A COMPLEX DEFORMATION MECHANISM FOR SUPERPLASTIC DEFORMATION OF Mg ALLOY

本文选用大晶粒和微细晶粒两种镁合金,利用现代测试手段进行超塑性变形机制的研究.结果表明,在超塑性变形条件下,两种合金都显示以晶界滑动为主的,由扩散蠕变和位错滑移所协调的复合变形机制.作者提出一个包括三种变形机制在内的复合机制模型.在超塑性变形中,下层金属晶粒通过晶界滑动不断涌现到试样表面横向晶界发生宽化及空洞的地方,从而不断增加沿拉伸轴方向上的晶粒数.这是试样在拉伸变形中获得非常大的伸长量的原因.     

脉冲电流对Ti-6Al-4V冷拉拔变形行为的影响(英文)

利用电子背散射衍射(EBSD)及透射电镜(TEM)研究在脉冲电流作用下Ti-6Al-4V钛合金冷拉拔变形后组织及织构的演变。研究结果表明:施加脉冲电流可以促进非有利滑移取向的晶粒发生变形,从而使Ti-6Al-4V钛合金各晶粒之间的变形更为协调。常规拉拔和电塑性拉拔的丝材织构对比显示,脉冲电流促进钛合金柱面,a滑移,抑制锥面c+a滑移,通过晶界滑移协调c方向应变。电塑性拉拔钛合金的小角度晶界比例降低,说明脉冲电流抑制了变形诱发伴生位错晶界和几何必须晶界的形成。     

Crossover from grain boundary sliding to rotational deformation in nanocrystalline materials

A theoretical model is suggested which describes cooperative action of grain boundary (GB) sliding and rotational deformation in mechanically loaded nanocrystalline materials. Focuses are placed on the crossover from GB sliding to rotational deformation occurring at triple junctions of GBs. In the framework of the model, gliding GB dislocations at triple junctions of GBs split into dislocations that climb along the adjacent boundaries. The splitting processes repeatedly occurring at triple junctions give rise to climb of GB dislocation walls that carry rotational deformation accompanied by crystal lattice rotation in grains of nanocrystalline materials. The role of GB sliding, rotational deformation and conventional dislocation slip in high-strain-rate superplastic flow in nanocrystalline materials is discussed.     

On the role of plastic deformation during the mild wear of alumina

Polycrystalline -alumina was worn against Mg-partially stabilized zirconia (Mg-PSZ), using water lubrication, a sliding speed of 0.24 m/s and a load of 10 N. Differential wear between grains (maximum 33 nm) and fine (0.3–1.9 μm diameter) abrasive grooves were found on the worn surface. TEM of back-thinned samples indicated widespread dislocation flow at the surface, heterogeneously distributed between grains, and largely associated with abrasive grooves. Those grains standing proud of the surface invariably contained extensive dislocation damage. The dominant slip system was pyramidal ( , , and ) although occasional basal slip was also found. No prism slip was observed. The pyramidal slip planes were concentrated at angles of 6–33° to the worn surface. Basal slip was frequently associated with basal twinning on planes at 72–73° to the worn surface. Dislocation pile-ups at grain boundaries often coincided with grain boundary cracking. The extent of damage from abrasive grooves varied from grain to grain and was dictated by crystallographic orientation more than the grain height. No evidence of mechanical damage was found in those grains that had suffered the highest wear, indicating that material removal had been controlled by tribochemical mechanisms. The origin of the differential wear between grains is considered and the implications of the experimental observations on the time-dependent transition to severe wear in aluminas are discussed.     

High-temperature grain boundary sliding behavior and grain boundary energy in cubic zirconia bicrystals

Misorientation dependence of grain boundary energy and grain boundary sliding at high temperature were examined in cubic zirconia bicrystals with [1 1 0] symmetric tilt boundaries, which were fabricated by diffusion bonding method from two cubic zirconia single crystals. High-resolution transmission electron microscopy observation revealed that the grain boundary in cubic zirconia bicrystals was clean and atomically sharp without any void or grain boundary amorphous layer. Grain boundary energy of the tilt boundaries was estimated from the dihedral angles on thermal grooved surface measured with atomic force microscope techniques. The misorientation dependence of the grain boundary energy in cubic zirconia bicrystals shows similar tendency to that of fcc metal such as aluminum and copper. Grain boundary sliding associated with intragranular dislocation slip in cubic zirconia bicrystals was observed for all specimens. The amount of the grain boundary sliding showed a good correlation with the misorientation factor of each boundary. Grain boundary migration also took place accompanying with the grain boundary sliding. The observed grain boundary sliding and migration can be explained based on a dislocation mechanism for sliding which is based on the movement of lattice dislocations along the grain boundary by a combination of climb and glide.     

