Influence of interfacial reaction between molten SnAgCu solder droplet and Au/Ni/Cu pad on IMC evolution

Intermetallic compounds（IMC） formed at Sn-Ag-Cu solder droplet/pad interface during wetting reaction were investigated. Comparative studies of the IMC evolution during reflow and aging were also conducted. The results show that the wetting reaction between molten solder droplet and pad leads to the formation of Au-Sn compound at interface, but Au element is not fully consumed during wetting reaction. After reflow, all Au layer disappears from the interface, Au element is dissolved into solder and Au-Sn intermetallic compounds are precipitated in the bulk. Reaction between Ni layer and Sn-Ag-Cu solder leads to the formation of （CuxNi1-x）6Sn5 layer at interface during reflow. According to the thermodynamic-kinetic of interfacial reaction, the wetting reaction at solder droplet/pad interface influences the phase selectivity of IMC evolution during reflow and aging process.     

Microstructural Characteristics and Heat Transfer of Flattened Millimeter-size Nickel Droplet

The splat is the fundamental unit of thermally sprayed coatings,which has been one of the hottest issues for decades.In order to study the splat formation,an experiment was designed and conducted,in which a millimeter-size nickel metal droplet fell freely and impacted on aluminum and stainless steel substrate.The microstructural characteristics of the splat and the heat conduction and solidification processes during the flattening process have been studied numerically and experimentally.The effect of the droplet temperature,impact velocity as well as the substrate temperature was investigated.The phenomenon of substrate melting was observed after the spreading of nickel droplet,which became more pronounced when the initial substrate temperature increased.Increasing the impact velocity of droplet resulted in a decrease in the interfacial temperature between droplet and substrate.     

Study on laser and hot air reflow soldering of PBGA solder ball

Laser and hot air reflow soldering of PBGA solder ball was investigated.experimental results showed that surface quality and shear strength of solder bump reflowed by laser was superior than the solder bump by hot air ,and the microstructure within the solder bump reflowed by laser was much finer.Analysis on interfacial reaction showed that eutectic solder reacted with Au/Ni/Cu pad shortly after the solder was melted.Interface of solder bump reflowed by laser consists of a continuous AuSn4 layer and remnant Au element.Needle-like AuSn4 grew sidewise from interface,and then spread out to the entire interface region.A thin layer of Ni3Sn4 intermetallic compound was found at the interface of solder bump reflowed by hot air,and AuSn4 particles distribute within the whole solder bump randomly.The combination effect of the continuous AuSn4 layer and finer eutectic microstructure contributes to the higher shear strength of solder bump reflowed by laser.     

Capillary wave formation on excited solder jet and fabrication of lead-free solder ball

A survey of solder ball production processes especially focusing on disturbed molten metal jet breakup process was made. Then the formation of capillary wave on tin melt jet in the way of rapid solidification was studied. A semi-empirical formula, which can be written as λ = Cvib （σ/ρ）^1/3 f^-2/3 to predict the relationship between wavelength of capillary wave and frequency of imposed vibration was obtained. Sn-4.0Ag-0.5Cu lead free solder ball was successfully produced with tight distribution and good sphericity. The excited jet breakup process is promising for cost effectively producing solder ball.     

Effects of rapid solidification on the microstructure and microhardness of a lead-free Sn-3.5Ag solder

A lead-free Sn-3.5Ag solder was prepared by rapid solidification technology. The high solidification rate, obtained by rapid cooling, promotes nucleation, and suppresses the growth of Ag3Sn intermetallic compounds （IMCs） in Ag-rich zone, yielding fine Ag3Sn nanoparticulates with spherical morphology in the matrix of the solder. The large amount of tough homogeneously-dispersed IMCs helps to improve the surface area per unit volume and obstructs the dislocation lines passing through the solder, which fits with the dispersion-strengthening theory. Hence, the rapidly-solidified Sn-3.5Ag solder exhibits a higher rnicrohardness when compared with a slowly-solidified Sn-3.5Ag solder.     

