, the flow resistances of fractal-like Y-shape branching tubes and flow rate of the pump are analyzed by using fractal theory. Then, finite element software is employed to simulate the flow field of the tube, and the relationships between pressure drop and flow rate along merging and dividing flows are obtained. Finally, valveless piezoelectric pumps with fractal-like Y-shape branching tubes with different fractal dimensions of diameter distribution are fabricated, and flow rate experiment is conducted. The experimental results show that the flow rate of the pump increases with the rise of fractal dimension of the tube diameter. When fractal dimension is 3, the maximum flow rate of the valveless pump is 29.16 mL/min under 100 V peak to peak （13 Hz） power supply, which reveals the relationship between flow rate and fractal dimensions of tube diameter distribution. This paper investigates the flow characteristics of valveless piezoelectric pump with fractal-like Y-shape branching tubes, which provides certain references for valveless piezoelectric pump with fractal-like Y-shape branching tubes in application on electronic chip cooling.     

Effect of channel and plenum aspect ratios on the performance of microchannel heat sink under different flow arrangements

Microchannels based heat sinks are considered as potential thermal management solution for electronic devices. The overall thermal performance of a microchannel heat sink depends on the flow characteristics within microchannels as well as within the inlet and outlet plenum and these flow phenomena are influenced by channel aspect ratio, plenum aspect ratio and flow arrangements at the inlet and outlet plenums. In the present research work an experimental investigation has been carried out to understand how the heat transfer and pressure drop attributes vary with different plenum aspect ratio and channel aspect ratio under different flow arrangements. For this purpose microchannel test pieces with two channel aspect ratios, 4.72 and 7.57 and three plenum aspect ratios, 2.5, 3.0 and 3.75 have been tested under three flow arrangements, namely U-, S- and P-types. Test runs were performed by maintaining three constant heat inputs, 125 W, 225 W and 375 W in the range 224.3 ?? R_e ?? 1121.7. Reduction in channel width (increase in aspect ratio, defined as depth to width of channel) in the present case has shown about 126 to 165% increase in Nusselt number, whereas increase in plenum length (reduction in plenum aspect ratio defined as width to length of plenum) has resulted in 18 to 26% increase in Nusselt number.     

Electroosmotically enhanced microchannel heat sinks

The present study investigates the microchannel heat sink for pure electroosmotic, pressure-driven, and mixed (electroosmotic and pressure-driven) flows. A three-dimensional numerical analysis is performed for electroosmotic and mixed flows. Electroosmotic flow (EOF) induced in an ionic solution in the presence of surface charge and electric field is investigated with hydrodynamic pressure-driven flow (PDF) to enhance heat removal through the microchannel heat sink. In a pressure-driven microchannel heat sink, the application of an external electric field increases the flow rate that consequently reduces the thermal resistance. The effects of ionic concentration represented by the zeta potential and Debye thickness are studied with the various steps of externally applied electric potential. A higher value of zeta potential leads to higher flow rate and lower thermal resistance, which consequently reduce the temperature of the microprocessor chip and load of the micropump used to supply coolant to the microchannels. This paper was recommended for publication in revised form by Associate Editor Do Hyung Lee Afzal Husain received B.E. and M.Tech. degrees in Mechanical Engineering with specialization in Thermal Sciences from Aligarh Muslim University, India in 2003 and 2005, respectively. Currently he is pursuing Ph.D. degree in Thermodynamics and Fluid Mechanics in Inha University, Republic of Korea. His research interests are numerical analysis and optimization of heat transfer systems using computational fluid dynamics and surrogate models, development of heat transfer augmentation techniques for conventional and micro systems, thermal analysis of microelectromechanical systems (MEMS), and electronic cooling. Kwang-Yong Kim received a B.S. degree from Seoul National University in 1978, and his M.S. and Ph.D. degrees from Korea Advanced Institute of Science and Technology (KAIST), Korea, in 1981 and 1987, respectively. Presently, he is professor and chairman, School of Mechanical Engineering, Inha University, Incheon, Korea. Prof. Kim is presently the editor-in-chief of Transactions of Korean Society of Mechanical Engineers (KSME), the editor-in-chief of International Journal of Fluid Machinery and Systems (IJFMS), and chief vice president of Korean Fluid Machinery Association (KFMA). Prof. Kim is Fellow of American Society of Mechanical Engineers (ASME).     

小型精密CVD金刚石热沉片的制备研究

CVD金刚石具有优异的导热性能,在微电子热沉应用方面有着广阔的应用前景。利用ICP工艺制造了硅模具,利用有限元对CVD系统中硅模具的温度场和流场进行了研究,在硅模具内制备了小型精密CVD金刚石热沉片。试验结果表明模具法能够获得表面品质好、形状和尺寸精度很高的小型金刚石热沉片。     

铜铝微通道热沉的三维数值结构优化

在恒定泵功0.05 W条件下,对水冷铜基和铝基微通道热沉对流换热进行详细数值模拟和结构优化。通过将数值预测结果与前人已发表的试验结果进行对比,验证所使用的数值模型的正确性。同时讨论在恒定泵功下微通道几何结构对微通道热沉中温度分布的影响。模拟结果显示水冷铜基微通道热沉最优的几何结构参数为通道深为580μm,通道宽为90μm,通道密度为100个/cm;铝基微通道热沉最优的几何结构参数为通道深为620μm,通道宽为80μm,通道密度为100个/cm。     