Interior dislocation behavior in superplastic deformation of 8090 Al-Li alloy

1lNTRODUCTl0NInteriordislocationslipisoneoftheimpor-tantaccomodationmechanisminsuperplasticde-f....ti..[1~10J,inwhichthegrainsarerefinedbydynamicrecrystallization.Butthesuperplas-ticdeformationprocessleadstodifferentgrainsizesatvariousstagesandcausesachangeingrainboundaryslidingquantity,italsomakestlieaccommodatingmechanismsatvariousstagesshowdifferentfunctions,especiallydislocationslipmechanism.Therefore,itissignificantf0rthisinvestigationtoreplenishthecurrenttheoryofsuperplasticdeformati…     

Competing deformation mechanisms in nanocrystalline metals and alloys: Coupled motion versus grain boundary sliding

Plastic deformation of nanocrystalline Pd and Cu as well as the demixing systems Cu–Nb and Cu–Fe is studied by means of atomic-scale computer simulations. The microstructures are specifically chosen to facilitate mesoscopic grain boundary sliding. The influence of segregating solutes on the deformation mechanisms is studied and different cases of solute distributions are compared. We find that the competition between mesoscopic grain boundary sliding and coupled grain boundary motion is controlled by the concentration and distribution of segregating solutes. By analyzing the microstructural evolution and dislocation activity we make a connection between the atomistic solute distribution and the mechanisms of deformation, explaining the observed stress–strain behavior. The detailed analysis of the normal grain boundary motion reveals a stick–slip behavior and a coupling factor which is consistent with results from bicrystal simulations.     

Grain Boundary Contributions to Hydrogen-Affected Plasticity in Ni-201

Hydrogen embrittlement of structural materials, such as nickel-based alloys, is often characterized by enhanced dislocation processes as well as grain boundary decohesion leading to macroscale intergranular fracture. Nanoindentation and scanning probe microscopy (SPM) were used to characterize slip transfer across random grain boundaries and Σ3 recrystallization twins in annealed Ni-201. Thermal hydrogen charging leads to an increase in slip step width within pileups produced by nanoindentation along grain boundaries. The likelihood of slip transmission in the presence of hydrogen depends on the ease of slip within adjacent grains as well as on the misorientation of the grain boundary between them. The observed changes suggest that hydrogen limits dislocation cross-slip while increasing overall dislocation mobility. Coupled nanoindentation and SPM investigations provide a unique, local method for analyzing hydrogen effects on dislocation plasticity, which will be useful in developing grain-boundary-engineered materials.     

SLIP FEATURE AND GRAIN BOUNDARY BEHAVIOURS OF Ni_3Al ALLOYS DURING DEFORMATION

The deformation behaviours of Ni_3Al alloys with various chemical compositions and subjectedto different heat treatments were in situ observed under SEM. Moreover,in situ observationsof slip trace were supplemented by the direct observation of dislocation arrangements underTEM.In B-doped Ni_3Al alloys it is shown that close to the grain boundary there exists a thinslip transition region,within which slip lines are reoriented or other slip systems are operatedto produce a local strain accommodation and to relax the stress concentration at grain bound-aries.Boron seems to lower the stress for dislocation generation from the grain boundaries orto ease the cross-slip close to the boundaries,and also to increase the number of dislocationsources.However,B-enhenced ductility is seriously affected by stoichiometry,the addition ofa tertiary alloy element and heat treatment,etc..     

金属间化合物Ag3Sn对Sn3.8Ag0.7Cu焊料合金拉伸性能的影响

利用不同凝固速率和等通道挤压法制备不同组织结构的Sn3.8Ag0.7Cu合金,使其包含不同形貌、大小及分布的Ag3Sn金属间化合物;拉伸曲线的比较分析和变形后组织的电镜观察表明,大的针状化合物对合金起着纤维增强的作用,但自身脆性断裂造成空洞,降低了材料的塑性;微细颗粒状化合物起着弥散强化作用,分布在小的等轴晶粒晶界上的化合物颗粒能够阻碍晶界的滑动,起到增强的作用.     

