CaO对MgO-Al2O3-SiO2微晶玻璃烧结和性能的影响

研究了氧化钙对MgO-Al2O3-SiO2系微晶玻璃烧结特性和性能的影响。结果表明:氧化钙替代氧化镁能够促进微晶玻璃粉体的烧结致密化,影响玻璃的晶化特性、介电性能和热膨胀特性。随着氧化钙量的增加,样品的介电常数和热膨胀系数增加,但其介质损耗呈现先减小后稍微增加的趋势。含3%CaO(质量分数)的样品可在900℃烧结致密化,并具有低的εr(5.4)、低的tgδ(≤0.13×10-2)和低的α(3.55×10-6℃-1),是一种有应用前景的低温共烧陶瓷基板材料。     

Yb_(2)O_(3)掺杂对镁铝硅系微晶玻璃烧结和性能的影响北大核心CSCD

采用高温熔融法制备Yb_(2)O_(3)掺杂镁铝硅系微晶玻璃,探究了不同Yb_(2)O_(3)含量对镁铝硅系微晶玻璃的晶相组成、微观结构以及热学、力学、介电性能的影响,并借助烧结动力学模型和稳固度模型分别计算了烧结活化能和玻璃稳固度。结果表明,Yb_(2)O_(3)掺杂有利于α-堇青石的析出,从而降低了镁铝硅体系的热膨胀系数;Yb_(2)O_(3)能显著降低烧结活化能,促进烧结过程,使微观结构致密化,提升了力学性能;掺杂0.1%(质量分数)的Yb_(2)O_(3)可以降低玻璃的稳固度,使玻璃体系变得活跃,有利于晶相的析出,增加镁铝硅体系的结晶度。在950℃烧结下镁铝硅体系获得最佳性能:热膨胀系数为3.40×10^(-6)/℃;抗弯强度为182 MPa;介电常数为6.18;介电损耗为1.9×10^(-3)。     

北京宝迪科工贸有限公司

本公司可对于化学瓷、普瓷、堇青石、滑石瓷、95％ Al2O3、99％ Al2O3、99．9％ Al2O3、99．99％ Al2O3(透明)、刚玉、氧化锆增韧氧化铝瓷、氧化锆瓷、镁橄榄瓷等不同材料、不同类型的陶瓷零件采用干压、等静压、热压铸、注浆、注凝、注射、挤制、轧膜、流延等不同类型的成型工艺及不同类型的烧结设备进行成型烧结加工。     

北京宝迪科工贸有限公司

本公司可对于化学瓷、普瓷、堇青石、滑石瓷、95％ Al2O3、99％ Al2O3、99．9％ Al2O3、99．99％Al2O3(透明)、刚玉、氧化锆增韧氧化铝瓷、氧化锆瓷、镁橄榄瓷等不同材料、不同类型的陶瓷零件采用干压、等静压、热压铸、注浆、注凝、注射、挤制、轧膜、流延等不同类型的成型工艺及不同类型的烧结设备进行成型烧结加工。     

材料

0600112 利用累托石合成堇青石[刊,中]／周燕／／山东理工大学学报(自然科学版)．-2005,19(1)．-72-76(G) 利用湖北省钟祥累托石作为合成堇青石的主要原料,主要研究了堇青石熟料对合成堇青石性能的影响。试验表明:加入30％堇青石熟料的坯料性能最好,且合成温度低,合成的堇青石机械度高,热稳定性好,热     

氧化铈对堇青石基微晶玻璃介电性能的影响

采用X-射线衍射(XRD)、扫描电镜(SEM)等手段研究了CeO2在堇青石基玻璃烧结中的作用及其添加量对微晶玻璃的烧结和性能的影响。结果表明,CeO2的加入可有效促进微晶玻璃的烧结致密化;随着CeO2加入量的增加,烧结样品的介电常数呈现先增加后降低的趋势,且与密度变化曲线相似;当CeO2添加量达4%(质量分数)时样品的介质损耗因子最低(≈0.2%)。     

低温烧结0.5CaTiO3-0.5CaTiSiO5高频介质陶瓷

对添加2ZnO-B2O3玻璃实现0.5CaTiO3-0.5CaTiSiO5 高频介质材料900℃下低温烧结进行了系统研究。实验结果表明:添加质量分数为5%~10% 2ZnO-B2O3玻璃可使体积密度达到0.5CaTiO3-0.5CaTiSiO5理论密度的97%以上,且介电性能优异,r = 58~76,tg? 3.3?04,= (329~472)?06/℃,? 1012 cm。利用XRD、SEM和介电测量技术分析材料的晶相组成、显微结构和介电特性发现:材料由三种晶相组成,分别是单斜型CaTiSiO5、正交型CaTiO3以及一个新相,新相的生成可能是在液相烧结后期2ZnO-B2O3 玻璃在晶界处结晶而形成,低温烧结0.5CaTiO3-0.5CaTiSiO5 介质材料的介电性能很好地遵循李氏对数混合法则。     