Simulation of microstructure evolution in fused-coating additive manufacturing based on phase field approach

The mechanical properties of metal components are determined by the solidification behavior and microstructure. A quantitative phase field model is used to investigate the microstructure evolution of fused-coating additive manufacturing, by which to improve the quality of deposition. During the fused-coating process, the molten metal in a crucible flows out of a nozzle and then reaches the substrate. The solidification happens at the moment when the molten metal comes into contact with substrate moving in three-dimensional space. The macroscopic heat transfer model of fused-coating is established to get the temperature field considered as the initial temperature boundary conditions in the phase field model. The numerical and experimental results show that the morphology of grains varies with different solidification environments. Columnar grains are observed during the early period at the bottom of fused-coating layer and the equiaxed grains appear subsequently ahead of the columnar grains. Columnar dendrites phase field simulations about the grains morphology and solute distribution are conducted considering the solidification environments. The simulation results are in good agreement with experimental results.     

Effects of bismuth on growth of intermetallic compounds in Sn-Ag-Cu Pb-free solder joints

The effects of Bi addition on the growth of intermetallic compound （IMC） formation in Sn-3.8Ag-0.7Cu solder joints were investigated. The test samples were prepared by conventional surface mounting technology. To investigate the element diffusion and the growth kinetics of intermetallics formation in solder joint, isothermal aging test was performed at temperatures of 100, 150, and 190 ℃, respectively. The optical microscope （OM） and scanning electron microscope （SEM） were used to observe microstructure evolution of solder joint and to estimate the thickness and the grain size of the intermetallic layers. The IMC phases were identified by energy dispersive X-ray （EDX） and X-ray diffractometer （XRD）. The results clearly show that adding about 1.0% Bi in Sn-Ag-Cu solder alloy system can refine the grain size of the IMC and inhibit the excessive IMC growth in solder joints, and therefore improve the reliability of the Pb-free solder joints. Through observation of the microstructural evolution of the solder joints, the mechanism of inhibition of IMC growth due to Bi addition was proposed.     

FORMATION AND CHANGE OF AuSn4 COMPOUNDS AT INTERFACE BETWEEN PBGA SOLDER BALL AND Au／Ni／Cu METALLIZATION DURING LASER AND INFRA-RED REFLOW SOLDERING

Interactions between 63Sn37Pb solder and PBGA metallization (Au/Ni/Cu) during laser and infrared reflow soldering were studied.During laser reflow soldering process,a thin layer of AuSn4 was observed at the interface of the solder bumps,its morphology was strongly dependent on the laser reflow power and heating time.The solder bumps formed by the first laser reflow was reflowed again to form the solder joints.The AuSn4 compounds formed in the first laser reflow process dissolved into the bulk solder after the secondary infrared reflow process.The needle-like AuSn4 changed into rodlike,and distributed inside the solder near the solder/pad interface.     

Study on solder joint reliability of ceramic ball grid array component based on design of experiment method

Four process parameters, pad diameter, stencil thickness, ball diameter and stand-off were chosen as four control factors. By using an L25 （5^6 ） orthogonal array the ceramic ball grid array （ CBGA ） solder joints which have 25 different combinations of process parameters were designed. The numerical models of all the 25 CBGA solder joints were developed using the Sugrace Evolver. Utilizing the sugrace coordinate exported from the 25 CBGA solder joints numerical models, the finite element analysis models were set up and the nonlinear finite element analysis of the CBGA solder joints under thermal cycles were pegrormed by ANSYS. The thermal fatigue life of CBGA solder joint was calculated using Coffin-Manson equation. Based on the calculated thermal fatigue life results, the range analysis and the variance analysis were pegrormed. The results show that the fatigue life of CBGA solder joint is affected by the pad diameter, the stencil thickness, the ball diameter and the stand-off in a descending order, the best combination of process parameters results in the longest fatigue life is 0.07 mm stand-off, 0.125 mm stencil thickness of, 0.85 mm ball diameter and 0. 89 mm pad diameter. With 95% confidence the pad diameter has a significant effect on the reliability of CBGA solder joints whereas the stand-off, the stencil thickness and the ball diameter have little effect on the reliability of CBGA solder joints.     