中低应变量冷轧AA1050铝合金中晶粒取向与形变位错界面的演变

采用ECC和EBSD技术研究了AA1050铝合金冷轧至中低应变量下位错界面结构的演变. 结果表明, 冷轧至中低应变量下形成典 型的位错胞块结构,其微观组织结构强烈依赖于晶粒的取向. 变形后主要形成三种典型的组织结构: Type A------两组交叉的几何必须位错界面 (GNBs) 结构,Type B------一组GNBs结构, Type C------近似等轴的普通胞状结构. 绝大多数Copper, Brass和Goss取向的晶粒具有Type A结构, S取向的晶粒具有Type B结构, 而Cube取向的晶粒主要具有Type C结构. 变形过程中的GNBs不仅具有与RD成±(30°---40°) 的宏观取向, 而且大多数GNBs位错界面近似平行于由最大Schmid因子所确定的{111}滑移面的迹线.     

拉伸变形对Hastelloy C-276合金组织与力学性能的影响

采用金相(OM)、电子背散射衍射(EBSD)以及拉伸实验等技术手段研究了不同变形量条件下Hastelloy C-276合金薄板的组织演化特征和力学性能。结果表明:变形量小于14%时,位错优先在晶界附近塞积,并产生局部应变集中;变形量在14%~30%范围内,孪晶界附近及晶粒内部产生大量位错,位错滑移引起晶粒内部应变集中增强;变形量由0%增加至30%,晶界应变集中程度因子先增大后减小,变形量为14%时晶界应变集中程度因子最大。利用Ludwigson模型回归拟合了不同变形条件下的真应力-真应变曲线,随变形量的增加,材料的加工硬化程度提高,加工硬化速率减小,发生单滑移向多滑移转变的临界应变减小。     

疲劳/蠕变复合作用下GH169合金变形和断裂过程的动态观察

利用高温金相显微镜动态观察了GH169合金在疲劳/蠕变复合作用下的变形和断裂过程。结果表明,疲劳/蠕变复合作用下的变形方式有晶内滑移、孪生和晶界滑动,其失效方式因显微组织而不同。沿晶裂纹源于晶界滑动在三叉点处产生的W型裂纹和晶界局部形变区,其扩展机制为空洞的形核、聚集长大和相互连接;穿晶裂纹源于晶内形变损伤区,其扩展机制为沿滑移面的剪切断裂。     

Mechanism of dynamic continuous recrystallization during superplastic deformation in a microduplex stainless steel

Microstructural evolution during the cyclic cold-rolling and annealing process in an (α + γ) microduplex stainless steel, which consists of α subgrains and fine γ particles, has been studied in detail with the aim of clarifying the mechanism of dynamic continuous recrystallization. A continuous increase in α subgrain boundary misorientation is obtained by the present processing where grain boundary sliding does not occur and the effect of increasing boundary misorientation with cumulative strain is comparable to those observed in dynamic continuous recrystallization of superplastic aluminium alloys. The increase in boundary misorientation is accounted for by the absorption of dislocations into subgrain boundaries during annealing, dislocations which had operated to accommodate the plastic strain incompatibility of the neighboring phases undergoing slip deformation. The present results show that grain boundary sliding is not indispensable but the difference in accommodation deformation between adjacent subgrains is of great importance for the dynamic continuous recrystallization during superplastic deformation.     

Effect of minor Sc and Zr on superplasticity of Al-Mg-Mn alloys

The effect of Sc and Zr on the superplastic properties of Al-Mg-Mn alloy sheets was investigated by control experiment. The superplastic properties and the mechanism of superplastic deformation of the two alloys were studied by means of optical microscope, scanning electronic microscope and transmission electron microscope. The elongation to failure of Al-Mg-Mn-Sc-Zr alloy is larger than that of Al-Mg-Mn alloy at the same temperature and initial strain rate. The variation of strain rate sensitivity index is similar to that of elongation to failure. In addition, Al-Mg-Mn-Sc-Zr alloy exhibits higher strain rate superplastic property. The activation energies of the two alloys that are calculated by constitutive equation and linear regression method approach the energy of grain boundary diffusion. The addition of Sc and Zr decreases activation energy and improves the superplastic property of Al-Mg-Mn alloy. The addition of Sc and Zr refines the grain structure greatly. The main mechanism of superplastic deformation of the two alloys is grain boundary sliding accommodated by grain boundary diffusion. The fine grain structure and high density of grain boundary, benefit grain boundary sliding, and dynamic recrystallization brings new fine grain and high angle grain boundary which benefit grain boundary sliding too. Grain boundary diffusion, dislocation motion and dynamic recrystallization harmonize the grain boundary sliding during deformation.     