低温烧结0.5CaTiO3-0.5CaTiSiO5高频介质陶瓷

对添加2ZnO-B2O3玻璃实现0.5CaTiO3-0.5CaTiSiO5 高频介质材料900℃下低温烧结进行了系统研究.实验结果表明添加质量分数为5%～10% 2ZnO-B2O3玻璃可使体积密度达到0.5CaTiO3-0.5CaTiSiO5理论密度的97%以上,且介电性能优异,εr = 58～76,tgδ≤ 3.3×10-4,αε= (329～472)×10-6/℃,ρν≥ 1012 Ω?cm.利用XRD、SEM和介电测量技术分析材料的晶相组成、显微结构和介电特性发现材料由三种晶相组成,分别是单斜型CaTiSiO5、正交型CaTiO3以及一个新相,新相的生成可能是在液相烧结后期2ZnO-B2O3 玻璃在晶界处结晶而形成,低温烧结0.5CaTiO3-0.5CaTiSiO5 介质材料的介电性能很好地遵循李氏对数混合法则.     

BNN对BZN系统结构和介电性能的影响

研究了Ba（Ni1／3Nb2／3）O3（BNN）对Ba（Zn1／3Nb2/3）O3（BZN）系统结构和介电性能的影响。系统的主晶相为立方钙钛矿结构的BZNN，并有少量第二相如Ba5Nb4O15，BaNb2O6等。实验表明，引入适量的BNN可以调整BZN的温度系数，且能有效改善其介电性能，当BNN摩尔分数为0．7时，于1450℃，1500℃烧结时性能最好。系统在较高温度下（1550℃）烧结时形成富Nb液相区。     

Li2O掺杂对CBS/Al2O3玻璃陶瓷性能的影响

研究了Li2O掺杂对CBS/Al2O3玻璃陶瓷烧结性能和介电性能的影响.结果表明,掺杂适量的Li2O可改善CBS/Al2O3玻璃陶瓷的烧结性能和介电性能,当掺杂Li2O的质量分数为0.5%时,CBS/Al2O3玻璃陶瓷在810 ℃可实现低温致密化烧结,试样的体积密度为2.89 g/cm3;在1 MHz的测试频率下,该材料的介电常数为8.6,介电损耗为1.0×10-3;XRD分析表明其相组成主要为CaSiO3、CaAl3BO7、残余Al2O3和玻璃相.     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Teleportation of an arbitrary unknown N-qubit entangled state under the controlling of M controllers

A new quantum protocol to teleport an arbitrary unknown N-qubit entangled state from a sender to a fixed receiver under M controllers(M < N) is proposed. The quantum resources required are M non-maximally entangled Greenberger-Home-Zeilinger (GHZ) state and N-M non-maximally entangled Einstein-Podolsky-Rosen (EPR) pairs. The sender performs N generalized Bell-state measurements on the 2N particles. Controllers take M single-particle measurement along x-axis, and the receiver needs to introduce one auxiliary two-level particle to extract quantum information probabilistically with the fidelity unit if controllers cooperate with it.     

A rigorous proof of MIMO channel capacity’s increase with antenna number

It is well known that adding more antennas at the transmitter or at the receiver may offer larger channel capacity in the multiple-input multiple-output（MIMO） communication systems. In this letter, a simple proof is presented for the fact that the channel capacity increases with an increase in the number of receiving antennas. The proof is based on the famous capacity formula of Foschini and Gans with matrix theory.     

Diode-end-pumped Nd:YVO4/LBO lasers with 4.2W continuous-wave output at 457 nm

A continuous-wave (CW) 457 nm blue laser operating at the power of 4.2 W is demonstrated by using a fiber coupled laser diode module pumped Nd: YVO4 and using LBO as the intra-cavity SHG crystal With the optimization of laser cavity and crystal parameters, the laser operates at a very high efficiency. When the pumping power is about 31 W, the output at 457nm reaches 4.2 W, and the optical to optical conversion efficiency is about 13.5% accordingly. The stability of the out putpower is better than 1.2% for 8 h continuously working.     

Call for Papers

正Wireless Body-area Networks The last decade has witnessed the convergence of three giant worlds:electronics,computer science and telecommunications.The next decade should follow this convergence in most of our activities with the generalization of sensor networks.In particular with the progress in medicine,people live longer and the aging of population will push the development of wireless personal networks