RESEARCH ON THE FORMATION MECHANISM OF INTERNAL CRACK IN THE CONTINUOUS CASTING SLAB

In view of the periodic bending deformation of solid-liquid interface in the solidification process for continuous casting slab, the variation of temperature gradient and dendritic spacing in the front edge of the solid-liquid interface, and the nucleation and propagation process of crack were studied. It is shown that the bending deformation of the interface results in the temperature field change in the front edge of solid-liquid interface, and the occurrence of temperature gradient along drawing direction results in the growth of secondary dendrites. The initial crack formed during the middle and final stage of solidification may extend to the surface of the casting slab and become an internal crack. The results of the theoretical analysis are basically in agreement with that of the experiment.     

钎料熔滴与焊盘界面反应及再重熔时的界面组织演变

采用熔滴直接凸点制作方法,对共晶SnPb及SnAgCu钎料熔滴与Au/Ni/Cu焊盘所形成的凸点/焊盘界面组织进行了研究,并与激光重熔条件下获得的凸点/焊盘界面组织进行了比较,考察了凸点/焊盘界面组织在随后的再重熔过程中的演变.结果表明:钎料熔滴与焊盘在接触过程中形成了Au-Sn化合物,Au层并未完全反应.在随后的再重熔过程中,Au层被完全消耗,全部溶入钎料基体中,Ni层与钎料发生反应.无铅钎料(SnAgCu)和SnPb钎料所形成的界面组织明显不同;再重熔后SnPb钎料/焊盘的界面组织为Ni3Sn1,SnAgCu钎料/焊盘界面组织为(CuxNi1-x)6Sn5.     

SnAgCu无铅钎料焊点结晶裂纹

针对印刷电路板(PCB)上无铅钎料SnAgCu微小焊点的结晶裂纹,利用设计的试件重现无铅钎料钎焊过程中产生的结晶裂纹,对无铅钎料结晶裂纹进行模拟,同时研究了微量元素的添加对SnAgCu合金焊点结晶裂纹形成的影响。结果表明,在尺寸很小的焊点上仍然存在明显的结晶裂纹。用焊点结晶裂纹的总长度定量地评价无铅钎料结晶裂纹的敏感倾向,添加Ni和Ce元素能够降低无铅钎料结晶裂纹的形成,而P元素的添加却加剧了结晶裂纹的形成,明显增加了焊点处的结晶裂纹。     

窄节距焊料凸点成形及焊盘尺寸对抗剪强度和微观组织的影响

通过优化模板印刷工艺实现了窄节距无铅焊料凸点成形,并观察了凸点形貌、高度以及评估成形的焊料凸点性能. 利用拉力剪切力试验机对凸点进行剪切力测试,研究焊盘尺寸对凸点抗剪强度的影响,同时观察了断口形貌,最后对凸点内部及界面处的金属间化合物(intermetallic compound,IMC)进行了观察. 结果表明,小尺寸焊盘的凸点较高、均匀性较好,抗剪强度表现出随焊盘尺寸减小而减小的尺寸效应,并从剪切受力和IMC分析尺寸效应的成因. 其中大尺寸焊盘的凸点界面IMC形貌为扇贝状,而小尺寸焊盘的界面IMC为针状,容易导致应力集中而降低抗剪强度.     

回流焊冷却过程中PBGA焊点力学行为分析

以热弹塑性理论为基础,建立球栅阵列PBGA焊点在回流焊工艺中焊接应力的有限元模型,利用ANSYS的热结构耦合功能,采用生死单元法对Sn-Ag-Cu焊点回流焊的冷却过程进行数值模拟分析.焊点冷却结晶后的初始阶段,等效应力随温度的降低快速增加,当焊点的温度逐渐降低至室温时,等效应力为最大.结果表明,在回流焊接工艺中,PBGA焊点的裂纹极可能发生在焊料冷却结晶后的初始阶段,在焊点高应力集中区首先开裂,并在应力的作用下沿界面逐渐扩展.对焊料凝固初期冷却速率的控制是减少焊接裂纹产生的有效方法.     