Effect of fully lamellar morphology on creep of a near γ-TiAl intermetallic

Creep properties of a polycrystalline binary near γ-TiAl intermetallic in two fully lamellar microstructural conditions are presented. Creep tests (760°C/240 MPa) indicate that a lamellar structure with fine interface spacing and planar grain boundaries improves creep resistance. A lamellar structure with wide lamellar interface spacing and interlocked grain boundaries has less than half the creep life, five times higher minimum creep strain rate and a greater tertiary creep strain. The deformation substructures are presented in terms of the lamellar orientation to the stress axis and indicate that creep strain is accommodated by dislocation motion in soft oriented grains, but the creep strain rate is controlled by hard oriented grains. The extent of tertiary creep is controlled by the grain boundary morphology, with planar grain boundaries susceptible to intergranular cracking. The results suggest that to maximize the creep resistance of near γ-TiAl intermetallics with lamellar microstructures requires narrow lamellar interface spacing and interlocked lamellae along grain boundaries.     

冲击疲劳循环形变阶段的晶界行为

研究了低碳钢在低周冲击疲劳循环变阶段的晶界行为,用扫描电子显微镜对试样表面进行了观察,结果表明晶界表出如下特征,滑移线既可连续地跨越晶界,也可受阻于晶界并形成台阶,晶界发生诸如增粗,消失等现象,伴随着形变过程,出现新的亚晶界,晶界的既阻碍滑移,又激发次滑移系开动,讨论了产生这些现象的可能机制。     

Al_2O_3-ZrO_2-Spinel三元纳米复相陶瓷超塑性变形及组织演变

采用真空热压烧结工艺制备了三元纳米复相陶瓷并进行了超塑性压缩试验.结果表明:纳米复相陶瓷中的第二相在烧结和变形过程中有效地阻止了基体Al_2O_3的晶粒长大.在1650 ℃材料表现出良好的高应变速率超塑变形能力,变形抗力小于30 MPa.微观组织观察表明由于变形过程中存在有益压应力,材料变形后晶界处未出现空洞,经变形量为60%的压缩变形后材料中存在较高密度的位错,位错主要存在于尖晶石和氧化锆第二相中,基体Al_2O_3的晶粒仍为等轴状,表明位错运动对晶界滑移起到了积极地协调作用.     

晶粒尺寸和孪晶界间距对纳米多晶铝合金塑性变形影响的分子动力学模拟研究

采用分子动力学模拟方法,分别研究了晶粒尺寸和孪晶密度对纳米多晶铝合金塑性变形的影响。模拟结果表明,弛豫后的位错密度对纳米多晶Al的微观结构演变和逆Hall-Petch关系产生了重要影响。变形受晶粒大小限制,在细晶中可形成层错四面体和复杂层错结构,从而激活了晶界的辅助变形。当孪晶界间距（TBS）较大时,Shockley分位错在晶界处形核并增殖。然而,随着TBS的减小,孪晶界成为Shockley分位错的来源。孪晶界上大量的分位错形核会导致孪晶界迁移甚至消失。在塑性变形过程中还观察到形变纳米孪晶。研究结果为开发具有可调节力学性能的先进纳米多晶Al提供了理论基础。     

Grain Boundary Responses to Heterogeneous Deformation in Tantalum Polycrystals

The evolution of heterogeneous deformation in a tantalum polycrystal was examined during a three-point bending experiment using electron backscatter pattern mapping. Slip bands formed at strains as low as 1%, and they became more intense with strain. Heterogeneous deformation was evident as intragranular orientation gradients as large as 30° were observed after a strain of about 8%. Nonmonotonic changes in the local average misorientation distribution were observed, implying that dislocation substructure developed in a complex manner. Slip bands were analyzed using plane traces computed from local orientation information. With the assumption of uniaxial stress, Schmid factors for favorable slip systems were identified for each grain and compared with observations, showing evidence for macroscopic activity on both {110} and {112} slip systems. Reconstructed boundary data were used to estimate the geometric potential for slip transfer at grain boundaries. The correlations indicated that when active slip systems were favorably oriented for slip transfer across the boundary, it was often observed in the form of continuous slip bands aligned across the boundary. In boundaries where geometrical alignment and Schmid factors were not favorable for slip transfer, there was a higher likelihood to form ledges (topographic discontinuities) along the grain boundaries. Dislocation pileups at grain boundaries were also correlated with a low potential for slip transfer.