CPU散热器结构设计与热分析

CPU散热器是将CPU核心热量迅速导出的关键,已成为获得新一代电子芯片的主要问题之一。采用数值模拟方法对放射状太阳花CPU散热器进行三维流场及温度场分析,探讨放射状散热器在不同的肋片形状、肋片数N和肋片厚度等各种不同的参数作用下,对于整体散热器散热和流动性能的变化与影响,同时分析了太阳花散热器自然对流和瞬时动态特性。     

用于大功率激光二极管列阵的硅基微通道热沉研制

将田口稳健设计方法用于面向大功率激光二极管列阵的硅基屋脊式微通道热沉的优化设计,利用正交试验和信噪比分析实现了参数的稳健优化。采用激光二极管条对样品进行了封装和测试。利用砷化镓激光波长的温度漂移系数估算出了中间的激光二极管条的有源区温升。测试结果表明,该微通道热沉的单位面积热阻约为0.070 K•cm2/W,与有限元分析结果基本一致。     

Approximate method of determining the optimum cross section of microhannel heat sink

Microchannels are at the forefront of today’s cooling technologies. They are widely being considered for cooling of electronic devices and in micro heat exchanger systems due to their ease of manufacture. One issue which arises in the use of microchannels is related to the small length scale of the channel or channel cross-section. In this work, the maximum heat transfer and the optimum geometry for a given pressure loss have been calculated for forced convective heat transfer in microchannels of various cross-section having finite volume for laminar flow conditions. Solutions are presented for 10 different channel cross sections: parallel plate channel, circular duct, rectangular channel, elliptical duct, polygonal duct, equilateral triangular duct, isosceles triangular duct, right triangular duct, rhombic duct and trapezoidal duct. The model is only a function of the Prandtl number and the geometrical parameters of the cross-section, i.e., area and perimeter. This solution is performed with two exact and approximate methods. Finally, in addition to comparison and discussion of these two methods, validation of the relationship is provided using results from the open literature.     

An experimental study on the heat transfer and pressure drop characteristics of electronics cooling heat sinks with FC-72 flow boiling

Journal of Mechanical Science and Technology - An experimental study was performed to measure FC-72(C6F14) flow boiling heat transfer and pressure drop in heat sinks for electronics cooling. The...     

Performance analysis of air-cooled microchannel absorber in absorptionbased miniature electronics cooling system

Theoretical analysis and simulation of performance of an air-cooled microchannel absorber is reported in this study. It is shown that the air-cooled microchannel absorber can be integrated into an absorption-based miniature electronics cooling system by which the chip junction temperature can be maintained near room temperature, while removing 100 W of heat load. Water/LiBr pair is used as the working fluid and refrigerant vapor is intended to counter-currently flow against aqueous LiBr solution flow. Parametric study is carried out to determine the effects of several operating parameters, including inlet temperature and mass flow rate of the coolant, and inlet temperature of LiBr solution. To facilitate the air-cooling of microchannel absorber, an offset-strip-fin array is adopted, by which enhanced air-side heat transfer coefficient and large heat transfer area are obtained. The performance of the air-cooled absorber is compared to liquid-cooled absorber.     

A cooling system using wickless heat pipes for multichip modules: Experiment and analysis

The present study is concerned with a cooling package system for electronic components such as multichip modules (MCM) which are used in many electronic system. The im of the cooling capacity up to heat flux of 4 W/cm² was achieved. A heat flux of 4 W/cm² is about two to three times of the value generally accepted as the limit by forced air cooling together with heat pipes (Kishimoto et al., 1994). The data obtained from the experimental program was used to manifest the deficiency and inaccuracies of multitude of the empirical correlations for various heat transfer modes involved in the computer simulation of the proposed system. The dominant role of the temperature distributions in the system and the related two-phase flow heat transfer have been quantitatively identified and the limit of the computer simulation for such system as proposed in the present study has been advanced.     

密闭机箱风冷散热结构设计与分析

文中以在严酷环境条件下使用的某型便携式电子设备为研究对象,结合传统机箱结构,设计出一款在高温环境下强迫风冷散热的密闭机箱。通过中空盖板设计,让气流在中空盖板内流动,以提高发热芯片与空气的换热速度,有效地降低整机设备及内部模块的温度,保证设备在湿热、盐雾、淋雨、高温等恶劣环境下能长时间正常工作。为了验证该强迫空冷散热设计的可实施性和量化设计指标,利用ANSYS Fluent软件对其结构装置在不同环境温度和风扇功率下的散热效果进行了三维仿真。仿真结果表明,中空盖板内的最优通风风速为1.5 m/s,该通风风速可使密闭机箱的散热效果与电能消耗达到最优平衡。     

基于仿生学的微通道耦合射流系统设计与研究

随着芯片热流密度的不断增长,散热问题日益严峻.文中以叶片脉络、斐波那契数列螺旋和雪花晶体结构为基础设计了3种由中心向四周拓扑的微通道耦合射流模型.通过仿真计算,分析了这3种仿生模型和典型肋柱模型的温度分布,并分析了这4种模型在不同雷诺数下的平均努塞尔数、在不同热流密度下的芯片温升和在不同泵功率下的综合性能.结果表明:3...     

微电子芯片高热流密度相变冷却技术

介绍了微电子芯片高热流密度相变冷却技术,包括热管、热虹吸、环路热管、毛细泵吸环路,分析了各自的优缺点,提出LHP和CPL技术是唯一能替代热管技术的先进相变冷却技术,将是今后微电子芯片高热流密度冷却的主要方向.