Heat transfer at the metal/substrate interface during solidification of Pb-Sn solder alloys

Heat transfer analysis during the solidification of lead, tin, and two lead-base solder alloys against two different chill materials (steel and copper) was carried out with and without flux coating on the chill surface. Temperatures at two known locations inside the chill and casting were recorded as the casting started solidifying, and the acquired chill temperature data were used for solving a one-dimensional heat conduction equation inversely to yield the metal/chill interfacial heat flux and chill surface temperature as a function of time. The initial heat flux was high due to good contact at the metal/chill interface. As the casting started solidifying, there was a reduction in the heat flux due to the nonconforming contact at the interface. Chills with flux coating resulted in finer microstructures near the solder/substrate interface compared to those obtained with uncoated chills. The fineness of the microstructure also increased when copper was used as the chill material. The estimated total heat flow was found to be higher with flux-coated and copper chills. This was in good agreement with the finer microstructures obtained near the solder/chill interfacial region for solidification against copper chills and chills with flux coating on their surface.     

金属熔滴连续沉积、凝固重叠工艺及实验验证

金属熔滴均匀连续沉积是一种新型的3D打印技术和快速原型(RP)技术。本文系统研究了铝熔滴连续沉积到基板表面的瞬态传热传质现象,沉积机理主要包括金属熔体的毛细现象及固液界面的传热、凝固、搭接和重熔。采用VOF方法对连续沉积的金属熔滴在水平固定铝基板表面沉积进行3D建模。针对凝固传热过程中不同参数下熔滴在铝基板表面沉积、凝固进行了研究,通过数值计算与实验验证,各种工艺参数的影响,如喷射速度、基板温度、熔滴直径与碰撞最大铺展因子的影响,显示了很好的一致性。基于上述研究,成形形貌和内部微观结构之间的定量关系进一步验证了金属熔滴连续沉积、凝固重叠工艺的可行性。此工艺为金属微沉积制造实施有效的过程控制提供指导。     

SnAgCu-xPr钎料组织及性能

研究了不同含量Pr元素（质量分数分别为0,0.05%,0.5%）对Sn-3.8Ag-0.7Cu无铅钎料凝固特性、润湿铺展性能以及微观组织的影响.结果表明,SAC,SAC-0.05Pr以及SAC-0.5Pr的凝固所需过冷度分别为20.6,5.0,5.1℃,说明适量Pr元素的加入能够显著降低SnAgCu钎料凝固所需的过冷度;同时,Pr元素的加入细化了钎料组织,降低钎料组织中初晶β-Sn的尺寸,抑制了SnAgCu/Cu焊点内部不同形貌大块化合物Ag3Sn初晶的形成;当Pr元素的添加量为0.05%时,钎料润湿性能最优、组织最佳;0.5%Pr元素的添加会在钎料以及焊点内部形成PrSn3相,对焊点的性能造成不利的影响.     

Printing solder droplets for micro devices packages using pneumatic drop-on-demand (DOD) technique

A pneumatic drop-on-demand (DOD) system has been applied to solder complex and dense interconnects of modern micro electronic devices. Initial parameters of uniform droplets were first measured. Then influences of experiment parameters, such as the crucible temperature, the substrate temperature and the droplet velocity on spread of solder droplets, were investigated experimentally and theoretically. The results showed that effects of impact velocity on the spreading could be negligible and the solder spreading process was driven by capillary forces because of the low Weber (We) number of depositing droplet. The influence of initial droplet temperature on the droplet spreading was not regular. The contact diameter of solder droplets on copper substrate increased when the substrate temperature increased from 443 K to 493 K. At last, copper cables were successfully soldered to pins of a flexible circuit using the direct solder deposition and re-melting process. The soldering results showed the feasibility of the data-driven soldering technique using the pneumatic DOD deposition technology.